Installation tools and installation devices

Abstract

The present invention provides a mounting tool and mounting apparatus that can reduce the residual air bubbles and damage to the substrate when mounting electronic components on a substrate. An embodiment is a mounting tool (31) for mounting electronic components (2) on a substrate (W), having: a holding surface (311) that is raised in such a way that the electronic components (2) are bent and joined together; a plurality of openings (312) provided on the holding surface (311); and a plurality of vent holes (313) respectively provided in communication with the plurality of openings (312). The plurality of vent holes (313) hold the electronic components (2) on the holding surface (311) by setting the internal pressure to negative pressure, and by setting the vent holes (313) adjacent to each other to positive pressure starting from the vent hole (313) closest to the most raised peak of the holding surface (311), the electronic components (2) are detached from the holding surface (311).

Description

[Technical Field]

[0001] This invention relates to an installation tool and an installation device. [Previous Technology]

[0002] When electronic components, such as logic, memory, and image sensors, are mounted on a substrate, monolithic wafers are produced by cutting wafers on which semiconductor components are formed. Then, the wafers are picked up one by one and transferred to the substrate for mounting.

[0003] During the installation of such electronic components, air bubbles sometimes remain between the electronic component and the substrate. If air bubbles exist between the electronic component and the substrate, poor connection and insufficient strength will result in poor installation. To address this, during the installation of the electronic component, the electronic component is bent and held in an installation tool that presses against the substrate. After a portion of the electronic component contacts the substrate, it is pressed using an elastomer, thereby expelling the air between the electronic component and the substrate for installation. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent No. 3757193 [Patent Document 2] Japanese Patent Application Publication No. 2003-203964 [Patent Document 3] Japanese Patent Application Publication No. 2005-150311 [Summary of the Invention]

[0005] [The problem the invention aims to solve]

[0006] However, in tools where the elastomer deforms and crushes while being pressed, depending on the size of the electronic component, the pressed area may not expand evenly, or sufficient force may not be applied to the outer edge, thus failing to expel air bubbles. In addition, sometimes excessive pressing force is applied to the central part, causing the electronic component to break.

[0007] This invention was made to solve the problems described above, and its object is to provide a mounting tool and mounting apparatus that can reduce the residue of air bubbles and damage to the substrate when mounting electronic components onto a substrate. [Means for Solving the Problem]

[0008] The present invention is a mounting tool for mounting electronic components on a substrate, comprising: a retaining surface raised in such a way that the electronic components are bent and joined together; a plurality of openings provided on the retaining surface; and vent holes communicating with the openings, wherein the electronic components are held on the retaining surface by setting the internal pressure to a negative pressure, and the electronic components are disengaged from the retaining surface by setting the vent holes adjacent to each other to a positive pressure, starting from the vent hole closest to the most raised peak of the retaining surface.

[0009] The installation apparatus of the present invention includes the installation tool, and further includes: a tool moving mechanism for reciprocating the installation tool between a junction position and an installation position and for raising and lowering it between the junction position and the installation position; a detection unit for detecting contact with the installation tool; and a switching unit for switching the negative pressure and positive pressure of the vent hole of the installation tool when contact is detected by the detection unit. [Effects of the Invention]

[0010] The mounting tool and mounting device according to the present invention can reduce the residual air bubbles and damage to the substrate when mounting electronic components on the substrate.

Implementation Method

[0012] The mounting apparatus of the embodiment will be described with reference to the accompanying drawings. Furthermore, the drawings are schematic diagrams, and exaggerated dimensions and proportions are included for ease of understanding. As shown in Figures 1 and 2, the mounting apparatus 1 includes a supply device 10, a pickup device 20, a mounting device 30, and a control device 50. It is a device that uses the pickup device 20 to transfer electronic components 2 to the mounting device 30, and uses the mounting device 30 to mount them onto the substrate W of the substrate stage 60. The electronic component 2 is, for example, a chip-shaped component. In this embodiment, the electronic component 2 is a semiconductor chip that has been divided into individual wafers.

[0013] The supply device 10 is a device for supplying electronic component 2 to the pickup device 20. The supply device 10 moves the electronic component 2, which is the pickup object, to the supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic component 2, which is the pickup object. The supply device 10 includes a supply platform 12 that supports a sheet 11 on which the electronic component 2 is attached, and a platform moving mechanism 13 that moves the supply platform 12. As the platform moving mechanism 13, for example, a linear guide that moves the slider on a guide rail by means of a ball screw mechanism driven by a servo motor can be used.

[0014] Here, the sheet 11 on which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). On the sheet 11, the electronic components 2 are arranged in a matrix. In this embodiment, the electronic components 2 are arranged in an upward-facing state with their functional surfaces exposed.

[0015] The supply stage 12 is a stage that horizontally supports the wafer ring on which the sheet 11 is attached. That is, the sheet 11 on which the electronic component 2 is attached is supported via the wafer ring. The supply stage 12 is configured to move horizontally via the stage moving mechanism 13. The sheet 11 and the supply stage 12 are horizontally supported together, so the sheet 11 and the electronic component 2 mounted on the sheet 11 are also configured to move horizontally.

[0016] Furthermore, as shown in Figures 1 and 2, the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Additionally, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The up direction is the direction bounded by the plane of the sheet 11 and on the side where the electronic component 2 is mounted, and the down direction is the direction bounded by the plane of the sheet 11 and on the side where the electronic component 2 is not mounted.

[0017] [Pickup Device] The pickup device 20 is a relay device that picks up electronic components 2 from the supply device 10 and transfers the picked-up electronic components 2 to the mounting device 30. The pickup device 20 includes a pickup nozzle 21, a nozzle moving mechanism 22, a direction conversion unit 23, and an upper pusher 24.

[0018] The pickup nozzle 21 is a cylindrical adsorption nozzle that holds the electronic component 2 and releases it upon release of the holding state. The pickup nozzle 21 has a nozzle orifice with an adsorption surface opening at its front end. The nozzle orifice is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and a negative pressure is generated by the circuit to adsorb and hold the electronic component 2 using the nozzle orifice. Furthermore, the electronic component 2 is released from the pickup nozzle 21 by releasing the negative pressure.

[0019] The nozzle moving mechanism 22 is a mechanism that causes the pickup nozzle 21 to reciprocate between the supply position P1 and the transfer position P2, and to rise and fall between the supply position P1 and the transfer position P2. Specifically, the nozzle moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222. Furthermore, the transfer position P2 is the position where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to the mounting tool 31, which functions as a receiving unit as described later.

[0020] The supply position P1 and the handover position P2 mainly refer to the positions in the XY direction, not necessarily the positions in the Z-axis direction. Furthermore, even when referring to the Z-axis position (height), its height has a specified width. The specified width includes the thickness of the electronic component 2 at the time of handover, the distance at which the electronic component 2 is pushed upwards, and the distance at which the electronic component 2 can be attracted, etc.

[0021] The sliding mechanism 221 reciprocates the pickup nozzle 21 between the supply position P1 and the transfer position P2. Here, the sliding mechanism 221 includes a guide rail 221b extending parallel to the X-axis direction and fixed to the support frame 221a, and a slider 221c traveling on the guide rail 221b. Although not shown, the slider 221c is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The lifting mechanism 222 moves the pickup nozzle 21 in the vertical direction. Specifically, the lifting mechanism 222 can use a linear guide that moves the slider on the guide rail by a ball screw mechanism driven by a servo motor. That is, driven by the servo motor, the pickup nozzle 21 rises and falls along the Z-axis direction.

[0022] A direction conversion unit 23 is provided between the pickup nozzle 21 and the nozzle moving mechanism 22. Here, the direction conversion unit 23 is an actuator comprising a drive source such as an electric motor that changes the orientation of the pickup nozzle 21, and a rotation guide such as a ball bearing. Changing the orientation means rotating 0° to 180° in the vertical direction. For example, the pickup nozzle 21 with its adsorption surface facing the supply stage 12 is used to adsorb and hold the electronic component 2 at the supply position P1. Then, the direction conversion unit 23 changes the orientation of the pickup nozzle 21 so that its adsorption surface faces upward. At this time, the rotation angle is 180°.

[0023] The upper pusher 24 is disposed below the sheet 11 of the supply device 10. The upper pusher 24 is a needle-like member with a sharp front end. The upper pusher 24 is disposed inside the support body 241 with its length direction parallel to the Z-axis direction.

[0024] The support 241 has a drive mechanism for moving the upper pusher 24 in and out of its interior or retracting it into its interior. The movement in and out is performed in the vertical direction. The drive mechanism includes, for example, a slider that moves guided by a guide rail in the vertical direction, and a cylinder or cam mechanism that drives the slider.

[0025] [Mounting Device] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate W. The mounting position P3 is the position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a mounting tool 31 and a tool moving mechanism 32.

[0026] The mounting tool 31 is a component that functions as a receiving part to receive the electronic component 2 from the pick-up nozzle 21 at the handover position P2 and to mount the electronic component 2 onto the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2 and releases the electronic component 2 after mounting.

[0027] Specifically, as shown in Figures 3(A) and 3(B), the mounting tool 31 is a block with a roughly rectangular cross-section and has a retaining surface 311, an opening 312, and a vent 313. The retaining surface 311 is the bottom surface of the mounting tool 31 and is a surface that is raised in a way that the electronic component 2 is bent and connected. The term "bending" refers to bending in a way that does not produce an angle, and also includes an embodiment such as bending by creating a curved surface between flat surfaces as shown in Figure 3(B), which is called buckling. In this embodiment, the retaining surface 311 is mountain-shaped. The mountain-shaped shape referred to here is the shape of two flat surfaces with different angles that are gently continuous at the peak portion including the highest point in the center. That is, the planar shape of the retaining surface 311 is rectangular, the center of the two sides in the long side direction becomes the peak portion, and the edge connecting the peak portions of the two sides becomes the short side direction. Furthermore, the retaining surface 311 is preferably formed of a rigid material to prevent elastic deformation under the pressure of mounting the electronic component 2. The retaining surface 311 can be rectangular or square depending on the electronic component 2 to be installed. Furthermore, as mentioned above, Figures 3(A) to 3(C) and other figures are schematic diagrams, and the degree of protrusion of the retaining surface 311 or its ratio to other parts is exaggerated for ease of understanding.

[0028] As shown in Figure 3 (C), multiple openings 312 are provided on the holding surface 311. The multiple openings 312 are arranged in multiple columns. Here, when the holding surface 311 is rectangular, the direction of each column is parallel to its short side. However, it is not limited to the stated direction. In this embodiment, the openings 312 are separated by a column [1] provided in the peak portion, and columns [2] and [3] are provided on each of the two short sides of the holding surface 311.

[0029] Multiple vent holes 313 are provided, and one end of each vent hole 313 is connected to a respective opening 312. The multiple vent holes 313 hold the electronic component 2 on the holding surface 311 by setting the pressure inside the holes to negative pressure, and by setting adjacent vent holes 313 to positive pressure sequentially, starting from the vent hole 313 closest to the most prominent peak of the holding surface 311, the electronic component 2 is detached from the holding surface 311. In this embodiment, the vent holes 313 on the central side of the electronic component 2 are sequentially set to positive pressure towards the adjacent vent holes 313. The other end of each vent hole 313 is connected to a pneumatic circuit (not shown) generated by switching between negative and positive pressure. In this embodiment, each row of vent holes 313 is connected to a pipe and a valve, so that the negative and positive pressure can be switched for each row. This valve functions as a switching part for switching between negative and positive pressure on the vent holes 313.

[0030] The tool moving mechanism 32 causes the installation tool 31 to reciprocate between the handover position P2 and the installation position P3, and to rise and fall between the handover position P2 and the installation position P3. The tool moving mechanism 32 has a sliding mechanism 321 and a lifting mechanism 322.

[0031] The sliding mechanism 321 causes the installation tool 31 to reciprocate between the junction position P2 and the installation position P3. Here, the sliding mechanism 321 includes two guide rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c traveling on the guide rails 321b. Although not shown, the slider 321c is driven by a ball screw, linear motor, or the like driven by a rotary electric motor. Furthermore, although not shown, the sliding mechanism 321 includes a sliding mechanism that causes the installation tool 31 to slide in the Y-axis direction. The sliding mechanism may also include a guide rail in the Y-axis direction and a slider traveling on the guide rail. The slider is driven by a ball screw, linear motor, or the like driven by a rotary electric motor.

[0032] The lifting mechanism 322 moves the installation tool 31 vertically by driving an arm on which the installation tool 31 is detachably mounted. Specifically, the lifting mechanism 322 may use a linear guide that moves the slider on a guide rail by a ball screw mechanism driven by a servo motor. That is, the installation tool 31 is raised and lowered along the Z-axis by the drive of the servo motor. Furthermore, a detection unit 322a is provided on the lifting mechanism 322 to detect contact with the installation tool 31. As the detection unit 322a, a load sensor such as a strain gauge or a piezoelectric element may be used.

[0033] The substrate stage 60 is a platform that supports the substrate W for mounting electronic components 2. The substrate stage 60 is provided with a stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that causes the substrate stage 60 to slide in the XY plane and positions the mounting position of the electronic components 2 on the substrate W at the mounting position P3. The stage moving mechanism 61 may, for example, use a linear guide that moves the slider on a guide rail by means of a ball screw mechanism driven by a servo motor.

[0034] The control device 50 controls the start, stop, speed, and timing of the supply device 10, pickup device 20, mounting device 30, and substrate stage 60. In other words, the control device 50 is the control device for the mounting device 1. The control device 50 can be implemented, for example, through a dedicated electronic circuit or a computer operating according to a prescribed program. Input devices for inputting instructions or information required for control by the operator, and output devices for confirming the status of the device, are connected to the control device 50. Input devices can be switches, touch screens, keyboards, mice, etc. Output devices can be displays such as liquid crystal displays (LCDs) or organic electroluminescent (EL) displays.

[0035] Figure 4 is a functional block diagram of the control device 50. The control device 50 includes: a supply device control unit 51 for controlling the supply device 10, an upper push control unit 52 and a pick-up nozzle control unit 53 for controlling the pick-up device 20, an installation tool control unit 54 for controlling the mounting device 30, a substrate stage control unit 56 for controlling the substrate stage 60, and a memory unit 57.

[0036] The supply device control unit 51 controls the movement of the supply platform 12. That is, it controls the movement of the electronic component 2, which is placed on the sheet 11 as a pickup object. The upper push control unit 52 controls the movement of the upper push 24.

[0037] The pickup nozzle control unit 53 controls the movement of the pickup nozzle 21, that is, the operation of the nozzle movement mechanism 22 and the direction conversion unit 23. In addition, the pickup nozzle control unit 53 controls the negative pressure generation circuit connected to the nozzle orifice 21b, and controls the holding and releasing of the electronic component 2.

[0038] The mounting tool control unit 54 controls the movement of the mounting tool 31, i.e., the operation of the tool moving mechanism 32. Additionally, the mounting tool control unit 54 controls the air pressure circuit connected to the vent 313 of the mounting tool 31, switching the negative and positive pressure of each row of openings 312 to control the holding and releasing of the electronic component 2. Furthermore, the mounting tool control unit 54 controls the switching of negative and positive pressure of the vent 313 based on contact detection performed using the detection unit 322a. The substrate stage control unit 56 controls the movement of the substrate stage 60, i.e., the operation of the stage moving mechanism 61.

[0039] The memory unit 57 is a memory device that includes various memory media (such as hard disk drives (HDDs) or solid state drives (SSDs)) and an interface between the recording media and the external environment. The memory unit 57 stores in advance the data and program required for the operation of the installation device 1, and also stores the data required for the operation of the installation device 1. This required data includes, for example, the position coordinates of the supply position P1, the handover position P2, the installation position P3, and the position coordinates of each moving mechanism. Each moving mechanism performs movement control of its respective structure based on these coordinates. Furthermore, the memory unit 57 stores the timing for switching which column of the vent holes 313 of the installation tool 31 from negative pressure to positive pressure.

[0040] [Operation] The operation of the mounting device 1 as described above will be explained. First, the pickup device 20 picks up the electronic component 2 from the supply device 10 and transfers the electronic component 2 to the mounting device 30. That is, the pickup device 20 moves the pickup nozzle 21 to the supply position P1 where the upper pusher 24 is located, so that the nozzle hole 21b of the pickup nozzle 21 faces the upper pusher 24.

[0041] On the other hand, the supply device 10 moves the supply stage 12, positioning the electronic component 2, which is the pick-up object, at the supply position P1. Then, the pick-up nozzle 21 is lowered so that the adsorption surface comes into contact with the electronic component 2 at the supply position P1 to adsorb the electronic component 2. Next, while holding the electronic component 2, the pick-up nozzle 21 is raised, and the electronic component 2 is pushed upward using the upper pusher 24, thereby picking up the electronic component 2 while it is being peeled off the sheet 11.

[0042] The pickup device 20 reverses the pickup nozzle 21 via the direction conversion unit 23. That is, the orientation of the pickup nozzle 21 is rotated 180° in the vertical direction so that the suction surface of the pickup nozzle 21 faces upward. Furthermore, the reversing operation can be performed at any location between the supply position P1 and the transfer position P2.

[0043] The pickup device 20 moves the picked-up electronic component 2 to the handover position P2 by means of the nozzle moving mechanism 22. The mounting tool 31 of the mounting device 30 is moved to the handover position P2 by means of the tool moving mechanism 32 and stands by. The holding surface 311 of the mounting tool 31 faces the nozzle hole 21b of the pickup nozzle 21 via the electronic component 2.

[0044] Then, after the mounting tool 31 is lowered toward the pickup nozzle 21 located at the transfer position P2, and negative pressure is applied to the vent 313 of the mounting tool 31 to hold the electronic component 2, the negative pressure on the pickup nozzle 21 is released, thereby transferring the electronic component 2 from the pickup nozzle 21 to the mounting tool 31. As a result, the electronic component 2 is bent in a manner similar to the bulge of the holding surface 311 and is adsorbed and held.

[0045] Next, the mounting tool 31 moves to the mounting position P3 and mounts the electronic component 2 onto the substrate W. The mounting operation will be described with reference to the flowchart in FIG5 and the operation diagram in FIG6. First, the mounting tool 31 moves to the mounting position P3, as shown in FIG6(A), with the electronic component 2 held by the mounting tool 31 facing the substrate W (step S01). Then, the mounting tool 31 descends, bringing the electronic component 2 closer to the substrate W (step S02).

[0046] When the detection unit 322a of the mounting tool 31 detects contact between the electronic component 2 and the substrate W (YES in step S03), the mounting tool 31 stops descending (step S04). Then, starting from a portion of the vent 313, the negative pressure is sequentially stopped and set to positive pressure, thereby causing the electronic component 2 to detach and be mounted on the substrate W. That is, the positive pressure is switched in the order of columns [1], [2], and [3] shown in Figures 3(A) to 3(C), and air is blown from the opening 312 (steps S05 to S07).

[0047] At this time, as shown in Figures 6(B), 6(C), and 6(D), the portion of the electronic component 2 corresponding to the most prominent peak of the holding surface 311 in the plurality of columns of the vent 313 initially contacts the substrate W. From the column of the peak portion to the adjacent column, the pressure changes sequentially from negative (white arrows in the figure) to positive (black arrows in the figure). As a result, the bent electronic component 2 gradually detaches from the peak portion outward in a manner mimicking the flat surface of the substrate W, so that the air bubble is expelled to the outside while being mounted on the substrate W. After mounting, as shown in Figure 6(E), the mounting tool 31 rises, and the remaining electronic component 2 is retracted from the substrate W (step S08).

[0048] [Effect] (1) The present embodiment is a mounting tool 31 for mounting electronic components 2 on a substrate W, having: a holding surface 311 that is raised in such a way that the electronic components 2 are bent and connected; a plurality of openings 312 provided on the holding surface 311; and a plurality of vent holes 313 that are respectively provided in communication with the plurality of openings 312. The plurality of vent holes 313 hold the electronic components 2 on the holding surface 311 by setting the internal pressure to negative pressure, and by setting the vent holes 313 adjacent to each other to positive pressure starting from the vent hole 313 closest to the most raised peak of the holding surface 311, the electronic components 2 are detached from the holding surface 311.

[0049] In addition, the installation device 1 of this embodiment has an installation tool 31 and includes: a tool moving mechanism 32 that moves the installation tool 31 back and forth between the junction position and the installation position and raises and lowers between the junction position and the installation position; a detection unit 322a that detects the contact pressure on the installation tool 31; and a switching unit that switches the negative pressure and positive pressure on the vent 313 of the installation tool 31 when the detection unit 322a detects contact.

[0050] Therefore, since the electronic component 2 is bent and held in the holding surface 311 by negative pressure, the vent is sequentially set to positive pressure. As the electronic component 2 becomes flat in a manner similar to the substrate W, air bubbles are expelled during installation. This suppresses the accumulation of air bubbles between the electronic component 2 and the substrate W, thereby reducing installation defects. Since the installation is performed by utilizing the bending and recovery of the electronic component 2 itself, the pressing pressure is applied evenly without bias, which can uniformly expel air bubbles and reduce damage to the electronic component 2.

[0051] (2)The multiple openings 312 are arranged in multiple columns. Therefore, by switching the negative pressure to positive pressure in each column in turn, the bent part can be restored to a flat position for installation while preventing excessive force from being applied to a part of the electronic component 2.

[0052] (3) Starting from the vent 313 closest to the most prominent peak of the holding surface 311 among the plurality of vent holes 313, adjacent vent holes 313 are sequentially set to positive pressure. Therefore, air bubbles can be discharged from the part where the electronic component 2 first contacts the substrate W and gradually contacts the substrate W towards the outer edge. Furthermore, by setting each column to be parallel to the short side direction, bending can be generated in the long side direction where the rectangular electronic component 2 is easily deformed.

[0053] (4) The retaining surface 311 is mountain-shaped. Therefore, by gradually flattening the outer edge substrate W from the central peak portion to both sides, the distance between the electronic component 2 and the substrate W is shortened while the bending returns to flatness from the center of the electronic component 2, thus reducing concerns about air bubbles being trapped. Furthermore, by forming a mountain shape on the long side of the retaining surface 311 and setting the edge connecting the peak portion in the short side direction, a bend is generated in the long side direction of the electronic component 2, thus making it easy for the electronic component 2 to conform to the retaining surface 311. Moreover, the edge connecting the peak portion can also be set on either side of the retaining surface 311. For example, if the edge is set on the short side at one end, by setting positive pressure sequentially from one end to the other, the electronic component 2 contacts the substrate W from one end to the other. Even in this case, the effect of reducing the breakage of the electronic component 2 while eliminating air bubbles can be obtained. The electronic component 2 does not bend, thus further reducing the risk of breakage. For example, in the case of a column with an opening 312 as shown in Figure 3 (C), the pressure is switched from negative to positive in the order of column [2], column [1], column [2] and column [3] on the other side, starting from column [3] on one side.

[0054] [Modifications] The following modifications can also be applied to this embodiment. (1) The holding surface 311 can also be a curved surface. For example, as shown in FIG7, the holding surface 311 can also be a raised shape like a part of the side of a cylinder. Furthermore, the part of the side of a cylinder mentioned here also includes the case of a part of a cylindrical body with a circular, elliptical, rounded rectangular, or racetrack-shaped cross section. As a result, the curvature of the electronic component 2 becomes gentle, thereby suppressing the influence on the electronic component 2. Furthermore, in the embodiment described above, an opening 312 is provided at the ridge of the connecting peak portion. However, the opening 312 does not necessarily need to be provided on the ridge, but can also be provided near it. By changing the pressure from negative to positive in sequence from the vent 313 of each opening 312 near the ridge, the same effect as described above can be obtained. In addition, even in the case of such a curved surface, the ridge portion can be provided on any side of the holding surface 311.

[0055] (2) When the installation tool 31 receives the electronic component 2 from the pick-up nozzle 21, the adjacent vent holes 313 can be set to negative pressure sequentially, starting from a portion of the vent holes 313 on the holding surface 311. That is, when the installation tool 31 receives the electronic component 2, even if the electronic component 2 is bent in accordance with the holding surface 311, if a part of it floats or leans to one side, problems such as the inability to identify the position of the electronic component 2 will occur. In addition, if the installation is performed in a state where the electronic component 2 is floated or leans to one side, there is a possibility that an air bubble may be drawn in due to a timing shift when moving away from the edge along the outer edge.

[0056] For example, starting from the vent 313 closest to the most prominent peak of the holding surface 311 among the plurality of vent holes 313, adjacent vent holes 313 can be set to negative pressure in sequence. More specifically, as shown in FIG8 (A), when the holding surface 311 of the mounting tool 31 approaches the electronic component 2 and the detection unit 322a detects contact, as shown in FIG8 (B) to FIG8 (D), starting from column [1] of the opening 312, columns [2] and [3] (refer to FIG3 (B)) are set to negative pressure in sequence. As a result, the electronic component 2 can be gradually bent in the manner of the holding surface 311, while the mounting tool 31 receives the electronic component 2 from the pick-up nozzle 21, thus suppressing floating or tilting, thereby preventing the inability to perform position recognition. In addition, since floating or tilting is reduced, it is difficult to cause a shift in the timing of detachment when mounting the electronic component 2, and the possibility of air bubbles being drawn in can be reduced.

[0057] [Other Embodiments] The present invention is not limited to the embodiments described herein, and also includes other embodiments shown below. Furthermore, the present invention also includes embodiments formed by combining all or any of the embodiments described herein and other embodiments shown below. Moreover, various omissions, substitutions, and modifications can be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention. [Simplified Explanation of the Diagram]

[0011] Figure 1 is a front view of the mounting device according to the embodiment. Figure 2 is a plan view of the mounting device according to the embodiment. Figures 3(A) to 3(C) are side views (A), cross-sectional views (B), and bottom views (C) of the mounting tool according to the embodiment. Figure 4 is a functional block diagram of the control device according to the embodiment. Figure 5 is a flowchart showing the sequence of mounting the electronic components according to the embodiment. Figures 6(A) to 6(E) are explanatory diagrams showing the mounting implementation method of the electronic components according to the embodiment. Figure 7 is a cross-sectional view showing a modified example of the mounting tool. Figures 8(A) to 8(D) are explanatory diagrams showing the receiving implementation method of the electronic components using the mounting tool.

Claims

1. A mounting tool for mounting electronic components on a substrate, comprising: a retaining surface raised in such a way that the electronic components are bent and joined together; a plurality of openings disposed on the retaining surface; and a plurality of vent holes respectively disposed in communication with the plurality of openings, wherein the plurality of vent holes retain the electronic components on the retaining surface by setting the internal pressure to a negative pressure, and the electronic components are disengaged from the retaining surface by sequentially setting the adjacent vent holes to a positive pressure, starting from the vent hole closest to the most raised peak of the retaining surface.

2. The installation tool as claimed in claim 1, wherein the plurality of openings are formed by arranging them in a plurality of columns.

3. The installation tool as described in claim 1 or claim 2, wherein the retaining surface is mountain-shaped.

4. The installation tool as described in claim 1 or claim 2, wherein the retaining surface is a curved surface.

5. An installation device, wherein, The installation tool is provided according to any one of claims 1 to 4, and includes: a tool moving mechanism for reciprocating between a junction position and an installation position and for raising and lowering the installation tool between the junction position and the installation position; a detection unit for detecting contact with the installation tool; and a switching unit for switching the negative pressure and positive pressure of the vent hole of the installation tool when contact is detected by the detection unit.

6. The installation device as claimed in claim 5, wherein, starting from the vent hole closest to the most prominent peak of the retaining surface among the plurality of vent holes, adjacent vent holes are sequentially set to negative pressure.

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