CMUT-Based Integrated Probe and Manufacturing Method Used for Photoacoustic and Ultrasonic Imaging Applications

Abstract

The invention relates to a compact probe that enables the combined use of photoacoustic (optoacoustic) and ultrasonic imaging, consisting of a CMUT (Capacitive Micromachined Ultrasonic Transducers) chip manufactured using MEMS (Micro-Electromechanical System) technology on a transparent substrate with an optically transparent / semi-transparent diaphragm integrated with optical fiber and coated with silver nanowire (AgNW).

Description

1 TARIFF CMUT-based systems used for photoacoustic and ultrasonic imaging applications. Integrated Probe and Production Method TECHNICAL FIELD The invention involves a silver nanowire (AgNW) coated and optically integrated fiber. MEMS on a transparent (glass) substrate with a transparent / semi-transparent (transparent) diaphragm. CMUT (Capacitive 10) produced using (Micro-Electromechanical System) technology. Micromachined Ultrasonic Transducers - capacitive micro-machined ultrasonic transducers Photoacoustic (optoacoustic) and ultrasonic imaging combined, consisting of a (transducer) chip. It is related to the compact probe that makes its use possible and the method of manufacturing this probe. PREVIOUS TECHNIQUE 15 Photoacoustic (opto-acoustic) imaging is one of the classical optical and acoustic imaging methods. It is a different and superior biomedical imaging technique [1]. This imaging method It basically consists of two parts; short-wavelength energy is applied to the area to be imaged. a laser light source that emits (illuminates) and the light sent to the tissue is absorbed by the tissue 20 pressure waves (ultrasonic) are generated as a result of rapid thermal expansion in the tissue due to absorption. Detection of waves) by transducers [2]. This method is non-invasive, because of its advantages such as high contrast, resolution and high depth of field Many promising therapy and diagnostic procedures are available. Some of these procedures include: functional imaging of the brain [3], diagnosis of breast cancer [4] and early diagnosis of arthritis [5]. 25 Ultrasound is used to detect acoustic waves produced by the absorption of light in biological tissues. The transducer (UST-Ultrasonic Transducer) is of critical importance. Optical stimulation (laser) Directional alignment between ultrasonic sensing (acoustic system) and signal acquisition efficiency This significantly improves image sensitivity and the overall performance of the system. [6]. To achieve optimal imaging performance, these two systems have 30 (Optical and acoustic) systems need to be efficiently combined (integrated). However, Due to the limitations of current optical and acoustic systems, these two systems (parts) integration is incompatible [1]. Therefore, traditionally displaying used to carry electromagnetic energy (laser beam) to the area to be illuminated. Fiber optics and ultrasonic probes (transducer arrays) mechanically differ by method 35 They are combined using [7]. Mechanical and geometric constraints in these methods Therefore, light cannot be transmitted ideally (homogeneously) to the desired area, resulting in a low signal. 2 This leads to a low sound-to-noise ratio (SNR). However, better results can be obtained with ultrasonic transducer arrays. To obtain a photoacoustic image, the area under the ultrasonic probe is connected to an optical fiber. It needs to be illuminated homogeneously. Therefore, photoacoustic microscopy (PAM- To improve the signal-to-noise ratio (SNR) in Photoacoustic Microscopy (Photoacoustic Microscopy) systems. Design studies for alternative fiber optic ultrasonic transducer integration are being intensively conducted. 5 Studies are underway. The existing ring-shaped ultrasonic system has a central cavity. Integration of Ring shaped ultrasonic Transducer-RUT is one of these approaches [6]. In photoacoustic microscopy (PAM) systems, ring-shaped ultrasonic transducers (RUTs), While allowing light to pass through, it offers a more compact structure, but also compromises acoustic sensitivity and focusing. It is limited in this respect. In order to overcome this problem, in 2019, 10 optical electrodes, including electrodes, were developed. Transparent ultrasonic transducer made of transparent materials (TUT-Transparent Ultrasonic) The transducer (TUT) has been developed. TUT is a high digital aperture PAM system. designing, creating compact configurations and multi-mode display It enables systems. Since 2021, TUT has been using different optical imaging techniques. It has been used in the integration of ultrasound imaging. Finally, 15 developed in 2024. Broadband and high-pass TUT enhances both resolution and system versatility. This has strengthened its potential for widespread use in biomedical applications by increasing its reach. The advantages of the system compared to other systems are shown in [6]. In addition, the simultaneous acquisition of photoacoustic (PA) and ultrasonic (US) images, 20 This allows for easier interpretation of biometric information in both display modes. It is recognized. A light stimulation source (optical fiber) and an ultrasonic transducer (UT) are used simultaneously. Combining PA and US imaging efficiently is challenging. However, US imaging... Common applications require an external pulser device to transmit US waves. This makes integrated PA / US imaging systems relatively complex and suboptimal. It brings about. In a recent study [8], without the need for a US pulser, semi- a transparent ultrasound transducer (sTUT - Semi-Transparent Ultrasound Transducer) Simultaneous PA and laser-induced US (LUS) imaging is demonstrated via this integrated system. In the system, pulsed electrodes are used with silver nanowires (AgNW) as translucent electrode layers. A portion of the stimulation light is converted into US waves on the sTUT surface. These waves are called stimulation 30 These are called transduced ultrasound (LUS) waves and are used for conventional US imaging (USI). This process is called LUS imaging (LUSI). The other part of the stimulation light comes from sTUT. It passes through, illuminates the target, and produces PA waves used for PAI (Photo Acoustic Imaging). Both reflected LUS and PA waves are emitted back and detected by sTUT. This Therefore, sTUT is a combination of an opaque UT that enables LUSI and a TUT that enables PA. 35 It functions as a combination [8]. The working principle and production method of this integrated system It is known in the literature. 3 There are two ways to generate ultrasound waves from light (laser energy) (photoacoustics). These are: This can occur through material ablation or thermoelastic effect when exposed to light. In high-intensity light pulses, the temperature of a light-absorbing material rises to melt or It can exceed its boiling point, thus causing the material to undergo a phase change. The resulting 5 Material ablation uses photoacoustic waves to apply rebound momentum to the material. It produces these types of ablation-induced photoacoustic waves with relatively high photoacoustic amplitudes. It has, however, the ablation process is destructive to the materials that make up the structure. In contrast, Photoacoustic wave generation via thermoelastic effect, light-induced damage in materials It is a non-destructive method that does not cause damage. It uses relatively low-intensity light pulses. Photoacoustic production relies on the thermoelastic effect. Photoacoustic materials convert light into heat. This situation leads to temporary thermal expansion and acoustic generation in the materials. One of the key requirements for photoacoustic production is the optical heating of a material. The requirement is that it must be faster than the thermal expansion of the heated material. To meet this, the incoming optical energy is delivered to the photoacoustic material in short pulses or with modulated intensity. should be applied in the form of generated waves [9]. Similar to the photoacoustic wave generation principle described above, silver nanowire (AgNW) It absorbs some of the incoming pulsed stimulation light and the sTUT (translucent ultrasonic transducer) It converts US waves on its surface. In this way, it can traditionally transmit 20 waves with a transmitter circuit. Driven ultrasonic transducers enable the production of ultrasonic signals without a transmitter circuit. This provides a smaller-scale ultrasonic system. laser system for imaging applications (ultrasonic and photoacoustic) This can enable the creation of a compact probe. A translucent ultrasound transducer. (sTUT) production requires an intensive trial and learning process (dexterity). 25 Polyvinylidene Fluoride (PVDF) material is known for its flexibility, low cost, and biocompatibility. It is frequently used in sensing applications due to its properties

[10] . However, PVDF's One of its limitations is that it is exposed to high temperatures for extended periods during production. It is the degradation of piezoelectric properties. In addition, thin film production is difficult and sub-discretionary. Due to its weak adhesion to sheets and metals, it is preferred in MEMS applications. 30 is not being used

[11] . MEMS is used in the field instead of PVDF because of its low cost. A silicone layer (membrane) that is transparent and translucent to light could be an alternative. (See Figure 1) The permeability of silicon material to different wavelengths has been demonstrated

[12] . It will also have a completely transparent or opaque silicone membrane using MEMS technology. CMUT (Capacitive Micromachined Ultrasonic Transducers) produced in this way (processed ultrasonic transducer) transducer has good receiver performance and small size. It is a compatible structure for the production of photoacoustic imaging probes (devices). Therefore, it is translucent. 4 As an alternative to ultrasound transducer (sTUT) production, coated with silver nanowire (AgNW) CMUT has an optically permeable silicon membrane freely spaced over a cavity. (Capacitive Micromachined Ultrasonic Transducers) (converter) transducer and optical fiber system integrated into CMUT, both the total system In terms of size, production cost, and practical use, ultrasonic and photoacoustic 5 It could be an alternative method for imaging applications. It will be coated onto a Si layer. The optical transmittance of the AgNW layer and consequently the acoustic wave generation efficiency and Results regarding its interaction with the CMUT structure were obtained after experimental studies were conducted. This can be done. Therefore, this patent application is planned to be further developed in future studies. It includes the conceptual stage of the system. 10 In current applications, piezoelectric devices are generally used for collecting photoacoustic signals. Essentially, PT or AlN-based membrane / diaphragm structures are used. However, the aforementioned The performance of piezoelectric-based structures is affected by temperature changes, and this Signal stability and measurement are particularly important in photoacoustic applications requiring precise measurements. This leads to limitations in terms of accuracy. However, some piezoelectric Due to the high acoustic impedance of the materials, especially PZT, they interact with the environment. Achieving acoustic harmony becomes more difficult, and this affects both performance and... This presents various limitations in terms of production processes. On the other hand, PVDF Because it is a flexible, transparent and low-cost material, it has some advantages. 20 However, PVDF's compatibility with MEMS manufacturing technologies is limited, and furthermore... Functional devices that can be used in photoacoustic applications with small dimensions It does not provide sufficient suitability in terms of production. Therefore, existing technical solutions both temperature-dependent performance variations and acoustic impedance mismatches, 25 in terms of development and adaptation to the production of MEMS-based miniature photoacoustic devices. It contains open aspects. As a result of research conducted in the literature, the application number “US12 / 747,428” and “Photoacoustic United States patent titled "Imaging Devices and Methods of Imaging" The publication was found. The application in question concerns photoacoustic medical imaging devices and 30 It relates to imaging methods and involves ultrasonic transducer arrays on a substrate. grooves created in the substrate, optical fibers and infrared placed in those grooves from a photoacoustic imaging structure containing reflective surfaces that direct light to the target It mentions this. However, the application states that a cavity coated with silver nanowires (AgNW) is involved. CMUT 35 has a free-floating optically permeable silicon membrane. (Capacitive Micromachined Ultrasonic Transducers) The transducer and the optical fiber system integrated into the CMUT are not mentioned. As a result of research conducted in the literature, the international application "PCT / TR2023 / 051698" PCT invention no. 1 and titled “A Compact Photoacoustic Probe and Its Manufacturing Method” A patent application has been found. This application concerns photoacoustic imaging. A compact probe with optical fiber integration was obtained for use in applications. 5 It relates to the manufacturing process and the related production method. However, the application states that it is made of silver. optically permeable nanowire (AgNW) coated and freely available in a cavity CMUT (Capacitive Micromachined Ultrasonic Transducers) with silicone membrane (processed ultrasonic transducer) transducer and optical fiber integrated into CMUT the system was not mentioned 10 As a result of other research conducted in the literature, application number “CN201410226273” and “CMUT (Capacitive Micro-machined Ultrasonic Transducer) Ring Assembly Based Micro- A Chinese patent application titled "Photoacoustic Transducer" has been found. Application, optical fiber head, lens, CMUT ring array probe, CMUT array element and light 15 micro photoacoustic transducer based on CMUT ring array containing permeable protective film It is related. However, the application states that a silver nanowire (AgNW) coated surface and placed in a cavity is involved. CMUT (Capacitive Beam Mutation) with free-floating optically permeable silicon membrane Micromachined Ultrasonic Transducers (capacitive micro-machined ultrasonic transducers) The transducer and the optical fiber system integrated into the CMUT are not mentioned. 20 As a result of other research conducted in the literature, application number “CN201410226274” and Chinese patent titled "Photoacoustic Endoscopic Type A Scanning Imaging System" The application was encountered. The application in question concerns the warning and detection unit and the control and Photoacoustic endoscopic A-type using CMUT ring array sensor, consisting of processing unit. It relates to a system for performing scanning and imaging. However, the application states that 25 an optically free-standing structure coated with silver nanowires (AgNW) in a cavity CMUT (Capacitive Micromachined Ultrasonic) with permeable silicone membrane Transducers (capacitive micro-machined ultrasonic transducers) integrated into the transducer and CMUT. The established optical fiber system has not been mentioned. As a result of other research conducted in the literature, the application number “US16 / 637,854” and “Optics The invention is titled "Transparent, Micromachine-Manufactured Ultrasonic Transducer (CMUT)". A United States patent application has been found. The application concerns optics. as a transparent substrate, the void created in that substrate is optically transparent. It relates to a transparent CMUT structure containing a conductive sub-electrode and a vibrating plate. However, the 35 that were made... The application describes an optical shield coated with silver nanowires (AgNW) and freely positioned in a cavity. CMUT (Capacitive Micromachined Ultrasonic) with silicone membrane that has permeability. 6 Transducers (capacitive micro-machined ultrasonic transducers) integrated into the transducer and CMUT. The optical fiber system that was installed was not mentioned. Ultimately, the problems mentioned above, which cannot be solved with current technology, are the subject of this technical analysis. This has made it necessary to make an innovation in the field. 5 A BRIEF DESCRIPTION OF THE INVENTION The present invention aims to eliminate the aforementioned disadvantages and introduce new technologies to the relevant technical field. Used for photoacoustic and ultrasonic imaging applications to bring advantages. It relates to CMUT-based integrated probe and manufacturing method. 10 The main purpose of the invention is to enable simultaneous or in-depth imaging in photoacoustic and ultrasonic imaging applications. Optical stimulation and ultrasonic signal generation, and photoacoustic / ultrasonic signals can be used separately. A CMUT-based compact probe that enables signal acquisition on the same probe structure. to improve. 15 Another objective of the invention is to illuminate the silver nanowire structure with a laser light source. As a result, the CMUT chip transmits an external ultrasonic signal by enabling ultrasonic signal generation. The aim is to reduce or eliminate the need for a generator to drive it. Another objective of the invention is to enable the CMUT chip to operate primarily in receiver mode. A simpler, portable solution for receiving / collecting photoacoustic and ultrasonic signals. a more flexible photoacoustic and ultrasonic imaging probe in terms of electronic design The goal is to obtain the structure. Another purpose of the invention is to create circuits for the transmit / transmit function in front-end electronic circuits. by enabling the reduction of components, receiver circuits and output amplifier on the PCB. The aim is to provide a more suitable space for design and design flexibility. Another objective of the invention is to produce MEMS 30 on an optically transparent glass substrate. Thanks to its CMUT chip structure compatible with manufacturing technologies, it is small and portable. and to obtain a compact photoacoustic / ultrasonic imaging probe. Another objective of the invention is to create a lower electrode, an insulating layer, an upper electrode, and a layer with optical transparency. Capacitive micro-machined ultrasonic 35 working in conjunction with a silver nanowire-coated silicon membrane structure. The transducer structure is integrated with a laser light source that provides optical stimulation. 7 Another purpose of the invention is to mechanically transmit light and ultrasonic signals through a PDMS acoustic lens. by enabling it to focus, it reduces the need for electronic focusing and The aim is to enable more efficient collection of photoacoustic / ultrasonic signals. Another aim of the invention is to enable the conversion of photoacoustic and ultrasonic signals within a thin silicone membrane structure. By enabling its use in harvesting / collecting, it is less affected by temperature changes. and to offer a probe architecture suitable for MEMS fabrication. Another purpose of the invention is to be used in medical applications such as breast cancer diagnosis, skin disease diagnosis, and similar fields. compact, portable and optically-acoustically advanced for use in imaging applications. The goal is to provide an integrated probe structure. All the purposes mentioned above and those that will emerge from the detailed explanation below. The present invention aims to achieve 15 applications in photoacoustic and ultrasonic imaging. Optical stimulation and ultrasonic signaling, developed for simultaneous or separate use. an external CMUT that enables the generation and collection of photoacoustic / ultrasonic signals. by reducing or eliminating the need for driving with an ultrasonic signal generator Enables transceiver / receiver mode-intensive operation and is compatible with MEMS manufacturing technologies. It is a probe structured in this way, and its characteristic is; 20  Photoacoustic stimulation is achieved by providing laser light and optical stimulation with silver nanowires. at least one laser light source associated with it,  Production of ultrasonic signals when illuminated by a laser light source by providing the CMUT chip with an external signal generator, eliminating the need to drive it. silver nanowire that reduces / eliminates, 25  The CMUT chip's carrier body portion, through which light passes via the probe structure. at least one substrate that allows transmission,  Capacitive converter of the CMUT chip, positioned in relation to the substrate. at least one sub-electrode forming the subconducting surface of its structure,  Associated with a silicon surface on which silver nanowires are positioned, and 30 Capacitive during the reception or collection of photoacoustic / ultrasonic signals at least one upper electrode (conductive silicon layer) that performs the sensing function,  Provides electrical insulation between the lower and upper electrodes of the CMUT chip. at least one insulating layer supporting the capacitive operating structure, 8  Silver nanowires positioned on a silicon surface, resistant to light and ultrasound mechanical focusing of the signal and photoacoustic and ultrasonic signals at least one PDMS acoustic lens that enables the collection,  Substrate, bottom electrode, insulating layer, top electrode, silver nanowire and PDMS The aforementioned CMUT chip 5 forms the body associated with the acoustic lens. It includes. The best way to utilize the advantages of the existing invention, together with its structure and additional elements. For it to be understood, it must be considered together with the figures explained below. BRIEF DESCRIPTION OF THE FIGURES Figure 1 is a representative illustration of the transmittance of silicon material to different wavelengths. It is a representation. Figure 2 is a schematic representation of the compact probe structure related to the method described in the invention. 15 The drawings do not necessarily need to be scaled and are necessary for understanding the invention. Details that are not present may have been overlooked. Furthermore, at least to a large extent... Elements that are identical or at least have substantially identical functions are numbered the same. It is shown. 20 REFERENCE NUMBERS 1. Laser light source 2. Substrate 25 3. Lower electrode 4. Insulating layer 5. Upper electrode 6. Silver nanowire 7. PDMS acoustic lens 30 C. CMUT chip DETAILED DESCRIPTION OF THE INVENTION This detailed explanation describes the photoacoustic and ultrasonic imaging that is the subject of the invention. 35 The CMUT-based integrated probe and manufacturing method used for its applications is only relevant to the subject. 9 with examples that will not create any limiting effect on a better understanding It is explained. Laser light source (1) will be used in photoacoustic and ultrasonic imaging applications. It is the fundamental component that ensures the provision of optical stimulation in the integrated probe structure. (Statement 5) The subject is laser light source (1), silver nanowire (AgNW) (6) structure with laser light It enables the CMUT chip (C) to generate an ultrasonic signal by being illuminated. This structure eliminates the need for driving it with an external signal generator. Thanks to the CMUT chip (C), it is mainly used for receiving / collection of PA and US signals. It can be used in receiver mode, thus providing more than 10 in front-end electronic circuit design. Flexibility is provided. The substrate (2) is the carrier structure on which the CMUT chip (C) is manufactured. It is stated that the substrate (2) in question within the scope of the invention is optically transparent glass. It can be created from this material and allows CMUT cells to run on it. Cavity structures providing optical fiber can be created on the substrate (2). It is possible to create gaps or eroded areas suitable for integration, thus 15 The light obtained from the laser light source (1) is integrated into the CMUT chip (C) structure. It becomes possible to transmit light. The optically transparent substrate (2) allows light to pass through the system. It is an important structural feature in terms of orientation and achieving a compact probe structure. It is a component. The bottom electrode (3) is formed on or over the substrate (2). It refers to a conductive electrode structure positioned within a cavity. The invention's preference is 20. In the application performed, the lower electrode (3) is indium tin oxide (ITO) with optical transmittance. It is made of material. This structure enables both the capacitive operation of the CMUT chip (C). creating an electrode structure that conforms to the principle and a transparent structure compatible with the optical system. It contributes to obtaining the probe architecture. The insulating layer (4) and the bottom electrode (3) Ensuring electrical insulation between the upper electrode (5) and the capacitive micro 25 of the CMUT chip (C) It is the layer used to create the processed ultrasonic transducer structure. Invention within the scope of an insulating layer (4), an electrically conductive silicon substrate or SOI substrate It can be structured as a Si3Ni4 layer that can be applied onto a silicon surface. Top electrode (5) is connected to the lower electrode (3) in the capacitive converter structure of the CMUT chip (C). The upper electrode in question (5), 30 is associated with a silicone membrane / film structure that can work and vibrate. It can be created with an electrically conductive thin silicon layer, PA and US. performing capacitive sensing function during signal reception / collection It contributes. Silver nanowire (6) is positioned on the silicon surface and laser light AgNW structure which enables ultrasonic signal generation when illuminated by source (1). It is stated that within the scope of the invention, silver nanowire (6) is placed on the cavity and bottom electrode (3) 35 The thin, suspended silicon surface can be coated with silver using the spin-coating method. CMUT for ultrasonic signal generation by excitation of nanowire (6) structure with laser light The chip (C) does not need to be driven by an external signal generator, thus making it more compact. portable and low electronic complexity integrated PA and US imaging probe obtained It is possible to focus the ultrasonic signal and laser light using a PDMS acoustic lens (7). It is an acoustic steering / focusing element that enables the collection of PA and US signals. This PDMS acoustic lens (7) will reduce or eliminate the need for electronic focusing. It can provide mechanical focusing in a way that will lift. Within the scope of the invention, PDMS acoustic The lens (7) is integrated into the silicon surface coated with silver nanowire (6), and is convex. It may have a geometric shape, or it may have a concave geometry in different applications. It can also be configured in this way. The CMUT chip (C) is the compact integrated probe that is the subject of the invention. The basic body structure consists of a capacitive micro-machined ultrasonic transducer chip. (Word 10) The subject of the CMUT chip is (C), substrate (2), bottom electrode (3), insulating layer (4) and top electrode (5), It includes the components of the CMUT chip (C), on an optically transparent substrate (2). manufacturability, compatibility with MEMS manufacturing technologies, use of thin silicone membranes. Thanks to its ability to enable low-cost production and its resistance to high temperatures, the silicon film... Its superior durability gives it an advantage over traditional piezoelectric-based structures. The invention provides the reception / collection of CMUT chip (C), PA and US signals. It is used for external signaling together with silver nanowire (6) and laser light source (1). It allows the generation of ultrasonic signals without the need for a generator. The differences between this invention and the existing technology are as follows: 20 - CMUT and MEMS can be fabricated on a transparent substrate integrated with optical fiber. It is compatible with the technology. Therefore, it is a small, handheld integrated probe. production is made possible. - A thin silicon film frequently used in MEMS device manufacturing for PA signal acquisition. It is available (because it is inexpensive). 25 - Silicone film is resistant to high temperatures (200 degrees). - CMUT can be used as both a transmitter (TX) and receiver (RX) for ultrasonic signals. In the invention... Silver nanowires (AgNW) will produce an ultrasonic signal when illuminated with laser light. The CMUT does not need to be driven by a signal generator. This allows for the use of thin silicon film. The layer is used solely for receiving (gathering) PA and US signals. CMUT 30 Operating the array in receiver mode only, front end electronics It provides greater flexibility in its design. The transmission (TX) function from electronics. Removing it provides more space for output amplifier design on the PCB. - Since the CMUT will not be driven by the signal generator, the necessary DC voltage in the receiver state will be supplied by the battery. It can be provided with a pre-charged CMUT structure or a CMUT probe of 35. Performance evaluation can be carried out. This allows for the use of a portable integrated PA and US. An imaging probe can be created. 11 This invention is directly related to the healthcare sector. Its medical application includes breast cancer diagnosis. The diagnosis of skin diseases is one of the most basic examples that can be given for the application method. In the invention... One of the most important components of the integrated system mentioned is the CMUT (Capacitive Mutual Mutation Unit). CMUT stands for Micromachined Ultrasonic Transducer. CMUT has long been used in ultrasonic medical technology. This is a subject being studied for imaging applications. Today, ultrasonic medical imaging is a key area of ​​research. on top of PZT (piezoelectric principle based) based systems used in imaging It is an advanced system. Although not yet commercially available, it is involved in the production of important medical devices. intensive research by the companies that manufacture them (such as Siemens, Hitachi, Vermon) This is being done. Therefore, medical ultrasonic imaging will be available very soon. 10 It is very likely that they will replace traditional PZT-based devices in applications. This invention involves illuminating a silver nanowire on a thin Si film using laser light. The presence of laser light is crucial because it is needed. Therefore, this invention is an optical system and... It deals with an integrated system consisting of a CMUT. The optical system and the CMUT system are discussed separately. Considering this, numerous studies have already been conducted in the literature, and these studies number 15. It continues. Optically designed to be used simultaneously in photoacoustic and ultrasonic imaging applications. Obtaining a compact probe using transparent CMUT arrays and optical fiber sourcing. The method of invention that provides; 20 - Creating a cavity on the surface of an optically transparent glass material as a substrate, cavity with indium tin oxide (ITO) electrode coating and without electrode coating. Etching for optical fiber integration on the surface, - Electrically conductive silicon substrate or insulating silicon surface of SOI substrate. Coating with Si3Ni4, 25 - Bonding of glass and silicone substrates using anodic bonding method and on the cavity To obtain the suspended silicone membrane, the silicone substrate must be thinned. - Coating the silicon surface with silver nanowires (AgNW), - Polydimethylsiloxane (PDMS) applied to a Si surface coated with silver nanowires (AgNW). Acoustic lens integration and optical fiber 30 in the gap created on the glass substrate surface obtaining a compact probe by placement It includes the steps involved in the process. The detailed steps of the method are as follows: - Creating a cavity on the surface of an optically transparent glass material as a substrate, cavity 35 indium tin oxide (ITO) electrode coating and on the uncoated surface Etching for optical fiber integration; 12  After photoresist is deposited on the surface of the glass substrate, the optical fiber will be placed using lithography. Transferring the design to the glass surface and dry etching (wet etching if necessary) (using) sufficient etching to remove the photoresist from the surface removal,  After the photoresist is deposited on the other surface of the optically transparent (transmitting) glass substrate, 5 then transferring the lower electrode design to the glass surface by lithography, dry etching. after sufficient abrasion has been carried out (using wet abrasion if necessary). indium tin oxide (ITO) metal coating and removal of photoresist from the glass surface This involves the creation of sub-electrodes. - Electrically conductive silicon substrate or insulating Si3Ni4 on the silicon surface of SOI substrate. coating with;  Electrically conductive silicon substrate or SOI substrate with no contact with the silicon surface. This involves coating with Si3Ni4 without performing a lithography process. Future studies Studies can be conducted on alternative insulating coating materials. 15 - Bonding of glass and silicone substrates using anodic bonding method and on the cavity To obtain the freely available silicone membrane, the silicone substrate must be thinned;  Bonding of glass and silicone substrate using the anodic bonding method and subsequent Using the dry etching method, free-floating Silicone 20 was applied to the cavity. Thinning the silicone substrate to obtain the membrane,  The geometry of the silicone membrane that will vibrate is circular, square, rectangular, and hexagonal. Silicone membranes can be in various shapes: circular, square, rectangular, and hexagonal. As an alternative geometry, a piston shape (a membrane with additional mass in the center) was given. Circular, square, rectangular, and hexagonal silicon geometries can also be used. Piston 25 The geometry represents a silicon wafer with an additional mass in the center. Piston A silicon wafer with a specific geometry is transparent once the silicon wafer is formed, allowing light to pass through. Obtained by coating with insulating (Si3Ni, SiO2, Silicon) or conductive material. It can be done. The dimensions (width and length) of the central mass to be located on the silicone membrane. This can be decided based on the dimensions of the silicone membrane. 30 - Coating of the silicon surface with silver nanowires (AgNW); suspended above the cavity and bottom electrode. Silver nanowires (AgNW) are applied to the thin silicon surface using the spin-coating method. It includes coating. 35 13 - Si surface coated with silver nanowires (AgNW) has a convex geometry. Polydimethylsiloxane (PDMS) acoustic lens integration and glass substrate surface Obtaining a compact probe by placing an optical fiber in the created cavity;  Production of Polydimethylsiloxane (PDMS) Acoustic Lenses with Convex Geometry and This involves integration into the CMUT surface. There are 5 steps available in the literature for this process. Methods can be used. Details are described in the aforementioned study (Chienliu Chang et al. al 2014 J. Micromech. Microeng. 24 085007)  It has a convex geometry for various applications that can be done in the future. Polydimethylsiloxane (PDMS) acoustic lens with concave geometry. Polydimethylsiloxane (PDMS) acoustic lenses were developed and applied to the silicon surface of the CMUT chip. It can be integrated.  This includes the process of integrating (joining) the optical fiber into the CMUT chip. 14 References [1]. C. Fang, H. Hu and J. Zou, “A Focused Optically Transparent PVDF Transducer for Photoacoustic Microscopy," in IEEE Sensors Journal, vol. 20, no. 5, pp. 2313-2319, 1 March1, 2020, doi: 10.1109 / JSEN.2019.2952971. 5 [2]. H. Wang, Z. Chen, H. Yang, H. Jiang and H. 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Claims

16 REQUESTS 1. Simultaneous or separate use in photoacoustic and ultrasonic imaging applications. 5 developed for use in the production of ultrasonic signals through optical stimulation and CMUT has an external ultrasonic sensor that enables the collection of photoacoustic / ultrasonic signals. by reducing or eliminating the need for driving with a signal generator Enables receiver / transmitter mode-based operation and utilizes MEMS manufacturing technologies. It is a probe that is configured in a compatible manner, and its feature is; 10  Photoacoustic stimulation is achieved by providing laser light and silver nanowire (6) at least one laser light source that is optically related to (1),  Production of ultrasonic signal when illuminated by laser light source (1) by providing the CMUT chip (C) to be driven by an external signal generator. silver nanowires (6), 15 that reduce / eliminate the need  CMUT chip (C) carrier body part and light probe structure at least one substrate (2) that allows transmission through it,  located in relation to the substrate (2) and the capacitive CMUT chip (C) at least one sub-conductor forming the sub-conductor surface of the converter structure electrode (3), 20  associated with a silicon surface on which silver nanowires (6) are located and Capacitive during the reception or collection of photoacoustic / ultrasonic signals at least one upper electrode (5) that performs sensing function,  providing electrical insulation between the lower electrode (3) and the upper electrode (5) and CMUT chip (C) must support at least one insulator 25 supporting the capacitive operating structure. layer (4),  silver nanowire (6) located on the silicon surface, light and mechanical focusing of the ultrasonic signal and photoacoustics and ultrasonics at least one PDMS acoustic lens (7) that enables the collection of signals,  related to substrate (2), bottom electrode (3), insulating layer (4), top electrode (5) 30 the mentioned CMUT chip (C) that forms the body It includes.

2. A probe that conforms to Claim 1, and its characteristic is that the substrate (2) is exposed to the laser light source (1) 35 that allows the incoming light to be optically correlated with the CMUT chip (C) structure 17 having a transparent / transparent structure and / or being made of transparent glass material It is the fact that.

3. A probe that conforms to Claim 1, and its characteristic is that the substrate (2) of the CMUT chip (C) is capacitive. It must contain at least one cavity suitable for its working structure. 5 4. A probe that conforms to Claim 1, and whose characteristic is that the substrate (2), the optical fiber and the probe body at least one gap, channel, or eroded link that allows for association It includes the region.

5. A probe that conforms to Claim 1, and whose characteristic is that the lower electrode (3) has optical transmittance. It is made of indium tin oxide (ITO) material.

6. A probe that conforms to claim 3, and its characteristic is that the lower electrode (3) is on the substrate (2). It has a conductive electrode structure positioned in relation to the cavity it contains. 15 7. A probe that conforms to Claim 1, and its characteristic is that the insulating layer (4) is silicon nitride based Si3Ni4 It includes a layer.

8. A probe conforming to claim 3, its feature being that the upper electrode (5) is suspended above the cavity 20 associated with a thin silicon wafer or electrically conductive silicon surface It is the presence of electrodes.

9. A probe that conforms to Claim 1, and whose feature is; PDMS acoustic lens (7), light and ultrasonic mechanical focusing of the signal without the need for electronic focusing 25 It should be structured in a way that provides opportunities.

10. A probe that conforms to Claim 1, and its feature is that the PDMS acoustic lens (7) has a convex geometry. It is having.

11. A probe that conforms to Claim 1, and its feature is that the PDMS acoustic lens (7) has a concave geometry. It is having.

12. A probe that conforms to Claim 1, and its characteristic is that the silicon membrane is circular, associated with the upper electrode (5), It has a square, rectangular, or hexagonal geometry. 35 18 13. A probe conforming to claim 12, characterized by its silicone membrane having an additional mass in the center. It has piston geometry.

14. A probe conforming to Claim 1, characterized by its CMUT chip (C), optically transparent substrate. (2) MEMS compatible chip 5 which contains an optically transparent silicon membrane It has a body.

15. Simultaneous or separate photoacoustic and ultrasonic imaging applications. suitable for use in the production of ultrasonic signals via optical stimulation and An external 10 CMUT chip (C) that enables the collection of photoacoustic / ultrasonic signals. reducing or eliminating the need for driving with an ultrasonic signal generator It is a probe manufacturing method compatible with MEMS production technologies, and its characteristic feature is; - Capacitive operation of CMUT chip (C) on optically transparent glass substrate (2) surface creating at least one cavity suitable for its structure, - The substrate (2) or the region associated with the cavity has optical permeability. Formation of the electrode (3), - Enables the connection of the optical fiber with the probe body on the substrate (2). creating at least one gap, channel or eroded joint area that provides - an electrically conductive silicon substrate or an insulating silicon surface of an SOI substrate. coating with layer (4), 20 - The substrate (2) and the silicone substrate are combined and suspended over the cavity and on top Obtaining the thin silicon wafer structure associated with the electrode (5), - when illuminated by laser light source (1) on the silicon surface Formation of silver nanowire (6) structure suitable for generating ultrasonic signal, - Light and ultrasonic signal on silicon surface associated with silver nanowire (6) 25 mechanically focusing and photoacoustic and ultrasonic signals integration of PDMS acoustic lens (7) which enables collection, - The laser light source (1) will be optically related to the silver nanowire (6) and CMUT chip (C) to provide laser light onto silver nanowire (6) association 30 It includes the steps of the process.

16. A probe manufacturing method in accordance with claim 15, the characteristic of which is that the substrate (2) is optically Selection of transparent glass material, lower electrode (3) indium tin oxide (ITO) The creation of a cavity, channel or 35 for the integration of optical fibers with the material. 19 lithography and dry etching or wet etching of the etched joint area It involves the steps involved in obtaining it through these processes.

17. A probe manufacturing method in accordance with claim 15, characterized by being electrically conductive. 5 The silicon surface of a silicone substrate or SOI substrate is coated with a silicon nitride insulating layer. It includes the coating steps.

18. A probe manufacturing method in accordance with claim 15, characterized by; substrate (2) and silicon bonding the substrate using the anodic bonding method and thinning the silicone substrate. The process steps for obtaining the thin silicone membrane structure suspended above the cavity are 10. It includes.

19. A probe production method in accordance with claim 15, the feature of which is the silver nanowire (6) structure. coating of silicone surface by spin-coating method and PDMS acoustic lens (7) 15 associated with silver nanowire (6) to have convex or concave geometry The process involves integrating the silicone into the surface.

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