A device that passively dissipates heat from handheld consoles.
Patent Information
- Authority / Receiving Office
- TR · TR
- Patent Type
- Applications
- Current Assignee / Owner
- NETAS TELEKOMUNIKASYON ANONIM SIRKETI
- Filing Date
- 2026-03-23
- Publication Date
- 2026-06-22
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Abstract
Description
1 TARIFF PROVIDES PASSIVE HEAT DISSIPATION IN HANDHELD CONSOLES. A DEVICE Technical Area The invention relates to handheld consoles, portable gaming computers, and handheld emulation systems. silent mode”, “low power mode” of devices and similar compact computing devices or in usage scenarios where the fan is disabled, the SoC / GPU temperature is passively controlled. It relates to a device that enables its removal. State of the Art Active cooling in handheld consoles and similar compact computing devices 10 usually through small-sized fans and directed air ducts This is provided for high heat-generating components such as the processor (CPU / APU) and graphics unit. Copper or aluminum heat spreader plates placed on top transfer the heat to a heat pipe (heat pipe) The heat is transferred to a pipe or a thin vapor chamber structure. This structure then transfers the heat to the device's fan. It transports air to the areas where airflow is provided. Then, 15 are created by the fan. Airflow is passed over the finned radiator surfaces, transferring heat to the outside of the device. This ensures that cooling is prevented. Such active cooling architectures are especially suitable for portable gaming devices. preferred in computers or high-performance handheld consoles, and limited Helps systems that provide high processing power in a large volume to operate stably. is. 20 Passive cooling is generally used in handheld emulation devices with low power consumption, and This method is preferred in some gaming consoles. In this method, a moving part such as a fan is used. There are no components. Instead, metal chassis parts that dissipate heat, graphite heat sinks. heat spreaders (graphite heat spreader), thermal pads, and large surface area aluminum Plates are used. Heat from the processor is transferred to the device through these conductive layers. 25 It spreads throughout the body and is transferred to the ambient air by natural convection. Passive Cooling solutions are quieter, more energy efficient, and have a lower risk of mechanical failure. However, due to its limited heat dissipation capacity, it generally has a lower TDP (Thermal It is used with processors that have Design Power. In summary, although the current technology involves passive surfaces, it also includes elements necessary for natural convection, above 30 It does not contain a directional and continuous column of air. Therefore, the technique... 2 In its known state, natural convection is weak, especially when the back surface is closed. This situation remains, especially due to the hand coming into contact with the hot surface. It causes discomfort during use and negatively affects user comfort. In conclusion, due to the negative aspects described above and the current solutions being the subject of discussion... Due to its shortcomings, an improvement in the relevant technical field is necessary. 5 It has been made. Purpose of the Invention The invention was created by drawing inspiration from existing situations and overcoming the aforementioned drawbacks. It aims to solve the problem. The main purpose of the invention is to channel 10 through an apparatus integrated into the back of the handheld device. The aim is to strengthen natural convection through passive cooling. Another purpose of the invention is to dissipate heat from inside the device through the rear cover without using an active fan. The aim is to ensure that the environment is transferred efficiently and comfortably. Another purpose of the invention is to discharge heated air from above using a foldable chimney structure. to provide heat while simultaneously releasing cool air from the bottom and sides 15 The purpose is to remove the air. Another purpose of the invention is to transfer heat to the airflow via a finned rear cover. to provide. The other purpose of the invention is to produce directed, continuous and vertically oriented windings, even in fanless mode. The component is to obtain a strong airflow. 20 Another aim of the invention is to enable handheld devices to be used without compromising user comfort. The goal is to ensure its use. To fulfill the purposes described above, the invention is designed for handheld consoles, Portable gaming computers, handheld emulation devices, and passive heat dissipation systems are connected to each other. 25 Two-phase heat transfer, which distributes the heat it receives from the processor over a large surface area. heat channels that provide A thermal conductor that forms a thermal bridge between the heat channels and the rear cover. pad 3 It is an apparatus that includes; By increasing the surface area, it transfers heat to natural airflow through its channeled structure. rear cover with guiding fins and By creating a vertical airflow at the top, air is discharged from above. and at the same time cool air from below and / or the sides 5 a manhole cover that opens to allow it to be pulled out It includes. The structural and characteristic features and all the advantages of the invention are given in the figures below. This becomes clearer thanks to the detailed explanation written with references to these figures. This will be understood as such, and therefore the evaluation will also be based on these forms and detailed explanations. 10 This should be done taking that into consideration. Figures that will help understand the invention. Figure 1 shows the external view of the device that is the subject of the invention. Figure 2 shows the appearance of the heat channels in the apparatus that is the subject of the invention. Figure 3 shows the device in question attached to the back of a hand console. 15 Explanation of Part References 1. Heat channels 2. Heat conductive pad 3. Flap rear cover 4. Chimney cap 20 5. Magnet Detailed Description of the Invention In this detailed description, the preferred configurations of the apparatus that is the subject of the invention are listed only. This is explained to facilitate a better understanding of the subject. The subject of the invention is a device for handheld consoles, portable gaming computers, and handheld 25-inch devices. It is connected to the back of the emulation devices and features a channeled passive cooling architecture. 4 It enhances natural convection. The heat inside the device is removed without using an active fan. The invention aims to efficiently and conveniently transfer material from the rear cover to the external environment. The device in question, in its most basic form, achieves this purpose by transferring the heat it receives from the processor to a wider area. heat channels (1) that spread heat across the surface, providing two-phase heat transfer, heat channels (1) and back a heat conductive pad (2) that forms a thermal bridge between the cover, a finned back cover (3) and a 5 It consists of an opening chimney flap (4). The device described in the invention, whose appearance is given in Figures 1 and 2, has the aforementioned winged rear end. The cover (3) increases the surface area and transfers heat to natural airflow through its channeled structure. It directs. Micro-fins and longitudinal on the winged rear cover (3). There are air channels. These fins increase the heat transfer surface area and 10 It thins the surface boundary layer; thus, convective heat transfer occurs at the heat / air interface. The coefficient is increasing. Also, the channels located here are from the bottom / side areas of the device. the cool air entering is heated and directed towards the chimney flap (4) located in the upper region It facilitates. The geometry of the finned rear cover (3) regulates the local airflow. It is designed with a longitudinal arrangement and gradual elevation so that it fits in a pocket 15 It has smooth edges suitable for carrying and gripping. The natural convection effect in the apparatus in question is achieved with the mentioned chimney flap (4) It is performed. The chimney cap (4) is located at the top of the apparatus and on top In this section, by creating a vertical airflow, the air is discharged from above and at the same time It also allows cool air to be drawn in from below and / or the sides. Openable chimney 20 the flap (4) is flush with the body when folded at the top edge of the rear cover, When opened, it forms a semi-closed vertical channel together with the rear cover. The operation... During this time, the air on the finned rear cover (3) heats up and its density changes. It is decreasing. With the upward lift force, the air flows towards the chimney flap (4). It rises and the flue flap (4) allows the heated air to escape in a controlled manner. This allows for the expulsion of fresh, cooler air through the bottom / side openings. This triggers the current to be drawn into the channels, thus creating a continuous current loop. This makes it possible to generate "draft" without a fan, and without a fan It offers a solution to the problem of cooling. In one application of the invention, the device When used on a stand / kickstand, the chimney can be opened by opening the chimney flap (4) for an additional 30 minutes. It is positioned vertically, and the stacking effect is maximized. The aforementioned chimney... The flap (4) is securely closed with a low-profile hinge and magnetic / click lock. It remains in place and does not protrude during transport. The user can use it in silent mode. It can be turned on with movement, and can be turned off while the fan is running during intensive games and applications (hybrid). (mod). One application of the invention is the secure attachment of the device to a handheld console or computer. It contains a magnet (5) that allows it to stick magnetically. In this way Without the need for any cables or adhesive, the user can comfortably hold it in their hand. 5 He can continue spending time with his console. In the use of the invention apparatus, the system is typically passive when the chimney flap (4) is closed. It acts like a back cover. When the chimney flap (4) is opened, the natural duct is channeled. Convection becomes pronounced; a core / hot surface drop of ~3–5 °C is targeted (device (It depends on the architecture, power limits, and environmental conditions). In fan-assisted devices, 10 at low-to-medium load. Quiet comfort is ensured when the fan is off; even when the fan is switched on under high load, the chimney... With partial assistance from the flap, the required fan speed can be reduced.
Claims
6 REQUESTS 1. Handheld consoles, portable gaming computers, handheld emulators connected to devices, enabling passive heat removal, Two-phase heat transfer, which distributes the heat it receives from the processor over a large surface area. heat channels (1) and 5 A heat conductor that forms a thermal bridge between the heat channels (1) and the rear cover ped (2) It is an apparatus that includes; By increasing the surface area, it transfers heat to natural airflow through its channeled structure. rear cover with guiding flaps (3) and 10 By creating a vertical airflow at the top, air is discharged from above. and at the same time cool air from below and / or the sides a hinged chimney flap that allows it to be pulled out (4) It includes.
2. An apparatus conforming to Claim 1, whose characteristic is that the apparatus is a handheld console or 15 a magnet that securely attaches to the computer magnetically (5) is included.