Heat sink with vapor chambers

Abstract

A heat sink with vapor chambers having a first vapor chamber, a second vapor chamber located above the first vapor chamber and a height adjusting-member is provided. The height adjusting-member is erectly arranged between the first vapor chamber and the second vapor chamber and movably through one of the first vapor chamber and the second vapor chamber. The height adjusting-member can be moved in a forming direction to regulate a relative distance between the first vapor chamber and the second vapor chamber, so that the heat sink adjusts to heat sources of different thickness.

Description

[Technical Field]

[0001] This invention relates to a heat-conducting element, and more particularly to a compound heat-conducting device with a heat-conducting plate. [Previous Technology]

[0002] Note that existing heat transfer elements, such as heat pipes or vapor chambers, which utilize an internal vacuum chamber to seal the working fluid and cause a vapor-liquid phase change in the working fluid due to heating or condensation, are widely used in heat dissipation applications. At the same time, since the heat sources used in general applications are mostly CPUs or electronic processing chips, the shape of the heat transfer plate (also known as a "heat spreader") is more suitable for contacting the heat source than the heat pipe due to its large surface area for attaching to the heat source.

[0003] However, on the motherboards of existing electronic products, multiple electronic processing chips are often set up to facilitate multiplexing, which increases the number of heat sources. Moreover, due to differences in manufacturing processes, the thickness of different processing chips varies, so a single heat-conducting plate or heat spreader cannot completely attach them, thus limiting their applicability.

[0004] In view of the above, the inventors have devoted themselves to research and applied theoretical knowledge in order to improve and solve the above-mentioned deficiencies, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned deficiencies. [Summary of the Invention]

[0005] The main objective of this invention is to provide a compound heat exchanger device, which consists of at least two heat exchangers stacked together and a height adjustment member used to adjust the distance between them, thereby providing multiple heat sources of different thicknesses.

[0006] In order to achieve the above objectives, the present invention provides a compound heat conduction device with a heat exchange plate, including a first heat exchange plate, a second heat exchange plate located above the first heat exchange plate, and a height adjustment member. The height adjustment member is vertically disposed between the first and second heat exchange plates, and one of the first and second heat exchange plates is accessible through which the height adjustment member moves, and can adjust the relative distance between the first and second heat exchange plates by displacement according to the direction formed by the height adjustment member.

Implementation Method

[0014] In order to enable your review committee to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and illustration only and are not intended to limit the present invention.

[0015] Please refer to Figures 1, 2, and 3, which are respectively a perspective schematic diagram, an exploded perspective view, and a perspective assembly view of the present invention. The present invention provides a compound heat-conducting device with a heat-dissipating plate, comprising a first heat-dissipating plate 1, a second heat-dissipating plate 2, and a height adjustment member 3; wherein:

[0016] The first temperature plate 1 and the second temperature plate 2 can both be composed of a temperature plate (vapor chamber) or other components; wherein the first temperature plate 1 is located below the second temperature plate 2, and the area occupied by the second temperature plate 2 can be larger than that of the first temperature plate 1, so that the first temperature plate 1 can be stacked below the second temperature plate 2.

[0017] As described above, the first heat spreader 1 is provided with a clearance space 10, which extends from the bottom surface of the first heat spreader 1 to its top surface, to accommodate or allow a heat-generating electronic processing chip 4 (as shown in Figure 6) to pass through. In the embodiment of the present invention, the clearance space 10 may be a through hole, which is surrounded by the first heat spreader 1. In other embodiments, the clearance space 10 may also be recessed from the periphery of the first heat spreader 1 into its plate area to form a notch (not shown), as long as it allows the electronic processing chip 4 to pass through the clearance space 10 from the bottom surface of the first heat spreader 1 and be exposed on the top surface of the first heat spreader 1 (the surface of the electronic processing chip 4 may protrude outside the clearance space 10 or be located inside the clearance space 10).

[0018] Please refer to Figure 4. The present invention mainly consists of the aforementioned height adjustment member 3, which is vertically disposed between the first and second heat exchange plates 1 and 2, to allow the first and second heat exchange plates 1 and 2 to be displaced according to the direction formed by the height adjustment member 3, thereby achieving the purpose of adjusting the distance between the first and second heat exchange plates 1 and 2. In this embodiment, the height adjustment member 3 can also be a heat exchange plate, with an opening 30 formed on one side to connect to the interior of the first heat exchange plate 1, so that the interior of the height adjustment member 3 and the interior of the first heat exchange plate 1 form the same sealed chamber that communicates with each other. The second heat exchange plate 2 can have a heating part 20 protruding from the aforementioned clearance space 10, and the heating part 20 can be accommodated in the clearance space 10 so that its bottom is flush with the bottom surface of the first heat exchange plate 1. A movable hole 21 is provided on the second heat exchange plate 2 so that the height adjustment member 3 can pass through, so that the second heat exchange plate 2 is stacked on the first heat exchange plate 1, and the second heat exchange plate 2 can move in the vertical length direction of the height adjustment member 3 through the movable hole 21, thereby adjusting the relative distance between the first and second heat exchange plates 1 and 2.

[0019] Therefore, by means of the above-described structure, the compound heat-conducting plate heat-conducting device of the present invention can be obtained.

[0020] Accordingly, as shown in FIG5, when the present invention is applied to a single electronic processing chip 4, since there is no height difference problem of contacting the heat source surface, the first heat spreader 1 can directly contact the electronic processing chip 4, or the first and second heat spreaders 1 and 2 can be stacked so that the heated part 20 of the second heat spreader 2 is accommodated in the clearance space 10, so that the first and second heat spreaders 1 and 2 can contact the surface of the electronic processing chip 4 together.

[0021] As shown in Figure 6, when applied to multiple electronic processing chips 4 and 5, since the second heat spreader 2 can move vertically along the length of the height adjustment member 3 via the movable hole 21, the second heat spreader 2 can contact the electronic processing chip 4 with a thickness H, while the first heat spreader 1 can contact the electronic processing chip 5 with a thickness h. At the same time, the electronic processing chip 4 can also contact the heated part 20 of the second heat spreader 2 through the clearance space 10 of the first heat spreader 1. In other applications, for example, by making the area occupied by the second heat spreader 2 larger than that of the first heat spreader 1, the portion of the second heat spreader 2 that extends beyond the outer perimeter of the first heat spreader 1 can be used to contact other heat sources with greater or thicker thicknesses (not shown), thereby enabling the application of more heat sources with different thicknesses.

[0022] Further explanation is provided: as shown in Figure 5 or Figure 6, a plurality of heat-conducting elements 22 can also be connected to the second heat-conducting plate 2. The heat-conducting element 22 can be a heat pipe or other heat-conducting plate, and has an opening 220 that connects to the interior of the second heat-conducting plate 2 to form a common sealed chamber that is interconnected with each other. In the embodiment shown in the figure, the opening 220 is located at one end when the heat-conducting element 22 is a heat pipe. A plurality of fins 221 can be installed on each heat-conducting element 22. If the height adjustment member 3 is a heat-conducting plate, fins 31 can also be provided at its upper end to increase the heat dissipation area.

[0023] Furthermore, as shown in Figure 7, the height adjustment component 3 can also be made of a general heat pipe, and multiple components can be added as needed. At the same time, movable holes 21 are added to the second heat spreader plate 2 according to the number of height adjustment components 3.

[0024] It is worth mentioning that the present invention is not limited to setting only the first heat spreader 1 and the second heat spreader 2; if a plurality of heat spreaders (not shown) are further added and stacked on the second heat spreader 2, the height adjustment member 3 can be set on the second heat spreader 2 to achieve the effect of adjusting the distance with more heat spreaders, thereby making it applicable to more heat sources of different thicknesses.

[0025] In summary, the present invention can indeed achieve the intended purpose of use and solve the deficiencies of the prior art. Furthermore, due to its novelty and progressiveness, it fully meets the requirements for an invention patent application. Therefore, this application is filed in accordance with the Patent Act. We respectfully request a detailed review and the granting of this patent to protect the rights of the inventor.

[0026] However, the above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent techniques and means made using the contents of the present invention specification and drawings are also included in the scope of the present invention and are hereby stated. [Simplified Explanation of the Diagram]

[0007] Figure 1 is a three-dimensional schematic diagram of the present invention.

[0008] Figure 2 is an exploded perspective view of the present invention from another angle.

[0009] Figure 3 is a three-dimensional composite diagram of the present invention from another perspective.

[0010] Figure 4 is a combined cross-sectional view of the present invention.

[0011] Figure 5 is a cross-sectional view of the present invention in use.

[0012] Figure 6 is a cross-sectional view of another usage state of the present invention.

[0013] Figure 7 is an exploded perspective view of another embodiment of the present invention.

Claims

1. A compound heat-conducting device with a heat spreader, comprising: A first temperature equalizer plate; a second temperature equalizer plate located above the first temperature equalizer plate; and a height adjustment member erected between the first and second temperature equalizer plates, wherein the height adjustment member can move through one of the first and second temperature equalizer plates and can adjust the relative distance between the first and second temperature equalizer plates by displacement according to the direction formed by the height adjustment member.

2. The compound heat-conducting device as described in claim 1, wherein the first heat-conducting plate is provided with a clearance space extending from the bottom surface of the first heat-conducting plate to its top surface.

3. The double-layer heat-conducting device as described in claim 2, wherein the clearance space is a through hole.

4. The double-plate heat conduction device as described in claim 2 or 3, wherein the second plate has a protruding heated portion relative to the clearance space.

5. The compound heat-conducting device of claim 4, wherein the heated portion is accommodated within the clearance space such that its bottom is flush with the bottom surface of the first heat-conducting plate.

6. The compound heat-conducting device with a heat exchange plate as described in claim 1, wherein the area occupied by the second heat exchange plate is larger than that of the first heat exchange plate.

7. The dual-plate heat conduction device as described in claim 1 or 6, wherein the second heat exchange plate is provided with a movable hole for the height adjustment member to pass through.

8. The compound heat-conducting device as claimed in claim 1, wherein the second heat-conducting plate is connected to a plurality of heat-conducting elements.

9. The dual-layer heat-conducting device as claimed in claim 8, wherein the heat-conducting element is a heat pipe or a heat-conducting plate and has an opening communicating with the interior of the second heat-conducting plate.

10. The double-layer heat-conducting device as described in claim 9, wherein fins are provided on the heat-conducting element.

11. The double-layer heat-conducting device as described in claim 1, wherein the height adjustment element is a heat-conducting plate or a heat pipe.

12. The dual-plate heat conduction device as claimed in claim 11, wherein the height adjustment member has an opening and communicates with the interior of the first heat exchange plate.

13. The compound heat-conducting plate as described in claim 1 or 11, wherein fins are provided at the end of the height adjustment member.

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