Method for manufacturing bonded object and bonded object manufacturing apparatus
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2021-02-23
- Publication Date
- 2021-10-16
Smart Images
Figure TWG2TA000830134_001 
Figure TWG2TA000830134_002 
Figure TWG2TA000830134_003
Abstract
Description
[Technical Field]
[0001] This disclosure relates to a method and apparatus for manufacturing a bonding component, and particularly to a method and apparatus for manufacturing a bonding component that can be properly bonded even when the bonding surfaces of the components to be bonded are not of the same shape. [Previous Technology]
[0002] For example, in the manufacturing process of a portable terminal, a step is performed to bond the main substrate and the protective cover using an adhesive. In recent years, the display surface of the main substrate has become not only flat, but also extends beyond the outer edge of the surface. In this case, the protective cover is also integrally formed to continuously cover the flat surface to the end face extending beyond the curved outer edge. Regarding the technique of bonding two components having the aforementioned curved surfaces, there is a technique described below: a coating material is supplied to both the planar and curved portions of the object, increasing the viscosity of the coating material on the planar portion, and then inserted into the cover, thereby filling the space between the object and the cover with the coating material on the curved portion while maintaining the thickness of the coating material on the planar portion (e.g., Japanese Patent Publication No. 6606239).
[0003] Regarding the bonding of two components to form a bonded component, there are situations where the precision of the thickness of the adhesive (hereinafter referred to as "adhesive") filled between the two components is required. If the technology disclosed in the above-mentioned patent document is to be used in this case, it is sufficient that the shapes of the bonding surfaces of the two components are substantially consistent. However, when it is difficult to make the shapes of the two bonding surfaces consistent, it is impossible to make the thickness of the adhesive appropriate.
[0004] This disclosure is made in view of the above-mentioned problems and relates to a method and apparatus for manufacturing a bonding member that can be properly bonded even when the bonding surfaces of the components to be bonded are not of the same shape.
[0005] To achieve the above objective, as shown in Figures 1, 3, 4, and 6, the manufacturing method of the first-state bonding member disclosed herein is a method for bonding a first member C and a second member T by bonding an adhesive R with variable viscosity between a first bonding surface Cs and a second bonding surface Ts (see Figure 2(B)). The first member C has the aforementioned first bonding surface Cs; the second member T is more flexible than the first member C and has a second bonding surface Ts to be bonded to the first bonding surface Cs; the manufacturing method of the bonding member includes an adhesive supply step (S2, S12, S21), which involves supplying an adhesive to the first bonding surface Cs. The adhesive R is supplied to the first bonding surface Cs or the second bonding surface Ts in a manner that covers the necessary portion; the adhesive clamping step (S5, S14, S26) is to bring the first bonding surface Cs and the second bonding surface Ts close together so that the first bonding surface Cs and the second bonding surface Ts clamp and hold the adhesive R; the adhesive bonding step (S3, S15, S22) is to bring the adhesive R into close contact with the necessary portion of the first bonding surface Cs; and the load-bearing step (S6, S17, S26) is to apply a load to the second member T relative to the adhesive R to deform the second member T, wherein the adhesive R is in close contact with the first bonding surface Cs and is harder than the second member T. In addition, before the load-bearing step (S6, S17, S26), if the adhesive R that is in close contact with the necessary part of the first bonding surface Cs is softer than the second component T, an adhesion-enhancing step (S4, S16, S23) can be performed to increase the viscosity of the adhesive R so that it is harder than the second component T.
[0006] When configured as described above, even if the shapes of the first bonding surface and the second bonding surface are not consistent, the second component can be deformed by applying a load relative to the adhesive, thereby properly bonding the first bonding surface and the second bonding surface.
[0007] Furthermore, as shown in FIG1, FIG3, and FIG6, the method for manufacturing the second-state bonding member disclosed herein comprises, in the method for manufacturing the first-state bonding member disclosed herein, the adhesive supply step (S2, S21) being configured to supply adhesive R to the first bonding surface Cs.
[0008] When constructed as described above, the adhesive can be made to be in close contact with the necessary parts while the adhesive is being supplied, thus avoiding the complexity of the manufacturing process.
[0009] Furthermore, as shown in Figures 1, 3, 4, and 6, the manufacturing method of the third-state bonding member disclosed herein includes, in addition to the manufacturing method of the first-state or second-state bonding member disclosed herein, an adhesive fixing step (S7, S18, S27) in which the adhesive R is fixed in close contact with the first bonding surface Cs and the second bonding surface Ts before the load applied in the load-bearing step (S6, S17, S26) (S8, S19, S28) is removed.
[0010] When configured as described above, it can be permanently maintained in a state where an adhesive with a desired thickness is filled between the first bonding surface and the second bonding surface.
[0011] Furthermore, as shown in Figures 5(A), 5(B), and 6, the manufacturing method of the fourth-state bonding member disclosed herein includes, in the manufacturing method of any of the first to third-state bonding members disclosed herein, a setting step (S24) in which the first member C and the second member T are set in a state in which the first member C or the second member T is separated by a sheet-like membrane 23 into an existence space Sp where the first member C and the second member T exist, and a non-existence space Sq where the first member C and the second member T do not exist; and a load-bearing step (S26) includes a pressure difference generation step in which the pressure in the non-existence space Sq is higher than the pressure in the existence space Sp, thereby making the membrane 23 in close contact with the object A, which is formed by the contact of the base 21, the first member C, and the second member T.
[0012] When configured as described above, even if the first bonding surface has a complex shape, the first bonding surface and the second bonding surface can be appropriately bonded.
[0013] In order to achieve the above-mentioned objective, as shown in FIG1, the fifth type of bonding component manufacturing apparatus disclosed herein is an apparatus 1 for manufacturing a bonding component E formed by bonding a first component C and a second component T by bonding an adhesive R with variable viscosity between a first bonding surface Cs and a second bonding surface Ts (for example, see FIG2(B)). The first component C has a first bonding surface Cs; the second component T is softer than the first component C and has a second bonding surface Ts to be bonded to the first bonding surface Cs; the bonding component manufacturing apparatus includes: an adhesive supply device 11 for supplying adhesive R to the first bonding surface Cs or the second bonding surface Ts; a viscosity variable device 13 for changing the viscosity of adhesive R; and a load-bearing device 15 for applying a load to the second component T relative to the adhesive R to deform the second component T, wherein the adhesive R is in close contact with the first bonding surface Cs and is harder than the second component T.
[0014] When configured as described above, even if the shapes of the first bonding surface and the second bonding surface are not consistent, the second component can be deformed by applying a load relative to the adhesive, thereby properly bonding the first bonding surface and the second bonding surface.
[0015] According to this disclosure, even when the shapes of the first mating surface and the second mating surface are inconsistent, a load can be applied to the second component to deform the second component, thereby properly mating the first mating surface and the second mating surface. [Simplified Explanation of the Diagram]
[0016] Figure 1 is a schematic diagram of a bonding component manufacturing apparatus of one embodiment.
[0016] FIG2(A) is an exploded side sectional view showing the general structure of the bonding member manufactured by a bonding member manufacturing apparatus and method according to an embodiment, and FIG2(B) is a side sectional view showing the general structure of the bonding member.
[0016] Figure 3 is a flowchart showing the manufacturing steps of a method for manufacturing a bonding component in one embodiment.
[0016] Figure 4 is a flowchart showing the manufacturing steps of a method for manufacturing a fitting component in a modified embodiment.
[0016] Figure 5(A) is a schematic diagram of a modified embodiment of the bonding component manufacturing apparatus, showing the state after the setting step is completed. Figure 5(B) is a schematic diagram of the bonding component manufacturing apparatus, showing the state where the internal pressure of the non-existent space is higher than that of the existing space.
[0016] Figure 6 is a flowchart showing the manufacturing steps of a method for manufacturing a fitting member in another variation of an embodiment.
Implementation Method
[0017] This application is based on Japanese Patent Application No. 2020-62597 filed on March 31, 2020, the contents of which form part of the contents of this application.
[0017] Furthermore, the present invention can be more fully understood through the following detailed description. The further scope of the present invention becomes clearer through the following detailed description. However, the detailed description and specific examples are preferred embodiments of the present invention and are provided for illustrative purposes only. Those skilled in the art will understand various modifications and alterations from the detailed description within the spirit and scope of the present invention.
[0017] The applicant has no intention of providing all embodiments described to the public. Any changes or alternatives disclosed that are not explicitly included in the scope of the patent application are also part of this invention under the doctrine of equivalence.
[0018] The following description refers to embodiments of the present invention. Furthermore, identical or similar symbols are used for identical or equivalent components in the figures, and repeated descriptions are omitted.
[0019] First, referring to FIG1, an embodiment of the bonding member manufacturing apparatus 1 will be described. FIG1 is a schematic configuration diagram of the bonding member manufacturing apparatus 1. The bonding member manufacturing apparatus 1 is an apparatus for manufacturing a bonding member formed by bonding a cover member C and a deformable member T together with an adhesive R. The bonding member manufacturing apparatus 1 includes: an adhesive supply device 11 (hereinafter referred to as "supply device 11") for supplying adhesive R, a UV irradiator 13 for irradiating ultraviolet light, and a load-bearing device 15. In addition, in this embodiment, the bonding member manufacturing apparatus 1 further includes: a pressing part 17 and a control device 19. Here, before describing the bonding member manufacturing apparatus 1, the bonding member will be described first.
[0020] Figure 2(A) is an exploded side sectional view of the bonding member before the covering member C and the deformable member T are bonded together, and Figure 2(B) is a side sectional view of the bonding member E. In this embodiment, the covering member C is formed as a rectangular plate-shaped main part (hereinafter referred to as "covering main part Ca") whose outer edge rises in an arc-shaped manner towards one side. The surface of the portion of the covering member C surrounded by the raised covering outer edge Ce becomes the covering bonding surface Cs that is joined with the deformable member T. In this embodiment, the deformable member T is generally similar to the covering member C, and is formed as a rectangular plate-shaped main part (hereinafter referred to as "deformed main part Ta") that is slightly smaller than the covering member C, whose outer edge rises in an arc-shaped manner towards one side. The surface of the back side of the portion of the deformable member T surrounded by the raised deformable outer edge Te becomes the deformable bonding surface Ts that is joined with the covering member C. Before being bonded to the covering member C, the radius of curvature of the arc-shaped portion of the deformable member T's outer edge Te is larger than the radius of curvature of the arc-shaped portion of the covering member's outer edge Ce. That is, the curvature of the arc-shaped portion of the deformable outer edge Te is smaller than the curvature of the arc-shaped portion of the covering member's outer edge Ce. Furthermore, the deformable member T is formed to be more flexible than the covering member C. In this embodiment, the covering member C corresponds to the first member, the covering bonding surface Cs corresponds to the first bonding surface, the deformable member T corresponds to the second member, and the deformable bonding surface Ts corresponds to the second bonding surface. The adhesive R is a substance used to bond the covering member C and the deformable member T. In this embodiment, it becomes gel-like at the point of supply to the covering member C or the deformable member T. In this embodiment, the adhesive R has the characteristic that its viscosity increases (hence its hardness) when exposed to ultraviolet light. The adhesive R becomes harder as its viscosity increases, and softer as its viscosity decreases. The viscosity of the adhesive R varies, including a state that is softer than the covering member C and harder than the deformable member T. In this embodiment, it also includes a state that is softer than the deformable member T. The state that is softer than the deformable member T includes the characteristics of being deformable and having fluidity. As mentioned above, the shapes of the covering outer edge Ce and the deformable outer edge Te are not identical. However, by using the bonding member manufacturing apparatus 1 and / or the bonding member manufacturing method described below, the covering member C and the deformable member T are joined via the adhesive R, thus creating a bonding member E in which the covering member C and the deformable member T are tightly bonded via the adhesive R.
[0021] Returning to Figure 1, the description of the bonding component manufacturing apparatus 1 will continue. In the following description, when referring to the composition of the bonding component E, the covering component C, and the deformable component T, reference will be made to Figures 2(A) and 2(B). The supply device 11 is a device for supplying adhesive R to the covering component C or the deformable component T. In this embodiment, the supply device 11 is configured to uniformly apply adhesive R to the necessary portions of the covering bonding surface Cs or the deformable bonding surface Ts, and can be a die coater, applicator, bar coater, slit coater, etc. Furthermore, the necessary portions refer to the portions where adhesive R must be supplied in order to manufacture the bonding component E. The supply device 11 is configured to move in directions parallel to and intersecting with the main portions Ca and Ta of the surfaces Cs and Ts to which adhesive R is supplied. The supply device 11 is connected to the adhesive reservoir (not shown) for storing adhesive R via a tube, and is configured to change the internal pressure of the adhesive reservoir (not shown) to control the amount of adhesive R delivered from the supply device 11 (supply amount).
[0022] The UV irradiator 13 is a device that can irradiate the adhesive R with ultraviolet light, thereby increasing the viscosity of the adhesive R, and is equivalent to a viscosity variable device. The UV irradiator 13 is configured to adjust the intensity of the irradiated ultraviolet light. In this embodiment, the UV irradiator 13 is configured such that the irradiation range of the ultraviolet light is smaller than that of the covering adhesive surface Cs and the deformable adhesive surface Ts, but it can move itself to change the irradiation range of the ultraviolet light, thereby irradiating the entire covering adhesive surface Cs or deformable adhesive surface Ts with ultraviolet light. The UV irradiator 13 is configured to move in a direction parallel to and intersecting with the main parts Ca and Ta of the surfaces Cs and Ts on which the adhesive R is supplied. By allowing the UV irradiator 13 and the supply device 11 to move together in a direction parallel to and intersecting with the main parts Ca and Ta of the surfaces Cs and Ts on which the adhesive R is supplied, the positional relationship between the UV irradiator 13 and the supply device 11 can be exchanged.
[0023] The load-bearing device 15 is a device that pushes the deformable member T toward the covering member C (applies force toward the covering member C) to deform the deformable member T. The load-bearing device 15 is formed as a roughly thick plate-shaped cuboid, and the outer edge of its surface facing the deformable member T (hereinafter referred to as "surface 15f") is rounded all the way around its circumference. When viewed from above (viewed in the direction directly opposite to surface 15f), the load-bearing device 15 is formed to be the same size as the surface on the back side of the deformable contact surface Ts of the deformable member T (hereinafter referred to as "opposing surface Tf"). Except for the curvature of the outer edge, the surface 15f of the load-bearing device 15 is consistent with the opposing surface Tf. The curvature of the outer edge of the surface 15f is formed to be the same as the curvature of the outer edge Ce of the covering contact surface Cs. Therefore, when the deformable member T is placed on the surface 15f, before the load is applied, the main deformable part Ta is in a state of floating off the surface 15f.
[0024] The pressing part 17 is used to fix the covering member C in order to support the deformable member T when the deformable member T is pressed towards the covering member C by the weight-bearing device 15. The pressing part 17 is configured to have an inner surface 17f, which is excavated in the surface of the cuboid member to accommodate the covering member C. The size of the surface can include the size of the covering member C when viewed from above. The shape of the inner surface 17f is formed to match the back surface of the covering contact surface Cs of the covering member C. The pressing part 17 is configured to hold the covering member C accommodated in the inner surface 17f by means of vacuum adsorption or other means (not shown).
[0025] The control device 19 is a machine for controlling the operation of the bonding component manufacturing apparatus 1. The control device 19 is configured to be electrically connected to the supply device 11 via wired or wireless means, and to control the adjustment of the supply flow rate of the adhesive R (including the flow rate O when the supply is stopped), and to control the movement amount and direction of the supply device 11. In addition, the control device 19 is also configured to be electrically connected to the UV irradiator 13 via wired or wireless means, and to adjust whether ultraviolet light is irradiated from the UV irradiator 13 and the intensity of the irradiated ultraviolet light, and to control the movement and direction of the UV irradiator 13. In addition, the control device 19 is also configured to be electrically connected to the load-bearing device 15 via wired or wireless means, and to move the load-bearing device 15 in the load-bearing direction and the unload-bearing direction. In addition, the control device 19 is also configured to be electrically connected to the pressing part 17 via wired or wireless means, and to switch the holding state and non-holding state of the covering component C.
[0026] Referring again to FIG3, a method for manufacturing an embodiment of the bonding member E will be described. FIG3 is a flowchart showing the manufacturing steps of the bonding member E. In this embodiment, as mentioned above, the shape (radius of curvature) of the arc-shaped portion of the outer edge Ce of the cover member C and the arc-shaped portion Te of the deformable outer edge Te are not the same as those of the bonding surfaces Cs and Ts constituting the bonding member E. If the shapes of the two are the same, they can be bonded simply by placing the adhesive R between them and pressing them against each other. However, due to the limitations of the manufacturing technology of the cover member C and / or the deformable member T, or the supply of the adhesive R, it is practically difficult to bond them by simply pressing them against each other. In view of this situation, this embodiment describes a method for manufacturing the bonding member E by properly bonding the cover member C and the deformable member T, whose bonding surfaces have different shapes. The following describes a method for manufacturing a bonding member E using the bonding member manufacturing apparatus 1 (see Figure 1) described so far. However, it is also possible to manufacture the member using an apparatus other than the bonding member manufacturing apparatus 1. The following description of the method for manufacturing a bonding member E using the bonding member manufacturing apparatus 1 also includes an explanation of the function of the bonding member manufacturing apparatus 1. In the following description, when referring to the configuration of the bonding member manufacturing apparatus 1 and / or the bonding member E (including constituent elements), reference is made appropriately to Figures 1 and / or 2(A) and / or 2(B). In this embodiment, the case where the adhesive R is supplied to the bonding surface Cs is described.
[0027] When the manufacturing of the bonding member E begins, the covering member C is held by the pressing part 17 (S1). At this time, the covering member C is received into the inner surface 17f in such a way that the back side of the covering bonding surface Cs contacts the inner surface 17f. This exposes the covering bonding surface Cs. Next, with the adhesive R being delivered from the supply port 11h of the supply device 11, the supply device 11 is moved along the covering bonding surface Cs, and the adhesive R is supplied to the necessary portion of the covering bonding surface Cs (adhesive supply step: S2). In this embodiment, since the adhesive R is supplied in a gel-like form, the adhesive R is in close contact with the necessary portion of the covering bonding surface Cs (supply without gaps) at the same time as the adhesive R is supplied to the necessary portion (adhesive contact step: S3). That is, in this embodiment, the adhesive supply step (S2) and the adhesive contact step (S3) are performed simultaneously.
[0028] After the adhesive R is adhered to the covering bonding surface Cs, the adhesive R supplied to the covering bonding surface Cs is irradiated with ultraviolet light using a UV irradiator 13, increasing the viscosity of the adhesive R until it becomes harder than the deformable member T (adhesion-enhancing step: S4). Furthermore, the deformable member T, placed on the surface 15f of the load-bearing device 15, is moved closer to the covering member C, and the adhesive R is clamped and held between the covering bonding surface Cs and the deformable bonding surface Ts (adhesive clamping step: S5). In the flowchart shown in FIG3, the adhesive clamping step (S5) is performed after the adhesion-enhancing step (S4), but it can also be performed before the adhesion-enhancing step (S4), or the adhesion-enhancing step (S4) and the adhesive clamping step (S5) can be performed simultaneously. Additionally, the action of placing the deformable member T on the surface 15f of the load-bearing device 15 can be completed before the adhesive clamping step (S5) begins.
[0029] Next, the weight-bearing device 15 is brought closer to the pressing part 17, and a load is applied to the deformable member T to bring it close to the covering member C and the adhesive R that is in close contact with the covering member C, thereby deforming the deformable member T (weight-bearing step: S6). At this time, the covering member C is harder than the deformable member T in terms of characteristics, and the adhesive R that is in close contact with the covering member C has become harder than the deformable member T through the adhesion-enhancing step (S4), so the deformable member T will be deformed. In particular, the arc-shaped portion of the deformable outer edge Te that is inconsistent with the covering adhesive surface Cs of the covering member C will be deformed. In this way, while deforming the deformable member T, the weight-bearing device 15 is brought closer to the pressing part 17, thereby making the deformable adhesive surface Ts in close contact with the adhesive R that is in close contact with the covering adhesive surface Cs. Here, the adhesive R serves to bond the covering member C to the deformable member T and also performs some of the functions within the bonding member E, thus requiring the maintenance of a desired thickness. In this embodiment, the adhesive R, which is tightly bonded to the covering member C, becomes harder than the deformable member T. Therefore, when a load is applied to the deformable member T, the thickness of the adhesive R can be maintained while ensuring a tight bond between the deformable member T and the adhesive R.
[0030] After the deformable bonding surface Ts is in close contact with the adhesive R that is in close contact with the covering bonding surface Cs, the adhesive R is irradiated with ultraviolet light using a UV irradiator 13 to fix the adhesive R (adhesive fixing step: S7). Through this adhesive fixing step (S7), the viscosity of the adhesive R is increased until the required hardness is achieved for the bonding component E of the product. After the adhesive R is fixed, the load-bearing device 15 is moved away from the pressing part 17 to release the load applied to the deformable component T (load unloading step: S8). After the load-bearing device 15 is retracted, the bonding component E remaining on the pressing part 17 is removed, thus ending the series of steps in manufacturing the bonding component E. In addition, when the load-bearing device 15 is retracted, the bonding component E may also adhere to the load-bearing device 15 instead of remaining on the pressing part 17. The operation of the bonding component manufacturing apparatus 1 described so far is typically controlled by the control device 19.
[0031] As explained above, the bonding member manufacturing apparatus 1 and the bonding member manufacturing method according to this embodiment apply a load to the deformable member T, which is softer than the covering member C and the adhesive R, so that the deformable member T is close to the covering member C and the adhesive R that is in close contact with the covering member C, thereby deforming the deformable member T. Therefore, even if the shapes of the bonding surfaces of the covering member C and the deformable member T are inconsistent, the bonding member E can be manufactured by bonding appropriately.
[0032] Next, referring to FIG4, a method for manufacturing a modified embodiment of the bonding member E will be described. FIG4 is a flowchart showing the manufacturing steps of the modified embodiment of the bonding member E. The difference between this modified embodiment and the manufacturing steps shown in FIG3 is that an adhesive R that is generally fluid when the adhesive R is supplied is applied to the deformable bonding surface Ts, and the order of each step is also different. The manufacturing method of the bonding member E implemented in this embodiment is typically performed using the bonding member manufacturing apparatus 1, but it can also be performed using an apparatus other than the bonding member manufacturing apparatus 1.
[0033] When the manufacturing of the bonding member E begins, the deformable member T is placed on the surface 15f of the load-bearing device 15 (S11). At this time, the shape of the deformable outer edge Te in the opposing surface Tf is inconsistent with the shape of the surface 15f of the load-bearing device 15, so a gap is generated between the deformable main part Ta and the surface 15f of the load-bearing device 15. Next, while feeding the adhesive R from the supply port 11h of the supply device 11, the supply device 11 is moved along the deformable bonding surface Ts to supply the necessary part of the deformable bonding surface Ts with the adhesive R (adhesive supply step: S12). After the adhesive R is supplied to the deformable bonding surface Ts, the adhesive R supplied to the deformable bonding surface Ts is irradiated with ultraviolet light using the UV irradiator 13, so that the viscosity of the adhesive increases to the point that the adhesive R is softer than the covering member C and will not flow out due to its own weight (let this viscosity be "first viscosity"). (First viscosity-increasing step: S13) In the first adhesion-enhancing step (S13), the adhesion should be enhanced to the extent that it spreads when other components (typically the cover component C) are relatively pressed against the deformable bonding surface Ts to which the adhesive R has been supplied. Furthermore, the deformable component T, placed on the surface 15f of the load-bearing device 15, is brought close to the cover component C held in the pressing part 17, so that the cover bonding surface Cs and the deformable bonding surface Ts clamp and hold the adhesive R (adhesive clamping step: S14). In the flowchart shown in FIG4, the adhesive clamping step (S14) is performed after the first adhesion-enhancing step (S13), but it can also be performed before the first adhesion-enhancing step (S13), or simultaneously. Additionally, the holding of the cover component C using the pressing part 17 can be completed before the start of the adhesive clamping step (S14). Furthermore, in the adhesive supply step (S12), when the adhesive R has been supplied from the supply device 11 to the deformable bonding surface Ts at a first viscosity, the first adhesion enhancement step (S13) is omitted.
[0034] In the adhesive clamping step (S14), the deformable member T, placed on the surface 15f of the load-bearing device 15, is brought closer to the covering member C until the adhesive R supplied to the deformable bonding surface Ts is in close contact with the necessary portion (in this modified example, the entire covering bonding surface Cs). That is, at the end of the adhesive clamping step (S14), the adhesive R applied to the deformable bonding surface Ts is brought into close contact with the covering bonding surface Cs (adhesive contact step: S15). After the adhesive R is in close contact with the covering bonding surface Cs, the adhesive R supplied to the covering bonding surface Cs is irradiated with ultraviolet light using a UV irradiator 13, so that the viscosity of the adhesive R increases to the point that the adhesive R is softer than the covering member C and harder than the deformable member T (let this viscosity be called "second viscosity"). (Second viscosity-increasing step: S16). Furthermore, at the point when the adhesive R is in close contact with the covering bonding surface Cs, when the adhesive R has a second viscosity, the second adhesion-enhancing step (S16) is omitted. Next, the weight-bearing device 15 is moved closer to the pressing part 17, and a load is applied to the deformable member T, bringing it close to the covering member C and the adhesive R in close contact with the covering member C, thereby deforming the deformable member T (weight-bearing step: S17). At this time, since the adhesive R is softer than the covering member C and harder than the deformable member T, the deformation of the deformable member T is the greatest first, and the adhesive R also deforms as needed, conforming to the covering bonding surface Cs of the covering member C. Therefore, the deformable member T and the adhesive R can conform to the covering member C while maintaining the thickness of the adhesive R.
[0035] After the deformable member T and the adhesive R are fitted onto the covering member C, the adhesive R is irradiated with ultraviolet light using a UV irradiator 13 to fix the adhesive R (adhesive fixing step: S18). Through this adhesive fixing step (S18), the viscosity of the adhesive R is increased until the required hardness is achieved for the bonding member E of the product. After the adhesive R is fixed, the load-bearing device 15 is moved away from the pressing part 17 to release the load applied to the deformable member T (load unloading step: S19). After the load-bearing device 15 is retracted, the bonding member E remaining on the pressing part 17 is removed, thus ending the series of steps in manufacturing the bonding member E. In addition, when the load-bearing device 15 is retracted, the bonding member E may also adhere to the load-bearing device 15, rather than remaining on the pressing part 17.
[0036] As explained above, according to the manufacturing method of the bonding member of this modified example, even if the shapes of the bonding surfaces of the covering member C and the deformable member T are inconsistent, the bonding member E can be manufactured by properly bonding after supplying the bonding agent R to the deformable bonding surface Ts.
[0037] Referring next to Figures 5(A) and 5(B), a method for manufacturing a bonding member suitable for cases where the shape of the covering member C is complex will be described. Figures 5(A) and 5(B) are schematic configuration diagrams of a modified embodiment of the bonding member manufacturing apparatus 2, and are apparatuses suitable for the bonding member manufacturing method described herein. The bonding member manufacturing apparatus 2 includes: a base 21 for mounting the deformable member T, a membrane 23, an outer frame 25 for housing the base 21 and the membrane 23, a cover 26, and a spacer 27. The surface 21f of the base 21 for mounting the deformable member T is formed to have the same shape as the surface 15f of the load-bearing device 15 (see Figure 1). The base 21 is fixed to the bottom surface of the outer frame 25. The outer frame 25 is configured to have a vessel-like (container-like) shape with a depth capable of accommodating the base 21, the deformable member T, and the covering member C. The outer frame 25 has an open top surface, and a flange 25b extending outwards is formed along the entire circumference of the opening. The cover 26 covers the open top surface of the outer frame 25 via a spacer 27. The spacer 27 is configured to correspond in shape to the flange 25b in overall contact with it. The cover 26 is a plate-like component in overall contact with the spacer 27. The membrane 23 is a sheet-like component and has elasticity that deforms when a predetermined pressure is applied. The membrane 23 is configured to be sandwiched between the flange 25b and the spacer 27, thus separating the space enclosed by the outer frame 25, the spacer 27, and the cover 26. The space enclosed by the outer frame 25, spacer 27, and cover 26 is divided by the membrane 23 into: a present space Sp on the side of the membrane 23 closer to the base 21 (lower side in Figure 5(A)), and a non-present space Sq opposite to the base 21 relative to the membrane 23 (upper side in Figures 5(A) and 5(B)). The present space Sp is the space where the base 21, deformable member T, and cover member C (which will later become the contact object, or collectively referred to as "contact object A") exist during the manufacturing of the bonding member. The non-present space Sq is the space where the contact object A does not exist. The cover 26 is not in contact with the membrane 23 due to the presence of the spacer 27. The thickness of the spacer 27 can be determined simply by the size of the non-present space Sq formed between the membrane 23 and the cover 26.
[0038] One end of the lower pipe 31, which communicates with the existing space Sp, is connected to the outer frame 25. The lower pipe 31 guides the gas in the existing space Sp to the outside and functions as an exhaust flow path for the existing space. A lower valve 35, which can close the flow path, is provided in the lower pipe 31. One end of the upper pipe 32, which communicates with the non-existent space Sq, is connected to the cover 26. The upper pipe 32 guides the gas in the non-existent space Sq to the outside and functions as an exhaust flow path for the non-existent space. An upper valve 36, which can close the flow path, is provided in the upper pipe 32. The other ends of the lower pipe 31 and the upper pipe 32 are connected to one end of the exhaust pipe 33. The exhaust pipe 33 is a flow path that allows the gas in the lower pipe 31 and the gas in the upper pipe 32 to merge and be guided to the outside. A vacuum pump 38 is provided in the exhaust pipe 33. The lower valve 35, the upper valve 36, and the vacuum pump 38 are configured to be controlled by a control device 39. In other words, the control device 39 is configured to be electrically connected to the lower valve 35 and the upper valve 36 via wired or wireless means, and can individually control the opening and closing of the lower valve 35 and the upper valve 36 by transmitting control signals. Furthermore, the control device 39 is configured to be electrically connected to the vacuum pump 38 via wired or wireless means, and can control the start and stop of the vacuum pump 38 by transmitting control signals. The control device 39 is configured to cause the vacuum pump 38 to operate, thereby controlling the opening and closing of the lower valve 35 and the upper valve 36, thereby generating: a state where the internal pressure of the existing space Sp and the non-existent space Sq are equal (see Figure 5(A)), and a state where the internal pressure of the non-existent space Sq is higher than that of the existing space Sp (see Figure 5(B)). Although omitted from Figures 5(A) and 5(B), the bonding component manufacturing apparatus 2 configured as described above also includes a supply device 11 (see Figure 1) and a UV irradiator 13 (see Figure 1), and is configured such that the operation of these components can be controlled by the control device 39 in the same manner as the control device 19 (see Figure 1). Hereinafter, referring to Figure 6, a method for manufacturing a bonding component E using another variation of one embodiment of the bonding component manufacturing apparatus 2 will be described.
[0039] Figure 6 is a flowchart showing the manufacturing steps of the bonding member E in another variation. In this variation, the members to be bonded are the aforementioned covering member C and deformable member T, and these members are bonded by an adhesive R, which is in a gel state when supplied. In this variation, the adhesive R is first supplied to the necessary portion of the covering bonding surface Cs for the covering member C (adhesive supply step: S21). At the same time, the adhesive R is brought into close contact with the necessary portion of the covering bonding surface Cs (adhesive contact step: S22). Then, the viscosity of the adhesive R is increased until it is harder than that of the deformable member T (adhesive increase step: S23). The adhesive supply step (S21), adhesive contact step (S22), and adhesive increase step (S23) here are the same as the adhesive supply step (S2), adhesive contact step (S3), and adhesive increase step (S4) in the flowchart of Figure 3, respectively.
[0040] Next, the deformable member T and the covering member C are set in the space Sp (setting step: S24). The setting step (S24) is performed as follows. First, the deformable member T is placed on the surface 21f of the base 21 with the opposing surface Tf facing the surface 21f. Next, the covering member C, to which the adhesive R has been supplied to the covering bonding surface Cs, is placed on the deformable member T with the adhesive R facing the bonding surface Ts. After that, the opening of the outer frame 25 is covered with the membrane 23, and the spacer 27 and the cover 26 are placed on it. Figure 5(A) shows the state after the setting step (S24) is completed. At this time, since the shape of the arc-shaped portion of the deformable outer edge Te is not consistent with the shape of the arc-shaped portion of the covering outer edge Ce, a gap is formed between most of the adhesive R supplied to the covering bonding surface Cs and the deformable bonding surface Ts.
[0041] After the setup step (S24) is performed, the vacuum pump 38 discharges gas from both the presence space Sp and the non-existence space Sq to achieve a predetermined vacuum level (negative pressure generation step: S25). The predetermined vacuum level is typically the vacuum level at which air bubbles will not be generated inside when the covering member C and the deformable member T are attached in the steps described later. In this vacuuming process, the presence space Sp and the non-existence space Sq are set to the same vacuum level, thereby maintaining the configuration state of the membrane 23. When the presence space Sp and the non-existence space Sq reach the predetermined vacuum level, the upper valve 36 is closed to stop the vacuuming of the non-existence space Sq. On the other hand, the vacuuming of the presence space Sp continues, so that the pressure of the non-existence space Sq is higher than that of the presence space Sp, thus creating a pressure difference. By generating this pressure difference, the membrane 23 is brought into close contact with the object A, and a load is applied by using the force that pulls the membrane 23, which exists at the interface, further toward the space Sp, to bring the covering member C closer to the deformable member T (pressure difference generation step / loading step: S26). Thus, the membrane 23 is pressed from the non-existent space Sq side toward the existing space Sp side, thereby pressing the covering member C closer to the deformable member T. This causes the deformable member T, which is softer than the covering member C, the adhesive R, and the base 21, to deform, and the deformable bonding surface Ts comes into close contact with the adhesive R that is close to the covering bonding surface Cs (see Figure 5(B)). This deformation and contact mechanism is the same as the loading step (S6) in the flowchart shown in Figure 3. In this modified example, the existing space Sp is made to a predetermined vacuum level before the load is applied, thus preventing air bubbles from forming between the bonding surfaces. In addition, in the pressure difference generation step / load-bearing step (S26), before the deformable bonding surface Ts comes into close contact with the adhesive R, the adhesive R is subjected to a state of being clamped by the covered bonding surface Cs and the deformable bonding surface Ts. Therefore, the pressure difference generation step / load-bearing step (S26) includes an adhesive clamping step.
[0042] After the deformable bonding surface Ts is in close contact with the adhesive R that is in close contact with the covering bonding surface Cs, the adhesive R is fixed (adhesive fixing step: S27). The adhesive fixing step (S27) here is the same as the adhesive fixing step (S7) in the process of FIG3. Afterwards, the vacuum of the existing space Sp and the non-existent space Sq is broken, and the load applied to the object A is released (unloading step: S28). Afterwards, the cover 26 and the membrane 23 are removed from the outer frame 25, and the bonding member E is taken out, thus ending the series of steps for manufacturing the bonding member E. In addition, in the description of this modified example, in the pressure difference generation step / load step (S26), although the vacuum degree of the existing space Sp is increased (the pressure of the existing space Sp is lowered) to make the membrane 23 in close contact with the object A, it is also possible to increase the pressure of the non-existent space Sq to make the membrane 23 in close contact with the object A. Furthermore, although negative pressure is generated in the existing space Sp and the non-existent space Sq before the pressure difference generation step / loading step (S26) (S25), if there is no problem of air bubbles mixing into the surfaces to be bonded, the negative pressure generation step (S25) can be omitted, and the non-existent space Sq can be made into positive pressure in the pressure difference generation step / loading step (S26), thereby making the membrane 23 and the object to be bonded tightly bonded.
[0043] In the above description, the adhesive R is provided as a gel or in a fluid state, and is supplied to the covering bonding surface Cs or deformable bonding surface Ts in the form of being delivered from the supply port 11h of the supply device 11. However, it can also be supplied in the form of being formed into a sheet and disposed on the covering bonding surface Cs or deformable bonding surface Ts.
[0044] Although the adhesive R is designed to have the property that its viscosity increases when exposed to ultraviolet light, it may also have the property that its viscosity increases when heated (typically a thermosetting resin), or conversely, it may have the property that its viscosity decreases when heated and increases when released (typically a thermoplastic resin). Thus, when the adhesive R has the property that its viscosity changes due to the application and release of heat, a heating device or the like can be used as a viscosity-changing device.
[0045] In the above description, the adhesive R is supplied to either the covering member C or the deformable member T. However, in the case where the adhesive R is supplied to both the covering member C and the deformable member T, the adhesive R supplied to each member C and T may come into contact with each other when the covering member C and the deformable member T are brought close to each other to clamp and hold the adhesive R.
[0046] In the above description, the bonding device and the manufacturing method of the bonding completed component of the present invention are described using the figures as examples. However, the composition, structure, quantity, arrangement, shape, material, etc. of the manufacturing method and the object are not limited to the specific examples described above. Any appropriate selection and adoption by those skilled in the art to which this invention pertains is included within the scope of this invention as long as it contains the spirit of this invention.
[0047] All documents, including those publications, patent applications and patents cited in this specification, are incorporated herein by reference to the same extent that each document is specifically shown and referenced, and to the same extent that the entire contents of each document are stated herein.
[0048] The use of nouns and similar indicators used in connection with the description of this invention (especially in connection with the following claims) shall be construed as covering both the singular and plural, unless specifically indicated in this specification or obviously contradictory to the context of the text. Unless otherwise stated, the words “having,” “possessing,” “comprising,” and “including” are construed as open-ended conjunctions (i.e., meaning “including but not limited to…”). Unless specifically indicated in this specification, the specific statements of numerical ranges in this specification are intended only to serve as a concise way of referring individually to the various values falling within the range, which are incorporated into the specification by way of individual enumeration. Unless specifically indicated in this specification or obviously contradictory to the context of the text, all methods described in this specification may be performed in any suitable order. Unless specifically asserted, any examples or illustrative terms (e.g., “etc.”) used in this specification are intended only to better illustrate the invention and not to limit the scope of the invention. No wording in this specification should be construed as indicating that any element not described in the claims is indispensable to the implementation of the invention.
[0049] This specification includes the best embodiments known to the inventors for carrying out the invention, and describes preferred embodiments of the invention. Those skilled in the art will understand variations of these preferred embodiments upon reading the above description. The inventors anticipate that those skilled in the art will appropriately apply these variations, and expect that the invention will be carried out in ways other than those specifically described in this specification. Therefore, as permitted by applicable law, this invention includes modifications and equivalents to all claims appended to this specification. Furthermore, unless specifically indicated in this specification or clearly contradicted in the context of the text, any combination of the above elements in all variations is also included in this invention.
Claims
1. A method for manufacturing an adhesive component, comprising manufacturing an adhesive component by bonding a first component and a second component together using an adhesive with variable viscosity between a first bonding surface and a second bonding surface, wherein... The first component has the aforementioned first bonding surface; the second component is more flexible than the first component and has the aforementioned second bonding surface to be bonded to the aforementioned first bonding surface; the manufacturing method of the bonding component comprises: The adhesive supply step involves supplying the adhesive to the first bonding surface or the second bonding surface in such a way that it covers the necessary portion. The adhesive clamping step involves bringing the first adhesive surface close to the second adhesive surface so that the first adhesive surface and the second adhesive surface clamp and hold the adhesive. The adhesive bonding step involves ensuring a tight bond between the adhesive and a necessary portion of the first bonding surface; and The loading step involves applying a load to the second component relative to the aforementioned adhesive, thereby deforming the second component. The adhesive is in close contact with the first bonding surface and is harder than the second component.
2. A method for manufacturing the bonding member as described in claim 1, wherein, The aforementioned adhesive supply step is configured to supply the aforementioned adhesive to the aforementioned first bonding surface.
3. The method for manufacturing the bonding member as described in claim 1 or 2 comprises: an adhesive fixing step, which fixes the adhesive in a state of close contact with the first bonding surface and the second bonding surface before removing the load applied in the aforementioned load-bearing step.
4. The method for manufacturing the bonding member as described in any one of claims 1 to 3 comprises: The setting step involves setting the first and second components while they are in contact with a base having a hardness equal to or greater than that of the first component. The first and second components are positioned in a space divided by a thin film into an area containing the first and second components, and a space where neither component exists. The aforementioned load-bearing step includes a pressure difference generation step, which makes the pressure in the aforementioned non-existent space higher than the pressure in the aforementioned existing space, thereby making the aforementioned membrane element in close contact with the object to be in contact, which is formed by the contact of the aforementioned base, the aforementioned first component, and the aforementioned second component.
5. An apparatus for manufacturing a bonding component, comprising manufacturing a bonding component by bonding a first component and a second component together using an adhesive with variable viscosity between a first bonding surface and a second bonding surface, wherein... The first component has the aforementioned first bonding surface; the second component is more flexible than the first component and has the aforementioned second bonding surface to be bonded to the aforementioned first bonding surface; the bonding component manufacturing apparatus includes: The adhesive supply device supplies the adhesive to the first bonding surface or the second bonding surface. The viscosity-variable device is used to change the viscosity of the aforementioned adhesive; and The load-bearing device applies a load to the second component relative to the adhesive, causing the second component to deform. The adhesive is in close contact with the first bonding surface and is harder than the second component.