Polishing pad and method of forming the same

Abstract

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

Description

[Technical Field]

[0001] The embodiments disclosed herein generally relate to the manufacture of abrasive objects used in chemical mechanical polishing (CMP) processes. More specifically, the embodiments disclosed herein relate to composite abrasive pads. [Previous Technology]

[0002] Chemical mechanical polishing (CMP) is commonly used in the manufacturing process of semiconductor devices to planarize substrates. During CMP, the substrate to be processed is held on a carrier head, with the device surface positioned against a rotating polishing pad. The carrier head provides a controlled load on the substrate to press the device surface against the polishing pad. A polishing slurry (e.g., a slurry containing abrasive particles) is typically supplied to the surface of the polishing pad. Polishing pads are consumables because they are usually worn down and need to be replaced after polishing a certain number of substrates.

[0003] Polishing pads are typically made from polyurethane material by molding, casting, or sintering. In the case of molding, the polishing pad can be made in one step, for example by injection molding. In the case of casting, a liquid precursor is poured and solidified into a cake, which is then cut into individual pads. These pads can then be machined to the final thickness. Grooves can be machined into the polishing surface or formed as part of the injection molding process. These methods of manufacturing polishing pads are expensive and time-consuming. Polishing pads manufactured by these methods often produce uneven polishing results. For example, in a CMP process, different areas on the substrate may be polished at different rates, resulting in too much material being removed in some areas ("over-polishing") or too little material being removed in other areas ("under-polishing").

[0004] Therefore, there is a need for an abrasive pad that provides improved abrasive uniformity and a method for manufacturing the improved abrasive pad. [Summary of the Invention]

[0005] The embodiments disclosed herein generally provide an abrasive pad including a composite pad body and a method of forming the abrasive pad.

[0006] One embodiment provides an abrasive pad including a composite pad body. The composite pad body includes one or more first features formed of a first material or a first material composition, and one or more second features formed of a second material or a second material composition, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or the first material composition and the second material or the second material composition.

[0007] Another embodiment provides a method for forming an abrasive pad. The method includes depositing a plurality of composite layers using a 3D printer until a target thickness is reached. Depositing each of the plurality of composite layers includes the steps of: depositing a first material or a first material composition on one or more first regions, and depositing a second material or a second material composition on one or more second regions, wherein the one or more first regions and the one or more second regions form a continuous region. The method further includes curing the composite layers to form a composite pad body having one or more first features of the first material or the first material composition and one or more second features of the second material or the second material composition, wherein the one or more first features and the one or more second features form a single body.

[0008] Another embodiment provides an abrasive pad having a composite pad body. The composite pad body includes a plurality of abrasive features forming an abrasive surface, wherein the plurality of abrasive features are formed of a first material; and one or more base features formed of a second material, wherein the one or more base features jointly surround the plurality of abrasive features to form a single body.

[0009] One embodiment provides an abrasive pad comprising a composite abrasive pad body. The composite abrasive body includes one or more first features formed of a first material and one or more second features formed of a second material. The one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material and the second material.

[0010] In one embodiment, the first material comprises a first material composition formed by depositing droplets of a third material and a fourth material. In one embodiment, the second material comprises a second material composition formed by depositing droplets of a fifth material and a sixth material.

[0011] Yet another embodiment provides a method for forming an abrasive pad. The method includes depositing a plurality of composite layers using a 3D printer to achieve a target thickness. Depositing the plurality of composite layers includes the steps of: depositing a first material on one or more first regions of a surface, and depositing a second material on one or more second regions of the surface, wherein the one or more first regions and the one or more second regions form a continuous portion of each of the plurality of composite layers. The method further includes curing the plurality of composite layers to form a composite pad body having one or more first features comprising the first material and one or more second features comprising the second material. The one or more first features and the one or more second features form a single body.

Implementation Method

[0043] This disclosure relates to a polishing object and a method for manufacturing the polishing object, as well as a polishing substrate and a method for conditioning the polishing object before, during and after the polishing substrate.

[0044] Embodiments of this disclosure provide an abrasive pad having a composite pad body. The composite pad body includes individual features formed of at least two different materials. According to embodiments of this disclosure, the abrasive pad can be produced by a three-dimensional (3D) printing process. For example, the composite pad body can be formed by sequentially depositing a plurality of layers using a 3D printer, wherein each layer contains regions of different materials or different material compositions. In some embodiments, the plurality of layers can then be cured by a curing process. Individual features in the composite pad body can be formed simultaneously of different materials or different material compositions. The deposition and curing processes of 3D printing allow individual features to be firmly bonded together. The geometry of the individual features can be easily controlled using a 3D printing process. By selecting different materials or different material compositions, individual features can have different mechanical, physical, chemical, and / or geometric properties to obtain the desired pad properties. In one embodiment, the composite body can be formed of a viscoelastic material with different mechanical properties. For example, the composite body can be formed of a viscoelastic material with different storage moduli and different loss moduli. As a result, the composite pad body may include some elastic features formed of a first material or a composition of a first material and some hard features formed of a second material or a composition of a second material that is harder than the first material or the composition of the first material.

[0045] Figure 1 is a schematic cross-sectional view of a polishing station 100. The polishing station 100 can be used in a polishing system to polish a substrate. The polishing station 100 includes a platform 102. The platform 102 can rotate about a central axis 104. A polishing pad 106 can be placed on the platform 102. According to an embodiment of the present disclosure, the polishing pad 106 may include a composite polishing body. The polishing pad 106 includes a polishing surface 112 provided for contacting and processing the substrate. The platform 102 supports the polishing pad 106 and rotates the polishing pad 106 during polishing. A support head 108 can hold the substrate 110 to be processed against the polishing surface 112 of the polishing pad 106. The support head 108 can rotate about a central axis 114 and / or move in a sweeping motion to generate relative movement between the substrate 110 and the polishing pad 106. During polishing, a polishing fluid 116, such as polishing slurry, can be supplied to the polishing surface 112 by means of a conveyor arm 118. Polishing slurry 116 may contain abrasive particles, pH adjusters, and / or chemically active ingredients to enable chemical mechanical polishing of the substrate. Polishing pad

[0046] Figure 2A is a schematic perspective cross-sectional view of a polishing pad 200 according to an embodiment of the present disclosure. The polishing pad 200 can be used in a polishing station, such as polishing station 100, for polishing a substrate by chemical mechanical polishing.

[0047] The abrasive pad 200 includes a composite pad body 202. The composite pad body 202 includes one or more hard features 204 and one or more resilient features 206. The hard features 204 and the resilient features 206 are individual features whose boundaries are joined together to form the composite pad body 202. In one embodiment, the hard feature 204 may have a hardness of about 40 Shore D to about 90 Shore D. The resilient feature 206 may have a hardness value between about 26 Shore A and about 95 Shore A.

[0048] The composite pad body 202 can be formed by 3D printing or other suitable techniques. The composite pad body 202 may include a plurality of layers, wherein, depending on the design of the composite pad body 202, each layer includes an elastic feature 206 region and / or a hard feature 204 region deposited by a 3D printer. The plurality of layers can then be cured, for example by UV light or by a heat source, to solidify and achieve a target hardness. After deposition and curing, a single composite pad body 202 is formed, comprising the hard features 204 and elastic features 206 coupled or bonded together.

[0049] Materials with different mechanical properties can be selected for the elastic feature 206 and the hard feature 204 to achieve the desired grinding process. The dynamic mechanical properties of the elastic feature 206 and the hard feature 204 can be achieved by selecting different materials and / or selecting different hardening processes used in the feature forming process. In one embodiment, the elastic feature 206 may have a lower hardness value and a lower Young's modulus value, while the hard feature 204 may have a higher hardness value and a higher Young's modulus value. In another embodiment, dynamic mechanical properties such as storage modulus and loss modulus can be adjusted or controlled within each feature and / or adjusted or controlled by the physical layout, pattern, or combination of the elastic feature 206 and the hard feature 204 within or throughout the grinding surface of the grinding pad.

[0050] The rigid feature 204 may be formed from one or more polymer materials. The rigid feature 204 may be formed from a single polymer material or a mixture of two or more polymers to achieve the desired properties. In one embodiment, the rigid feature 204 may be formed from one or more thermoplastic polymers. The rigid feature 204 may be formed from thermoplastic polymers such as polyurethane, polypropylene, polystyrene, polyacrylonitrile, polymethyl methacrylate, polychlorotrifluoroethylene, polytetrafluoroethylene, polyoxymethylene, polycarbonate, polyimide, polyetheretherketone, polyphenylene sulfide, polyethersulfone, acrylonitrile butadiene styrene (ABS), polyetherimide, polyamide, melamine, polyester, polysulfone, polyvinyl acetate, fluorinated hydrocarbons, etc., as well as acrylates, copolymers of the above, grafts, and mixtures. In one embodiment, the rigid feature 204 may be formed from acrylates. For example, the rigid feature 204 may be polyurethane acrylate, polyether acrylate, or polyester acrylate. In another embodiment, the hard feature 204 may include one or more thermosetting polymers, such as epoxy resins, phenolic resins, amines, polyesters, ethyl carbamate, silicone, and acrylates, mixtures of the above, copolymers, and grafts.

[0051] In one embodiment, the hard feature may be formed from a simulated plastic 3D printing material. In one embodiment, abrasive particles may be embedded in the hard feature 204 to enhance the abrasive process. The material containing the abrasive particles may be a metal oxide, such as cerium oxide, aluminum oxide, silicon dioxide, or a combination thereof, a polymer, a dielectric metal, or a ceramic.

[0052] The elastic feature 206 may be formed from one or more polymer materials. The elastic feature 206 may be formed from a single polymer material or a mixture of two or more polymers to achieve the desired property. In one embodiment, the elastic feature 206 may be formed from one or more thermoplastic polymers. For example, the elastic feature 206 may be formed from thermoplastic polymers such as polyurethane, polypropylene, polystyrene, polyacrylonitrile, polymethyl methacrylate, polychlorotrifluoroethylene, polytetrafluoroethylene, polyoxymethylene, polycarbonate, polyimide, polyetheretherketone, polyphenylene sulfide, polyethersulfone, acrylonitrile butadiene styrene (ABS), polyetherimide, polyamide, melamine, polyester, polysulfone, polyvinyl acetate, fluorinated hydrocarbons, etc., as well as acrylates, copolymers of the above, grafts, and mixtures. In one embodiment, the elastic feature 206 may be formed from acrylates. For example, the elastic feature 206 may be polyurethane acrylate, polyether acrylate, or polyester acrylate. In another embodiment, the elastic feature 206 may be formed of a thermoplastic elastomer. In one embodiment, the elastic feature 206 may be formed of a rubber-like 3D printing material.

[0053] The hard feature 204 is generally harder and more rigid than the elastic feature 206, while the elastic feature 206 is softer and more flexible than the hard feature 204. The materials and patterns of the hard feature 204 and the elastic feature 206 can be selected to achieve the "adjustment" bulk material of the abrasive pad 200. The abrasive pad 200 formed using this "adjustment" bulk material has various advantages, such as improved abrasive results, reduced manufacturing costs, and extended pad life. In one embodiment, the "adjustment" bulk material or the abrasive pad as a whole can have a hardness between about 65 Shore A and about 75 Shore D. The tensile strength of the abrasive pad can be between 5 MPa and about 75 MPa. The abrasive pad can have an elongation at break of about 5% to about 350%. The abrasive pad can have a shear strength greater than about 10 mPa. The abrasive pad can have a storage modulus between about 5 MPa and about 2000 MPa. The abrasive pad can have a stable storage modulus in a temperature range of 25 °C to 90 °C, such that the storage modulus ratio of E30 / E90 falls between about 6 and about 30, where E30 is the storage modulus at 30 °C and E90 is the storage modulus at 90 °C.

[0054] In one embodiment, the materials of the hard feature 204 and the elastic feature 206 are chemically resistant to the abrasive slurry. In another embodiment, the materials of the hard feature 204 and the elastic feature 206 are hydrophilic.

[0055] In one embodiment, the hard feature 204 and the elastic feature 206 may be alternating concentric rings arranged to form a circular composite pad body 202. In one embodiment, the height 210 of the hard feature 204 is greater than the height 212 of the elastic feature 206, such that the upper surface 208 of the hard feature 204 protrudes from the elastic feature 206. A groove 218 or channel is formed between the hard feature 204 and the elastic feature 206. During polishing, the upper surface 208 of the hard feature 204 forms a polishing surface that contacts the substrate, while the groove 218 retains polishing fluid. In one embodiment, the hard feature 204 is thicker than the elastic feature 206 in a direction perpendicular to the plane parallel to the composite pad body 202, such that the groove 218 and / or channel are formed on the top surface of the composite pad body 202.

[0056] In one embodiment, the width 214 of the hard feature 204 may be between about 250 micrometers and about 2 millimeters. The spacing 216 between the hard features 204 may be between about 0.5 millimeters and about 5 millimeters. Each hard feature 204 may have a width in the range of about 250 micrometers to about 2 millimeters. The width 214 and / or the spacing 216 may vary across the radius of the abrasive pad 200 to areas of different hardness.

[0057] Compared to conventional abrasive pads, the composite abrasive pad 200 disclosed herein has several advantages. Conventional abrasive pads typically include an abrasive layer with a textured abrasive surface and / or an abrasive material supported by a sub-pad formed of a soft material (e.g., foam material) to achieve a target hardness or Young's modulus for abrasive substrates. By selecting materials with various mechanical properties (e.g., Young's modulus, storage modulus, and loss modulus) and adjusting the size and spacing of features or changing the configuration of different features, ideal hardness, dynamic properties, and / or mechanical properties can be achieved in the composite pad body 202 without using sub-pads. Therefore, the abrasive pad 200 reduces ownership costs by eliminating the need for sub-pads. Furthermore, the hardness and abrasiveness of the abrasive pad 200 can be adjusted by mixing features with different hardness and abrasiveness, thereby improving abrasive performance.

[0058] The composite abrasive pad disclosed herein can possess variable mechanical properties, such as Young's modulus or storage modulus and loss modulus, at various locations on the surface features (e.g., hard feature 204) and the substrate (e.g., elastic feature 206), through pattern variations and / or variations in feature dimensions. The mechanical properties at various locations on the abrasive pad can be symmetrical or asymmetrical, uniform or non-uniform, to achieve the desired properties. Depending on the desired properties achieved, such as predetermined mechanical properties, such as Young's modulus or storage modulus and loss modulus, the pattern of the surface features at various locations on the abrasive pad can be radial, concentric, rectangular, or irregular.

[0059] In one embodiment, hard features and elastic features can be interlocked to improve the strength and solid integrity of the composite abrasive pad. The interlocked hard and elastic features can improve the shear strength and / or tensile strength of the abrasive pad.

[0060] Figure 2B is a schematic partial top view of an abrasive pad 200b according to an embodiment of the present disclosure. The abrasive pad 200b is similar to the abrasive pad 200 of Figure 2A, except that the abrasive pad 200b includes interlocking hard features 204b and elastic features 206b. The hard features 204b and elastic features 206b may form a plurality of concentric rings. In one embodiment, the hard feature 204b may include a protruding vertical ridge 220, while the elastic feature 206b may include a vertical groove 222 for receiving the vertical ridge 220. Alternatively, the elastic feature 206b may include a protruding ridge, while the hard feature 204b includes a groove. By interlocking the elastic feature 206b with the hard feature 204b, the abrasive pad 200b will have greater mechanical strength than the shear forces that may be applied during CMP processes and / or material handling.

[0061] Figure 2C is a schematic partial cross-sectional view of an abrasive pad 200c according to an embodiment of the present disclosure. The abrasive pad 200c is similar to the abrasive pad 200 of Figure 2A, except that the abrasive pad 200c includes interlocking hard features 204c and elastic features 206c. The hard features 204c and elastic features 206c may include a plurality of concentric rings. In one embodiment, the hard feature 204c may include a protruding sidewall 224, while the elastic feature 206c may include a recessed sidewall 225 for receiving the hard feature 204c. Alternatively, the elastic feature 206c may include a protruding sidewall, while the hard feature 204c includes a recessed sidewall. By interlocking the elastic feature 206c with the hard feature 204c via the protruding sidewall, the abrasive pad 200c gains increased tensile strength. Furthermore, the interlocking sidewalls prevent the abrasive pad 200c from being pulled apart.

[0062] Figure 2D is a schematic partial cross-sectional view of an abrasive pad according to an embodiment of the present disclosure. The abrasive pad 200d is similar to the abrasive pad 200c of Figure 2C, except that the abrasive pad 200d includes interlocking features with different arrangements. The abrasive pad 200d may include a hard feature 204d and an elastic feature 206d. The hard feature 204d and the elastic feature 206d may include a plurality of concentric rings. In one embodiment, the hard feature 204d may include a horizontal ridge 226, while the elastic feature 206d may include a horizontal groove 227 for receiving the horizontal ridge 226 of the hard feature 204d. Alternatively, the elastic feature 206d may include a horizontal ridge, while the hard feature 204d includes a horizontal groove. In one embodiment, vertical interlocking features (e.g., the interlocking features of Figure 2B) and horizontal interlocking features (e.g., the interlocking features of Figures 2C and 2D) may be combined to form the abrasive pad.

[0063] Figure 3A is a schematic perspective cross-sectional view of an abrasive pad 300 according to an embodiment of the present disclosure. The abrasive pad 300 includes a plurality of surface features 302 extending from a substrate layer 304. The upper surface 306 of the surface features 302 forms an abrasive surface for contacting the substrate during abrasion. The surface features 302 and the substrate layer 304 have different properties. For example, the surface features 302 may be formed of a rigid material, such as the material used for the rigid features 204 of the abrasive pad 200, while the substrate layer 304 may be formed of an elastic material, such as the material used for the elastic features 206 of the abrasive pad 200. Similar to the abrasive pad 200, the abrasive pad 300 may be formed by 3D printing.

[0064] In one embodiment, surface features 302 may have substantially the same size. Alternatively, the size of surface features 302 may be varied to create different mechanical properties at various locations on the abrasive pad 300, such as different Young's moduli or different storage moduli and different loss moduli.

[0065] In one embodiment, the surface features 302 may be uniformly distributed throughout the polishing pad 300. Alternatively, the surface features 302 may be configured in a non-uniform pattern to achieve the desired properties in the polishing pad 300.

[0066] In Figure 3A, surface feature 302 is illustrated as a cylinder protruding from substrate layer 304. Alternatively, surface feature 302 may have any suitable shape, such as a column with an elliptical, square, rectangular, triangular, polygonal, or irregular cross-section. In one embodiment, surface feature 302 may have different shapes to adjust the hardness of abrasive pad 300.

[0067] Figure 3B is a schematic partial top view of an abrasive pad 300b according to an embodiment of the present disclosure. The abrasive pad 300b is similar to the abrasive pad 300 of Figure 3A, except that the abrasive pad 300b includes a plurality of surface features 302b interlocking with a substrate layer 304b. In one embodiment, each of the plurality of surface features 302b may include a protruding vertical ridge 310, and the substrate layer 304b may include a vertical groove 312 for receiving the vertical ridge 310. Alternatively, the substrate layer 304b may include a protruding ridge, and the surface feature 302b includes a groove. By interlocking the surface features 302b with the substrate layer 304b, the abrasive pad 300b becomes mechanically stronger under applied shear force.

[0068] Figure 3C is a schematic partial cross-sectional view of an abrasive pad 300c according to an embodiment of the present disclosure. The abrasive pad 300c is similar to the abrasive pad 300 of Figure 3A, except that the abrasive pad 300c includes a plurality of surface features 302c interlocking with a substrate layer 304c. In one embodiment, each of the plurality of surface features 302c may include a protruding horizontal ridge 314, and the substrate layer 304c may include a horizontal groove 316 for receiving the horizontal ridge 314. Alternatively, the substrate layer 304c may include a protruding ridge, and the surface feature 302c includes a groove. By using protruding sidewalls to interlock the substrate layer 304c with the surface features 302c, the abrasive pad 300c achieves enhanced tensile strength. Furthermore, the interlocking sidewalls prevent the abrasive pad 300c from being pulled apart during CMP processing or during the processing of CMP pads.

[0069] In another embodiment, vertical interlocking features (e.g., the interlocking features in Figure 3B) and horizontal interlocking features (e.g., the interlocking features in Figure 3C) can be combined to form an abrasive pad.

[0070] Figure 4 is a schematic perspective cross-sectional view of an abrasive pad 400 according to one embodiment of the present disclosure. The abrasive pad 400 includes a soft and elastic base layer 402, similar to the elastic feature 206 of the abrasive pad 200. Similar to the elastic feature 206, the base layer 402 may be formed of one or more elastomeric polymers. The abrasive pad 400 includes a plurality of surface features 406 extending from the base layer 402. The outer surface 408 of the surface features 406 may be formed of a soft material or a composition of soft materials. In one embodiment, the outer surface 408 of the surface features 406 may be formed of the same material or the same material composition as the base layer 402. The surface features 406 may also include hard features 404 embedded therein. The hard features 404 may be formed of a material or material composition that is harder than the surface features 406. The hard features 404 may be formed of a material similar to the material of the hard features 204 of the abrasive pad 200. The embedded hard feature 404 alters the effective hardness of surface feature 406, thus providing the target pad hardness required for polishing. The soft polymer layer on the outer surface 408 can be used to reduce defects and improve planarization on the substrate being polished. Alternatively, the soft polymer material can be printed onto the surface of other polishing pads disclosed herein to provide the same benefits.

[0071] Figure 5 is a schematic perspective sectional view of an abrasive pad 500 having one or more viewing windows 510. The abrasive pad 500 may have a pad body 502. The pad body 502 may include one or more resilient features 506 and a plurality of hard features 504 extending from the resilient features 506 for abrasion. The resilient features 506 and hard features 504 may be formed of a material similar to the material used for the resilient features 206 and hard features 204 of the abrasive pad 200. According to this disclosure, the hard features 504 may be arranged in any suitable pattern.

[0072] One or more viewing windows 510 may be formed of a transparent material to allow observation of the polished substrate. Viewing windows 510 may be formed with resilient features 506 or hard features 504 through and / or adjacent portions. In some embodiments, viewing windows 510 may be formed of a generally transparent material and thus capable of transmitting light emitted from a laser and / or white light source used in a CMP optical endpoint detection system. In one embodiment, viewing windows 510 may be formed of a transparent 3D-printed photopolymer. In one example, viewing windows 510 may be formed of polymethyl methacrylate (PMMA). In some embodiments, viewing windows 510 are formed of a material with a low refractive index approximately the same as that of the polishing slurry, and the material has high optical transparency to reduce reflections from the air / window / water interface and improve light transmission through viewing windows 510 as it enters and exits the substrate. The optical transparency should be high enough to provide at least about 25% (e.g., at least about 50%, at least about 80%, at least about 90%, at least about 95%) of light transmission across the wavelength range of the light beam used by the photodetector in the endpoint detection system. Typical optical endpoint detection wavelength ranges include the visible spectrum (e.g., from about 400 nm to about 800 nm), the ultraviolet (UV) spectrum (e.g., from about 300 nm to about 400 nm), and / or the infrared spectrum (e.g., from about 800 nm to about 1550 nm).

[0073] Figure 6 is a schematic perspective sectional view of an abrasive pad 600 including a backing layer 606. The abrasive pad 600 includes a substrate layer 604 and a plurality of surface features 602 protruding from the substrate layer 604. The abrasive pad 600 may be similar to the abrasive pads 200, 300, 400, and 500 described above, except that the backing layer 606 is attached to the substrate layer 604. The backing layer 606 can provide the required compressibility to the abrasive pad 600. The backing layer 606 may also be used to modify the overall mechanical properties of the abrasive pad 600 to achieve the required hardness and / or have the required dynamic material properties (e.g., storage modulus and elastic modulus). The backing layer 606 may have a hardness value less than 80 Shore A.

[0074] In one embodiment, the backing layer 606 may be formed of an open-cell or closed-cell foam material, such as polyurethane or polysiloxane with pores, such that the pores disintegrate and the backing layer 606 is compressed under pressure. In another embodiment, the backing layer 606 may be formed of natural rubber, ethylene propylene diene monomer (EPDM) rubber, nitrile, or polychloroprene (Neoprene rubber).

[0075] Figure 7 is a schematic cross-sectional view of a polishing pad 700 having multiple regions. The polishing pad 700 can be designed to have different properties in the region contacting the central area of ​​the substrate and the region contacting the edge area of ​​the substrate during polishing. Figure 7 schematically illustrates a carrier head 108 positioning the substrate 110 relative to the polishing pad 700. In one embodiment, the polishing pad 700 may include a composite pad body 702 disposed on a backing layer 704. The composite pad body 702 can be manufactured by 3D printing. As shown in Figure 7, the polishing pad 700 can be divided along the radius of the polishing pad into an outer edge region 706, a central region 708, and an inner edge region 710. The outer edge region 706 and the inner edge region 710 contact the edge area of ​​the substrate 110 during polishing, while the central region 708 contacts the central area of ​​the substrate during polishing.

[0076] The abrasive pad 700 has different mechanical properties on the edge regions 706, 708 than on the central region 708, such as Young's modulus or storage modulus and loss modulus, to improve edge abrasion quality. In one embodiment, the edge regions 706, 710 may have a lower Young's modulus than the central region 708.

[0077] Figure 8 is a partially enlarged cross-sectional view of the abrasive pad 700, illustrating an exemplary design for the outer edge region 706 and the central region 708. The outer edge region 706 includes a substrate layer 806 and a plurality of surface features 804. The surface features 804 may be formed of a material harder than the substrate layer 806. The central region 708 includes a substrate layer 808 and a plurality of surface features 802. The surface features 802 may be formed of a material harder than the substrate layer 808. In one embodiment, the central region 708 may include a locking layer 810 beneath the substrate layer 808. The locking layer 810 may be formed of a hard material, such as the material used for surface feature 302 or hard feature 202. The plurality of surface features 802 may be printed on the locking layer 810 to improve stability. As shown in Figure 8, in terms of size, the surface features 802 in the central region 708 are larger than the surface features 804 in the outer edge region 706. In one embodiment, the distance between surface features 804 in the outer edge region 706 may be smaller than the distance between surface features 802 in the central region 708.

[0078] Figure 9 is a schematic cross-sectional view of an abrasive pad 900 having two different abrasive surfaces 902 and 904. The abrasive pad 900 is a composite abrasive pad including individual features. The abrasive surfaces 902 and 904 may have different patterns and / or different hardness and abrasiveness. In one embodiment, the abrasive surface 904 may be a hard, wear-resistant surface for abrading a substrate, and the abrasive surface 904 may be a soft surface. During the abrasive process, as the abrasive pad 900 rotates about its central axis (e.g., the center of the abrasive pad extending from the page of the figure), the substrate 110 is alternately exposed to the two abrasive surfaces 902 and 904 during each rotation of the abrasive pad. If the abrasive surface 902 is configured for bulk abrasion and the abrasive surface 904 is configured for soft abrasion, then the abrasive pad 900 performs both bulk abrasion and soft abrasion simultaneously in each rotation, thereby enabling the two abrasive stages to be performed concurrently.

[0079] Figure 10 is a schematic cross-sectional view of the abrasive pad 1000. The abrasive pad 1000 may include two or more composite pad bodies 1002, 1006, 1004. The composite pad bodies 1002, 1004, 1006 may be formed by 3D printing. The composite pad bodies 1002, 1004, 1006 may have the same or different patterns formed on them. The composite pad bodies 1002, 1004, 1006 may include locking features 1008, 1010 to securely connect them to each other to form the abrasive pad 1000. The configuration of multiple composite pad bodies provides flexibility in the manufacture and / or transport of the abrasive pad.

[0080] Figure 11 is a partial cross-sectional view of the composite pad bodies 1002 and 1004, illustrating locking features according to one embodiment of this disclosure. For example, locking feature 1008 may be a horizontal ridge, while locking feature 1010 may be a horizontal groove for receiving the horizontal ridge. Any suitable locking feature may be used to combine the composite pad bodies 1002, 1004, and 1006. 3D Printing Station

[0081] Figure 12 is a schematic cross-sectional view of a 3D printing station 1200 for manufacturing an abrasive pad according to this disclosure. The abrasive pad 200 can be printed on a support 1202. The abrasive pad 200 is formed from a CAD (computer-aided design) program using a droplet jet printer 1206. During the printing process, the droplet jet printer 1206 and the support 1202 can move relative to each other.

[0082] The droplet jet printer 1206 may have one or more print heads having nozzles for dispensing liquid precursors. In the embodiment of Figure 12, the droplet jet printer 1206 includes a print head 1208 with nozzle 1210 and a print head 1214 with nozzle 1212. Nozzle 1210 may be configured to dispense liquid precursors for a first material (e.g., a soft or elastic material), while nozzle 1212 may be used to dispense liquid precursors for a second material (e.g., a hard material). In other embodiments, the droplet jet printer 1206 may include more than two print heads to form an abrasive pad having more than two materials. The liquid precursor may be dispensed only at selected locations or areas to form the abrasive pad 200. These selected locations collectively form a target printed pattern of surface features and substrate layers, and may be stored as a CAD-compatible file, which is then read by an electronic controller 1204 (e.g., a computer) controlling the droplet jet printer 1206.

[0083] The 3D printing processes described herein include, but are not limited to, multi-jet deposition, inkjet printing, fused deposition modeling, binder jetting, powder bed fusion, selective laser sintering, stereolithography, barrel photopolymerization digital photoprocessing, sheet lamination, directional energy deposition, and other 3D deposition or printing processes.

[0084] After 3D printing, the polishing pad can be cured by hardening. Hardening can be performed by heating the printed polishing pad to a hardening temperature. Alternatively, hardening can be performed by exposing the printed polishing pad to an ultraviolet beam generated by an ultraviolet light source.

[0085] 3D printing provides a convenient and highly controllable process for producing polishing pads with individual features formed from different materials and / or compositions of different materials. In one embodiment, the elastic and / or hard features of the polishing pad can be formed from a single material. For example, the elastic features of the polishing pad can be formed from a first material dispensed from printhead 1210. The hard features of the polishing pad can be formed from droplets of a second material dispensed from printhead 1212.

[0086] In another embodiment, the elastic features and / or hard features may be formed from a mixture of two or more materials. Figure 13 is a schematic partial cross-sectional view of an abrasive pad 1300 having hard features 1304a and 1304b formed from a composition of two materials. Hard features 1304a and 1304b may be formed from a mixture of a first material and a second material. The first material may be dispensed in the form of droplets 1316 by a first printhead (e.g., printhead 1210), and the second material may be dispensed in the form of droplets 1318 by a second printhead (e.g., printhead 1212). To form hard feature 1304a using a mixture of droplets 1316 and droplets 1318, printhead 1212 may first be aligned with the pixel corresponding to hard feature 1304a, and droplets 1318 may be dispensed onto a predetermined pixel. Then printhead 1210 may be aligned with the pixel corresponding to hard feature 1304a, and droplets 1316 may be dispensed onto the predetermined pixel. As a result, a layer including droplets 1316 and droplets 1318 is added to the hard featurer 1304a. Therefore, the abrasive pad can be formed from a first material comprising a first material composition (formed by depositing droplets of one or more materials) and a second material comprising a second material composition (formed by depositing droplets of one or more different materials).

[0087] The properties of the hard features 1304a and 1304b can be adjusted or harmonized based on the ratio and / or distribution of the first and second materials. In one embodiment, the composition of the hard features 1304a and 1304b is controlled by selecting the size, position, velocity, and / or density of the droplets 1316 and 1318.

[0088] Hard features 1304a and 1304b may have the same composition. Alternatively, each hard feature 1304a and 1304b may have an individual composition. Similarly, the elastic feature 1306 may also be formed from a mixture of materials. The composition of each elastic feature 1306 may also be individualized to achieve the desired properties. Even if only two materials are used to form features 1304a and 1304b, embodiments disclosed herein include forming features on a polishing pad using a plurality of materials. In some configurations, the composition of hard and / or elastic features in the polishing pad is adjusted in a plane parallel to the polishing surface and / or by the thickness of the polishing pad, as discussed further below. Polishing Pad Pattern

[0089] Figures 14A-14O are schematic diagrams of a polishing pad design according to embodiments of the present disclosure. Each of Figures 14A-14O includes a pixel image having white areas (in the regions of white pixels) representing polishing features 1402a-1402o for contacting and polishing the substrate, and black areas (in the regions of black pixels) representing base features 1404a-1404o. Polishing features 1402a-1402o may be similar to hard features 204 of polishing pad 200. Base features 1404a-1404o may be similar to elastic features 206 of polishing pad 200. The white areas generally protrude above the black areas, such that channels are formed in the black areas between the white areas. During polishing, polishing slurry can flow through the channels and can be retained in the channels. The polishing pad illustrated in Figures 14A-14O can be formed by depositing a plurality of material layers using a 3D printer. Each of the plurality of layers may comprise two or more materials to form abrasive features 1402a-1404o and base features 1404a-1404o. In one embodiment, abrasive features 1402a-1402o may be thicker than base features 1404a-1404o in a direction perpendicular to the plane parallel to the plurality of material layers, such that grooves and / or channels are formed on the top surface of the abrasive pad.

[0090] Figure 14A is a schematic pixel diagram of a polishing pad design 1400a having a plurality of concentric polishing features 1402a. The polishing features 1402a can be concentric circles of equal width. In one embodiment, the base features 1404a can also have the same width, such that the radial spacing of the polishing features 1402a is fixed. During polishing, the channels between the polishing features 1402a retain the polishing slurry and prevent the polishing slurry from being rapidly lost due to the centrifugal force generated by the rotation of the polishing pad around its central axis (i.e., the center of the concentric circles).

[0091] Figure 14B is a schematic pixel diagram of a polishing pad design 1400b having a plurality of segmented polishing features 1402b arranged in concentric circles. In one embodiment, the segmented polishing features 1402b may have substantially the same length. The segmented polishing features 1402b may form a plurality of concentric circles. In each circle, the segmented polishing features 1402b may be evenly distributed within each concentric circle. In one embodiment, the segmented polishing features 1402b may have the same width in the radial direction. In some embodiments, each segmented polishing feature 1402b has substantially the same length regardless of the radius of the concentric circles (e.g., equal arc lengths, except for the central region of the polishing pad). In one embodiment, the base features 1404b between the plurality of concentric circles may also have the same width, such that the spacing between the concentric circles is fixed. In one embodiment, the gaps between the segmented polishing features 1402b may be staggered between the circles to prevent the polishing slurry from flowing directly out of the polishing pad under the centrifugal force generated by the rotation of the polishing pad around its central axis.

[0092] Figure 14C is a schematic pixel diagram of a polishing pad design 1400c having a plurality of concentric polishing features 1402c formed above a base feature 1404c. The pad design in Figure 14C is similar to the pad design 1400a in Figure 14A, except that the width of the polishing features 1402c gradually changes along the radial direction. In one embodiment, the width of the polishing features decreases from the center of the polishing pad to the edge of the polishing pad, while the distance between adjacent polishing features 1402c remains constant. As the polishing pad rotates about its central axis, the change in the width of the polishing features 1402c can be used to compensate for differences in the linear velocity of the substrate being polished at various radial positions on the polishing pad.

[0093] Figure 14D is a schematic pixel diagram of a polishing pad design 1400d having a plurality of concentric polishing features 1402d formed above a base feature 1404d. The pad design in Figure 14D is similar to the pad design 1400a in Figure 14A, except that the polishing features 1402d are elliptical instead of circular. The elliptical polishing features 1402d will allow for polishing features of various sizes and orientations at any radial location on the polishing pad, thereby improving polishing uniformity.

[0094] Figure 14E is a schematic pixel diagram of a polishing pad design 1400e having a plurality of concentric elliptical polishing features 1402e formed above the base feature 1404e. The pad design in Figure 14E is similar to the pad design 1400d in Figure 14D, except that the elliptical polishing features 1402e vary in width along the radial direction. Elliptical polishing features with different widths allow for greater variation in the radial position of the polishing pad in contact with the substrate during polishing, thereby improving polishing uniformity.

[0095] Figure 14F is a schematic pixel diagram of a grinding pad design 1400f having a spiral grinding feature 1402f above a base feature 1404f. In Figure 14F, the grinding pad 1400f has four spiral grinding features 1402f extending from the center of the grinding pad to the edge of the grinding pad. Although four spiral grinding features are shown, fewer or more spiral grinding features 1402f can be configured in a similar manner. The spiral grinding features 1402f define a spiral channel. In one embodiment, each spiral grinding feature 1402f has a fixed width. In one embodiment, the spiral channel also has a fixed width. During grinding, the grinding pad can rotate about a central axis in a direction opposite to the direction of the spiral grinding features 1402f to retain the grinding slurry in the spiral channel. For example, in Figure 14F, the spiral grinding features 1402f and the spiral channel are formed in a counterclockwise direction, so that during grinding, the grinding pad can rotate clockwise to retain the grinding slurry in the spiral channel and on the grinding pad. In some configurations, each spiral channel is continuous from the center to the edge of the grinding pad. This continuous spiral channel allows the grinding slurry, along with any grinding waste, to flow from the center to the edge of the grinding pad. In one embodiment, the grinding pad can be cleaned by rotating the grinding pad in the same direction as the spiral grinding feature 1402f (e.g., counterclockwise in Figure 14F).

[0096] Figure 14G is a schematic pixel diagram of a polishing pad design 1400g having segmented polishing features 1402g arranged in a spiral pattern on a base feature 1404g. The polishing pad in Figure 14G is similar to the polishing pad in Figure 14F, except that the spiral polishing features 1402g are segmented. In one embodiment, the segmented polishing features 1402g have approximately the same length. The segmented polishing features 1402g may be evenly distributed along each spiral polishing feature. In some embodiments, the segmented polishing features 1402g may each have approximately the same length in the spiral direction.

[0097] Figure 14H is a schematic pixel diagram of a polishing pad design 1400h having segmented polishing features 1402h arranged in a spiral pattern on a base feature 1404h. The polishing pad in Figure 14H is similar to the polishing pad in Figure 14G, except that the length of the segmented polishing features 1402h is changed. In one embodiment, the length of the segmented polishing features 1402h increases from the center of the polishing pad to the edge region of the polishing pad.

[0098] Figure 14I is a schematic pixel diagram of a polishing pad design 1400i having segmented polishing features 1402i arranged in a spiral pattern on a base feature 1404i. The polishing pad in Figure 14I is similar to the polishing pad in Figure 14G, except that the radial spacing of the segmented polishing features 1402i is changed. In one embodiment, the radial spacing of the segmented polishing features 1402i decreases from the center of the polishing pad to the edge region of the polishing pad.

[0099] Figure 14J is a schematic pixel diagram of a polishing pad design 1400j having segmented polishing features 1402j arranged in a spiral pattern on a base feature 1404j. The polishing pad in Figure 14J is similar to the polishing pad in Figure 14I, except that the radial spacing of the segmented polishing features 1402j increases from the center of the polishing pad to the edge region of the polishing pad.

[0100] Figure 14K is a schematic pixel diagram of a polishing pad design 1400k having a plurality of individual polishing features 1402k formed in a base feature 1404k. In one embodiment, each of the plurality of polishing features 1402k may be cylindrical. In one embodiment, the plurality of polishing features 1402k may have the same dimensions in a plane of the polishing surface. In one embodiment, the plurality of cylindrical polishing features 1402k may be configured as concentric circles. In one embodiment, the plurality of cylindrical polishing features 1402k may be configured as a regular 2D pattern relative to a plane of the polishing surface.

[0101] Figure 14L is a schematic pixel diagram of a grinding pad design 1400l having a plurality of individual grinding features 1402l formed above a base feature 1404l. The grinding pad in Figure 14L is similar to the grinding pad in Figure 14K, except that each individual grinding feature 1402l in Figure 14L can be a hollow cylinder, or have a recess formed therein relative to the grinding surface. The hollow cylinder allows some grinding paste to be retained therein.

[0102] Figure 14M is a schematic pixel diagram of a grinding pad design 1400m having a plurality of individual grinding features 1402m formed above a base feature 1404m. The grinding pad in Figure 14M is similar to the grinding pad in Figure 14K, except that some grinding features 1402m in Figure 14M can be connected to form one or more closed circles. These one or more closed circles can form one or more barriers that retain the grinding slurry during the grinding process.

[0103] Figure 14N is a schematic pixel diagram of an abrasive pad design 1400n having a plurality of individual abrasive features 1402n formed in a base feature 1404n. The abrasive pad in Figure 14N is similar to the abrasive pad in Figure 14M, except that some abrasive features 1402n in Figure 14N can be connected to form one or more helical chains. This one or more helical chains can guide the fluid flow of the abrasive slurry to help retain the abrasive slurry and clean the abrasive pad.

[0104] Figure 140 is a schematic pixel diagram of a polishing pad design 1400o having a plurality of individual polishing features 1402o and a base feature 1404o. The polishing pad in Figure 140 is similar to the polishing pad in Figure 140K, except that each individual polishing feature 1402o in Figure 140 has the shape of the Applied Materials logo. Figure 140 illustrates that the polishing pads covered by the embodiments disclosed herein have polishing features of any suitable design, pattern, and / or configuration.

[0105] The abrasive features 1402a-1402o in the design of figures 14A-14O can be formed from the same material or the same material composition. Alternatively, the material composition and / or material properties of the abrasive features 1402a-1402o in the design of figures 14A-14O can be changed with the abrasive features. Individualized material composition and / or material properties allow the abrasive pad to be customized according to specific requirements.

[0106] When the polishing feature is formed from two different 3D printing materials, the polishing feature can be manufactured by printing at least two overlapping images using two printheads. Figures 15A-15B to 18A-18B provide design examples of polishing pads with composite polishing features. In Figures 15-18, white pixels mark the locations where material droplets are dispensed, while black pixels mark the locations where no material is dispensed within one or more layers used to form the polishing pad. By using these techniques, gradients in the material composition can be formed within one or more print layers used to form at least a portion of the complete polishing pad. Custom compositions of one or more print layers within the polishing pad can be used to adjust and customize the overall mechanical properties of the polishing pad.

[0107] By using these techniques, in some embodiments, it is desirable to form a gradient in the material composition in a direction perpendicular to the abrasive surface of the abrasive pad (e.g., perpendicular to the direction illustrated in Figures 15-18) or in the plane of the abrasive surface of the abrasive pad (e.g., radial direction). In one embodiment, it is desirable to form a gradient in the material composition in a direction perpendicular to the abrasive surface of the abrasive pad, among the hard and / or elastic features discussed above. In one example, it is desirable to have a higher concentration of material for forming elastic features in the printed layer near the base of the abrasive pad (e.g., opposite the abrasive surface) and a higher concentration of material for forming hard features in the printed layer near the abrasive surface of the abrasive pad. In another example, it is desirable to have a higher concentration of material for forming hard features in the printed layer near the base of the abrasive pad and a higher concentration of material for forming elastic features in the printed layer near the abrasive surface of the abrasive pad.

[0108] The gradient in the material composition and / or material properties of the stacked 3D printed layers can vary from high concentration to low concentration in one direction, or vice versa. In some cases, one or more regions with abrasive pads can include more complex concentration gradients, such as high / low / high or low / high / low concentration gradients. In one configuration, the concentration gradient can be formed by changing the position and / or amount of the first printed component to the second printed component in each successive layer of the formed abrasive pad. For example, the first layer may have a 1:1 first printed component to second printed component ratio, the second layer may have a 2:1 first printed component to second printed component ratio, and the third layer may have a 3:1 first printed component to second printed component ratio. Gradients can also be formed in different portions of a single layer by adjusting the arrangement of the printed droplets in the plane of the deposition layer.

[0109] Figures 15A and 15B are black-and-white bitmap images of the pixel map of an abrasive pad with composite features. In Figures 15A and 15B, white pixels mark the locations where material droplets are dispensed, while black pixels mark the locations where no material is dispensed. Figure 15A is a pixel map 1500a of a first material used for the abrasive pad, and Figure 15B is a pixel map 1500b of a second material used for the same abrasive pad. The first material can be dispensed by a first printhead according to pixel map 1500a, and the second material can be dispensed by a second printhead according to pixel map 1500b. The two printheads overlap pixel maps 1500a and 1500b to form a plurality of individual abrasive features. Abrasive features near the edge of the abrasive pad include more first material than second material. Abrasive features near the center of the abrasive pad include more second material than first material. In this example, each abrasive feature has a unique composition of first and second materials.

[0110] Figures 16A and 16B are schematic pixel diagrams 1600a and 1600b of an abrasive pad with composite features. Figure 16A is a pixel diagram 1600a of a first material used for the abrasive pad, while Figure 16B is a pixel diagram 1600b of a second material used for the same abrasive pad. The abrasive pads according to Figures 16A and 16B are similar to the abrasive pads in Figures 15A and 15B, the only difference being that the abrasive features in Figures 16A and 16B are larger.

[0111] Figures 17A and 17B are schematic pixel diagrams 1700a and 1700b of an abrasive pad with composite features. Figure 17A is a pixel diagram 1700a of a first material used for the abrasive pad, while Figure 17B is a pixel diagram 1700b of a second material used for the same abrasive pad. The abrasive pads according to Figures 17A and 17B are similar to the abrasive pads in Figures 15A and 15B, except that the composition of the abrasive features changes from left to right across the abrasive pad.

[0112] Figures 18A and 18B are schematic pixel diagrams 1800a and 1800b of an abrasive pad with composite features. Figure 18A is a pixel diagram 1800a of a first material used for the abrasive pad, while Figure 18B is a pixel diagram 1800b of a second material used for the same abrasive pad. The abrasive pads according to Figures 18A and 18B are similar to the abrasive pads in Figures 17A and 17B, the only difference being that the abrasive features in Figures 17A and 17B are larger.

[0113] It should be noted that the composition of the abrasive features can be varied in any suitable pattern. Although the abrasive pad described above is illustrated as being formed of two materials, composite abrasive pads comprising three or more features are also within the scope of this disclosure.

[0114] It should be noted that the composition of the abrasive features in any abrasive pad design (e.g., the abrasive pads in Figures 14A-14O) can be changed in a similar manner to the abrasive pads in Figures 15-18. (Laminated fabrication and hardening technology)

[0115] Figure 19 illustrates a cross-sectional view of an exemplary CMP station 1902 having a carrier head assembly 1900 positioned above a platform assembly 1911. The carrier head assembly 1900 typically includes a drive system 1901 coupled to a carrier head 1921. The drive system 1901 may be coupled to a controller (not shown) that provides signals to the drive system 1901 for controlling the rotational speed and direction of the carrier head 1921. The drive system 1901 typically provides rotational motion to the carrier head 1921 and may also be actuated toward the platform assembly 1911 such that, during processing, the feature 1904 side of the substrate 1914 held on the carrier head 1921 may be positioned toward the processing surface 1925 of the pad assembly 1913 of the CMP station 1902. Typically, the substrate 1914 and the processing pad assembly 1913 are rotated relative to each other to remove material from the feature side 1904 of the substrate 1914. Depending on the process parameters, the carrier head 1921 is rotated at a speed greater than, less than, or equal to the rotational speed of the platform assembly 1911. The carrier head assembly 1900 can also remain stationary and can move along a path during processing. During processing, the carrier head assembly 1900 can also provide track movement or sweeping across the processing surface 1925 of the pad assembly 1913. The pad assembly 1913 may be adapted to be releasably bonded to the upper surface of the platform assembly 1911 using an adhesive layer 1906. The pad assembly 1913 typically includes the processing surface 1925, the adhesive layer 1906, and may include an optional backing layer 1907.

[0116] Platform assembly 1911 is rotatably mounted on base 1908 and is typically supported on base 1908 by bearing 1938, such that platform assembly 1911 can be rotated relative to base 1908. Platform assembly 1911 may be made of a rigid material, such as metal or rigid plastic, and in one embodiment, platform assembly 1911 has an upper surface made of or coated with a dielectric material (e.g., CPVC). Platform assembly 1911 may have a circular, rectangular, or other planar shape.

[0117] Grinding fluid can be supplied from grinding fluid source 1948 to nozzle 1917 positioned above the treatment pad assembly 1913 of CMP station 1902 via appropriate piping and control. In the embodiment illustrated in Figure 19, grinding fluid 1941 is supplied by nozzle 1917. Grinding fluid 1941 may be contained by platform edge 1958. Grinding fluid 1941 may be deionized water (DIW) or other grinding fluids primarily composed of water (e.g., DIW), or a slurry containing abrasive particles entrained in DIW.

[0118] The processing surface 1925 of the pad assembly 1913 may further include a patterned surface 1951 formed on the surface above the processing surface 1925 to facilitate the polishing of the substrate 1914. The pattern of the patterned surface 1951 may include a plurality of small protrusions extending above the processing surface 1925. These protrusions may take any geometric shape, such as ellipse, circle, rectangle, hexagon, octagon, triangle, or combination of the above shapes, and may be formed by a three-dimensional printing process as described herein. The patterned surface 1951 may be maintained and / or updated using a conditioning device 1955 positioned to interact with the processing surface 1925 of the pad assembly 1913. In one embodiment, the conditioning device 1955 includes an electromagnetic energy source 1959. In one embodiment, the electromagnetic energy source 1959 is a laser and is used to emit one or more electromagnetic energy beams 1960 toward the processing surface 1925. One or more electromagnetic energy beams 1960 are used to selectively heat and / or strip multiple areas of the treated surface 1925 to update or maintain the patterned surface 1951 on the treated surface 1925. In some embodiments, an electromagnetic energy source 1959 may be used to condition the treated surface 1925 of the pad assembly 1913 by selectively heating individual areas of the treated surface 1925.

[0119] Figure 20A is a schematic isometric view of one embodiment of a pad manufacturing system 2000A for preparing a pad assembly that can be used on a platform assembly, such as the pad assembly 1913 used in the platform assembly 1911 of Figure 19. In one embodiment, the pad manufacturing system 2000A typically includes a feed section 2002, a printing section 2004, and a hardening section 2006. The pad manufacturing system 2000A is used to produce a plurality of printing pads 2008, which can be used as the pad assembly 1913 in the platform assembly 1911 of Figure 19. Although not shown, the pad manufacturing system 2000A can also be modified to print pads used in a roller-to-roll grinding system.

[0120] The padding manufacturing system 2000A also includes a conveyor belt 2010, which includes a drum 2012 disposed between at least two rollers 2014. One or both rollers 2014 may be coupled to a drive motor 2015, which rotates the rollers 2014 and / or the drum 2012 in the direction indicated by the arrow in A. The feed section 2002, the printing section 2004, and the hardening section 2006 may be operatively coupled to a controller 2011. The conveyor belt 2010 may be operated by the controller 2011 to move continuously or intermittently.

[0121] The feeding section 2002 may include a supply roller 2016, operatively coupled to the conveyor belt 2010. The supply roller 2016 may be a backing material 2017, such as a polymer material, for example, biaxial polyethylene terephthalate (BoPET). The supply roller 2016 may be configured on a feed roller 2018, which is driven or controlled by a motion control device 2020. The motion control device 2020 may be a motor and / or include a braking system that provides a predetermined tension on the supply roller 2016, such that the unfolding speed of the supply roller 2016 is driven by a drive motor 2015 and / or a drum 2012. The feeding section 2002 may also include a pretreatment device 2022. Before printing in the printing section 2004, the pretreatment device 2022 may be configured to spray or otherwise provide a coating onto the backing material 2017. In some embodiments, the pretreatment device 2022 may be used to heat the backing material 2017 before printing the printing section 2004.

[0122] The printing section 2004 includes a 3D printing station 2024 disposed downstream of the feed section 2002. The printing section 2004 utilizes one or more print heads 2027 to provide a patterned surface 2028 onto a backing material 2017. The printing section 2004 may include a movable platform 2030 coupled to a motion control device 2032, which can be used to move the print heads 2027 relative to the backing material 2017 and the roll 2012.

[0123] The printhead 2027 can be coupled to a material source 2025 having a print material, which can be used to form a patterned surface 2028. The print material may include polymeric materials such as polyurethane, polycarbonate, fluoropolymers, PTFE, PTFA, polyphenylene sulfide (PPS), or combinations of the above polymeric materials. Examples also include polyvinyl alcohol, pectin, polyvinylpyrrolidone, hydroxyethyl cellulose, methyl cellulose, hydrogen propyl methyl cellulose, carboxymethyl cellulose, hydroxypropyl cellulose, polyacrylic acid, polyacrylamide, polyethylene glycol, polyhydroxy ether acrylate, starch, maleic acid copolymer, polyethylene oxide, polyurethane, and combinations thereof, or any other materials described above.

[0124] In one embodiment, the polymeric material may be deposited as a base material on the backing material 2017. The formed polymeric material may comprise an open-cell or closed-cell polyurethane material and may include nanoscale particles dispersed therein. These particles may include organic nanoparticles. In one embodiment, the nanoparticles may include molecular or elemental rings and / or nanostructures. Examples include allotropes of carbon (C), such as carbon nanotubes and other structures, molecular carbon rings having 5 bonds (pentagonal), 6 bonds (hexagonal), or more than 6 bonds. Other examples include fullerene-like supramolecular structures. In another embodiment, the nanoscale particles may be ceramic materials, alumina, glass (e.g., silicon dioxide (SiO2)), and combinations or derivatives of the above materials. In another embodiment, the nanoscale particles may include metal oxides, such as titanium dioxide (IV) or titanium dioxide (TiO2), zirconium oxide (IV) or zirconium dioxide (ZrO2), combinations of the above materials and derivatives of the above materials, and other oxides.

[0125] The patterned surface 2028 formed by the printhead 2027 may comprise a composite substrate, such as a polymeric matrix, which may be formed from ethyl carbamate, melamine, polyester, polyurethane, polyvinyl acetate, fluorinated hydrocarbons, etc., and mixtures, copolymers, and grafts thereof. In one embodiment, the polymeric matrix comprises an ethyl carbamate polymer that can be formed from a polyether-based liquid ethyl carbamate. The liquid ethyl carbamate may react with polyfunctional amines, diamines, triamines, or polyfunctional hydroxyl compounds or mixed functional compounds, such as the hydroxyl / amine in an ethyl carbamate / urea crosslinked composition, which forms a urea-linked and crosslinked polymer network upon curing.

[0126] The curing section 2006 includes a curing device 2033 that can be disposed in or on a housing 2034. The housing 2034 is disposed above the roll 2012 such that the patterned surface 2028 on the roll 2012 and the backing material 2017 can pass under the housing 2034. The curing device 2033 may be a thermal oven, an ultraviolet (UV) light emitter, or a combination thereof. In one embodiment, the curing device 2033 may include one or both of a laser light source 2036 and an electron beam emitter 2038, which can be used to cure the material deposited by the printhead 2027 to form the patterned surface 2028. In some embodiments, when using an electron beam emitter, the pad manufacturing system 2000A may be located in a pressure-controlled housing. The laser light source 2036 and the electron beam emitter 2038 may be used alone or in combination with thermal or UV energy. In some embodiments, the laser source 2036 and electron beam emitter 2038 can be used for a point hardening process targeting specific portions of the patterned surface 2028. The point targeted by the laser source 2036 or electron beam emitter 2038 can heat individual areas of the patterned surface 2028 to form individual surface areas that are harder or less compressible than surrounding portions. The laser source 2036 can also be used to peel away portions of the patterned surface 2028 to form fine textures on the patterned surface 2028.

[0127] Figure 20B is a schematic side view of another embodiment of the pad manufacturing system 2000B. The pad manufacturing system 2000B may be similar to the pad manufacturing system 2000A of Figure 20A, including a conveyor belt 2010 having a feed section 2002, a printing section 2004, and a hardening section 2006. The pad manufacturing system 2000B may also include a winding section 2009 for manufacturing abrasive objects 2029 used in a roll-to-roll system. The winding section 2009 includes a take-up roller 2040 on which abrasive objects 2029, with a patterned surface 2028 printed, are wound. The take-up roller 2040 may be removed from the pad manufacturing system 2000A to be used as a supply roller 2018 in a roll-to-roll platform assembly. During manufacturing, the take-up roller 2040 may be coupled to a motion control device 2042. The motion control device 2042 may be a motor and / or a braking system that controls the winding speed of the take-up roller 2040. In some embodiments, the pad manufacturing system 2000B is used to print a plurality of print pads 2008 (illustrated in Figure 20A), which may be used as pad assembly 1913 in the platform assembly 1911 of Figure 19.

[0128] The padding manufacturing system 2000B includes a supply roller 2016 that controllably unwinds a roll 2012, which moves over a conveyor belt 2010 to a take-up roller 2040. The roll 2012 may be a backing material similar to the backing material 2017 described in Figure 20A. Similar to the padding manufacturing system 2000A described in Figure 20A, the movement of the roll 2012, as well as the conveyor belt 2010 and the take-up roller 2040, can be controlled by a motion control device and a controller, and for the sake of brevity, related descriptions are omitted in Figure 20B.

[0129] The gasket manufacturing system 2000B includes an optional pretreatment section 2044 located between the feed section 2002 and the printing section 2004. The pretreatment section 2044 can be used to form an adhesive or release layer on the roll 2012. Alternatively, an adhesive or release layer can be formed in the printing section 2004 using a 3D printing station 2024. When using the pretreatment section 2044, a slot / die coater 2046 can be used to deposit one or more layers onto the roll 2012. Furthermore, a curing station 2048 utilizing ultraviolet light or a heating element can be used to cure the material deposited by the slot / die coater 2046.

[0130] In this embodiment, the 3D printing station 2024 includes an array of printheads 2026. The printheads 2026 can be used to optionally form an adhesive or release layer on the roll 2012 and to form a patterned surface 2028 on the roll 2012. In one example, multiple columns and rows of printheads 2026 may span the width of the conveyor belt 2010 and a portion of the length of the conveyor belt 2010. In some embodiments, one or more printheads 2026 may be movable relative to the conveyor belt 2010. The printheads 2026 may be coupled to a material source 2025, as shown in Figure 20A.

[0131] The curing section 2006 may include one or both of an optional electromagnetic energy source 2050 and a thermosetting device 2052. The electromagnetic energy source 2050 may be one or a combination of a laser source or an electron beam emitter as shown in Figure 20A. The thermosetting device 2052 may be an oven or a UV light array.

[0132] The padding winding section 2009 includes a take-up roller 2040 capable of winding the grinding object 2029. The take-up roller 2040 can be removed from the padding manufacturing system 2000A to be used as a supply roller in a roller-to-roll platform assembly.

[0133] Figure 21A is a schematic cross-sectional view of one embodiment of a 3D printing station 2024A that can be used in the pad manufacturing system 2000A of Figure 20A or the pad manufacturing system 2000B of Figure 20B. Figure 21A illustrates part of one embodiment of an abrasive pad 2102 manufactured using a 3D printing process. The abrasive pad 2102 may be the pad assembly 1913 described in Figure 19, the printing pad 2008 (illustrated in Figure 20A), or the abrasive object 2029 (illustrated in Figure 20B). 3D printing provides a convenient and highly controllable process for producing abrasive objects with abrasive material embedded in specific locations within the abrasive layer. The abrasive pad 2102 may be printed on a support 2100, which may be the backing material 2017 of Figure 20A or the roll 2012 of Figure 20B.

[0134] Referring to Figure 21A, at least one abrasive layer 2105 of the abrasive pad 2102 is manufactured using a 3D printing process. In the manufacturing process, thin material layers are progressively deposited and fused onto the support 2100 while the support is moved along the arrow indicated by A (in the X direction). For example, droplets 2110 of pad precursor material (from material source 2025 in Figure 20A) can be ejected from the nozzle 2126 of a droplet jet printer 2115 to form a plurality of layers 2120A, 2120B, and 2122. These layers can form a cured material 2125 containing the pad precursor material, allowing other layers to be deposited sequentially on the cured material 2125. The droplet jet printer 2115 can be similar to an inkjet printer, but uses pad precursor material instead of ink. During manufacturing, the nozzle 2126 can be translated in one or both of the X and Y directions, while the support 2100 moves continuously or intermittently in the X direction.

[0135] In one example, the first layer 2120A can be deposited by spraying droplets 2110 onto the support 2100. After curing, subsequent layers, such as layers 2120B and 2122 (other layers are not mentioned for brevity), can be deposited on the first layer 2120A. After each layer is cured, a new layer is then deposited on top of the previously deposited layer until a complete 3D abrasive layer 2105 is produced. Curing can be accomplished by polymerization. For example, the liner precursor material layer can be a monomer, and the monomer can be cured by UV curing or thermal in-situ polymerization. The liner precursor material can be cured effectively immediately after deposition, or the entire liner precursor material layer can be deposited, and then all deposited layers can be cured simultaneously.

[0136] Each layer can be applied via nozzle 2126 with a pattern stored in a 3D graphics computer program provided on controller 2111. Each layer 2120A, 2120B, and 2122 can be less than 50% of the total thickness of the abrasive layer 2105 or less than the total thickness of the abrasive layer 2105. In one example, each layer 2120A, 2120B, and 2122 can be less than 10% of the total thickness of the abrasive layer 2105, for example, less than 5% of the total thickness of the abrasive layer 2105, for example, about 1% of the total thickness of the abrasive layer 2105. In one embodiment, the thickness of each layer can include a thickness of about 30 micrometers to about 60 micrometers or less, for example, on the nanometer scale (e.g., 1 to 100 nanometers), or even down to the picometer scale (e.g., 10-12 meters).

[0137] The support 2100 can be a rigid base or a flexible film, such as a polytetrafluoroethylene (PTFE) layer. If the support 2100 is a film, it can optionally form part of the abrasive pad 2102. For example, the support 2100 can be a backing layer 2017 or a layer between the backing layer 2017 and the abrasive layer 2105. Alternatively, the abrasive layer 2105 can be removed from the support 2100, and layers 2120A and 2120B can form the backing layer 2017.

[0138] In some embodiments, the abrasive particles may be dispersed in droplets 2110 of the liner precursor material. During the formation of each layer, the abrasive particles may be locally dispersed into the abrasive layer 2105. Local dispersion of the abrasive particles can help minimize agglomeration. In some embodiments, the abrasive particles may be premixed with a liquid thermosetting polymer precursor. Continuously stirring the mixture of the thermosetting polymer precursor and the abrasive particles can prevent particle agglomeration, similar to devices used to homogenize ink pigments used in inkjet printers. In addition, continuous stirring of the mixture can ensure that the abrasive particles are dispersed fairly uniformly in the precursor material. This can result in more uniform particle dispersion throughout the abrasive layer, resulting in improved abrasive uniformity and can also help avoid agglomeration.

[0139] The premixed mixture can be dispensed from a single nozzle (e.g., nozzle 2126) according to a specific pattern. For example, the premixed mixture can be dispensed uniformly to produce a uniform abrasive layer 2105 with embedded abrasive particles having a uniform distribution throughout the thickness of the abrasive layer 2105.

[0140] Figure 21B is a schematic cross-sectional view of one embodiment of the 3D printing station 2024B that can be used in the pad manufacturing system 2000A of Figure 20A or the pad manufacturing system 2000B of Figure 20B. Figure 21B illustrates a portion of another embodiment of an abrasive pad 2132 manufactured using a 3D printing process. The abrasive pad 2132 may be the pad assembly 1913 described in Figure 19, the printing pad 2008 (illustrated in Figure 20A), or the abrasive object 2029 (illustrated in Figure 20B).

[0141] As illustrated in Figure 21B, the abrasive pad 2132 is formed by a droplet jet printer 2115 according to instructions from a CAD program, comprising a plurality of structures 2150 separated by grooves 2155. Structures 2150 and grooves 2155 can form an abrasive layer 2105. A sublayer 2130 can also be formed by the droplet jet printer 2115 using an abrasive object. The sublayer 2130 can be a backing layer 2017 (illustrated in Figure 20A). For example, the sublayer 2130 and the abrasive layer 2105 can be manufactured by the droplet jet printer 2115 in a non-interrupted operation. The sublayer 2130 can be provided with a different hardness than the abrasive layer 2105 by using different precursors and / or different amounts of hardening (e.g., different UV radiation intensities or durations). In other embodiments, the sublayer 2130 is manufactured by a conventional process and then fixed to the abrasive layer 2105. For example, the polishing layer 2105 can be fixed to the sublayer 2130 by means of a thin adhesive layer (e.g., pressure-sensitive adhesive).

[0142] In Figure 21B, a printhead 2126A with nozzle 2135 can be used to dispense pure liquid thermosetting polymer precursors, while a printhead 2126B with nozzle 2135 can be used for liquid thermosetting polymer precursors or molten thermoplastics containing abrasive particles 2145. Droplets 2140 of the abrasive particles 2145 can be dispensed only at selected locations on the abrasive pad 2132. These selected locations collectively form a target print pattern of the abrasive particles and can be stored as a CAD-compatible file, which is then read by an electronic controller (e.g., controller 2111) controlling the droplet jet printer 2115. An electronic control signal is then sent to the droplet jet printer 2115 to dispense the premixed mixture only when the nozzle 2135 is moved to the position specified in the CAD-compatible file.

[0143] Alternatively, instead of using a liquid thermosetting polymer precursor, the abrasive particles 2145 can be premixed with the molten thermoplastic. In this embodiment, the mixture containing the abrasive particles 2145 is also continuously stirred before being dispensed. After the mixture is dispensed from the droplet jet printer 2115 according to the target printing pattern, the molten portion of the mixture cools and solidifies, and the abrasive particles 2145 are frozen in place. Continuous stirring of the mixture ensures that the abrasive particles 2145 are distributed fairly uniformly in the precursor material. This can result in a more uniform distribution of the particles 2145 throughout the abrasive layer, thereby improving abrasive uniformity and minimizing agglomeration.

[0144] Similar to the case of using a liquid thermosetting polymer precursor, the thermoplastic mixture can be uniformly distributed to produce uniformly distributed abrasive particles 2145 throughout the abrasive layer 2105. Alternatively, the thermoplastic mixture containing abrasive particles can be distributed only at selected locations on the abrasive layer 2105 according to a target print pattern of the abrasive particles 2145, which is stored as a CAD-compatible file and read by an electronic controller used to drive the droplet jet printer 2115.

[0145] Instead of dispensing abrasive particles in a suspension from nozzles 2135 coupled to printhead 2126B, the abrasive particles can be dispensed directly from nozzles 2135 of printhead 2126B in powder form, while nozzles 2135 of printhead 2126A are used to dispense the padding polymer precursor. In one embodiment, the polymer precursor is dispensed before the abrasive particles 2145 are dispensed into the deposited polymer material, and then the mixture is hardened.

[0146] While 3D printing is particularly useful for constructing abrasive pads 2132 using abrasive particles 2145 (such as alumina, cerium dioxide, and others that are prone to clumping), this method can also be used to distribute other abrasive particles. Therefore, abrasive particles may include silicon dioxide, ceramic oxides, metals, and hard polymers.

[0147] The droplet jet printer 2115 can deposit solid particles 2145 or hollow particles 2145. The droplet jet printer 2115 can also dispense different types of particles, some of which can undergo chemical reactions during CMP processing to produce targeted changes on one or more layers of the abrasive pad 2132, and to chemically react with the substrate being abraded. Examples of chemical reactions used in CMP processing include chemical processes involving one or more of potassium hydroxide, ammonium hydroxide, or other patented chemical processes used by paste manufacturers, occurring in an alkaline pH range of 10-14. Chemical processes involving organic acids such as acetic acid and citric acid, occurring in an acidic pH range of 2-5, are also used in CMP processing. Oxidation reactions involving hydrogen peroxide are also examples of chemical reactions used in CMP processing. The abrasive particles 2145 can also be used to provide mechanical abrasive functionality. The particles 2145 can have a size up to 1 mm, or smaller, such as 10 micrometers, or smaller, such as 1 micrometer. Particle 2145 can have different shapes, such as being round, elongated, or multifaceted.

[0148] Due to the layer-by-layer printing method, 3D printing allows for tight tolerances in the pattern of the abrasive layer 2105 and high tolerances in the distribution of the abrasive particles 2145 embedded in the abrasive layer 2105. Abrasive pad

[0149] Figure 22 illustrates part of one embodiment of the polishing pad 2200, which can be used as the pad assembly 1913 described in Figure 19, the printing pad 2008 (illustrated in Figure 20A), or the polishing object 2029 (illustrated in Figure 20B). The polishing pad 2200 includes an polishing surface 2205 forming the patterned surface 2028 of Figures 20A and 20B. The polishing surface 2205 includes a plurality of holes 2232 formed in the polishing material 2270. The polishing material 2270 can be bonded to the backing material 2222 by means of a suitable adhesive 2219, selected to be resistant to the chemical and physical elements used in the CMP process. The holes 2232 in the polishing pad 2200 are generally circular or elliptical in shape, but may also include other annular geometries, such as cones or hollow truncated cones, i.e., cones between generally parallel planes. The abrasive pad 2200 can also be formed to match any abrasive pad design illustrated in Figures 14A-14O or other designs described herein.

[0150] In one embodiment, the aperture 2232 may be hollow (i.e., empty space), and the aperture 2232 may be sized and / or spaced to improve slurry retention and facilitate rotation of the abrasive pad 2200. In other embodiments, the aperture 2232 may be at least partially filled with a first material 2210, which is different from the abrasive material 2270 (second material 2212). The first material 2210 may be a polymeric material with different reactivity to the curing method compared to the second material 2212. For example, in one embodiment, the second material 2212 may be cured using UV energy, while the first material 2210 is not significantly affected by UV energy. However, in one embodiment, the first material 2210 may be thermally cured. In other embodiments, the first material 2210 and the second material 2212 may be cured at different rates. In one embodiment, the abrasive pad 2200 may be differentially cured using the first material 2210 and the second material 2212. In an example of differential hardening, the first material 2210 and the second material 2212 of the abrasive pad 2200 can be hardened using UV energy that does not harden the first material 2210. This can make the second material 2212 harder than the first material 2210, thereby adding compressibility and / or flexibility to the abrasive pad 2200, since the first material 2210 is more viscous than the second material 2212.

[0151] In one embodiment, the first material 2210 is thermosetting so that the hole 2232 contains a harder first material 2210, but still softer and more compressible than the second material 2212. In another embodiment, the first material 2210 in the hole 2232 is thermosetting by heat generated by friction during the substrate polishing process. In this embodiment, the first material 2210 can be hardened to be harder than the second material 2212, thereby forming a region on the polished surface 2205 that is harder than the surrounding second material 2212.

[0152] In other embodiments, the first material 2210 may have different reactivity with electromagnetic energy, such as one or more energy beams from an electromagnetic energy source 1959 (illustrated in Figure 19), compared to the second material 2212. Different reactivity can be used to form microtextures on the abrasive surface 2205. The different reactivity between the first material 2210 and the second material 2212 can provide that the first material 2210 is peeled off at a faster rate than the second material 2212, or vice versa. The aperture 2232 may be a micron-sized or nanon-sized material forming a micron-sized or nanon-sized region within the abrasive surface 2205 of the abrasive pad 2200. In one embodiment, the aperture 2232 may include an average diameter of less than about 150 micrometers to about 10 micrometers, or smaller.

[0153] One embodiment of this disclosure provides an abrasive pad including a composite pad body. The composite pad body includes one or more first features formed of a first polymeric material and one or more second features formed of a second polymeric material. The one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first polymeric material and the second polymeric material. One of the first features or the second features is differentially hardened to provide differential hardness or other useful material properties therebetween. In one embodiment, the one or more first features and the one or more second features are alternately arranged throughout the pad body. In one embodiment, the one or more first features are thicker than the one or more second features, such that grooves and / or channels are formed on the top surface of the composite pad body. In one embodiment, the one or more first features include a plurality of concentric rings separated by the one or more second features. In one embodiment, the one or more first features include a plurality of cylinders surrounded by the one or more second features. In one embodiment, the one or more first features and the one or more second features are formed by 3D printing. In one embodiment, the abrasive pad further includes a composite pad body with two or more edges joined together. In one embodiment, the abrasive pad further includes a sub-pad body, wherein the composite pad body is formed over the sub-pad body. In one embodiment, the one or more first features include pores in which a third material is disposed. The third material is a thermosetting material. In one embodiment, the first polymer material has a first Young's modulus, and the second polymer material has a second Young's modulus. In one embodiment, the first material has a higher modulus of elasticity than the second material.

[0154] Although the abrasive pad described herein is circular, the abrasive particles according to this disclosure may include any suitable shape, such as an abrasive roll that is designed to move linearly during the abrasive process.

[0155] Although the foregoing content is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be designed without departing from the basic scope of the present disclosure, and the scope of the present disclosure is determined by the subsequent claims. [Simplified Explanation of the Diagram]

[0012] To gain a more detailed understanding of the features of the present disclosure described above, a more specific description of the present disclosure, which has been briefly summarized above, can be made with reference to the embodiments (some of which are illustrated in the accompanying drawings). However, it should be noted that the accompanying drawings only illustrate typical embodiments of the present disclosure and should not be regarded as limiting the scope of the present disclosure, as the present disclosure may recognize other equivalent and effective embodiments.

[0013] Figure 1 is a schematic cross-sectional view of the grinding station.

[0014] Figure 2A is a schematic perspective cross-sectional view of an abrasive pad according to one embodiment of the present disclosure.

[0015] Figure 2B is a schematic partial top view of an abrasive pad according to one embodiment of the present disclosure.

[0016] Figure 2C is a schematic partial cross-sectional view of an abrasive pad according to one embodiment of the present disclosure.

[0017] Figure 2D is a schematic partial cross-sectional view of an abrasive pad according to one embodiment of the present disclosure.

[0018] Figure 3A is a schematic perspective cross-sectional view of an abrasive pad according to one embodiment of the present disclosure.

[0019] Figure 3B is a schematic partial top view of an abrasive pad according to one embodiment of the present disclosure.

[0020] Figure 3C is a schematic partial cross-sectional view of an abrasive pad according to one embodiment of the present disclosure.

[0021] Figure 4 is a schematic perspective cross-sectional view of an abrasive pad according to one embodiment of the present disclosure.

[0022] Figure 5 is a schematic perspective cross-sectional view of an abrasive pad having one or more viewing windows according to one embodiment of the present disclosure.

[0023] Figure 6 is a schematic perspective cross-sectional view of an abrasive pad including a supporting foam layer according to one embodiment of the present disclosure.

[0024] Figure 7 is a schematic cross-sectional view of an abrasive pad having multiple regions according to one embodiment of the present disclosure.

[0025] Figure 8 is a partially enlarged cross-sectional view of the abrasive pad of Figure 7 according to one embodiment of the present disclosure.

[0026] Figure 9 is a schematic perspective cross-sectional view of an abrasive pad according to one embodiment of the present disclosure.

[0027] Figure 10 is a schematic perspective cross-sectional view of an abrasive pad according to one embodiment of the present disclosure.

[0028] Figure 11 is a partial cross-sectional view of the abrasive pad in Figure 10.

[0029] Figure 12 is a schematic cross-sectional view of an apparatus for manufacturing abrasive pads according to one embodiment of the present disclosure.

[0030] Figure 13 is a schematic partial cross-sectional view of an abrasive pad having features formed from a composition of two materials according to one embodiment of the present disclosure.

[0031] Figures 14A to 14O are schematic diagrams of abrasive pad designs according to at least one embodiment of the present disclosure.

[0032] Figures 15A and 15B are schematic diagrams of an abrasive pad having composite features according to at least one embodiment of the present disclosure.

[0033] Figures 16A and 16B are schematic diagrams of an abrasive pad having composite features according to at least one embodiment of the present disclosure.

[0034] Figures 17A and 17B are schematic diagrams of an abrasive pad having composite features according to at least one embodiment of the present disclosure.

[0035] Figures 18A and 18B are schematic diagrams of an abrasive pad having composite features according to at least one embodiment of the present disclosure.

[0036] Figure 19 is a schematic cross-sectional view of a grinding station according to one embodiment of the present disclosure.

[0037] Figure 20A is a schematic perspective view of an abrasive pad manufacturing system according to one embodiment of the present disclosure.

[0038] Figure 20B is a schematic diagram of an abrasive pad manufacturing system according to another embodiment of the present disclosure.

[0039] Figure 21A is a schematic diagram of a 3D printing station according to one embodiment of the present disclosure.

[0040] Figure 21B is a schematic diagram of a 3D printing station according to another embodiment of the present disclosure.

[0041] Figure 22 is a schematic perspective view of an abrasive pad according to one embodiment of the present disclosure.

[0042] For ease of understanding, common terms have been used where possible to refer to the same elements that are common to the diagram. It is conceivable that elements disclosed in one embodiment can be advantageously used in other embodiments without further detail. [Biomaterial Storage]

[0157] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A method of forming an abrasive pad, comprising the steps of: (a) depositing a plurality of first precursor droplets in a first predetermined pattern and a plurality of second precursor droplets in a second predetermined pattern on a base layer; (b) exposing the plurality of first precursor droplets and the plurality of second precursor droplets to electromagnetic radiation; and (c) repeating (a) and (b) to form a plurality of abrasive features, the abrasive features comprising a first material and a plurality of pore regions disposed in the first material, wherein the plurality of first precursor droplets form the first material, and the plurality of second precursor droplets form a second material defining the plurality of pore regions.

2. The method as described in claim 1 further comprises forming the base layer by means of the following steps: (d) depositing a plurality of third precursor droplets; (e) exposing the plurality of third precursor droplets to electromagnetic radiation; and (f) repeating (d) and (e) to form a third material.

3. The method as claimed in claim 1, wherein, upon exposure to electromagnetic radiation in step (b), the plurality of first precursor droplets and the plurality of second precursor droplets are differentially hardened.

4. The method as described in claim 2, wherein the Shore hardness of the first material is greater than that of the third material.

5. The method as claimed in claim 1, wherein step (b) exposes the plurality of first precursor droplets to electromagnetic radiation to bond the plurality of abrasive features to the base layer.

6. The method as described in claim 2, wherein one or both of the first precursor droplets and the third precursor droplets comprise an acrylate component.

7. The method as claimed in claim 1, wherein (a) further comprises depositing a plurality of third precursor droplets in a third predetermined pattern, and (b) further comprises exposing the plurality of third precursor droplets deposited in step (a) to electromagnetic radiation.

8. The method as described in claim 1, wherein the first predetermined pattern definition is configured in one or more channels among the plurality of polishing features.

9. The method as claimed in claim 1, wherein the plurality of first precursor droplets comprises a precursor that is one or a combination of the following substances: polypropylene, polystyrene, polyacrylonitrile, polymethyl methacrylate, polychlorotrifluoroethylene, polytetrafluoroethylene, polyoxymethylene, polyoxymethylene, polycarbonate, polyimide, polyetheretherketone, polyphenylene sulfide, polyethersulfone, acrylonitrile butadiene styrene (ABS), polyetherimide, polyamide, melamine, polyester, polysulfone, polyvinyl acetate, fluorinated hydrocarbons, and acrylates, copolymers, grafts, and mixtures thereof.

10. The method as claimed in claim 2, wherein one or both of the plurality of first precursor droplets or the plurality of third precursor droplets comprise a precursor that is one or a combination of the following substances: polypropylene, polystyrene, polyacrylonitrile, polymethyl methacrylate, polychlorotrifluoroethylene, polytetrafluoroethylene, polyoxymethylene, polyoxymethylene, polycarbonate, polyimide, polyetheretherketone, polyphenylene sulfide, polyethersulfone, acrylonitrile butadiene styrene (ABS), polyetherimide, polyamide, melamine, polyester, polysulfone, polyvinyl acetate, fluorinated hydrocarbons, and acrylates, copolymers, grafts, and mixtures thereof.

11. The method as described in claim 1, wherein the plurality of grinding features have a hardness of about 40 Shore D to about 90 Shore D.

12. The method as described in claim 1, wherein the plurality of abrasive features are formed from an acrylate material.

13. The method as described in claim 1, wherein the base layer is formed of an acrylate material.

14. The method as described in claim 1, wherein the plurality of grinding features are arranged in a segmented spiral pattern.

15. The method as described in claim 14, wherein the plurality of abrasive features extend upward from the base layer to define the plurality of channels thereon.

16. The method as described in claim 15, wherein the plurality of grinding features have substantially the same length in the helical direction.

17. The method as described in claim 15, wherein a radial spacing between individual features of the plurality of abrasive features varies from the center of the abrasive pad to the edge region of the abrasive pad.

18. An abrasive pad comprising: a base material layer; and a plurality of abrasive features extending from the base material layer to form an abrasive surface, wherein the plurality of abrasive features and a surface of the base material layer define one or more channels disposed between the features, the plurality of abrasive features being arranged in a segmented helical pattern, a plurality of holes being arranged in the plurality of abrasive features, and the plurality of abrasive features comprising a first material composition formed of a mixture of at least two different droplet compositions, and the base material layer comprising a second material composition different from the first material composition.

19. The abrasive pad as claimed in claim 18, wherein the base material layer is formed of an acrylic material.

20. The abrasive pad as claimed in claim 18, wherein the plurality of abrasive features are formed of an acrylic material.

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