Connectors and relevant panel, tray and substrate

Abstract

A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I / O connector attached to the cable connector.

Description

[Technical Field]

[0001] This invention relates to connector systems. More specifically, this invention relates to connector systems that allow cable connectors to be connected to a substrate in a stacked configuration.

[0002] This application claims the benefits of U.S. Patent Application No. 62 / 704,025, filed October 9, 2018; U.S. Patent Application No. 62 / 704,052, filed January 28, 2019; U.S. Patent Application No. 62 / 813,102, filed March 3, 2019; U.S. Patent Application No. 62 / 840,731, filed April 30, 2019; and PCT Application No. PCT / US2019 / 041356, filed July 11, 2019, all of which are incorporated herein by reference in their entirety for all purposes as fully set forth herein. [Previous Technology]

[0003] It is known that cable connector systems may include differential signal pairs or optical cables that connect application-specific integrated circuits (ASICs) and boards electrically or optically. A problem with using known cable connector systems is providing higher density and higher terabyte throughput between the ASIC and the front board of the rack-mount equipment enclosing the ASIC. [Summary of the Invention]

[0004] To overcome the above-mentioned problems, preferred embodiments of the present invention provide a cable connector system that allows cable connectors to be connected to board connectors in a stacked or nested configuration while simultaneously reducing the required footprint and stacking height of the board connectors. For example, embodiments of the present invention can be used for groups of connectors positioned on one or two opposing surfaces of a die package substrate or on one or two opposing sides of a second substrate, the second substrate including a die package and attached to a body substrate. Embodiments of the present invention can be used to transmit at least 50 terabytes of data with -40 dB or better frequency domain crosstalk on standard 70 mm x 70 mm die packages, 75 mm x 75 mm die packages, 85 mm x 85 mm die packages, 120 mm x 120 mm die packages, 150 mm x 150 mm die packages, or other sizes of die packages. Embodiments of the present invention may have a height measured from the mounting surface of the substrate to the top surface of any of the connectors described herein from about 1.5 mm to about 7 mm.

[0005] The board connector may include a housing. The housing may include a first board connector mating interface surface, a first slot defined by the first board connector mating interface surface, a second slot vertically stacked above the first slot, and a first housing wall partially defining both the first slot and the second slot. A first lead frame assembly may be disposed in the first slot. The first lead frame assembly may include a first signal conductor defining a first mating end and a second signal conductor defining a second mating end. A second lead frame assembly may be disposed in the second slot. The second lead frame assembly may include a third signal conductor defining a third mating end and a fourth signal conductor defining a fourth mating end. The first mating end and the second mating end may each be disposed closer to the first board connector mating interface surface than the third mating end and the fourth mating end. The first housing wall may extend above the first mating end, the second mating end, the third mating end, and the fourth mating end.

[0006] The first groove may be defined by the first housing wall, a first wall and a pair of third walls on opposite sides. The first wall and the third wall on opposite sides may be evenly spaced from a longitudinal centerline located between the first wall and the third wall on opposite sides. The longitudinal centerline may also be parallel to both the first wall and the third wall on opposite sides.

[0007] The second groove may be defined by a first housing wall, a first wall and a third wall on the opposite side, and the first wall and the third wall on the opposite side may be unevenly spaced from the longitudinal centerline. Alternatively, the second groove may be defined by a first housing wall, a first wall and a third wall on the opposite side, and the first wall and the third wall on the opposite side may be evenly spaced from the longitudinal centerline.

[0008] The housing may include a third slot vertically stacked above the second slot, a second housing wall partially defining both the second and third slots, and a third lead frame assembly disposed in the third slot. The third lead frame assembly may include a fifth signal conductor having a fifth mating end and a sixth signal conductor having a sixth mating end. The fifth and sixth mating ends may each be disposed further away from the mating interface surface of the first board connector than the first, second, third, and fourth mating ends.

[0009] The third groove may be defined by the second housing wall, the first wall and the third wall on the opposite side, and the first wall and the third wall on the opposite side are unevenly spaced from the longitudinal centerline. Alternatively, the second groove may be defined by the second housing wall, the first wall and the third wall on the opposite side, and the first wall and the third wall on the opposite side are evenly spaced from the longitudinal centerline.

[0010] The board connector housing may further include a fourth slot vertically stacked above the third slot, a third housing wall partially defining both the third and fourth slots, and a fourth lead frame assembly disposed in the fourth slot. The fourth lead frame assembly may include a seventh signal conductor having a seventh mating end and an eighth signal conductor having an eighth mating end. The seventh and eighth mating ends may each be disposed further away from the first board connector mating interface surface than the first, second, third, fourth, fifth, and sixth mating ends.

[0011] The fourth groove may be defined by the third shell wall, the first wall and the third wall portion on the opposite side, and the first wall and the third wall portion on the opposite side are unevenly spaced from the longitudinal centerline. Alternatively, the fourth groove may be defined by the third shell wall, the first wall and the third wall portion on the opposite side, and the first wall and the third wall portion on the opposite side are evenly spaced from the longitudinal centerline.

[0012] The first and second slots may each have the same width. The first and second slots may each have the same depth. The first and second slots may each have different depths. The first and second slots may each accommodate the same cable connector. The first, second, third, and fourth signal conductors may each be socket conductors. The housing is configured to protrude beyond the edge of the mounting base. The housing may have a height of approximately 1.7 mm to approximately 4 mm, approximately 4 mm to approximately 7 mm, approximately 5 mm to approximately 8 mm, or approximately 1.7 mm to approximately 7 mm. The first, second, and third slots may each have the same width. The second and third slots may each have the same width. The first, second, and third slots may each have the same depth. The second and third slots may each have the same depth. The first, second, third, and fourth slots may each have the same width. The third and fourth slots may each have the same width. The first, second, third, and fourth slots may each have the same depth. The third and fourth slots may each have the same depth.

[0013] The cable connector may include a cable connector shield. The cable connector shield may include a single piece of conductive material having shield arms and holes. The shield arms may be bent backward and extend into the holes. The cable connector may mate with a mating connector. The shield arms may be configured to form an electrical connection with the mating connector shield. The cable connector may include an insert comprising a cable connector signal conductor. A cable may be connected to the cable connector signal conductor. The cable connector height may be approximately 1 mm.

[0014] An electrical connector may be provided having differential signal pairs and a unified connector shield. The connector shield may include a first connector shield surface, a second connector shield surface opposite to the first connector shield surface, a hole, and a shield arm. The shield arm is rearwardly bendable above the first connector shield surface and through the hole, the first connector shield surface, and the second connector shield surface, such that the shield arm is configured to contact a mating connector shield of a mating connector when the electrical connector mates with the mating connector. The electrical connector may be a cable connector.

[0015] A board may be provided. The board may define a 1RU area and at least 257 56 Gbits / sec differential signal pairs disposed in the 1RU area, or at least 289 56 Gbits / sec differential signal pairs may be disposed in the 1RU area, or at least 300 56 Gbits / sec differential signal pairs may be disposed in the 1RU area, or at least 400 56 Gbits / sec differential signal pairs may be disposed in the 1RU area, or at least 500 56 Gbits / sec differential signal pairs may be disposed in the 1RU area.

[0016] A tray may be provided. The tray may include a first airflow area and a second airflow area. The first airflow area and the second airflow area may be arranged parallel to each other, may be arranged adjacent to each other, and may each be served by an individual fan. A back-to-back transceiver may be arranged in the first airflow area. A die may be arranged in the second airflow area.

[0017] A mating electrical right-angle connector may have a mating stack height greater than zero but less than approximately 5 mm.

[0018] A substrate may be provided. The substrate may include a first linear pad array extending along a first pad centerline and may include a first end pad and a second end pad at opposite ends of the first linear pad array. A second linear pad array extending along a second pad centerline and may include a third end pad and a fourth end pad at opposite ends of the second linear pad array. A possible first solder tab pad on the substrate may have a first solder tab centerline. A possible second solder tab pad on the substrate may have a second solder tab centerline. The first pad centerline may be arranged parallel to the second pad centerline. The first linear pad array may be offset from the second linear pad array by more than one column spacing. The first end pad and the third end pad may each be on the same side of the substrate, and the second end pad and the fourth end pad may each be on the same side of the substrate opposite to the first end pad and the third end pad. The center lines of the first and second weld tabs can be arranged parallel to each other and perpendicular to the center lines of the first and second pads, respectively. A first pad distance from the center of the second end pad to the center line of the second weld tab can be less than a second pad distance from the center of the third end pad to the center line of the first weld tab. A third pad distance in the first linear pad array between the first end pad and the center line of the first weld tab can be greater than the first pad distance. The center lines of the first and second pads do not intersect with the first or second weld tab pads.

[0019] Referring to the accompanying drawings, the above and other features, elements, characteristics, steps and advantages of the present invention will become more apparent from the following detailed description of embodiments of the present invention.

Implementation Method

[0021] The cable connector system described herein is capable of transmitting (i.e., transmitting and / or receiving) signals of up to 56 Gbits / sec non-return-to-zero (NRZ) and / or 112 Gbits / sec fourth-order pulse amplitude modulation (PAM4). The cable connector system can be applied to die package substrates or expansion cards attached to die substrates, which are 70 mm x 70 mm, 75 mm x 75 mm, 80 mm x 80 mm, 85 mm x 85 mm, 90 mm x 90 mm, 95 mm x 95 mm, 100 mm x 100 mm, 105 mm x 105 mm, 110 mm x 110 mm, or any die package with an N x N dimension, wherein N is greater than or equal to 70 mm and N is less than or equal to 200 mm. Cable connector systems can also be applied to substrates including chip packages, chip substrates, or expansion cards attached to chip packages or chip substrates.

[0022] Figure 1 illustrates a cable connector system 10. The cable connector system 10 may include a board connector 12 and at least one, at least two, at least three, at least four, or four or more cable connectors 14. The board connector 12 may be configured to be electrically, physically, or electrically and physically connected to a suitable substrate (not shown in Figure 1), including, for example, a die package, a die substrate, an expansion card attached to a die package or die substrate, a body substrate, etc. The board connector 12 may include a housing 16, which may include a first housing 18 and a second housing 20. The cable connector 14 or these cable connectors 14 may include one or more cables 22 and may be detachably connected to the board connector 12, in order starting with the cable connector 14 closest to the surface of the mounting substrate. Alternatively, the order may be reversed, starting with the cable connector 14 furthest from the surface of the mounting substrate (height H), or the cable connectors 14 may be mated simultaneously with the board connector 12. Cable connector 14 can be connected to board connector 12 or the first housing 18 of board connector 12 by insertion of cable connector 14 in a direction parallel or substantially parallel (within manufacturing tolerances) to the surface of the substrate on which board connector 12 is mounted. Each cable connector 14 can be attached to one end of cable 22, and the opposite end of cable 22 can be attached to board connector, board connector, I / O connector (e.g., as shown in FIG30), etc. Board connector 12 and / or the cable connector 14 may include conductive or non-conductive magnetic absorbing material. Magnetic absorbing material may, for example, be positioned on the housing and / or on the conductors of board connector 12 and / or cable connector 14. By employing a vertically stacked configuration of the cable connectors 14, it is possible to achieve a stacking height for the cable connector system 10. This stacking height is determined by the height H of the housing 16 of the board connector 12, depending on the total number of rows of cable connectors 14. The height H can be approximately 1.0 mm to approximately 7.0 mm, or approximately 1.7 mm to approximately 6.8 mm, or approximately 1.7 mm to approximately 4 mm, or approximately 4 mm to approximately 7 mm, or approximately 5 mm to approximately 8 mm. The portion of the cable 22 adjacent to or connected to the cable connector 14 can extend parallel or substantially parallel (within manufacturing tolerances) to the substrate to which the board connector 12 is mounted. Each cable connector 14 can individually have a height of approximately 1 mm (within manufacturing tolerances).

[0023] Figure 2 illustrates a cable connector system 10 that may include a board connector 12 with a height H and cable connectors 14, 14a, 14b, 14c, which are stacked vertically such that each cable connector 14, 14a, 14b, 14c does not completely overlap adjacent cable connectors. Each cable connector 14, 14a, 14b, 14c may include a corresponding copper cable 22, such as a shielded differential biaxial cable. The board connector 12 may include a housing 16, which may include a first housing 18 and a second housing 20. In the presence of at least three vertically stacked cable connectors 14, 14a, 14b, the overlap OV between the first cable connector 14 and the adjacent second cable connector 14a may be greater than the overlap OV1 between the second cable connector 14a and the third cable connector 14b.

[0024] Figure 3 is a bottom perspective view of the cable connector system 10 shown in Figures 1 and 2. A board connector 12, which may have a two-part housing 16, is divided into a first housing 18 and a second housing 20, either independently or integrally formed. The cable connector system 10 may include a cable connector 14 and individual cables 22 and lead frame assemblies 24a and 24b, wherein each lead frame assembly 24a and 24b may each include an electrical conductor, such as a signal conductor 26 or an optional ground conductor 28. The electrical conductors may be evenly spaced from centerline to centerline. The distance between the individual centerlines of two adjacent electrical conductors defines the conductor spacing. A board connector shield 40 may terminate in the ground conductor 28 (or a power / reference conductor) and may be positioned adjacent to a corresponding one of the lead frame assemblies 24a and 24b. Alternatively, the lead frame assemblies 24a and 24b may be molded or insert-molded together with the board connector shield 40. Each signal conductor 26 can be terminated in a solder ball 30, solder block, any suitable SMT, any through-hole or plated through-hole technology, etc.

[0025] If there are N cable connectors 14, the corresponding board connector 12 may include N leadframe assemblies 24a, 24b or wafers, one leadframe assembly or wafer for each corresponding cable connector 14. Assuming each cable 22 is a biaxial cable with two center cable conductors 38, if there are a total of P cables 22 in the corresponding cable connector 14, the corresponding board connector 12 may include 2×P electrical conductors, including a signal conductor 26 and a ground conductor 28. If the cable 22 has only a single center cable conductor 38, the board connector 12 may include P electrical conductors, such as a signal conductor 26 and an optional ground conductor 28.

[0026] Two sets of adjacent lead frame assemblies 24a and 24b are shown. The two adjacent lead frame assemblies 24a and 24b are offset relative to each other in a horizontal direction D perpendicular to the insertion direction I of the cable connector 14. As shown in FIG3, each lead frame assembly 24a is horizontally offset relative to each other lead frame assembly 24b in the housing 16. Each cable 22 may be a shielded cable that may include an insulating sheath 32, a cable shield 34, a cable dielectric 36, and a single cable conductor or a pair of cable conductors 38. The board connector shield 40 may be electrically, physically, or electrically and physically connected to the corresponding cable connector shield 42. Each cable shield 34 may be electrically, physically, or electrically and physically connected to the corresponding cable connector shield 42.

[0027] Figure 4 is similar to Figure 1, but the cable connector 14 is removed. The board connector 12 may include a housing 16. The housing 16 may include a first housing 18, a second housing 20, and one or more lead frame assemblies 24a, 24b. Although the housing 16 may house four lead frame assemblies 24a, 24b, any number of lead frame assemblies 24a, 24b may be used. The first housing 18 or the second housing 20 may define or include one or both of the raised portion and the retaining tab 46.

[0028] As shown in Figure 5, the first housing 18 and the second housing 20 can be connected together by inserting the retaining tab 46 into the corresponding housing hole 48 in the first housing 18. Alternatively, the retaining tab 46 and the corresponding housing hole 48 can be reversed. Generally, the first housing 18 and the second housing 20 can be connected in any suitable manner. The retaining tab 46 can also be used to secure the board connector 12 to the substrate. For example, the retaining tab 46 can be soft-soldered to the substrate.

[0029] Housing 16 or first housing 18 may define four slots 50, 50a, 50b, 50c. At least one or both of the first slot 50 and the second slot 50a may each open at a first board connector mating interface surface 52a of housing 16 or first housing 18. At least one or both of the third slot 50b and the fourth slot 50c may each open at a second board connector mating interface surface 52b of housing 16 or first housing 18. The first board connector mating interface surface 52a may each be located in a first plane FP that is substantially perpendicular to the mounting interface plane MIP that is parallel to the board connector mounting interface surface 44 of housing 16. The second board connector mating interface surface 52b may each be located in a second plane SP that is substantially perpendicular to the mounting interface plane MIP. The first plane FP and the second plane SP may be parallel to each other and substantially perpendicular to the mounting interface plane MIP. The first board connector mating interface surface 52a and the second board connector mating interface surface 52b may be spaced apart from each other. The second board connector mating interface surface 52b can be vertically positioned above the first board connector mating interface surface 52a, and can be recessed away from the first board connector mating interface surface 52a in the direction toward the second housing 20.

[0030] Each of the four slots 50, 50a, 50b, and 50c can accommodate a corresponding one of the four cable connectors 14. Different numbers of slots 50 to 50c can be included if different numbers of corresponding cable connectors 14 are used. Slots 50 to 50c can be arranged parallel to each other. The first slot 50 can be arranged adjacent to a mounting substrate (such as a printed circuit board (PCB) (e.g., shown in FIG. 12)) and stacked perpendicularly to each other in the direction along the height H of the housing 16. The first slot 50 can be defined by a first wall 54, a first housing wall 56, and a third wall 58. Three walls 54, 56, and 58 are shown, but a fourth wall spanning the first wall 54 and the third wall 58 can also be used. When only three walls 54, 56, and 58 are used, the first slot 50 exposes a portion of the mounting substrate. The second slot 50a can be defined by four walls (such as the first wall 54a of the first slot 50, the second housing wall 56a, the third wall 58a, and the first housing wall 56). The mating ends 62 of the signal conductors 26 and the board connector shield 40 may protrude into individual slots 50, 50a. In this embodiment, the first slot 50 and the second slot 50a may be horizontally offset such that a pair of signal conductors 26 disposed in the first slot 50 may be horizontally offset from a corresponding pair of signal conductors 26a disposed in the second slot 50a by a portion of the column spacing, a full column spacing, more than a column spacing, a full conductor spacing, at least two conductor spacings, at least three conductor spacings, more than two conductor spacings, or more than three conductor spacings. The conductor spacing may be the distance between the center lines of two adjacent signal conductors. For a column spacing, a corresponding pair of signal conductors may have the same position number, such as the last two signal conductors (signal conductor pair 26b) disposed in the third slot 50b from left to right, and the last two signal conductors (signal conductor pair 26c) disposed in the fourth slot 50c from left to right. The first housing 18 may define a recess 60. The notch 60 may be defined such that the notches 60 present at the ends of each row or slot 50 to 50c are aligned. The notches 60 may alternate between slot and slot or row and row, such that an equal number of notches 60 exist on each side of the housing 16 or the first housing 18.

[0031] The third slot 50b may be stacked vertically above the first slot 50 and the second slot 50a and may be positioned adjacent to the second slot 50a in the vertical direction along the height H of the housing 16. The third slot 50b may be defined by the first wall 54b, the third housing wall 56b, the third wall 58b, and the second housing wall 56a of the second slot 50a. The fourth slot 50c may be stacked vertically above the first slot 50, the second slot 50a, and the third slot 50b and may be positioned adjacent to the third slot 50b in the vertical direction along the height H of the housing 16. The fourth slot may be defined by four walls, such as the first wall 54c, the fourth housing wall 56c, the third wall 58c, and the third housing wall 56b of the third slot 50b.

[0032] The mating ends 62 of the signal conductor pairs 26b, 26c and the board connector shields 40b, 40c can protrude into the respective slots 50b, 50c. Similar to the first slot 50 and the second slot 50a, the third slot 50b and the fourth slot 50c can be horizontally offset in a direction perpendicular to the insertion direction I of the cable connector 14, such that the signal conductor pair 26b disposed in the third slot 50b can be offset from the corresponding signal conductor pair 26c disposed in the fourth slot 50c by a portion of the column spacing, a full column spacing, or more than one column spacing.

[0033] Figure 6 shows the first housing 18. The first groove 50 may be defined by at least three walls or only three walls, such as a first wall 54, a third wall 58 on the opposite side, and a first housing wall 56 that spans the first wall 54 and the third wall 58 on the opposite side. The first housing wall 56 may partially define the first groove 50 and the second groove 50a. The first housing wall 56 may define the first wall edge 64.

[0034] The second groove 50a may be defined by at least four walls or only four walls, such as a first wall 54a, a third wall 58a on the opposite side, a first housing wall 56 that spans the first wall 54a and the third wall 58a on the opposite side, and a second housing wall 56a that spans the first wall 54a and the third wall 58a on the opposite side. The second housing wall 56a may partially define both the second groove 50a and the third groove 50b and may define the edge 64a of the second wall.

[0035] The third groove 50b may be defined by at least four walls or only four walls, such as a first wall 54b, a third wall 58b on the opposite side, a second housing wall 56a that spans the first wall 54b and the third wall 58b on the opposite side, and a third housing wall 56b that spans the first wall 54b and the third wall 58b on the opposite side. The third housing wall 56b may partially define both the third groove 50b and the fourth groove 50c and may define the edge 64b of the third wall.

[0036] The fourth groove 50c may be defined by at least four walls or only four walls, such as a first wall 54c, a third wall 58c on the opposite side, a third housing wall 56b that spans the first wall 54c and the third wall 58c on the opposite side, and a fourth housing wall 56c that spans the first wall 54c and the third wall 58c on the opposite side. The third housing wall 56b may partially define both the third groove 50c and the fourth groove 50d. The fourth housing wall 56c may also define a fourth wall edge 64c. All grooves 50 to 50c may have the same width, the same depth, different widths, or different depths.

[0037] The first wall edge 64, the second wall edge 64a, the third wall edge 64b, and the fourth wall edge 64c can each be stepped vertically along the height H1 of the first housing 18. For example, compared to the second wall edge 64a, the third wall edge 64b, or the fourth wall edge 64c, the first wall edge 64 of the first housing wall 56 can be positioned further away from the rear vertical wall 66 of the first housing 18. As measured from the rear vertical wall 66 of the first housing 18, the second wall edge 64a can be positioned further away from the rear vertical wall 66 compared to the third wall edge 64b and the fourth wall edge 64c. Alternatively, the first wall edge 64 and the second wall edge 64a can each be spaced equidistant from the rear vertical wall 66 of the first housing 18. As measured from the rear vertical wall 66 of the first housing 18, compared to the fourth wall edge 64c of the fourth housing wall 56c, the third wall edge 64b can be positioned further away from the rear vertical wall 66 of the first housing 18. Alternatively, the third wall edge 64b and the fourth wall edge 64c may each be spaced equidistant from the rear vertical wall 66 of the first housing 18. The groove 68 may accommodate portions of the corresponding molded lead frame assemblies 24a and 24b.

[0038] As shown in Figure 7, each slot 50, 50a, 50b, 50c may have a corresponding trench 68 into which a molded leadframe assembly 24a, 24b or wafer may be embedded. Adjacent trenches 68 may be horizontally offset from each other, causing the corresponding leadframe assemblies 24a, 24b to be offset from each other. To ensure constant electrical performance, a notch 60 may be provided in the first housing 18 to ensure that each slot 50a to 50c has approximately the same amount of dielectric material on each side. The first housing 18 may have solder tab holes 70 into which solder tabs may be embedded. These solder tabs are not used to connect the first housing 18 to the second housing 20, but can be used to secure the first housing 18 and thus the board connector 12 to the mounting substrate.

[0039] As shown in FIG. 8, the second housing 20 may include trenches 68 into which wafer or leadframe assemblies 24a, 24b may be embedded. Opposite trenches 68 may be offset to ensure that leadframe assemblies 24a, 24b are offset relative to each other. The second housing 20 may include cutouts 72 for receiving leadframe assemblies included in the first housing 18. The second housing 20 may be used to more accurately position the leadframe assemblies 24a, 24b included in the second housing 20 and the first housing 18, which subsequently utilize corresponding SMT pads, plated vias, or other suitable terminations defined on the surface of the mating substrate to more accurately position the conductor mounting ends of the signal conductor 26, solder balls, etc., and the tail end of the board connector shield 40. The second housing 20 also provides mechanical stability to the entire housing 16.

[0040] Figure 9 is another view of the cable connector system 10, in which the plastic or overmolded plastic is selectively removed from the lead frame assemblies 24a and 24b of the board connector 12 without the housing 16 (including the first housing 18 and the second housing 20). Figure 9 shows the signal conductor 26 deflected in the mating case.

[0041] The first leadframe assembly 74 may include a second signal segment 84 and a second board connector shielding segment 88. The second leadframe assembly 76, the third leadframe assembly 78, and the fourth leadframe assembly 80 may each include a first signal segment 82, a second signal segment 84, a first board connector shielding segment 86, and a second board connector shielding segment 88. The first signal segment 82 may be individually attached to the first board connector shielding segment 86, and the second signal segment 84 may be individually attached to the second board connector shielding segment 88. Alternatively, the second signal segment 84 and each individual second board connector shielding segment 88 may be molded together, and the first signal segment 82 and each individual first board connector shielding segment 86 may be molded together. The board connector 12 may not include discrete ground conductors located between adjacent signal conductors 26 or between adjacent signal conductor pairs 26a, 26b.

[0042] The first signal segment 82 and the corresponding second signal segment 84 can be defined at a right angle. Compared with the first signal segment 82 of the second lead frame assembly 76, the first signal segment 82 of the third lead frame assembly 78 can be longer and taller. Compared with the first signal segment 82 of the third lead frame assembly 78, the first signal segment 82 of the fourth lead frame assembly 80 can be longer and taller.

[0043] In the second leadframe assembly 76, the third leadframe assembly 78, and the fourth leadframe assembly 80, the respective first signal segments 82 and second signal segments 84 can be connected together in any suitable manner, including (e.g.) by soft soldering, welding, acoustic soldering, laser soldering, etc. The first board connector shield segment 86 and the respective second board connector shield segment 88 of each board connector shield 40 can be connected together in any suitable manner, such as the methods discussed in this paragraph regarding the first signal segments 82 and second signal segments 84. In one embodiment, the signal conductor 26 of the second signal segment 84 is embedded in a corresponding hole defined by the signal conductor 26 of the second signal segment 84, and the first signal segments 82 and second signal segments 84 are soft soldered or welded. The first board connector shield segment 86 and the second board connector shield segment 88 can be similarly attached. The tail end 92 of the board connector shield can extend from the board connector shield 40 and be in a straight line with the tail end of the signal conductor 26 carried by the corresponding first signal segment 82.

[0044] FIG10 is similar to FIG9 except that the first lead frame assembly 74 and the second lead frame assembly 76 are not horizontally offset relative to each other in the vertical stacking or height direction, and the third lead frame assembly 78 and the fourth lead frame assembly 80 are not horizontally offset relative to each other in the vertical stacking or height direction. However, both the first lead frame assembly 74 and the second lead frame assembly 76 are offset relative to the third lead frame assembly 78 and the fourth lead frame assembly 80 in the vertical stacking or height direction. All lead frame assemblies 74, 76, 78, and 80 are independent of each other, so the first lead frame assembly 74, the second lead frame assembly 76, the third lead frame assembly 78, and the fourth lead frame assembly 80 shown in FIG9 and FIG10 can be used with any of the cable connector systems 10, 10a, 10b, and 10c shown herein. As discussed above, lead frame assemblies 24a, 24b (such as the first lead frame assembly 74, the second lead frame assembly 76, the third lead frame assembly 78, and the fourth lead frame assembly 80) may be embedded into the housing 16 via groove 68 and retained in the housing 16 by an interference fit. Each of the board connector shields 40 may include one or more arms 90 that can engage with the cable connector shield 42 of the corresponding cable connector 14. Signal conductors 26 may be grouped together in the form of signal conductor pairs 26a, 26b to transmit differential signals.

[0045] The first leadframe assembly 74 is shown in FIG. 11, but this paragraph applies to all leadframe assemblies 24a, 24b. Each signal conductor pair 26a, 26b of the signal conductor 26 may include a cantilevered web 94 extending between the facing edges of the signal conductor pair 26a, 26b of the signal conductor 26 and a button 96 located on one side of the signal conductor pair 26a, 26b. The web 94 and / or the button 96 are optional. Each board connector shield 40 may define a cutout or air gap 98 directly below the signal conductor pair 26a, 26b. Each leadframe assembly 24a, 24b may include an insert 100 surrounding a portion of the signal conductor 26. The insert 100 may be manufactured by molding a dielectric material around the insert of the signal conductor 26. The insert 100 may also surround a portion of a section 88 of the second board connector shield. Alternatively, each molded leadframe assembly 24a, 24b may have its own insert 100, and each second board connector shielding segment 88 may have its own insert 100. Leadframe assemblies 24a, 24b may not include signal conductor 26 located between adjacent signal conductor pairs 26a, 26b.

[0046] Except that board connector 12a has a different slot configuration and is shown with an optional substrate 102 (such as a PCB), FIG12 is similar to FIG5. Unlike FIG5 (where slots 50, 50a, 50b, 50 are alternately offset or horizontally staggered in the vertical stacking or height direction H2), the first slot 50 and the second slot 50a in FIG12 are not horizontally offset or staggered relative to each other in the vertical stacking, vertical stepping, or height direction H2. The third slot 50b and the fourth slot 50b in FIG12 are also not horizontally offset or staggered in the vertical stacking or height direction H2. However, the third slot 50b and the fourth slot 50c (which can generally be described as adjacent to the first and second slots) can both be horizontally offset or staggered relative to the first slot 50 and the second slot 50a in the vertical stacking, stepping, stacking, or height direction H2.

[0047] FIG13 shows a board connector 12a having a first housing 18. A first groove (such as a second groove 50a) may be partially defined by a first housing wall (such as a second housing wall 56a), a surface defined by a first wall 54a, and a surface defined by a third wall 58a on the opposite side. The surfaces of the first wall 54a and the third wall 58a on the opposite side may be uniformly spaced from a longitudinal centerline CL located between the first wall 54a and the third wall 58a, parallel to both the first wall 54a and the third wall 58b on the opposite side. A second groove (such as a third groove 50b) may be partially defined by a first housing wall (such as a second housing wall 56a), a surface defined by a first wall 54b, and a surface defined by a third wall 58b on the opposite side. The surfaces of the first wall 54b and the third wall 58b on the opposite side may be non-uniformly spaced from the longitudinal centerline CL. In other words, Figures 1 and 13 show that the first and second slots (such as first slot 50 and second slot 50a or second slot 50a and third slot 50b) can be arranged adjacent to each other and can be horizontally offset from each other in the vertical stacking or height direction. The cable connectors 14 embedded in the first and second slots are also horizontally offset from each other in the vertical stacking or height direction. As shown in Figures 12 and 13, at least four slots 50 to 50c can also be configured as two pairs of slots. The first pair of slots can be spaced apart, rather than horizontally offset from each other in the vertical stacking or height direction. However, the second pair of slots can be horizontally offset from the first pair of slots in the vertical stacking or height direction. The corresponding cable connectors 14 housed in the first pair of slots can be horizontally offset from the cable connectors 14 housed in the second pair of slots in the vertical stacking or height direction. Each of Figures 1, 12, 13, and 15 shows a slot of any given type in which the first slot and the immediately adjacent second slot (such as the second slot 50a and the third slot 50b in Figures 12 and 13) may be offset relative to each other. As shown in Figures 12 and 13, it is also possible to have a first slot and an immediately adjacent second slot that are not horizontally offset relative to each other.

[0048] In this embodiment, one of the electrical conductors (such as signal conductor pair 26a) disposed in the second slot 50a (or the first slot 50) may be offset in the horizontal direction from the corresponding electrical conductor (such as signal conductor pair 26b disposed in the third slot 50b (second slot 50a)) by no column spacing RP1 (i.e., no offset), a partial column spacing RP1 less than the full column spacing RP1, the full column spacing RP1, greater than the column spacing RP1, the full conductor spacing CP, at least two conductor spacings CP, at least three conductor spacings CP, more than two conductor spacings CP, or more than three conductor spacings CP, wherein the conductor spacing CP is the distance between the center lines of two adjacent electrical conductors or two adjacent signal conductor pairs 26a or 26b. The corresponding electrical conductors or signal conductors 26a and 26b may have the same position number from left to right, such as the last signal conductor pair 26a placed in the second slot 50a (or the first slot 50), and the last signal conductor pair 26b placed from left to right in the third slot 50b (or the second slot 50a).

[0049] A signal conductor pair 26a disposed in the second slot 50a (or the first slot 50) may be offset in the horizontal direction from the corresponding signal conductor pair 26b disposed in the third slot 50b (or the second slot 50) by no conductor column spacing RP2 (i.e., no offset), a partial conductor column spacing RP2 less than the full conductor column spacing RP2, the full conductor column spacing RP2, a conductor column spacing greater than the conductor column spacing RP2, the full conductor spacing CP, at least two conductor spacings CP, at least three conductor spacings CP, more than two conductor spacings CP, or more than three conductor spacings CP, wherein the conductor spacing CP is the distance between the center lines of two adjacent electrical conductors (such as two signal conductors, signal conductor pair 26a or signal conductor pair 26b). The corresponding signal conductor pairs 26a and 26b can have the same position number from left to right, such as the last two signal conductors (signal conductor pair 26a) placed in the second slot 50a (or the first slot 50), and the corresponding last two signal conductors (signal conductor pair 26b) placed from left to right in the third slot 50b (or the second slot 50a).

[0050] Figure 14 illustrates a cable connector system 10a similar to that of Figure 12, but the first housing 18a of the board connector 12a may be defined by a protrusion 104 extending below the second housing 20a and the main surface 106 of the substrate 102. The cable connector 14 is disposed in a first pair of cable connectors 108 and a second pair of cable connectors 110. The first pair of cable connectors 108 may be horizontally offset by an equal distance from the second pair of cable connectors 110 in the vertical stacking or height direction. The first pair of cable connectors 108 each has a first sidewall 112 that is located in a first common plane. The second pair of cable connectors 110 each has a second sidewall 114 that is spaced apart from and parallel to the first common plane in a second common plane. The protrusion 104 may include a protruding wall 104a to provide support for the cable connector 14.

[0051] FIG15 illustrates a 1x2 cable connector system 10b similar to the 1x4 cable connector system 10 shown in FIGS. 1 to 10. The cable connector system 10b may include a board connector 12b, cable connectors 14, a housing 16b that may include a first housing 18b and a second housing 20b, a cable 22, and an optional substrate 102. The first housing 18b may define a first slot 50 and a second slot 50a. The second slot 50a may be horizontally offset relative to the first slot 50 in the vertical stacking or height direction, such that the first sidewall 112a of one of the two cable connectors 14 and the second sidewall 114a of the other of the two cable connectors 14 are not in a common plane. The respective first endwalls 116 of the two cable connectors 14 do not coincide with each other and do not overlap each other.

[0052] Figure 16 illustrates a cable connector system 10c similar to the cable connector system 10b of Figure 15, except that the housing 16c (such as the first housing 18c) defines the protrusion 104c. The protrusion 104c may extend below the second housing 20c and the main surface 106 of the substrate 102. The protrusion 104c may define a protruding wall 104a to help support the mating cable connector 14.

[0053] Figure 17 shows a cable connector 14 that can be used with any of the board connectors 12, 12a, 12b, and 12c described herein. The cable connector 14 may include a cable 22, a cable connector signal conductor 120, a cable connector shield 42, and a cover 122. Although Figure 17 shows eight biaxial cables and eight signal conductor pairs 26a, 26b, any number or type of cable 22 and signal conductor pairs 26a, 26b may be used, including, for example, coaxial cables having a single center conductor.

[0054] As shown in Figure 18, the cable conductor 38 of cable 22 can be attached to the signal conductor 120 of each individual cable connector. Cable shield 34 can be electrically attached to cable connector shield 42. Cable connector insert 118 can surround a portion of the cable connector signal conductor 120 and can be attached to cable connector shield 42. For example, cable connector insert 118 can be manufactured by insert molding. Cable connector shield 42 can define a cantilever shield arm 124 that bends backward over itself.

[0055] Figure 19 shows board connector shield 40 and cable connector shield 42, which are electrically connected, physically connected, or both electrically connected and physically connected. The shield arm 124 of cable connector shield 42 can be bent rearwards onto itself. The mating end 138 of the shield arm 124 can extend through a corresponding hole 126 defined by cable connector shield 42, through the first cable connector shield surface 128 of cable connector shield 42 and the opposite second cable connector shield surface 130, and pass beneath them. This allows the shield arm 124 to electrically and / or physically contact the board connector shield 40 of board connector 12 when cable connector 14 is inserted into any of board connectors 12, 12a, 12b, 12c. The spacing between the first lead frame assembly 74 and the second lead frame assembly 76 can be approximately 1.35 mm. The spacing between the second lead frame assembly 76 and the third lead frame assembly 78 can be approximately 3 mm. The spacing between the third lead frame assembly 78 and the fourth lead frame assembly 80 can be approximately 1.35 mm.

[0056] Figure 20 further shows the shielding arm 124 of the cable connector shield 42 and the cable connector insert 118 including the cable connector signal conductor 120. The cable connector shield 42 may include a monolithic conductive material, such as copper, beryllium copper, or other suitable material, formed as a single unit. The cable connector shield 42 may include the shielding arm 124. The shielding arm 124 may have a first shielding arm portion 132. A bent or U-shaped second shielding arm portion 134 may be attached to the first shielding arm portion 132 and may be bent in a second direction toward the cable connector shield 42. A third shielding arm portion 136 may be connected to the second shielding arm portion 134 and may extend upward toward the cable connector shield 42 and opposite to the direction of the first shielding arm 132, such that the mating end 138 of the third shielding arm portion 136 is received in a hole 126 defined by the cable connector shield 42. The first shield arm portion 132 and the mating end 138 of the third shield arm portion 136 of the shield arm 124 are electrically connected and / or physically contact the board connector shield 40 of the mating connector. When the shield arm 124 contacts or connects with the corresponding board connector shield 40 of the board connectors 12, 12a, 12b, 12c, the shield arm bends backward toward itself to shorten the grounding or return path, thereby increasing the electrical efficiency of the cable connector 14 or the mating combination of the cable connector 14 and the board connector 12. The third shield arm portion 136 and the associated mating end 138 flex in a direction away from the surface 128 of the first cable connector shield of the board connector shield 40, thereby generating a normal force.

[0057] Figures 21 to 25 illustrate a method for manufacturing a cable connector shield 42, a cable connector signal conductor 120, and a shield arm 124 from a single stamping of material. Figure 21 shows a flat-stamped cable connector shield 42 that may include individual cable connector signal conductors 120 and individual shield arms 124. The cable connector shield 42, cable connector signal conductors 120, and shield arms 124 are all formed from a single stamped metal sheet. Any suitable metal sheet can be used. In Figure 22, a progressive die is used to bend and shape the flat-stamped portion to further produce the cable connector shield 42, cable connector signal conductors 120, and shield arms 124. The cable connector signal conductor 120 can be temporarily held in place using a movable connecting rod T. In Figure 23, insert molding can form a cable connector insert 118, which allows the connecting rod T to be removed. After the connecting rod T is removed, the cable connector insert 118 electrically isolates the cable connector signal conductor 120 from the cable connector shield 42 and shield arm 124. The outer frame can also be removed when the connecting rod T is removed. As shown in Figure 24, removing the connecting rod T disconnects the cable connector signal conductor 120 from the remaining portion of the shield arm 124 and cable connector shield 42, thus electrically isolating the cable connector signal conductor 120 from the cable connector shield 42. In Figure 25, the shield arm 124 can be bent through corresponding holes 126 defined by the first cable connector shield surface 128 and the opposite second cable connector shield surface 130.

[0058] Figures 26 and 27 show substrates having substrate coverage areas corresponding to the respective connector coverage areas of each board connector 12, 12a, 12b, 12c. For 1x2 board connectors 12b, 12b, Figure 26 shows a general mounting substrate 160, such as a die substrate, expansion card substrate, or body substrate defining a first substrate occupying area 140. The first substrate occupying area 140 may include a first linear pad array 144. The first linear pad array 144 may extend along a first pad centerline PC1. A second linear pad array 146 may extend along a second pad centerline PC2. The first pad centerline PC1 may be positioned parallel to the second pad centerline PC2.

[0059] In this embodiment, one of the pads in the first linear pad array 144 (such as pad 157 corresponding to one of the signal conductors 26) may be horizontally offset from the corresponding pad in the second linear pad array 146 (such as pad 157a corresponding to one of the signal conductor pairs 26a). The horizontal offset may be no pad column spacing RP (i.e., no offset), a partial pad column spacing RP1 less than the full pad column spacing RP, the full pad column spacing RP, greater than the pad column spacing RP, the full pad spacing PP, at least two pad spacings PP, at least three pad spacings PP, more than two pad spacings PP, or more than three pad spacings PP. The pad column spacing RP may be measured from the center line of the pads in the first linear pad array 144 and the corresponding pads in the second linear pad array 146. The pad spacing PP may be the distance between the center lines of two adjacent pads in each of the first linear array 144 or the second linear array 146. For the pad column spacing RP, the corresponding pads may have the same position number from left to right in each of the first linear pad array 144 and the second linear pad array 146. For example, the corresponding pads may each be the last or second to last pad 157, 157a from left to right in each of the first linear pad array 144 and the second linear pad array 146.

[0060] The first solder tab pad 152 and the second solder tab pad 154 may be positioned adjacent to the second linear pad array 146 on the universal mounting substrate 160. The first solder tab pad 152 may have a first solder tab centerline TCL1, and the second solder tab pad 154 may have a second solder tab centerline TCL2. The first solder tab centerline TCL1 and the second solder tab centerline TCL2 may be arranged parallel to each other and perpendicular to the first pad centerline PC1 and the second pad centerline PC2, respectively. The first pad distance PD1, measured from the center of the last pad 156 in the first linear pad array 144 to the second solder tab centerline TCL2, is less than the second pad distance PD2, measured from the center of the opposite last pad 158 in the second linear pad array 146 to the first solder tab centerline TCL1. The distance PD3 between the third pad 162 in the first linear pad array 144 and the center line TCL1 of the first solder tab can be greater than the distance PD1 of the first pad or the distance PD2 of the second pad. The center lines PC1 of the first pad and PC2 of the second pad do not intersect with the pad 152 of the first solder tab or the pad 154 of the second solder tab.

[0061] For the 1x4 board connectors 12, 12a, as shown in FIG27, the second substrate occupying region 142 is similar to the first substrate occupying region 140 discussed above. The second substrate occupying region 142 may be defined on the universal mating substrate 160 and may include a first linear pad array 144. The first linear pad array 144 may extend along the first pad centerline PC1. The second linear pad array 146 may extend along the second pad centerline PC2. The first pad centerline PC1 may be arranged parallel to the second pad centerline PC2.

[0062] One of the pads in the first linear pad array 144 (such as pad 157 of the corresponding pad in the signal conductor pair 26b) may be horizontally offset from the corresponding pad in the second linear pad array 146 (such as pad 157a of the corresponding pad in the signal conductor pair 26a) by the following distances: no pad column spacing RP (i.e., no offset), a partial pad column spacing RP less than the full pad spacing RP, the full pad column spacing RP, a pad column spacing greater than the pad column spacing RP, the full pad spacing PP, at least two pad spacings PP, at least three pad spacings PP, more than two pad spacings PP, or more than three pad spacings PP. The pad column spacing RP may be the distance from the center lines of the pads in the first linear pad array 144 and the corresponding pads in the second linear pad array 146. The pad spacing PP may be the distance between the center lines of two adjacent pads in each of the first linear array 144 or the second linear array 146. For the pad column spacing RP, the corresponding pads may have the same position number from left to right in each of the first linear pad array 144 and the second linear pad array 146. For example, the corresponding pads may each be the last or second to last pad 157, 157a from left to right in each of the first linear pad array 144 and the second linear pad array 146.

[0063] The first solder tab pad 152 and the second solder tab pad 154 can be positioned on the universal mounting substrate 160. The first solder tab pad 152 may have a first solder tab centerline TCL1, and the second solder tab pad 154 may have a second solder tab centerline TCL2. The first solder tab centerline TCL1 and the second solder tab centerline TCL2 may be arranged parallel to each other and perpendicular to the first pad centerline PC1 and the second pad centerline PC2, respectively. The first pad distance PD1, measured from the center of the last pad 156 in the first linear pad array 144 to the second solder tab centerline TCL2, is less than the second pad distance PD2, measured from the center of the last pad 158 on the opposite side in the second linear pad array 146 to the first solder tab centerline TCL1. The distance PD3 of the third pad, measured between the last pad 162 in the first linear pad array 144 and the center line TCL1 of the first solder tab, may be greater than the distance PD1 of the first pad or the distance PD2 of the second pad. The third linear pad array 164 may extend along the third pad center line PC3, which extends parallel to the center line PC1 of the first pad. The fourth linear pad array 166 may extend along the fourth pad center line PC4, which extends parallel to the center line PC1 of the first pad. The first linear pad array 144 may be arranged in a column-pitch-free manner between the first linear pad array 144 and the third linear pad array 164. The second linear pad array 146 may be arranged in a column-pitch-free manner between the second linear pad array 146 and the fourth linear pad array 166. The center lines PC1, PC2, PC3, and PC4 of the first pad do not intersect with the first solder tab pad 152 or the second solder tab pad 154.

[0064] Figure 28 shows a die substrate 168, a die 170 mounted to the die substrate 168, and a first group of a plurality of cable connector systems 10, 10a, 10b, and 10c. Each cable connector system may include a board connector 12 and a corresponding cable connector 14. The die 170 may be a chip and may be included on a first die substrate surface 172 of the die substrate 168. The combination of the die substrate 168 and the die 170 may be referred to as a die package 174. The first die substrate surface 172 may include an optional serializer / deserializer chip (not shown). The board connector 12 and the cable connector 14 may make electrical contact with the die 170. Placing the cable connector system 10 directly on the die package 174 helps to eliminate trace loss from the die package 174 to the universal mounting substrate 160a.

[0065] The die substrate 168 can be any suitable size, such as an approximately 85 mm by 85 mm printed circuit board measured along the two intersecting first die edge 176 and second die edge 178 of the die substrate 168. The die substrate 168 can be other sizes. The die package 174 is preferably square, but does not necessarily have to have sides of equal length and can have other shapes. The larger the area of ​​the die substrate 168, the more cable connector systems 10, 10a, 10b, 10c can be added to the surface 172 of the first die substrate.

[0066] FIG29 shows a second die substrate surface 180 of die substrate 168. The second die substrate surface 180 may include a second group of cable connector systems 10, 10a, 10b, 10c, each electrically connected to die 170 (FIG. 28). The second die substrate surface 180 may also define pin or pad areas 182 that can electrically connect die 170 (FIG. 28) to power, crimp connectors, pin connectors, inserts, etc. (not shown). The crimp or pin connector may exclusively contain low-speed, power, control, or other sideband signals to die 170 or may include high-speed signals. The second die substrate surface 180 of die package 174 may include serializer / deserializer chips, such as 16x16 channel SERDES chips.

[0067] As shown in Figures 28 and 29, the die package 174 may therefore include a die substrate 168 defining a first die substrate surface 172, a second die substrate surface 180 on the opposite side, a die 170 included on the first die substrate surface 172, cable connector systems 10, 10a, 10b, 10c included on the first die substrate surface 172, and cable connector systems 10, 10a, 10b, 10c included on the second die substrate surface 180. Each cable connector system 10, 10a, 10b, 10c may include a board connector 12 included on the first die substrate surface 172, a board connector 12 included on the second die substrate surface 180, and a cable connector 14 detachably connected to each of the board connectors 12.

[0068] Board connector 12 and cable connector 14 may each include one, two, three, or four rows of four differential signal pairs, or any other number of rows, contacts, or differential pairs. For example, each board connector 12 may include eight differential signal pairs per slot, and each cable connector may include eight differential signal pairs per cable connector system 10, 10a, 10b, 10c, or a total of eight, sixteen, twenty-four, or thirty-two differential signal pairs with 56 Gbits / sec NRZ or 112 Gbits / sec PAM4 capability. As shown on the 85 mm by 85 mm die package 174, twelve two-row cable connector systems 10 (FIGs 16 and 17) can provide at least one hundred and ninety-two differential signal pairs on the first die substrate surface 172 of the die package 174 and at least one hundred and ninety-two differential signal pairs on the second die substrate surface 180 opposite to the die package 174. A system 10 of twelve four-row cable connectors (Figures 1 to 10 and Figures 12 to 14) positioned on the surface 172 of the first die substrate 174 can provide at least 384 differential signal pairs on the surface 172 of the first die substrate 174 and at least 384 differential signal pairs on the surface 180 of the second die substrate 174. Any of the cable connectors in the system may be positioned on a substrate different from the die substrate 168.

[0069] The cable 22 attached to the cable connector 14 may have a maximum diameter of 33, 34, 35, or 36 gauges. Both the board connector 12 and the cable connector 14 may be configured not to accommodate edge cards. The 2x1 board connectors 12, 12a, 12b, or the cable connector 14 have modeled embedding losses between 0 dB and -1 dB at frequencies up to 25 GHz, between 0 dB and -1 dB at frequencies up to 30 GHz, and between 0 dB and -2 dB at frequencies up to 40 GHz. The differential return loss may be between -20 dB and -60 dB at frequencies up to 20 GHz and between -10 dB and -60 dB at frequencies up to 30 GHz. The differential far-end crosstalk (FEXT) power sum is modeled to be between -30 dB and -100 dB at frequencies up to 40 GHz and between -20 dB and -100 dB at frequencies up to 90 GHz. The modeled differential near-end crosstalk (NEXT) is between -40 dB and -100 dB at frequencies up to 35 GHz and between -30 dB and -100 dB at frequencies up to 50 GHz.

[0070] The 4x1 board connectors 12, 12a, 12b or cable connector 14 have modeled embedding losses between 0 dB and -2 dB at frequencies up to 15 GHz, between 0 dB and -3 dB at frequencies up to 20 GHz, and between 0 dB and -5 dB at frequencies up to 40 GHz. Differential return loss is between -20 dB and -60 dB at frequencies up to 10 GHz and between -10 dB and -60 dB at frequencies up to 50 GHz. The differential far-end crosstalk (FEXT) exponentiation is modeled between -30 dB and -100 dB at frequencies up to 40 GHz and between -20 dB and -100 dB at frequencies up to 60 GHz. Modeled differential near-end crosstalk (NEXT) is between -40 dB and -100 dB at frequencies up to 40 GHz and between -30 dB and -100 dB at frequencies up to 50 GHz. The data rate is approximately twice the frequency; therefore, 20 GHz is roughly equivalent to a data rate of 40 Gbits / sec, 30 GHz is roughly equivalent to a data rate of 60 Gbits / sec, 40 GHz is roughly equivalent to a data rate of 80 Gbits / sec, and so on.

[0071] Each cable connector 14 can terminate another connector, such as board I / O connector 184, board connector, etc. As shown in Figure 30, board I / O connector 184 can be a modified accelerated I / O connector. Standard ACCELERATEC connectors are available from SAMTEC. Modified ACCELERATEC I / O connectors may include 33 AWG, 34 AWG, 35 AWG, or 36 AWG cables 22. Cables with other gauges are also possible, including, for example, 26 AWG, 27 AWG, 28 AWG, 29 AWG, 30 AWG, 31 AWG, 32 AWG, and 33 AWG.

[0072] The board I / O connector 184 may include a first row 188, a second row 190, a third row 192, and a fourth row 194 of electrical conductors, such as eight I / O differential signal pairs 196 and a ground 198 configured in an SSG or SSGG configuration. The SSGG configuration can reduce signal density. The first row 188 and the second row 190 may be spaced apart by a first pitch P1 of approximately 2.2 mm, the second row 190 and the third row 192 may be spaced apart by a second pitch P2 of approximately 3 mm, and the third row 192 and the fourth row 194 may be spaced apart by a third pitch P3 of approximately 2.2 mm. The electrical conductors may be spaced at a pitch of 0.635 mm. Board fasteners 200 may be used to attach the board I / O connector 184 to a board, such as the 1 RU board 202 shown in FIG. 32. Cables attached to the respective differential signal pairs 196 and ground may be terminated to respective cable connectors 14.

[0073] Figure 31 shows an external cable connector 186 that can mate with the board I / O connector 184 of Figure 30. The external cable connector 186 of Figure 31 may include a first row 188a, a second row 190a, a third row 192a, and a fourth row 194a of electrical contacts, such as eight I / O differential signal pairs 196a and a ground 198a configured in an SSG or SSGG configuration. The SSGG configuration can reduce signal density. The first row 188a and the second row 190b may be spaced apart by a first pitch P1 of about 2.2 mm, the second row 190a and the third row 192a may be spaced apart by a second pitch P2 of about 3 mm, and the third row 192a and the fourth row 194a may be spaced apart by a third pitch P3 of about 2.2 mm. Electrical conductors may be spaced at a pitch of about 0.635 mm. Cable 22 may be electrically connected to the respective differential signal pairs 196a and the ground 198a.

[0074] Figure 32 shows the surface of a 1 RU board 202 filled with board I / O connectors 184. At least thirty-two board I / O connectors 184 can be assembled in an area of ​​the 1 RU board that is approximately 1.75 inches by approximately 19 inches, or approximately 29.75 inches, or approximately 214 cm2.

[0075] Embodiments of the present invention can pass through or assemble at least 257, at least 280, at least 300, at least 400, and at least 500 56 Gbits / sec NRZ or 112 Gbits / sec PAM4 differential signal pairs via a 1 RU board area. In a 1 x 4 configuration, on an 85 mm x 85 mm die package, with eight differential signal pairs per slot or column, only twelve board connectors 12, 12a, 12b, 12c and only twelve board I / O connectors need to pass through a minimum of 380 four-way differential signals on the board. If more than twelve board connectors are positioned on the surface of the second die substrate of the die package, the total number of differential signal pairs can be doubled to 768 differential signal pairs passing through a board area smaller than 1 RU.

[0076] Any 1RU panel area described herein is not limited to a single 1RU panel. 1RU panel areas may be distributed across two or more 1RU panels. A 1RU panel may define a plurality of panel through-holes (such as screens) to allow airflow through the 1RU panel.

[0077] As shown in Figure 33, for a 1 RU board optical solution, the onboard transceiver 204 (such as the commercially available FIREFLY onboard transceiver manufactured by SAMTEC) can be carried by tray 206. The optical front board connector 208 can be easily fitted within 50% to 60% of the 1.75-inch by 17-inch area of ​​the 1 RU board 202. The optical front board connector 208 (such as an MPO, LC, or SC connector compatible with both multimode and single-mode fiber or with high-density optical connectors with fiber, each having a pitch of 250 μm or less) can be optically connected to the onboard transceiver 204 via individual optical cables 210. At least one onboard heatsink 212 can be located between two back-to-back onboard transceivers 204. A cooling fan 214 can move air above the onboard transceivers 204 and above the onboard heatsink 212. The die package and its corresponding die package heat sink 216 can be located between two linear arrays of the onboard transceiver 204.

[0078] Referring to Figure 34, the onboard transceivers 204 can be housed by corresponding low-speed connectors 218 and high-speed connectors 220, each positioned on a corresponding tray substrate 222. This configuration yields thirty-two onboard transceivers 204, sixteen of which are not reversed and sixteen of which are reversed. Cables 22 are electrically attached at one end to each of the high-speed connectors 220, and at a second end on the opposite side to a corresponding cable connector 14 (Figure 3). Two onboard heat sinks 212 are shown.

[0079] As shown in Figure 35, the first airflow region 224, the second airflow region 226, and the third airflow region 228 can be isolated in the tray 206, so that the onboard transceiver 204 has discrete dedicated first airflow regions 224 and third airflow regions 228, and the die 170, die package 174, and die package heat sink (e.g., die package heat sink 216 in Figure 33) also have a dedicated second airflow region 226. The airflow regions 224, 226, and 228 can be formed by physical partitions 230 or dedicated cooling fans, heating pipes, etc. The die package 174 shown in Figure 35 is similar to the die package 174 shown in Figure 28. Separating or separating the first airflow region 224, the second airflow region 226, and the third airflow region 228 helps prevent heat from diffusing from the die 170 and its associated heat sink to the onboard transceiver 204, and from the onboard transceiver 204 to the die 170 and its associated die package heat sink. The first airflow region 224, the second airflow region 226, and the third airflow region 228 may be parallel to each other, may be arranged adjacent to each other, and may be served by individual fans (such as cooling fan 214 in Figure 33). A back-to-back transceiver 204 may be disposed in the first airflow region 224 and the third airflow region 228. A die 170 and its associated die-packaged heatsink may be disposed in the second airflow region 226.

[0080] It should be understood that the foregoing description is merely illustrative of the invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the invention. Therefore, the invention is intended to cover all such alternatives, modifications, and variations that fall within the scope of the appended claims. The description of the embodiments described herein is not limited to the described embodiments and can also be applied to other embodiments disclosed herein. [Simplified Explanation of the Diagram]

[0020] [Figure 1] is a perspective top view of the cable connector system. [Figure 2] is a side view of the cable connector system shown in Figure 1. [Figure 3] is a perspective bottom view of the cable connector system shown in Figure 1. [Figure 4] is a perspective top view of the board connector shown in Figure 1. [Figure 5] is a perspective front view of the board connector shown in Figure 1. [Figure 6] is a perspective front view of the first housing shown in Figure 1. [Figure 7] is a perspective rear view of the first housing shown in Figure 1. [Figure 8] is a perspective top view of the second housing shown in Figure 1. [Figure 9] is a perspective side view of the conductors of the mating lead frame assembly shown in Figure 1 without any plastic or overmolding. [Figure 10] is a perspective front view of the lead frame assembly. [Figure 11] is a perspective top view of the first lead frame assembly shown in Figure 10. [Figure 12] is a perspective front view of the board connector including the lead frame assembly shown in Figure 10. [Figure 13] is a front view of the first housing shown in Figure 12. [Figure 14] is a perspective rear view of a cable connector system with a protruding plate connector. [Figure 15] is a perspective rear view of a 1x2 cable connector system. [Figure 16] is a perspective rear view of a 1x2 cable connector system with a protruding plate connector. [Figure 17] is a perspective front view of a cable connector. [Figure 18] is a perspective top view of the cable connector shown in Figure 17. [Figure 19] is a cross-sectional side view of the cable connector system shown in Figure 1. [Figure 20] is a top perspective view of the cable connector shield and insert. [Figure 21] is a perspective top view of the cable connector shield before bending. [Figure 22] is a top perspective view of the cable connector shield machined by progressive die machining. [Figure 23] is a top perspective view of the cable connector shield machined by progressive die machining. [Figure 24] is a top perspective view of the cable connector shield machined by progressive die machining. [Figure 25] is a top perspective view of the cable connector shield manufactured using progressive die-casting. [Figure 26] is a top view of the area occupied by the first substrate. [Figure 27] is a top view of the area occupied by the second substrate. [Figure 28] is a top view of the die package mounted to the main substrate. [Figure 29] is a bottom view of the die package filled with the cable connector system. [Figure 30] is a perspective side view of the board I / O connector. [Figure 31] is a perspective side view of the external cable connector. [Figure 32] is a front view of the 1RU board. [Figure 33] is a perspective top view of the tray. [Figure 34] is a side view of two stacked onboard transceivers. [Figure 35] is a perspective top view of the tray shown in Figure 33, where components have been removed for clarity.

Claims

1. A system comprising: A board comprising: a 1RU region; and at least two hundred and fifty-seven 56 Gbits / sec non-return-to-zero (NRZ) and / or 112 Gbits / sec fourth-order pulse amplitude modulation (PAM4) differential signal pairs disposed in the 1RU region; And a board connector, the board connector being mounted on the board and comprising: a housing including: a first board connector mating interface surface; a first slot defined by the first board connector mating interface surface; a second slot vertically stacked above the first slot; and a first housing wall partially defining both the first slot and the second slot; a first lead frame assembly disposed in the first slot, the first lead frame assembly including a first signal conductor having a first mating end and a second signal conductor having a second mating end; a second lead frame assembly disposed in the second slot, the second lead frame assembly including a third signal conductor having a third mating end and a fourth signal conductor having a fourth mating end; wherein the first mating end and the second mating end are disposed closer to the first board connector mating interface surface than the third mating end and the fourth mating end; and the first housing wall extends above the first mating end, the second mating end, the third mating end, and the fourth mating end.

2. The system as described in claim 1, wherein at least two hundred and eighty-nine 56 Gbits / sec NRZ and / or 112 Gbits / sec PAM4 differential signal pairs are located in the 1RU area.

3. The system as described in claim 1, wherein at least three hundred 56 Gbits / sec NRZ and / or 112 Gbits / sec PAM4 differential signal pairs are located in the 1RU area.

4. The system as described in claim 1, wherein at least four hundred 56 Gbits / sec NRZ and / or 112 Gbits / sec PAM4 differential signal pairs are located in the 1RU area.

5. The system as described in claim 1, wherein at least five hundred 56 Gbits / sec NRZ and / or 112 Gbits / sec PAM4 differential signal pairs are located in the 1RU area.

6. The system as described in any one of claims 1 to 5, wherein the first groove is defined by the first housing wall, a first wall and a pair of third walls on either side, and the first wall and the third wall on either side are uniformly spaced from a longitudinal centerline located between the first wall and the third wall on either side and parallel to both the first wall and the third wall on either side.

7. The system as claimed in claim 6, wherein the second groove is defined by the first housing wall, the first wall and the third wall on the opposite side, and the first wall and the third wall on the opposite side are unevenly spaced from the longitudinal centerline.

8. The system as claimed in claim 6, wherein the second groove is defined by the first housing wall, the first wall and the third wall on the opposite side, and the first wall and the third wall on the opposite side are evenly spaced from the longitudinal centerline.

9. The system as described in any one of claims 1 to 5, wherein the housing further comprises: A third slot, which is vertically stacked above the second slot; a second housing wall, which partially defines both the second and third slots; and a third lead frame assembly disposed in the third slot. The third lead frame assembly includes a fifth signal conductor having a fifth mating end and a sixth signal conductor having a sixth mating end, wherein the fifth mating end and the sixth mating end are each disposed further away from the mating interface surface of the first board connector than the first mating end, the second mating end, the third mating end and the fourth mating end.

10. The system as claimed in claim 9, wherein the third groove is defined by the second housing wall, a first wall and a pair of side third walls, and the first wall and the side third walls are unevenly spaced from a longitudinal centerline.

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