Composition, film and display device

Abstract

The present invention provides: a composition which contains (A) luminescent inorganic semiconductor particles and (B) a luminescent organic compound; a film which is formed from this composition; and a display device which comprises this film.

Description

[Technical Field]

[0001] The present invention relates to a composition and a film formed therefrom, and a display device including the film. [Previous Technology]

[0002] Patent Document 1 discloses a curable resin composition containing quantum dots and a wavelength conversion film formed using the curable resin composition. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2016-065178 [Summary of the Invention]

[0004] [The problem that the invention aims to solve]

[0005] One object of the present invention is to provide a composition comprising luminescent inorganic semiconductor particles such as quantum dots, and having good luminescence intensity. Another object of the present invention is to provide a film formed from the composition, and a display device including the film. [Means for Solving the Problem]

[0006] The present invention provides the following composition, film and display device. [1] A composition comprising: luminescent inorganic semiconductor particles (A) and luminescent organic compound (B). [2] The composition of [1] wherein the luminescent inorganic semiconductor particles (A) have a maximum wavelength of 480 nm or more and 560 nm or less, or 570 nm or more and 680 nm or less in its emission spectrum. [3] The composition of [1] or [2] wherein the luminescent organic compound (B) has a maximum wavelength of 350 nm or more and 550 nm or less in its absorption spectrum. [4] The composition of any one of [1] to [3] further comprises a light scattering agent (C). [5] The composition of any one of [1] to [4] further comprises a resin (D). [6] The composition of any one of [1] to [5] further comprises a polymerizable compound (E) and a polymerization initiator (F). [7] A film formed from any one of the compositions described in [1] to [6]. [8] The film of [7], wherein the film has a maximum emission peak in its emission spectrum with a maximum wavelength of 480 nm or more and 560 nm or less, or 570 nm or more and 680 nm or less, and the half-maximum amplitude of the emission peak is 50 nm or less. [9] A display device comprising the film of [7] or [8]. [Effects of the Invention]

[0007] A composition, a film formed from the composition, and a display device including the film are provided, wherein the composition is a composition containing luminescent inorganic semiconductor particles and has good luminescence intensity.

Implementation Method

[0009] <Composition> The composition of the present invention (hereinafter also simply referred to as the "composition") comprises: luminescent inorganic semiconductor particles (A) (hereinafter also simply referred to as "semiconductor particles (A)") and luminescent organic compound (B). The composition may further comprise other components described later. The composition may be a curable composition that is cured by light irradiation or heat. Several embodiments of the composition are listed below, for example. Composition a, comprising semiconductor particles (A) and luminescent organic compound (B); composition b, comprising semiconductor particles (A), luminescent organic compound (B), and solvent (J); composition c, comprising semiconductor particles (A), luminescent organic compound (B), resin (D), and solvent (J); composition d, comprising semiconductor particles (A), luminescent organic compound (B), resin (D), polymerizable compound (E), polymerization initiator (F), and solvent (J); composition e, comprising organic ligand (G) in compositions a to d; and composition f, comprising light scattering agent (C) in compositions a to e.

[0010] The composition of the present invention exhibits good luminescence intensity, and the film formed from the composition also exhibits good luminescence intensity. Hereinafter, the film formed from the composition of the present invention will also be simply referred to as "film". Furthermore, unless otherwise specified, any descriptions relating to luminescence intensity refer to the luminescence intensity of the composition and / or the film. The components contained in or possibly contained in the composition will be described below.

[0011] [1]Luminescent inorganic semiconductor particles (A) Semiconductor particles (A) contained in the composition may include quantum dots and compounds having a perovskite-type crystal structure (hereinafter also referred to as "perovskite compounds"), preferably quantum dots. Quantum dots are luminescent semiconductor microparticles with a particle size of 1 nm or more and 100 nm or less, which are microparticles that emit light by absorbing ultraviolet light or visible light (e.g., blue light) using the band gap of a semiconductor.

[0012] Examples of quantum dots include: CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdHgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, H gSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZn Compounds of Group 12 and Group 16 elements such as SeS, HgZnSeTe, and HgZnSTe; compounds of Group 13 and Group 15 elements such as GaN, GaP, GaAs, AlN, AlP, AlAs, InN, InP, InAs, GaNP, GaNAs, GaPAs, AlNP, AlNAs, AlPAs, InNP, InNAs, InPAs, GaAlNP, GaAlNAs, GaAlPAs, GaInNP, GaInNAs, GaInPAs, InAlNP, InAlNAs, and InAlPAs; and compounds of Group 14 and Group 16 elements such as PdS and PbSe.

[0013] When the quantum dots contain S or Se, quantum dots that have been surface-modified using metal oxides or organic compounds can be used. By using surface-modified quantum dots, the removal of S or Se from reactive components contained in or potentially contained in the composition can be prevented. Furthermore, quantum dots can be combined with the aforementioned compounds to form a core-shell structure. Examples of such combinations include microparticles with a CdSe core and a ZnS shell, and microparticles with an InP core and a ZnSeS shell.

[0014] The energy state of quantum dots depends on their size, thus the emission wavelength can be freely selected by changing the particle size. For example, in the case of quantum dots composed solely of CdSe, the peak wavelengths (maximum wavelengths of the emission peaks) of the emission spectra (fluorescence spectra) with particle sizes of 2.3 nm, 3.0 nm, 3.8 nm, and 4.6 nm are 528 nm, 570 nm, 592 nm, and 637 nm, respectively. Furthermore, the emission light from quantum dots has a narrow spectral width; by combining light with such steep peaks, the displayable color gamut can be expanded in display devices including films formed from the constituent materials. Moreover, quantum dots have high responsivity, allowing for efficient utilization of light emitted from a self-source light source.

[0015] The perovskite compound is a compound having a perovskite-type crystalline structure with components A, B, and X. A is the component located at each vertex of the hexahedron centered on B in the perovskite-type crystalline structure, and is a monovalent cation. X represents the component located at each vertex of the octahedron centered on B in the perovskite-type crystalline structure, and is at least one ion selected from the group consisting of halide ions and thiocyanate ions. B is the component located at the center of the hexahedron where A is located at the vertex and the octahedron where X is located at the vertex in the perovskite-type crystalline structure, and is a metal ion.

[0016] The perovskite compound consisting of A, B, and X is not particularly limited and can be any compound having a three-dimensional structure, a two-dimensional structure, or a quasi-two-dimensional structure. In the case of a three-dimensional structure, the perovskite compound is represented by ABX (3+δ). In the case of a two-dimensional structure, the perovskite compound is represented by A 2BX (4+δ). Here, δ is a number that can be appropriately varied according to the charge balance of B, and is greater than or equal to -0.7 and less than or equal to 0.7.

[0017] Preferred specific examples of perovskite compounds having a three-dimensional perovskite-type crystalline structure represented by ABX (3+δ) include: CH3NH3PbBr3, CH3NH3PbCl3, CH3NH3PbI3, CH3NH3PbBr(3-y)Iy (0 < y < 3), CH3NH3PbBr(3-y)Cly (0 < y < 3), (H2N=CH-NH2)PbBr3, (H2N=CH-NH2)PbCl3, (H2N=CH-NH2)PbI3, CH3NH3Pb(1-a)CaBr3 (0 < a ≤ 0.7), CH3NH3Pb(1-a)Sr aBr3 (0 < a ≤ 0.7), CH3NH3Pb (1-a)La aBr (3+δ) (0<a≦0.7, 0<δ≦0.7), CH 3NH 3Pb (1-a)Ba aBr 3 (0<a≦0.7), CH 3NH 3Pb (1-a)Dy aBr (3+δ) (0<a≦0.7, 0<δ≦0.7), CH 3NH 3Pb (1-a)Na aBr (3+δ) (0<a≦0.7, -0.7≦δ<0), CH 3NH 3Pb (1-a)Li aBr (3+δ) (0<a≦0.7, -0.7≦δ<0), CsPb (1-a)Na aBr (3+δ) (0<a≦0.7, -0.7≦δ<0), CsPb (1-a)Li aBr (3+δ) (0<a≦0.7, -0.7≦δ<0), CH 3NH 3Pb (1-a)Na aBr (3+δ-y)I y (0<a≦0.7, -0.7≦δ<0, 0<y<3), CH 3NH 3Pb (1-a)Li aBr (3+δ-y)I y (0<a≦0.7, -0.7≦δ<0, 0<y<3), CH 3NH 3Pb (1-a)Na aBr (3+δ-y)Cl y (0<a≦0.7, -0.7≦δ<0, 0<y<3), CH 3NH 3Pb (1-a)Li aBr (3+δ-y)Cl y (0<a≦0.7, -0.7≦δ<0, 0<y<3), (H 2N=CH-NH 2)Pb (1-a)Na aBr (3+δ) (0<a≦0.7, -0.7≦δ<0), (H 2N=CH-NH 2)Pb (1-a)Li aBr (3+δ) (0<a≦0.7, -0.7≦δ<0), (H 2N=CH-NH 2)Pb (1-a)Na aBr (3+δ-y)I y (0<a≦0.7,-0.CsPbBr 3、CsPbCl 3、CsPbI 3、CsPbBr (3-y)I y(0<y<3)、CsPbBr (3-y)Cl y(0<y<3)、CH 3NH 3PbBr (3-y)Cl y(0<y<3)、CH 3NH3Pb(1-a)Zn aBr3(0<a ≤ 0.7) CH3NH3Pb(1-a)Al aBr(3+δ)(0<a ≤ 0.7, 0<a ≤ 0.7) CH3NH3Pb(1-a)Co aBr3(0<a ≤ 0.7) CH3NH3Pb(1-a)Mn aBr3(0<a ≤ 0.7) CH3NH3Pb(1-a)Mg aBr3(0<a ≤ 0.7) CsPb(1-a)Zn aBr 3(0<a≦0.7)、CsPb (1-a)Al aBr (3+δ)(0<a≦0.7,0<δ≦0.7)、CsPb (1-a)Co aBr 3(0<a≦0.7)、CsPb (1-a)Mn aBr 3(0<a≦0.7)、CsPb (1-a)Mg aBr 3(0<a≦0.7)、CH 3NH 3Pb (1-a)Zn aBr (3-y)I y(0<a≦0.7,0<y<3)、CH 3NH3Pb(1-a)Al aBr(3+δ-y)I y(0<a≤0.7, 0<δ≤0.7, 0<y<3) CH3NH3Pb(1-a)Co aBr(3-y)I y(0<a≤0.7, 0<y<3) CH3NH3Pb(1-a)Mn aBr(3-y)I y(0<a≤0.7, 0<y<3) CH3NH3Pb(1-a)Mg aBr(3-y)I y(0<a≤0.7, 0<y<3) CH3NH3Pb(1-a)Zn aBr(3-y)Cl y(0<a≤0.7, 0<y<3) CH3NH3Pb(1-a)Al aBr(3+δ-y)Cl y(0<a≤0.7, 0<δ≤0.7, 0<y<3) CH3NH3Pb(1-a)Co aBr(3+δ-y)Cl y(0<a≤0.7, 0<y<3) CH3NH3Pb(1-a)Mn aBr (3-y)Cl y(0)a≦0.7, 0 < y < 3), CH₃NH₃Pb(1 - a)MgₐBr(3 - y)Clₙ (0 < a ≤ 0.7, 0 < y < 3), (H₂N=CH-NH₂)ZnₐBr₃ (0 < a ≤ 0.7), (H₂N=CH-NH₂)MgₐBr₃ (0 < a ≤ 0.7), (H₂N=CH-NH₂)Pb(1 - a)ZnₐBr(3 - y)Iₙ (0 < a ≤ 0.7, 0 < y < 3), (H₂N=CH-NH₂)Pb(1 - a)ZnₐBr(3 - y)Clₙ (0 < a ≤ 0.7, 0 < y < 3), etc.

[0018] Preferred specific examples of perovskite compounds having a two-dimensional perovskite-type crystalline structure represented by A 2BX (4+δ) include: (C 4H 9NH 3) 2PbBr 4, (C 4H 9NH 3) 2PbCl 4, (C 4H 9NH 3) 2PbI 4, (C 7H 15NH 3) 2PbBr 4, (C 7H 15NH 3) 2PbCl 4, (C 7H 15NH 3) 2PbI 4, (C 4H 9NH 3) 2Pb (1-a)Li aBr (4+δ) (0<a≦0.7, -0.7≦δ<0), (C 4H 9NH 3) 2Pb (1-a)Na aBr (4+δ) (0<a≦0.7, -0.7≦δ<0), (C 4H 9NH 3) 2Pb (1-a)Rb aBr (4+δ) (0<a≦0.7, -0.7≦δ<0), (C 7H 15NH 3) 2Pb (1-a)Na aBr (4+δ) (0<a≦0.7, -0.7≦δ<0), (C 7H 15NH 3) 2Pb (1-a)Li aBr (4+δ) (0<a≦0.7, -0.7≦δ<0), (C 7H 15NH 3) 2Pb (1-a)RbaBr (4+δ) (0<a≦0.7, -0.7≦δ<0), (C 4H 9NH 3) 2Pb (1-a)Na aBr (4+δ-y)I y (0<a≦0.7, -0.7≦δ<0, 0<y<4), (C 4H 9NH 3) 2Pb (1-a)Li aBr (4+δ-y)I y (0<a≦0.7, -0.7≦δ<0, 0<y<4), (C 4H 9NH 3) 2Pb (1-a)Rb aBr (4+δ-y)I y (0<a≦0.7, -0.7≦δ<0, 0<y<4), (C 4H 9NH 3) 2Pb (1-a)Na aBr (4+δ-y)Cl y (0<a≦0.7, -0.7≦δ<0, 0<y<4), (C 4H 9NH 3) 2Pb (1-a)Li aBr (4+δ-y)Cl y (0<a≦0.7, -0.7≦δ<0, 0<y<4), (C 4H 9NH 3) 2Pb (1-a)Rb aBr (4+δ-y)Cl y (0<a≦0.7, -0.7 ≦ δ < 0, 0 < y < 4), (C4H9NH3)2PbBr4, (C7H15NH3)2PbBr4, (C4H9NH3)2PbBr(4 - y)Cl y (0 < y < 4), (C4H9NH3)2PbBr(4 - y)I y (0 < y < 4), (C4H9NH3)2Pb(1 - a)ZnaBr4 (0 < a ≦ 0.7), (C4H9NH3)2Pb(1 - a)MgaBr4 (0 < a ≦ 0.7), (C4H9NH3)2Pb(1 - a)CoaBr4 (0 < a ≦ 0.7), (C4H9NH3)2Pb(1 - a)MnaBr4 (0 < a ≦ 0.7), (C7H15NH3)2Pb(1 - a)ZnaBr4 (0 < a ≦ 0.7), (C7H15NH3)2Pb(1 - a)MgaBr4 (0 < a ≦ 0.7), (C7H15NH3)2Pb(1 - a)CoaBr4 (0 < a ≦ 0.7), (C7H15NH3)2Pb(1 - a)MnaBr4 (0 < a ≦ 0.7), (C4H9NH3)2Pb(1 - a)ZnaBr(4 - y)I y (0 < a ≦ 0.7, 0 < y < 4), (C4H9NH3)2Pb(1 - a)MgaBr(4 - y)I y (0 < a ≦ 0.7, 0 < y < 4), (C4H9NH3)2Pb(1 - a)CoaBr(4 - y)I y (0 < a ≦ 0.7, 0 < y < 4), (C4H9NH3)2Pb(1 - a)MnaBr(4 - y)I y (0 < a ≦ 0.7, 0 < y < 4), (C4H9NH3)2Pb(1 - a)ZnaBr(4 - y)Cl y (0 < a ≦ 0.7, 0 < y < 4), (C4H9NH3)2Pb(1 - a)MgaBr(4 - y)Cl y (0 < a ≦ 0.7, 0 < y < 4), (C4H9NH3)2Pb(1 - a)CoaBr(4 - y)Cl y (0 < a ≦ 0.7, 0 < y < 4), (C4H9NH3)2Pb(1 - a)MnaBr(4 - y)Cl y (0 < a ≦ 0.7, 0 < y < 4), etc.

[0019] The composition may contain only one type of semiconductor particle (A) that emits light of a specific wavelength by means of light emitted from a light source, or it may combine two or more semiconductor particles (A) that emit light of different wavelengths. Examples of the specific wavelength of light include red light, green light, and blue light, with red light and green light being preferred. The semiconductor particle (A) and the composition containing it may have a maximum emission peak in their emission spectrum with a wavelength of 480 nm or more and 560 nm or less, or 570 nm or more and 680 nm or less.

[0020] In one embodiment, the composition includes a semiconductor particle (A-1) as the semiconductor particle (A), which has a emission peak in its emission spectrum with a maximum wavelength of 480 nm or more and 560 nm or less, preferably 500 nm or more and 560 nm or less, and more preferably 520 nm or more and 550 nm or less. In other embodiments, the composition includes a semiconductor particle (A-2) as the semiconductor particle (A), which has a emission peak with a maximum wavelength of 570 nm or more and 680 nm or less, preferably 590 nm or more and 660 nm or less, and more preferably 600 nm or more and 650 nm or less. The half-peak amplitude of the emission peaks of the semiconductor particles (A-1) and (A-2) is preferably 50 nm or less, and more preferably 45 nm or less. The half-peak amplitude may be 20 nm or more or 30 nm or more. The emission spectrum of the semiconductor particle (A) can be determined according to the measurement method described in the Example 1 section below.

[0021] From the viewpoint of improving luminescence intensity, the semiconductor particle (A-1) preferably has an absorption peak with a maximum wavelength of 450 nm or more and 550 nm or less in its absorption spectrum, more preferably has an absorption peak with a maximum wavelength of 450 nm or more and 550 nm or less and absorbs in the wavelength region below 500 nm. The semiconductor particle (A-1) more preferably has an absorption peak with a maximum wavelength of 460 nm or more and 530 nm or less in its absorption spectrum.

[0022] From the viewpoint of improving luminescence intensity, the semiconductor particle (A-2) preferably has an absorption peak with a maximum wavelength of 550 nm or more and 650 nm or less in its absorption spectrum, more preferably it has an absorption peak with a maximum wavelength of 550 nm or more and 650 nm or less and absorbs in the wavelength region below 600 nm. The semiconductor particle (A-2) is more preferably an absorption peak with a maximum wavelength of 560 nm or more and 630 nm or less in its absorption spectrum. The absorption spectrum of the semiconductor particle (A) can be measured according to the measurement method described in the Example section below.

[0023] When the composition includes the resin (D) described later, the content of semiconductor particles (A) in the composition is, for example, more than 1% by mass and less than 60% by mass, more preferably more than 10% by mass and less than 50% by mass, more preferably more than 15% by mass and less than 50% by mass, more preferably more than 20% by mass and less than 50% by mass, and more preferably more than 20% by mass and less than 40% by mass, relative to the total amount of solid components in the composition.

[0024] When the composition does not contain the resin (D) described later, the content of semiconductor particles (A) in the composition is, for example, 30% by mass or more and 95% by mass or less, more preferably 40% by mass or more and 90% by mass or less, more preferably 50% by mass or more and 85% by mass or less, even more preferably 55% by mass or more and 80% by mass or less, and even more preferably 60% by mass or more and 75% by mass or less, relative to the total amount of solid components in the composition.

[0025] The composition may include, for example, semiconductor particles (A-1) and semiconductor particles (A-2), and may contain two or more types of semiconductor particles (A). In this case, the content of semiconductor particles (A) refers to the total content of two or more types of semiconductor particles (A). The same applies to components other than semiconductor particles (A) contained in or possibly contained in the composition; when two or more components are contained, the content or content of such components refers to the total content or total content of those components.

[0026] In this specification, the total amount of solid components refers to the sum of the components contained in the composition after removing the solvent (J). The content of solid components in the composition can be determined by known analytical methods such as liquid chromatography or gas chromatography. The content of each component in the solid components of the composition can also be calculated based on the formulation during the preparation of the composition.

[0027] [2] Organic ligand (G) The composition may further include an organic ligand (G), and the semiconductor particle (A) may also exist in the composition in a state where the organic ligand (G) is coordinated. The organic ligand (G) is, for example, an organic compound having a polar group that exhibits the ability to coordinate with the semiconductor particle (A). The organic ligand (G) may, for example, be coordinated to the surface of the semiconductor particle (A). The composition may include one or more organic ligands (G).

[0028] In the composition, the organic ligand (G) preferably has at least a portion of its molecules coordinated to the semiconductor particle (A), or all or almost all of its molecules may be coordinated to the semiconductor particle (A). That is, the composition preferably includes the organic ligand (G) coordinated to the semiconductor particle (A), but may also include both the organic ligand (G) coordinated to the semiconductor particle (A) and the organic ligand (G) not coordinated to the semiconductor particle (A).

[0029] From the viewpoint of improving the stability and dispersibility of the semiconductor particle (A) and the luminescence intensity, it may be advantageous to include an organic ligand (G) disposed on the semiconductor particle (A). The organic ligand (G) may, for example, be disposed on the surface of the semiconductor particle (A).

[0030] The polar group of the organic ligand (G) is preferably selected from at least one group chosen from the group consisting of thiol (-SH), carboxyl (-COOH), and amino (-NH2). Polarity selected from this group may be advantageous in terms of improving coordination with the semiconductor particle (A). High coordination can help improve the stability and dispersibility of the semiconductor particle (A) in the composition, as well as increase luminescence intensity, etc. The polar group is more preferably selected from at least one group chosen from the group consisting of thiol and carboxyl groups. The organic ligand (G) may have one or more polar groups.

[0031] The organic ligand (G) may be, for example, an organic compound represented by the following formula (x). X A X (x) Wherein, XA is the polar group, and RX is a monovalent hydrocarbon group that may contain heteroatoms (N, O, S, halogen atoms, etc.). This hydrocarbon group may have one or more unsaturated bonds such as carbon-carbon double bonds. This hydrocarbon group may have a straight-chain, branched-chain, or cyclic structure. The number of carbon atoms in this hydrocarbon group may be, for example, 1 or more and 40 or less, or 1 or more and 30 or less. The methylene group contained in this hydrocarbon group may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc.

[0032] The base RX may also contain a polar base. For a specific example of such a polar base, please refer to the description of the polar base XA.

[0033] Specific examples of organic ligands having a carboxyl group as a polar group XA include: formic acid, acetic acid, propionic acid, and other saturated or unsaturated fatty acids. Specific examples of saturated or unsaturated fatty acids include: saturated fatty acids such as butyric acid, valeric acid, hexanoic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, margaric acid, stearic acid, arachidic acid, docosahexaenoic acid, and lignoceric acid; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, icosenoic acid, erucic acid, and nervonic acid; and linolenic acid, α-linolenic acid, γ-linolenic acid, stearidonic acid, dihomeno-γ-linolenic acid, arachidonic acid, eicosatetraenoic acid, docosadienoic acid, and adrenaline. Polyunsaturated fatty acids such as docosatraenoic acid (docosatetraenoic acid).

[0034] Specific examples of organic ligands having a thiol group or an amino group as a polar group XA include organic ligands formed by replacing the carboxyl group of the organic ligands having a carboxyl group as a polar group XA as illustrated above with a thiol group or an amino group.

[0035] In addition to the above, compounds (G-1) and (G-2) can be listed as organic ligands represented by the formula (x).

[0036] 〔Compound (G-1)〕 Compound (G-1) is a compound having a first functional group and a second functional group. The first functional group is a carboxyl group (-COOH), and the second functional group is a carboxyl group or a thiol group (-SH). Because compound (G-1) has a carboxyl group and / or a thiol group, it can serve as a ligand for the semiconductor particle (A). The composition may contain only one compound (G-1) or may contain two or more compounds.

[0037] An example of compound (G-1) is the compound represented by the following formula (G-1a). Compound (G-1) may also be the acid anhydride of the compound represented by formula (G-1a).

[0038] [Chemical 1] [In the formula, RB represents a divalent hydrocarbon group; when multiple RBs are present, they may be the same or different; the hydrocarbon group may have more than one substituent; when multiple substituents are present, they may be the same or different, and they may bond to each other and form a ring together with the atoms they are bonded to; the -CH 2- contained in the hydrocarbon group may be substituted to at least one of -O-, -S-, -SO 2-, -CO- and -NH-; p represents an integer from 1 to 10]

[0039] As represented by RB, examples include chain hydrocarbon groups, alicyclic hydrocarbon groups, aromatic hydrocarbon groups, etc.

[0040] As a chain hydrocarbon group, examples include straight-chain or branched alkyl diesters, which typically have 1 to 50 carbon atoms, preferably 1 to 20, and more preferably 1 to 10. As an alicyclic hydrocarbon group, examples include monocyclic or polycyclic cycloalkyl diesters, which typically have 3 to 50 carbon atoms, preferably 3 to 20, and more preferably 3 to 10. As an aromatic hydrocarbon group, examples include monocyclic or polycyclic aromatic diesters, which typically have 6 to 20 carbon atoms.

[0041] Examples of substituents that may be present in the hydrocarbon group include: alkyl groups with 1 to 50 carbon atoms, cycloalkyl groups with 3 to 50 carbon atoms, aryl groups with 6 to 20 carbon atoms, carboxyl groups, amino groups, halogen atoms, etc. Preferably, the substituents that may be present in the hydrocarbon group are carboxyl groups, amino groups, or halogen atoms.

[0042] Where the -CH 2- contained in the hydrocarbon group is substituted with at least one of -O-, -CO- and -NH-, the substitution of -CH 2- is preferably at least one of -CO- and -NH-, more preferably -NH-. p is preferably 1 or 2.

[0043] As a compound represented by formula (G-1a), for example, compounds represented by formulas (1-1) to (1-9) can be listed below.

[0044] [Chemical 2]

[0045] Specific examples of compounds represented by formula (G-1a) can be shown by chemical names, such as: mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, 4-mercaptobutyric acid, mercaptosuccinic acid, mercaptostearic acid, mercaptooctanoic acid, 4-mercaptobenzoic acid, 2,3,5,6-tetrafluoro-4-mercaptobenzoic acid, L-cysteine, N-acetylglycine, 3-methoxybutyl 3-mercaptopropionic acid, 3-mercapto-2-methylpropionic acid, etc. Among these, 3-mercaptopropionic acid and mercaptosuccinic acid are preferred.

[0046] Another example of compound (G-1) is a polycarboxylic acid compound, preferably a compound (G-1b) formed by substituting -SH in formula (G-1a) with a carboxyl group (-COOH).

[0047] As compounds (G-1b), the following compounds can be listed for example: succinic acid, glutaric acid, adipic acid, octafluoroadipic acid, azelaic acid, dodecanoic acid, tetradecanoic acid, hexadecanoic acid, heptadecanedioic acid, octadecanoic acid, nonadecanedioic acid, dodecanoic acid, 3-ethyl-3-methylglutaric acid, hexafluoroglutaric acid, trans-3-hexenic acid, sebacic acid, hexafluorosecanedioic acid, acetylenic acid dicarboxylic acid, trans-torsinolic acid, 1,3-adamantane dicarboxylic acid, bicyclo[2.2.2]octane-1,4-dicarboxylic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, 1,1-cyclopropane dicarboxylic acid, 1,1-cyclobutane dicarboxylic acid, cis-1,3-cyclohexane dicarboxylic acid or trans-1,3-cyclohexane dicarboxylic acid, cis-1 4-Cyclohexanedicarboxylic acid or trans-1,4-cyclohexanedicarboxylic acid, 1,1-cyclopentanediacetic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, decahydro-1,4-naphthalenedicarboxylic acid, 2,3-norbornanedicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid, phthalic acid, 3-fluorophthalic acid, isophthalic acid, tetrafluoroisophthalic acid, terephthalic acid, tetrafluoroterephthalic acid, 2,5-dimethylterephthalic acid, 2,6-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,1'-ferrocenedicarboxylic acid, 2,2'-biphenyldicarboxylic acid, 4,4'-biphenyldicarboxylic acid, 2,5-furandicarboxylic acid, diphenylcarboxylic acid Ketone-2,4'-dicarboxylic acid monohydrate, benzophenone-4,4'-dicarboxylic acid, 2,3-pyrazine dicarboxylic acid, 2,3-pyridine dicarboxylic acid, 2,4-pyridine dicarboxylic acid, 3,5-pyridine dicarboxylic acid, 2,5-pyridine dicarboxylic acid, 2,6-pyridine dicarboxylic acid, 3,4-pyridine dicarboxylic acid, pyrazole-3,5-dicarboxylic acid monohydrate, 4,4'-stilbene dicarboxylic acid, anthraquinone-2,3-dicarboxylic acid, 4-(carboxymethyl)benzoic acid, chelidonic acid monohydrate, azobenzene-4,4'-dicarboxylic acid, azobenzene-3,3'-dicarboxylic acid, chlorobridged acid, 1H-imidazolium-4,5-dicarboxylic acid, 2,2-bis(4-carboxyphenyl)hexafluoropropane 1,10-bis(4-carboxyphenoxy)decane, dipropylmalonic acid, dithiodiethanolic acid, 3,3'-dithiodipropionic acid, 4,4'-dithiodibutyric acid, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl ether, ethylene glycol bis(4-carboxyphenyl) ether, 3,4-ethyldioxythiophene-2,5-dicarboxylic acid, 4,4'-isopropylidene diphenoxyacetic acid, 1,3-propanone dicarboxylic acid, methylene disalicylic acid, 5,5'-thiodisalicylic acid, tris(2-carboxyethyl)isocyanurate, tetrafluorosuccinic acid, α,α,α',α'-tetramethyl-1,3-phenylenediamine, 1,3,5-benzenetricarboxylic acid, etc.

[0048] From the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity, the molecular weight of compound (G-1) is preferably 3000 or less, more preferably 2500 or less, even more preferably 2000 or less, even more preferably 1000 or less, particularly preferably 800 or less, and most preferably 500 or less. The molecular weight of compound (G-1) is typically 100 or more.

[0049] The molecular weight may be either the number average molecular weight or the weight average molecular weight. In this case, the number average molecular weight and the weight average molecular weight are the number average molecular weight and weight average molecular weight converted from standard polystyrene, respectively, determined by gel permeation chromatography (GPC).

[0050] When the composition includes compound (G-1), the content ratio of compound (G-1) to semiconductor particles (A) in the composition, by mass ratio, is preferably 0.001 or more and 1 or less, more preferably 0.01 or more and 0.5 or less, and even more preferably 0.02 or more and 0.45 or less. If the content ratio is within this range, it may be advantageous from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity.

[0051] When the composition includes compound (G-1) and the resin (D) described later, the content of compound (G-1) in the composition, from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity, is preferably 0.1% by mass or more and 20% by mass or less relative to the total amount of solid components in the composition, more preferably 0.2% by mass or more and 20% by mass or less, further preferably 0.2% by mass or more and 10% by mass or less, further preferably 0.5% by mass or more and 10% by mass or less, and particularly preferably 0.5% by mass or more and 8% by mass or less.

[0052] When the composition contains compound (G-1) and does not contain the resin (D) described later, the content of compound (G-1) in the composition, from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity, is preferably 0.1% by mass or more and 40% by mass or less, more preferably 0.2% by mass or more and 35% by mass or less, further preferably 0.2% by mass or more and 30% by mass or less, further preferably 0.5% by mass or more and 25% by mass or less, and particularly preferably 0.5% by mass or more and 20% by mass or less.

[0053] [Compound (G-2)] Compound (G-2) is a compound different from compound (G-1), and is a compound containing a polyalkylene glycol structure and having a polar group at the molecule's end. The molecule's end is preferably the end of the longest carbon chain in compound (G-2) (the carbon atom in the carbon chain may be replaced by other atoms such as oxygen atoms). The composition may contain only one compound (G-2), or it may contain two or more. The composition may contain compound (G-1) or compound (G-2), or it may contain both compound (G-1) and compound (G-2). Furthermore, a compound containing a polyalkylene glycol structure and having both the first and second functional groups belongs to compound (G-1).

[0054] The polyalkylene glycol structure refers to the structure represented by the following formula (n is an integer greater than 2).

[0055] [Chemical 3] In the formula, RC is an alkyl group, such as alkyl ethyl, alkyl propyl, etc.

[0056] As a specific example of compound (G-2), polyalkylene glycol compounds represented by the following formula (G-2a) can be listed.

[0057] [Chemical 4]

[0058] In formula (G-2a), X is a polar group, Y is a monovalent group, and ZC is a divalent or trivalent group. n is an integer greater than or equal to 2. m is 1 or 2. RC is an alkyl group.

[0059] The polar group X is preferably at least one group selected from the group consisting of thiol groups (-SH), carboxyl groups (-COOH), and amino groups (-NH2). Polarity selected from this group may be advantageous in terms of improving coordination with the semiconductor particle (A). In particular, from the viewpoint of improving the stability and dispersibility of the semiconductor particle (A) and the luminescence intensity, the polar group X is more preferably at least one group selected from the group consisting of thiol groups and carboxyl groups.

[0060] The group Y is a monovalent group. There are no particular limitations on the group Y; examples include monovalent hydrocarbon groups that may have substituents (N, O, S, halogen atoms, etc.). The -CH 2- contained in this hydrocarbon group may be substituted by -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. The number of carbon atoms in the hydrocarbon group is, for example, 1 or more and 12 or less. The hydrocarbon group may also have unsaturated bonds.

[0061] Examples of the base Y include: alkyl groups having a straight-chain, branched-chain, or cyclic structure with 1 or more and 12 or less carbon atoms; and alkoxy groups having a straight-chain, branched-chain, or cyclic structure with 1 or more and 12 or less carbon atoms. The alkyl group and alkoxy group preferably have 1 or more and 8 or less carbon atoms, more preferably 1 or more and 6 or less, and even more preferably 1 or more and 4 or less carbon atoms. The -CH 2- group contained in the alkyl group and alkoxy group may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. Preferably, the base Y is a straight-chain or branched-chain alkoxy group with 1 or more and 4 or less carbon atoms, and more preferably a straight-chain alkoxy group with 1 or more and 4 or less carbon atoms.

[0062] The base Y may contain a polar group. Such a polar group may be selected from at least one group chosen from the group consisting of thiols (-SH), carboxyl groups (-COOH), and amino groups (-NH₂). As described above, compounds containing a polyalkylene glycol structure and having both the first and second functional groups belong to compound (G-1). Preferably, the polar group is disposed at the end of the base Y.

[0063] The ZC group is a divalent or trivalent group. There are no particular restrictions on the ZC group, and examples include divalent or trivalent hydrocarbon groups that may contain heteroatoms (N, O, S, halogen atoms, etc.). The number of carbon atoms in the hydrocarbon group is, for example, 1 or more and 24 or less. The hydrocarbon group may also have unsaturated bonds.

[0064] Examples of divalent ZC groups include: alkyl groups having a linear, branched, or cyclic structure with 1 or more and 24 or less carbon atoms; and alkenyl groups having a linear, branched, or cyclic structure with 1 or more and 24 or less carbon atoms. Preferably, the alkyl and alkenyl groups have 1 or more and 12 or less carbon atoms, more preferably 1 or more and 8 or less, and even more preferably 1 or more and 4 or less carbon atoms. The -CH2- group contained in the alkyl and alkenyl groups may be substituted by -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. Examples of trivalent ZC groups include groups formed by removing one hydrogen atom from the divalent ZC groups described above.

[0065] The ZC base may have a branched structure. The ZC base having a branched structure may also have a polyalkylene glycol structure different from the polyalkylene glycol structure represented by the formula (G-2a) in a branched chain that is different from the branched chain containing the polyalkylene glycol structure represented by the formula (G-2a).

[0066] Wherein, the ZC is preferably a straight-chain or branched alkyl group having 1 or more and 6 or less carbon atoms, and more preferably a straight-chain alkyl group having 1 or more and 4 or less carbon atoms.

[0067] RC is an alkyl group, preferably a straight-chain or branched alkyl group having 1 or more and 6 or fewer carbon atoms, and more preferably a straight-chain alkyl group having 1 or more and 4 or fewer carbon atoms.

[0068] In formula (G-2a), n is an integer greater than or equal to 2, preferably greater than or equal to 2 and less than 540, more preferably greater than or equal to 2 and less than 120, and even more preferably greater than or equal to 2 and less than 60.

[0069] The molecular weight of compound (G-2) can be, for example, about 150 or more and about 10,000 or less. From the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the luminescence intensity, it is preferably 150 or more and about 5,000 or less, and more preferably 150 or more and about 4,000 or less. This molecular weight can be either the number average molecular weight or the weight average molecular weight. In this case, the number average molecular weight and the weight average molecular weight are respectively the number average molecular weight and weight average molecular weight converted from standard polystyrene as determined by GPC.

[0070] When the composition includes compound (G-2), the content ratio of compound (G-2) to semiconductor particles (A) in the composition, by mass ratio, is preferably 0.001 or more and 2 or less, more preferably 0.01 or more and 1.5 or less, and even more preferably 0.1 or more and 1 or less. If this content ratio is within this range, it may be advantageous from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity.

[0071] When the composition includes compound (G-2) and the resin (D) described later, the content of compound (G-2) in the composition, from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity, is preferably 0.1% by mass or more and 40% by mass or less, more preferably 0.1% by mass or more and 20% by mass or less, more preferably 1% by mass or more and 15% by mass or less, and more preferably 2% by mass or more and 12% by mass or less, relative to the total amount of solid components in the composition.

[0072] When the composition contains compound (G-2) and does not contain the resin (D) described later, the content of compound (G-2) in the composition, from the viewpoint of improving the stability and dispersibility of semiconductor particles (A) and the luminescence intensity, is preferably 0.1% by mass or more and 50% by mass or less, more preferably 0.1% by mass or more and 40% by mass or less, more preferably 1% by mass or more and 30% by mass or less, and more preferably 2% by mass or more and 20% by mass or less.

[0073] When the composition includes an organic ligand (G), the content ratio of the organic ligand (G) to the semiconductor particles (A) in the composition, by mass ratio, is preferably 0.001 or more and 1 or less, more preferably 0.01 or more and 0.8 or less, and even more preferably 0.02 or more and 0.5 or less. If this content ratio is within this range, it may be advantageous from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the luminescence intensity. The content of the organic ligand (G) mentioned herein refers to the total content of all organic ligands contained in the composition.

[0074] When the composition includes an organic ligand (G) and the resin (D) described later, the content of the organic ligand (G) in the composition, from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the luminescence intensity, is preferably 0.1% by mass or more and 40% by mass or less, more preferably 0.1% by mass or more and 20% by mass or less, more preferably 1% by mass or more and 15% by mass or less, and more preferably 2% by mass or more and 12% by mass or less, relative to the total amount of the solid components in the composition.

[0075] When the composition contains an organic ligand (G) and does not contain the resin (D) described later, the content of the organic ligand (G) in the composition, from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the luminescence intensity, is preferably 0.1% by mass or more and 50% by mass or less, more preferably 0.1% by mass or more and 40% by mass or less, more preferably 1% by mass or more and 30% by mass or less, and more preferably 2% by mass or more and 20% by mass or less.

[0076] When the composition includes an organic ligand (G) and the resin (D) described later, the total content of the semiconductor particles (A) and the organic ligand (G) in the composition, from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the luminescence intensity, is preferably 10% by mass or more and 75% by mass or less, more preferably 12% by mass or more and 70% by mass or less, and even more preferably 15% by mass or more and 65% by mass or less, relative to the total amount of solid components in the composition.

[0077] When the composition includes an organic ligand (G) and does not contain the resin (D) described later, the total content of the semiconductor particles (A) and the organic ligand (G) in the composition, from the viewpoint of improving the stability and dispersibility of the semiconductor particles (A) and the luminescence intensity, is preferably 10% by mass or more and 95% by mass or less, more preferably 15% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 80% by mass or less, relative to the total amount of solid components in the composition.

[0078] [3] The composition includes both semiconductor particles (A) and a luminescent organic compound (B). This increases the luminescence intensity. In addition, when obtaining a film with the same luminescence intensity, the thickness of the film can be reduced. The luminescent organic compound (B) included in the composition can be a compound known as an organic light emitter. Organic light emitters include organic phosphors. Organic phosphors can be high molecular weight compounds (polymers) or low molecular weight compounds. The composition may contain one or more luminescent organic compounds (B).

[0079] Examples of the polymeric compounds that are organic phosphors include those described in Japanese Patent Application Publication No. 2008-133346, International Publication No. 2004 / 060970, International Publication No. 2012 / 153083, and Chemical Review (Vol. 109, pp. 897-1091 (2009)).

[0080] The constituent units contained in the polymeric compound that serves as an organic fluorescent agent may include, for example, aryl groups such as phenylene, naphthyl, fluorenediyl, phenanthrenediyl, dihydrophenanthrenediyl, anthracenediyl, and pyrenediyl; aromatic amine residues such as alkyl groups formed by removing two hydrogen atoms from an aromatic amine; and divalent heterocyclic groups such as carbazolediyl, phenoxazinediyl, and phenoxazinediyl, which may have substituents (e.g., alkyl, alkoxy, and aryl groups). That is, the polymeric compound that serves as an organic fluorescent agent is preferably a polymeric compound containing at least one of the following groups: aryl groups that may have substituents, aromatic amine residues that may have substituents, and divalent heterocyclic groups that may have substituents; more preferably, a polymeric compound containing at least one of the following groups: aryl groups that may have substituents, aromatic amine residues that may have substituents, and divalent heterocyclic groups that may have substituents.

[0081] When the polymeric compound serving as an organic phosphor contains aryl groups, the total content of aryl groups contained in the polymeric compound is sufficient to allow it to function as an organic phosphor. When the polymeric compound serving as an organic phosphor contains aryl groups, the total content of aryl groups contained in the polymeric compound, relative to the total content of the constituent units contained in the polymeric compound, is, for example, 1 mol% or more and 100 mol% or less, preferably 50 mol% or more and 99 mol% or less, more preferably 70 mol% or more and 98 mol% or less, and even more preferably 90 mol% or more and 97 mol% or less.

[0082] When the polymeric compound serving as an organic phosphor contains aromatic amine residues and / or divalent heterocyclic groups, the total content of the aromatic amine residues and / or divalent heterocyclic groups contained in the polymeric compound serving as an organic phosphor is sufficient to allow it to function as an organic phosphor. When the polymeric compound serving as an organic phosphor contains aromatic amine residues and / or divalent heterocyclic groups, the total content of the aromatic amine residues and / or divalent heterocyclic groups contained in the polymeric compound, relative to the total content of the constituent units contained in the polymeric compound, is, for example, 1 mol% or more and 100 mol% or less, preferably 1 mol% or more and 50 mol% or less, more preferably 2 mol% or more and 30 mol% or less, and even more preferably 3 mol% or more and 10 mol% or less.

[0083] In the polymeric compound that is an organic phosphor, examples of constituent units M1, M2, M3, M5, and M7, as shown below, can be used as an aryl group. Additionally, examples of constituent units M6, as an aromatic amine residue, can be used as an aromatic amine residue. Furthermore, examples of constituent units M4, as a divalent heterocyclic group, can be used as a divalent heterocyclic group in the polymeric compound that is an organic phosphor.

[0084] Specifically, the polymeric compounds that are organic phosphors can be categorized as the following polymeric compounds (conjugated polymers): Polymeric compounds containing constituent units M1, M2, M3, and M4 (the ratio of the constituent units, expressed in molar ratios, is, for example, M1 / M2 / M3 / M4 = 50 / 22.5 / 22.5 / 5). Polymeric compounds containing constituent units M1, M2, and M4 (the ratio of the constituent units, expressed in molar ratios, is, for example, M1 / M2 / M4 = 50 / 45 / 5). Polymeric compounds containing constituent units M3, M2, and M4 (the ratio of the constituent units, expressed in molar ratios, is, for example, M3 / M2 / M4 = 50 / 45 / 5). Polymer compounds containing constituent units M1, M3, M5, and M6 (the ratio of constituent units, expressed in molar ratios, is, for example, M1 / M3 / M5 / M6 = 50 / 35 / 10 / 5). Polymer compounds containing constituent units M1, M7, M3, and M4 (the ratio of constituent units, expressed in molar ratios, is, for example, M1 / M3 / M5 / M6 = 50 / 22.5 / 20.5 / 7).

[0085] [Transformation 5][Transformation 6]

[0086] The low molecular weight compounds that are organic phosphors can be listed as follows: [a] bispyrrole methylene compounds, [b] xanthene compounds, [c] terephthalic acid compounds, [d] arylindole compounds, [e] silicon crosslinked fluorene compounds, [f] red fluorene compounds, [g] perylene compounds, [h] oxadiazole compounds or thiadiazole compounds, [i] benzenesulfonic acid compounds, etc.

[0087] [Transformation 7][Transformation 8][Transformation 9]

[0088] In formulas [a] to [i], R independently represents a hydrogen atom or a monovalent organic group. In formula [c], X represents, for example, a halogen atom, an alkoxy group, a silicate group, or a monovalent organic group. In formula [d], X represents, for example, Si. In formula [h], X represents, for example, O or S.

[0089] The luminescent organic compound (B) is preferably an energy-transfer type luminescent organic compound. That is, the luminescent organic compound (B) preferably has the property that at least a portion of the energy obtained by light absorption can be transferred to a nearby semiconductor particle (A) present in the composition or film. The luminescent organic compound (B) is more preferably having the aforementioned property and does not emit light itself or emits almost no light.

[0090] By comprising a composition including semiconductor particles (A) and a luminescent organic compound (B), when the composition or a film formed therefrom is irradiated with excitation light such as ultraviolet or visible light (e.g., blue light), the luminescent organic compound (B) can absorb excitation light that cannot be completely absorbed by the semiconductor particles (A) alone. This improves the utilization efficiency of the excitation light. Furthermore, leakage of excitation light emitted from the composition or film can be suppressed. Moreover, at least a portion of the energy gained by the luminescent organic compound (B) through light absorption is transferred to the semiconductor particles (A), thereby increasing the total luminescence from the composition or film based on the enhanced luminescence of the semiconductor particles (A), and thus increasing the luminescence intensity of the composition or film. At this time, with efficient energy transfer and the luminescent organic compound (B) itself emitting little or no light, a sharp spectral width (full width at half maximum) exhibited by the semiconductor particles (A) can be ensured.

[0091] From the viewpoint of improving the absorption efficiency of excitation light, the luminescent organic compound (B) preferably has an absorption peak with a maximum wavelength of 350 nm or more and 550 nm or less in its absorption spectrum, and more preferably has an absorption peak with a maximum wavelength of 360 nm or more and 520 nm or less. Furthermore, from the viewpoint of improving the absorption efficiency of excitation light, the luminescent organic compound (B) has absorption in the wavelength region of 400 nm or more and 500 nm or less. The absorption spectrum of the luminescent organic compound (B) can be measured according to the measurement method described in the Example section below.

[0092] In one embodiment, the composition includes a luminescent organic compound (B-1) as the luminescent organic compound (B), which has a luminescence peak in its emission spectrum preferably having a maximum wavelength of 450 nm or more and 550 nm or less, more preferably 450 nm or more and 520 nm or less, and even more preferably 450 nm or more and 500 nm or less. The emission spectrum of the luminescent organic compound (B) can be determined according to the determination method described in the Example section below.

[0093] In one embodiment, from the viewpoint of improving the efficiency of the energy transfer and increasing the luminescence intensity, the composition comprises the following semiconductor particles (A-1) and luminescent organic compound (B-1). Semiconductor particles (A-1): In the absorption spectrum, preferably having an absorption peak with a maximum wavelength of 450 nm or more and 550 nm or less, more preferably having an absorption peak with a maximum wavelength of 450 nm or more and 550 nm or less and having absorption in the wavelength region below 500 nm. Additionally, preferably having an absorption peak with a maximum wavelength of 460 nm or more and 530 nm or less in the absorption spectrum. Luminescent organic compound (B-1): In the emission spectrum, preferably having a maximum wavelength of 450 nm or more and 550 nm or less, more preferably 450 nm or more and 520 nm or less, and even more preferably 450 nm or more and 500 nm or less. From the viewpoint of improving the efficiency of energy transfer and increasing the intensity of light emission, the maximum wavelength of the light emission peak of the luminescent organic compound (B-1) is preferably smaller than the maximum wavelength of the light absorption peak of the semiconductor particle (A-1).

[0094] In other embodiments, the composition includes a luminescent organic compound (B-2) as the luminescent organic compound (B), which has a luminescence peak in its emission spectrum preferably having a maximum wavelength of 480 nm or more and 580 nm or less, more preferably 480 nm or more and 550 nm or less, and even more preferably 480 nm or more and 530 nm or less.

[0095] In other embodiments, from the viewpoint of improving the efficiency of energy transfer and increasing the luminescence intensity, the composition includes the following semiconductor particles (A-2) and luminescent organic compound (B-2). Semiconductor particles (A-2): In the absorption spectrum, preferably having an absorption peak with a maximum wavelength of 550 nm or more and 650 nm or less, more preferably having an absorption peak with a maximum wavelength of 550 nm or more and 650 nm or less and having absorption in the wavelength region below 600 nm. Additionally, preferably having an absorption peak with a maximum wavelength of 560 nm or more and 630 nm or less in the absorption spectrum. Luminescent organic compound (B-2): In the emission spectrum, preferably having a maximum wavelength of 480 nm or more and 580 nm or less, more preferably 480 nm or more and 550 nm or less, and even more preferably 480 nm or more and 530 nm or less. From the viewpoint of improving the efficiency of energy transfer and increasing the luminescence intensity, the maximum wavelength of the luminescence peak of the luminescent organic compound (B-2) is preferably smaller than the maximum wavelength of the absorption peak of the semiconductor particle (A-2).

[0096] When the composition includes the resin (D) described later, the content of the luminescent organic compound (B) in the composition, relative to the total amount of solid components of the composition, is, for example, 0.001% by mass or more and 1% by mass or less. From the viewpoint of improving luminescence intensity, it is preferably 0.0015% by mass or more and 0.5% by mass or less, more preferably 0.002% by mass or more and 0.4% by mass or less, and even more preferably 0.002% by mass or more and 0.3% by mass or less. When the composition does not contain the resin (D) described later, the content of the luminescent organic compound (B) in the composition, relative to the total amount of solid components of the composition, is, for example, 5% by mass or more and 70% by mass or less, more preferably 10% by mass or more and 60% by mass or less, more preferably 15% by mass or more and 50% by mass or less, even more preferably 20% by mass or more and 45% by mass or less, and even more preferably 25% by mass or more and 40% by mass or less.

[0097] When the composition includes the resin (D) described later, the content of the luminescent organic compound (B) in the composition is, for example, 0.001 parts by mass and 1 part by mass or less relative to 100 parts by mass of semiconductor particles (A). From the viewpoint of improving luminescence intensity, it is more preferably 0.002 parts by mass and 0.8 parts by mass or less, more preferably 0.003 parts by mass and 0.5 parts by mass or less, and even more preferably 0.005 parts by mass and 0.4 parts by mass or less. When the composition includes the resin (D) described later, the content of the luminescent organic compound (B) in the composition is, for example, 0.001 parts by mass or more and 1 part by mass or less, relative to a total of 100 parts by mass of semiconductor particles (A) and organic ligands (G). From the viewpoint of improving luminescence intensity, it is more preferably 0.002 parts by mass or more and 0.8 parts by mass or less, more preferably 0.003 parts by mass or more and 0.5 parts by mass or less, and even more preferably 0.005 parts by mass or more and 0.3 parts by mass or less.

[0098] When the composition does not contain the resin (D) described later, the content of the luminescent organic compound (B) in the composition, relative to 100 parts by mass of semiconductor particles (A), is, for example, 12 parts by mass or more and 150 parts by mass or less. From the viewpoint of improving luminescence intensity, it is preferably 20 parts by mass or more and 100 parts by mass or less, more preferably 25 parts by mass or more and 90 parts by mass or less, and even more preferably 30 parts by mass or more and 80 parts by mass or less. When the composition does not contain the resin (D) described later, the content of the luminescent organic compound (B) in the composition, relative to 100 parts by mass of the total semiconductor particles (A) and organic ligands (G), is, for example, 10 parts by mass or more and 100 parts by mass or less. From the viewpoint of improving luminescence intensity, it is preferably 15 parts by mass or more and 90 parts by mass or less, more preferably 20 parts by mass or more and 80 parts by mass or less, and even more preferably 30 parts by mass or more and 75 parts by mass or less.

[0099] In a composition containing resin (D), if the content of luminescent organic compound (B) is too high, sometimes not all of the luminescent organic compound (B) is dissolved in the composition. In this case, it may adversely affect the membrane properties. From this point of view, the content of luminescent organic compound (B) in the composition containing resin (D) is sometimes preferably set to 0.25 parts by mass or less, and further to 0.2 parts by mass or less, relative to 100 parts by mass of semiconductor particles (A) or a total of 100 parts by mass of semiconductor particles (A) and organic ligand (G).

[0100] [4] Light scattering agent (C) The composition may further include a light scattering agent (C). The resin film formed from the composition may exhibit light scattering properties. The composition may contain two or more light scattering agents (C). From the viewpoint of improving luminescence intensity, the composition preferably further includes a light scattering agent (C).

[0101] Examples of light scattering agents (C) include inorganic particles such as metal or metal oxide particles and glass particles. Examples of metal oxides include TiO2, SiO2, BaTiO3, and ZnO, with TiO2 particles being preferred for efficient light scattering. The particle size of the light scattering agent (C) is, for example, about 0.03 μm or more and about 20 μm or less, preferably 0.05 μm or more and about 1 μm or less, and more preferably 0.05 μm or more and about 0.5 μm or less.

[0102] As a light scattering agent (C), a substance in which the light scattering agent is pre-dispersed in part or all of the solvent (J) using a dispersant may also be used. Commercially available products may be used as the dispersant. Examples of commercially available products include: DISPERBYK-101, 102, 103, 106, 107, 108, 109, 110, 111, 116, 118, 130, 140, 154, 161, 162, 163, 164, 165, 166, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 192, 2000, and 2001 manufactured by BYK-Chemie Japan. 2020, 2025, 2050, 2070, 2095, 2150, 2155; ANTI-TERRA-U, U100, 203, 204, 250; BYK-P104, P104S, P105, 220S, 6919; BYK-LPN6919, 21116; LACTIMON, LACTIMON-WS; Bykumen, etc. The SOLSPERSE series manufactured by Lubrizol Corporation of Japan includes models such as 3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, and 76500. BASF manufactures EFKA series products including 46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, and 1503; Ajinomoto Precision Technology... Fine-Techno manufactures Ajisper PA111, PB711, PB821, PB822, PB824, etc.

[0103] The content of light scattering agent (C) in the composition is, for example, 0.001% by mass or more and 50% by mass or less, relative to the total amount of solid components in the composition. From the viewpoint of improving the light scattering ability and luminescence intensity of the composition or film, it is preferably 1% by mass or more and 30% by mass or less, more preferably 2% by mass or more and 20% by mass or less, even more preferably 2% by mass or more and 15% by mass or less, and even more preferably 3% by mass or more and 10% by mass or less.

[0104] [5] Resin (D) The composition may further include resin (D). From the viewpoint that the composition forms a film, the composition preferably includes resin (D). Resin (D) may include one or more resins. Resin (D) is non-luminescent, which is different from luminescent organic compounds (B). Examples of resin (D) include resins [K1] to [K4].

[0105] Resin [K1]: a copolymer of at least one (a) (hereinafter also referred to as "(a)") selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and a monomer (c) (which is different from (a)) (hereinafter also referred to as "(c)") capable of copolymerizing with (a); Resin [K2]: a resin obtained by reacting a monomer (b) (hereinafter also referred to as "(b)") having a cyclic ether structure having 2 to 4 carbon atoms with an ethylene unsaturated bond, and a copolymer of (a) and (c); Resin [K3]: a resin obtained by reacting a copolymer of (a) and (b) with (c); Resin [K4]: a resin obtained by reacting a copolymer of (a) and (b) with (c), and then reacting it with a carboxylic anhydride.

[0106] As for (a), examples include: unsaturated monocarboxylic acids such as (meth)acrylic acid, crotonic acid, o-vinylbenzoic acid, m-vinylbenzoic acid, and p-vinylbenzoic acid; and unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, succinic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid, and 1,4-cyclohexene dicarboxylic acid. Methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, and other bicyclic unsaturated compounds containing carboxyl groups; Maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxylic acid bicyclo[2.2.1]hept-2-ene anhydride, and other unsaturated dicarboxylic acid anhydrides; unsaturated mono[(meth)acrylic acid alkyl] esters of di- or higher polycarboxylic acids, such as succinate mono[2-(meth)acrylic acid oxyethyl] ester and phthalate mono[2-(meth)acrylic acid oxyethyl] ester; unsaturated (meth)acrylates containing both hydroxyl and carboxyl groups in the same molecule, such as (meth)acrylate α-(hydroxymethyl) ester. Among these, (meth)acrylate and maleic anhydride are preferred from the viewpoint of copolymerization reactivity. In this specification, (meth)acrylic acid refers to acrylic acid and / or methacrylic acid. The same applies to "(meth)acrylyl", "(meth)acrylate", etc.

[0107] (b) For example, a monolith having a cyclic ether structure having 2 to 4 carbon atoms (e.g., selected from at least one of the group consisting of an oxecyclopropane ring, an oxecyclobutane ring, and a tetrahydrofuran ring) and an ethylene unsaturated bond. (b) Preferably, a monolith having a cyclic ether structure having 2 to 4 carbon atoms and a (meth)acrylic acid oxy group.

[0108] As in (b), examples include: (meth)acrylate glycidyl ester, (meth)acrylate β-methylglycidyl ester, (meth)acrylate β-ethylglycidyl ester, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinylbenzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-bis(glycidyloxymethyl)styrene, 2,4- Monomers of bis(glycidoxymethyl)styrene, 2,5-bis(glycidoxymethyl)styrene, 2,6-bis(glycidoxymethyl)styrene, 2,3,4-tris(glycidoxymethyl)styrene, 2,3,5-tris(glycidoxymethyl)styrene, 2,3,6-tris(glycidoxymethyl)styrene, 3,4,5-tris(glycidoxymethyl)styrene, 2,4,6-tris(glycidoxymethyl)styrene, etc., containing oxocyclic propane rings and vinyl unsaturated bonds; Monomers of 3-methyl-3-methylpropenyloxymethyloxetane, 3-methyl-3-propenyloxymethyloxetane, 3-ethyl-3-methylpropenyloxymethyloxetane, 3-ethyl-3-propenyloxymethyloxetane, 3-methyl-3-propenyloxyethyloxetane, 3-ethyl-3-propenyloxyethyloxetane, 3-ethyl-3-propenyloxyethyloxetane, 3-ethyl-3-propenyloxyethyloxetane, etc., having an oxetane ring and an ethylene-like unsaturated bond; Monomers of tetrahydrofurfuryl acrylate (e.g., Biscoat V#150, manufactured by Osaka Organic Chemicals Co., Ltd.), tetrahydrofurfuryl methacrylate, etc., having a tetrahydrofuran ring and an ethylene-like unsaturated bond, etc. Regarding the aspect that the reactivity of resins [K2] to [K4] is high and unreacted residues are not easily left during the manufacture of (b), as (b), it is preferable to be a monolithic form having an oxopropane ring and an ethylene unsaturated bond.

[0109] As (c), examples include: methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, dibutyl methacrylate, tributyl methacrylate, 2-ethylhexyl methacrylate, dodecyl methacrylate, lauryl methacrylate, stearyl methacrylate, cyclopentyl methacrylate, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo[5.2.1.0 2,6]decane-8-yl ester (commonly known in this art as "dicyclopentyl methacrylate"; sometimes also as "tricyclodecyl methacrylate"), tricyclo[5.2.1.0 2,6]decane-8-yl ester (in this art, it is commonly referred to as "dicyclopentyl methacrylate"; in addition, it is sometimes referred to as "tricyclodecyl methacrylate"). [2,6] Decen-8-yl ester (commonly referred to as "(meth)acrylate dicyclopentenyl ester"), (meth)acrylate dicyclopentyloxyethyl ester, (meth)acrylate isobornyl ester, (meth)acrylate adamantyl ester, (meth)acrylate allyl ester, (meth)acrylate propargyl ester, (meth)acrylate phenyl ester, (meth)acrylate naphthyl ester, (meth)acrylate benzyl ester, etc. (meth)acrylates; (meth)acrylate 2-hydroxyethyl ester, (meth)acrylate 2-hydroxypropyl ester, etc. (meth)acrylates containing hydroxyl groups; dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, and diethyl itaconic acid; Bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5, 6-Dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-bis(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(cyclohexyloxycarbonyl)bicyclo[2.2.1].[1] Bicyclic unsaturated compounds such as hepta-2-ene; dicarbonyl amide derivatives such as N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-succinimido-3-maleimide benzoate, N-succinimido-4-maleimide butyrate, N-succinimido-6-maleimide hexanoate, N-succinimido-3-maleimide propionate, and N-(9-acridyl)maleimide; Styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, etc. Among these, from the viewpoint of copolymerization reactivity and the heat resistance of resin (D), styrene, vinyltoluene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo[2.2.1]hept-2-ene, etc., are preferred.

[0110] Among all the constituent units constituting resin [K1], the ratio of constituent units originating from each of the constituent units in resin [K1] is preferably: constituent units originating from (a): 2 mol% or more and 60 mol% or less, constituent units originating from (c): 40 mol% or more and 98 mol% or less, more preferably: constituent units originating from (a): 10 mol% or more and 50 mol% or less, constituent units originating from (c): 50 mol% or more and 90 mol% or less. If the ratio of constituent units in resin [K1] is within the aforementioned range, there is a tendency for the composition to have excellent storage stability and the film to have excellent solvent resistance.

[0111] The resin [K1] can be manufactured, for example, by referring to the method described in the literature "Experimental Method for Polymer Synthesis" (written by Takayuki Otsu, Chemical Publishers Co., Ltd., 1st Edition, 1st Printing, March 1, 1972) and the references described in that literature.

[0112] Specifically, the following method can be used: A specified amount of (a) and (c), the polymerization initiator, and the solvent are placed into a reaction vessel. For example, nitrogen is used to replace the oxygen, thereby creating a deoxygenated environment. The mixture is then stirred while being heated and kept at a constant temperature. There are no particular limitations on the polymerization initiator and solvent used; those commonly used in the field can be used. For example, azo compounds (2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylpentanonitrile) etc.) or organic peroxides (benzoyl peroxide, etc.) can be used as polymerization initiators. As for the solvent, any solvent that dissolves the monomers is acceptable; solvents that can be included in the composition (J) and described later can be used as examples.

[0113] The obtained copolymer can be used directly from the reaction solution, or from a concentrated or diluted solution, or from a solid (powder) obtained by methods such as reprecipitation. If the solvent (J) described later is used as the solvent during polymerization, the reaction solution can be used directly in the preparation of the composition, thus simplifying the manufacturing steps of the composition.

[0114] The resin [K2] can be manufactured by adding a cyclic ether of (b) having 2 to 4 carbon atoms to a carboxylic acid and / or carboxylic anhydride in (a) to a copolymer of (a) and (c) in the same manner as described in the method for manufacturing resin [K1]. In this case, the ratio of the constituent units derived from each is preferably the same as the ratio described for resin [K1].

[0115] Next, the cyclic ether having 2 to 4 carbon atoms in (b) is reacted with a portion of the carboxylic acid and / or carboxylic anhydride derived from (a) in the copolymer. After producing the copolymer of (a) and (c), the environment inside the flask is replaced with air instead of nitrogen, and the reaction is carried out in the presence of (b), a reaction catalyst for the carboxylic acid or carboxylic anhydride and the cyclic ether (e.g., an organophosphorus compound, a metal complex, an amine compound, etc.) and a polymerization inhibitor (e.g., hydroquinone, etc.), for example at 60°C or higher and 130°C or lower for 1 hour or more and 10 hours or less, thereby producing resin [K2].

[0116] Compared to (a) 100 mol, the amount used in (b) is preferably 5 mol or more and 80 mol or less, and more preferably 10 mol or more and 75 mol or less. By setting it within this range, there is a tendency for the preservation stability of the composition, as well as the balance between the solvent resistance, heat resistance and mechanical strength of the membrane, to become better.

[0117] Examples of organophosphorus compounds that can serve as reaction catalysts include triphenylphosphine. Examples of amine compounds that can serve as reaction catalysts include aliphatic tertiary amine compounds or aliphatic quaternary ammonium salt compounds; specific examples include tris(dimethylaminomethyl)phenol, triethylamine, tetrabutylammonium bromide, and tetrabutylammonium chloride. Organophosphorus compounds are preferred as reaction catalysts.

[0118] The amount of the reaction catalyst used is preferably 0.001 parts by mass or more and 5 parts by mass or less, relative to the total amount of 100 parts by mass of (a), (b) and (c). The amount of the polymerization inhibitor used is preferably 0.001 parts by mass or more and 5 parts by mass or less, relative to the total amount of 100 parts by mass of (a), (b) and (c).

[0119] The charging method, reaction temperature, and time, among other reaction conditions, can be appropriately adjusted taking into account the heat generated by the manufacturing equipment or polymerization. Furthermore, similarly to polymerization conditions, the charging method or reaction temperature can be appropriately adjusted taking into account the heat generated by the manufacturing equipment or polymerization.

[0120] Regarding resin [K3], as a first stage, copolymers of (b) and (c) are obtained in the same manner as those for resin [K1]. Similarly, the obtained copolymer can be used directly from the reaction solution, or from a concentrated or diluted solution, or can be extracted in solid (powder) form by methods such as reprecipitation.

[0121] The ratio of constituent units derived from (b) and (c) is preferably as follows, relative to the total number of moles of all constituent units constituting the copolymer: 5 mol% or more and 95 mol% or less, and 5 mol% or more and 95 mol% or less, respectively. More preferably, the ratio of constituent units derived from (b) is 10 mol% or more and 90 mol% or less, and 10 mol% or more and 90 mol% or less.

[0122] The resin [K3] can be obtained by reacting the carboxylic acid or carboxylic anhydride contained in (a) with the cyclic ether derived from (b) in the copolymer of (b) and (c) under the same conditions as the method for manufacturing the resin [K2]. The amount of (a) used in reaction with the copolymer is preferably 5 mol or more and 80 mol or less relative to 100 mol of (b).

[0123] The resin [K4] is a resin obtained by further reacting a carboxylic anhydride with a resin [K3]. The carboxylic anhydride is reacted with a hydroxyl group generated by the reaction of a cyclic ether with a carboxylic acid or a carboxylic anhydride. Examples of carboxylic anhydrides include: maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxylic bicyclo[2.2.1]hept-2-ene anhydride, etc. The amount of carboxylic anhydride used is preferably 0.5 mol to 1 mol relative to the amount used in (a).

[0124] As resins [K1], [K2], [K3], and [K4], examples include: (meth)acrylate benzyl ester / (meth)acrylate copolymer, styrene / (meth)acrylate copolymer, etc. [K1]; resins obtained by adding glycidyl methacrylate to (meth)acrylate benzyl ester / (meth)acrylate copolymer, resins obtained by adding glycidyl methacrylate to (meth)acrylate tricyclodecyl ester / styrene / (meth)acrylate copolymer, resins obtained by adding glycidyl methacrylate to (meth)acrylate tricyclodecyl ester / (meth)acrylate benzyl ester / (meth)acrylate copolymer, etc. [K2]; resins obtained by reacting (meth)acrylate with a copolymer of (meth)acrylate tricyclodecyl ester / (meth)acrylate glycidyl ester, resins obtained by reacting (meth)acrylate with a copolymer of (meth)acrylate tricyclodecyl ester / (meth)acrylate glycidyl ester, etc. [K3]; A resin is obtained by reacting (meth)acrylic acid with a copolymer of tricyclodecyl (meth)acrylate / glycidyl (meth)acrylate to obtain a resin, and the obtained resin is further reacted with tetrahydrophthalic anhydride to obtain a resin, such as resin [K4]. Resin (D) is preferably at least one selected from the group consisting of resin [K2], resin [K3], and resin [K4].

[0125] As a further example of resin (D), the resin described in Japanese Patent Application Publication No. 2018-123274 can be cited. Such resin can be exemplified as a polymer (hereinafter also referred to as "resin (Da)") having double bonds in its side chains and containing, in its main chain, a constitutive unit (α) represented by formula (I) and a constitutive unit (β) represented by formula (II), and further containing an acid group. The acid group can be introduced into the resin (Da) by, for example, by the resin (Da) containing a constitutive unit (γ) derived from an monomer containing an acid group (e.g., (meth)acrylic acid). Preferably, the resin (Da) contains constitutive units (α), (β), and (γ) in its main chain backbone.

[0126] [Chemical 10] [In the formula, RA and RB may be the same or different, representing hydrogen atoms or hydrocarbon groups with 1 to 25 carbon atoms; n represents the average number of repeating units of the constituent unit represented by formula (I), and is a number greater than 1]

[0127] [Chemical 11] [In the formula, RC, whether the same or different, represents a hydrogen atom or a methyl group; RD, whether the same or different, represents a straight-chain or branched-chain hydrocarbon group with 4 to 20 carbon atoms; m represents the average number of repeating units of the constituent unit represented by formula (II), and is a number greater than 1]

[0128] In the resin (Da), from the viewpoint of the heat resistance or storage stability of the resin (Da), the content of the constituent unit (α) is, for example, 0.5% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 40% by mass or less, and more preferably 5% by mass or more and 30% by mass or less, relative to the total amount of all monolithic units providing the main chain backbone of the resin (Da) of 100% by mass. In Formula (I), n represents the average number of repeating units of the constituent unit (α) in the resin (Da), and n can be set in such a way that the content of the constituent unit (α) is within the range described above.

[0129] From the viewpoint of solvent resistance of the membrane, the content of the constituent unit (β) is, for example, 10% by mass or more and 90% by mass or less, preferably 20% by mass or more and 80% by mass or less, and more preferably 30% by mass or more and 75% by mass or less, relative to the total amount of all monolithic units of the main chain backbone providing the resin (Da) . In Formula (II), m represents the average number of repeating units of the constituent unit (β) in the resin (Da), and m can be set in such a way that the content of the constituent unit (β) is within the range described above.

[0130] From the viewpoint of the solubility of resin (Da) relative to solvent (J), the content of constituent unit (γ) is, for example, 0.5% by mass or more and 50% by mass or less, preferably 2% by mass or more and 50% by mass or less, and more preferably 5% by mass or more and 45% by mass or less, relative to the total amount of all monolithic units providing the main chain skeleton of resin (Da) 100% by mass.

[0131] The resin (D) may include one or more of the group consisting of the resins [K1], [K2], [K3], [K4] and (Da).

[0132] Regarding resin (D), the weight-average molecular weight (Mw) converted from standard polystyrene by GPC is, for example, 1000 or more and 9000 or less. From the viewpoint of the developability of the composition and the luminescence intensity of the composition or film, it is preferably 2000 or more and 8500 or less, and more preferably 3000 or more and 8500 or less. The Mw of resin (D) can be adjusted appropriately by combining the selection of raw materials used, the loading method, the reaction temperature, and the reaction time. The Mw of resin (D) can be determined according to the determination method described in the Examples section below. Alternatively, the Mw of resin (D) contained in the composition can be determined using GPC.

[0133] The molecular weight distribution of the resin (D) [weight average molecular weight (Mw) / number average molecular weight (Mn)] determined by CPC is, for example, 1.0 or more and 6.0 or less, and from the viewpoint of improving luminescence intensity, it is preferably 1.2 or more and 4.0 or less.

[0134] From the viewpoint of the developability of the composition and the solvent resistance of the film, the acid value of the resin (D) is preferably 90 mgKOH / g or more and 150 mgKOH / g or less, more preferably 95 mgKOH / g or more and 140 mgKOH / g or less, and even more preferably 100 mgKOH / g or more and 130 mgKOH / g or less. The acid value of the resin (D) can be adjusted by the content of monomer components having acid groups (such as (a) described above).

[0135] The acid value of resin (D) is determined as the amount (mg) of potassium hydroxide required to neutralize 1 g of resin (D), and can be determined, for example, by titration using an aqueous solution of potassium hydroxide. Specifically, it can be determined according to the determination method described in the Examples section below. Alternatively, the acid value of the resin (D) contained in the composition can also be determined, for example, by structural analysis.

[0136] From the viewpoint of improving luminescence intensity, resin (D) is preferably a resin containing a double bond equivalent of 300 g / eq or more and 2000 g / eq or less, and more preferably a resin containing a double bond equivalent of 500 g / eq or more and 1500 g / eq or less. Examples of resins having a double bond equivalent of 300 g / eq or more and 2000 g / eq or less include (meth)acrylic resins. Resin (D) is preferably a (meth)acrylic resin.

[0137] Relative to the total amount of solid components in the composition, the content of resin (D) in the composition is, for example, 5% by mass or more and 80% by mass or less, preferably 10% by mass or more and 70% by mass or less, more preferably 13% by mass or more and 60% by mass or less, and even more preferably 17% by mass or more and 55% by mass or less. If the content of resin (D) is within the range described above, there is a tendency for the semiconductor particles (A) to be easily dispersed and for the luminescence intensity to be easily increased.

[0138] In the composition, the mass ratio (solid content ratio) of resin (D) to polymeric compound (E) described later is, for example, 1 or more, and from the viewpoint of the developability of the composition and the luminescence intensity of the composition or film, it is preferably 1.5 or more, and more preferably 2 or more.

[0139] [6] Polymerizable compound (E) The composition may further include a polymerizable compound (E). The polymerizable compound (E) is a compound that can be polymerized by active free radicals, acids, etc. generated from the polymerization initiator (F) described later. Examples of polymerizable compounds (E) include photopolymerizable compounds such as compounds having vinyl unsaturated bonds, for example, (meth)acrylate compounds. Other examples of polymerizable compounds (E) are thermopolymerizable compounds. The composition may also include two or more polymerizable compounds (E).

[0140] The polymerizable compound (E) is preferably a photopolymerizable compound having three or more vinyl unsaturated bonds within its molecule. The weight average molecular weight of the polymerizable compound (E) is preferably 150 or more, more preferably 250 or more, and more preferably 2900 or less, more preferably 1500 or less.

[0141] Examples of photopolymerizable compounds having three or more ethylene unsaturated bonds within the molecule include: compounds (Ea) having three or more ethylene unsaturated bonds within the molecule and having an acidic functional group; and compounds (Eb) having three or more ethylene unsaturated bonds within the molecule and not having an acidic functional group. The polymerizable compound (E) preferably includes at least one of compounds (Ea) and (Eb), and may also include two or more compounds (Ea), two or more compounds (Eb), or at least one of compounds (Ea) and at least one of compounds (Eb). Examples of the acidic functional group include, for example, a carboxyl group, a sulfonic acid group, and a phosphate group. The acidic functional group is preferably a carboxyl group.

[0142] By including compound (Ea) in a polymeric compound (E), the dispersion of semiconductor particles (A) in the composition can be improved, thereby enhancing the luminescent properties. In addition, by including compound (Ea) in a polymeric compound (C), the curability and heat resistance of the composition can be improved.

[0143] The vinyl unsaturated bond in compound (Ea) is preferably (meth)acryloxy. The number of vinyl unsaturated bonds in a molecule of compound (Ea) is preferably 3 or more and 5 or less, more preferably 3. The number of acidic functional groups in a molecule of compound (Ea) is 1 or more. When there are two or more acidic functional groups, the acidic functional groups may be different or the same, but it is preferable to have at least one carboxyl group.

[0144] As a compound (Ea), examples include compounds obtained by modifying a compound having three or more (meth)acrylic acid groups, such as pentaerythritol tri(meth)acrylate or dipentaerythritol penta(meth)acrylate, with a polybasic acid. Examples of such compounds include compounds formed by monoesterifying pentaerythritol tri(meth)acrylate with a diacid (e.g., succinic acid, maleic acid) or its anhydride, and compounds formed by monoesterifying dipentaerythritol penta(meth)acrylate with a diacid (e.g., succinic acid, maleic acid) or its anhydride.

[0145] The vinyl unsaturated bond in compound (Eb) is preferably (meth)acryloxy. The number of vinyl unsaturated bonds in a molecule of compound (Eb) is preferably 3 or more and 6 or less.

[0146] As compounds (Eb), examples include: trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, tri(2-(meth)acryloxyethyl)isocyanurate, ethylene glycol modified pentaerythritol tetra(meth)acrylate, ethylene glycol modified dipentaerythritol hexa(meth)acrylate, propylene glycol modified pentaerythritol tetra(meth)acrylate, propylene glycol modified dipentaerythritol hexa(meth)acrylate, caprolactone modified pentaerythritol tetra(meth)acrylate, caprolactone modified dipentaerythritol hexa(meth)acrylate, etc. Among them, dipentaerythritol penta(meth)acrylate and dipentaerythritol hexa(meth)acrylate are preferred.

[0147] When the composition contains a polymeric compound (E), the content of the polymeric compound (E) in the composition is preferably 5% by mass or more, more preferably 7% by mass or more, and even more preferably 10% by mass or more, and preferably 60% by mass or less, more preferably 45% by mass or less, and even more preferably 30% by mass or less, relative to the total amount of solid components in the composition. If the content of the polymeric compound (E) is within the aforementioned range, there is a tendency for the developability of the composition and the solvent resistance of the film to improve.

[0148] [7] Polymerization Initiator (F) The composition may further include a polymerization initiator (F). The polymerization initiator (F) is a compound that can generate active free radicals, acids, etc. by the action of light or heat, thereby initiating the polymerization of the polymerizable compound (E). The composition may include one or more polymerization initiators (F). Examples of polymerization initiators (F) include: photopolymerization initiators such as oxime compounds, benzyl ketone compounds, biimidazole compounds, triazine compounds, and acetyphosphine compounds; and thermal polymerization initiators such as azo compounds or organic peroxides.

[0149] An example of an oxime compound is an oxime compound having the first molecular structure represented by the following formula (1). Hereinafter, the oxime compound will also be referred to as "oxime compound (1)".

[0150] [Chemistry 12]

[0151] From the viewpoint of increasing luminescence intensity, it may be advantageous to include oxime compound (1) as a polymerization initiator (F). One reason for this effect is speculated to be that, due to the unique molecular structure of oxime compound (1), the absorption wavelength of oxime compound (1) changes significantly before and after the cleavage (decomposition) of oxime compound (1), which is necessary for the initiation of photopolymerization, thus oxime compound (1) has a high photoradical polymerization initiation ability.

[0152] In formula (1), R1 represents R11, OR11, COR11, SR11, CONR12R13 or CN. R11, R12 and R13 independently represent hydrogen atoms, alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms or heterocyclic groups with 2 to 20 carbon atoms. The hydrogen atoms of the groups represented by R11, R12 or R13 may be substituted with OR21, COR21, SR21, NR22Ra23, CONR22R23, -NR22-OR23, -N(COR22)-OCOR23, -C(=N-OR21)-R22, -C(=N-OCOR21)-R22, CN, halogen atoms or COOR21. R 21, R 22, and R 23 independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. The hydrogen atom of the group represented by R 21, R 22, or R 23 may be substituted with CN, a halogen atom, a hydroxyl group, or a carboxyl group. When the group represented by R 11, R 12, R 13, R 21, R 22, or R 23 has an alkyl extension moiety, the alkyl extension moiety may be interrupted 1 to 5 times by -O-, -S-, -COO-, -OCO-, -NR 24-, -NR 24CO-, -NR 24COO-, -OCONR 24-, -SCO-, -COS-, -OCS-, or -CSO-. R 24 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. When the group represented by R 11, R 12, R 13, R 21, R 22, or R 23 has an alkyl moiety, the alkyl moiety may be branched or cyclic. Furthermore, R 12 and R 13, and R 22 and R 23, may each form a ring together. * indicates a bond with a molecular structure other than the first molecular structure of the oxime compound (1), i.e., a second molecular structure.

[0153] The alkyl groups with 1 to 20 carbon atoms represented by R 11, R 12, R 13, R 21, R 22, R 23 and R 24 in formula (1) can be, for example: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, dibutyl, tributyl, pentyl, isopentyl, tripentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecayl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, etc.

[0154] The aryl groups represented by R11, R12, R13, R21, R22, R23 and R24 in formula (1) with 6 to 30 carbon atoms can be exemplified by: phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthracene, phenanthryl, phenyl, biphenyl, naphthyl, anthracene, etc., which are substituted with one or more of the alkyl groups.

[0155] The aralkyl groups with 7 to 30 carbon atoms represented by R 11, R 12, R 13, R 21, R 22, R 23 and R 24 in formula (1) can be exemplified by, for example: benzyl, α-methylbenzyl, α,α-dimethylbenzyl, phenylethyl, etc.

[0156] The heterocyclic groups with 2 to 20 carbon atoms represented by R 11, R 12, R 13, R 21, R 22, R 23 and R 24 in formula (1) can be, for example: pyridinyl, pyrimidinyl, furanyl, thiopheneyl, tetrahydrofuranyl, dioxazolyl, benzoxazol-2-yl, tetrahydropyranyl, pyrrolidinyl, imidazolidinyl, pyrazolidinyl, tetrahydrothiazolyl, isotetrahydrothiazolyl, oxazolidinyl, isoxazolidinyl, piperidinyl, piperazinyl, morpholinyl, etc., preferably 5-membered to 7-membered heterocyclic groups.

[0157] In formula (1), R12 and R13, as well as R22 and R23, can form a ring together, meaning that R12 and R13, as well as R22 and R23, can form a ring together with the nitrogen atom, carbon atom, or oxygen atom to which they are attached. Examples of rings that can be formed together by Ra12 and Ra13, as well as Ra22 and Ra23 in formula (1) include: cyclopentane ring, cyclohexane ring, cyclopentene ring, benzene ring, piperidine ring, morpholine ring, lactone ring, lactamine ring, etc., preferably 5-membered to 7-membered rings.

[0158] The halogen atoms that can be present as substituents in formula (1) include: fluorine atoms, chlorine atoms, bromine atoms and iodine atoms.

[0159] In formula (1), R1 is preferably R11, more preferably an alkyl group having 1 to 20 carbon atoms, and even more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms.

[0160] An example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (2) below. The second molecular structure refers to the molecular structure portion other than the first molecular structure possessed by the oxime compound (1). The bond represented by "*" in formula (2) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (2), the benzene ring with "-*" in formula (2) is directly bonded to the carbonyl group with "-*" in formula (1).

[0161] [Chemistry 13]

[0162] In formula (2), R2 and R3 independently represent R11, OR11, SR11, COR11, CONR12R13, NR12COR11, OCOR11, COOR11, SCOR11, OCSR11, COSR11, CSOR11, CN, or a halogen atom. When there are multiple R2s, they may be the same or different. When there are multiple R3s, they may be the same or different. R11, R12, and R13 have the same meaning as described above. s and t independently represent integers from 0 to 4. L represents a sulfur atom, CR31R32, CO, or NR33. R31, R32, and R33 independently represent a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, or an aralkyl group with 7 to 30 carbon atoms. When the group represented by R 31, R 32 or R 33 has an alkyl moiety, the alkyl moiety may be branched chain or cyclic, and R 31, R 32 and R 33 may each independently form a ring with an adjacent benzene ring. R 4 represents a hydroxyl group, a carboxyl group or a group represented by the following formula (2-1).

[0163] [Chemical 14] (In Formula (2-1), L1 represents -O-, -S-, -NR 22-, -NR 22CO-, -SO 2-, -CS-, -OCO- or -COO-; R 22 represents the same meaning as described above; L2 represents a group formed by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, a group formed by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, a group formed by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, or a group formed by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms; When the group represented by L2 has an alkyl extension portion, the alkyl extension portion may be -O-, -S-, -COO-, -OCO-, -NR 22-, -NR 22COO-, -OCONR 22-, -SCO-, -COS-, -OCS-, or -CSO- are interrupted 1 to 5 times. The alkyl moiety can be branched or cyclic. R 4a represents OR 41, SR 41, CONR 42R 43, NR 42COR 43, OCOR 41, COOR 41, SCOR 41, OCSR 41, COSR 41, CSOR 41, CN, or a halogen atom. When multiple R 4a are present, they can be the same or different. R 41, R 42, and R 43 independently represent a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, or an aralkyl group with 7 to 30 carbon atoms. When the group represented by R 41, R 42, and R 43 has an alkyl moiety, the alkyl moiety can be branched or cyclic. R 42 and R 43 can form a ring together. v represents an integer from 1 to 3) * represents a bond with the first molecular structure of the oxime compound (1).

[0164] The examples of alkyl groups with 1 to 20 carbons, aryl groups with 6 to 30 carbons, and aralkyl groups with 7 to 30 carbons represented by R11, R12, R13, R21, R22, R23, R24, R31, R32 and R33 in formula (2) and R22, R41, R42 and R43 in formula (2-1) are the same as the examples of R11, R12, R13, R21, R22, R23 and R24 in formula (1).

[0165] The examples of heterocyclic groups with 2 to 20 carbons represented by R11, R12, R13, R21, R22, R23, R24 in formula (2) and R22 in formula (2-1) are the same as the examples of R11, R12, R13, R21, R22, R23 and R24 in formula (1).

[0166] In formula (2), R31, R32, and R33 can each independently form a ring with an adjacent benzene ring, meaning that R31, R32, and R33 can each independently form a ring with an adjacent benzene ring and the nitrogen atom to which they are attached. The examples of rings formed by R31, R32, and R33 with an adjacent benzene ring in formula (2) are the same as the examples of rings formed by Ra12 and Ra13 and Ra22 and Ra23 together in formula (1).

[0167] In the formula (2-1), L2 represents a group formed by removing v hydrogen atoms from an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0168] As a group formed by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, for example, when v is 1, the following can be listed: methylene, ethyl, propyl, methyl ethyl, butyl, 1-methyl propyl, 2-methyl propyl, 1,2-dimethyl propyl, 1,3-dimethyl propyl, 1-methyl butyl, 2-methyl butyl, 3-methyl butyl, 4-methyl butyl, 2,4-dimethyl butyl, 1,3-dimethyl butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, dodecyl, tridecyl, tetradecyl, decadecyl, ethane-1,1-diyl, propane-2,2-diyl, etc.

[0169] As a group formed by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, for example, when v is 1, examples include: 1,2-epenylphenyl, 1,3-epenylphenyl, 1,4-epenylphenyl, 2,6-epenylnaphthyl, 1,4-epenylnaphthyl, 2,5-dimethyl-1,4-epenylphenyl, diphenylmethane-4,4'-diyl, 2,2-diphenylpropane-4,4'-diyl, diphenyl sulfide-4,4'-diyl, diphenyl arbutin-4,4'-diyl, etc.

[0170] As a group formed by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, for example, when v is 1, the group represented by formula (a) and the group represented by formula (b) below can be listed.

[0171] [Chemical 15] [In formulas (a) and (b), L3 and L5 represent alkyl groups having 1 to 10 carbon atoms, and L4 and L6 represent single bonds or alkyl groups having 1 to 10 carbon atoms]

[0172] Examples of alkyl groups having 1 to 10 carbon atoms include: methylene, ethyl, propyl, methyl ethyl, butyl, 1-methyl propyl, 2-methyl propyl, 1,2-dimethyl propyl, 1,3-dimethyl propyl, 1-methyl butyl, 2-methyl butyl, 3-methyl butyl, 4-methyl butyl, 2,4-dimethyl butyl, 1,3-dimethyl butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, etc.

[0173] As a group formed by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms, for example, when v is 1, the following divalent heterocyclic groups can be listed: 2,5-pyridinidinediyl, 2,6-pyridinidinediyl, 2,5-pyrimidinediyl, 2,5-thiophenediyl, 3,4-tetrahydrofurandiyl, 2,5-tetrahydrofurandiyl, 2,5-furandiyl, 3,4-thiazoldiyl, 2,5-benzofurandiyl, 2,5-benzothiophenediyl, N-methylindole-2,5-diyl, 2,5-benzothiazoldiyl, 2,5-benzoxazolediyl, etc.

[0174] As examples of halogen atoms represented by R2 and R3 in formula (2) and R4a in formula (2-1), fluorine atoms, chlorine atoms, bromine atoms and iodine atoms can be listed.

[0175] From the viewpoint of solubility in solvent (J) and / or developability of the composition, a preferred example of the structure represented by formula (2) is the structure represented by formula (2a) below.

[0176] [Chemical 16] [In formula (2a), L' represents a sulfur atom or NR 50, R 50 represents a linear, branched, or cyclic alkyl group with 1 to 20 carbon atoms, and R 2, R 3, R 4, s, and t have the same meaning as described above]

[0177] For the same viewpoint described above, another preferred example of the structure represented by equation (2) is the structure represented by equation (2b) below.

[0178] [Chemical 17] [In formula (2b), R 44 represents a hydroxyl group, a carboxyl group or a group represented by the following formula (2-2);

[0179] [Chemical 18] (In formula (2-2), L 11 represents -O- or *-OCO-, * represents the bond with L 12, L 12 represents an alkyl group with 1 to 20 carbon atoms, which can be interrupted by 1 to 3 -O-, R 44a represents OR 55 or COOR 55, R 55 represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms)

[0180] R 44 is preferably the base represented by formula (2-2). In this case, it is advantageous in terms of the solubility of the oxime compound (1) in the solvent (J) and the developability of the composition.

[0181] The alkyl group represented by L 12 preferably has 1 to 10 carbon atoms, more preferably 1 to 4. R 44a is preferably a hydroxyl or carboxyl group, more preferably a hydroxyl group.

[0182] There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (2). For example, it can be manufactured by the method described in Japanese Patent Application Publication No. 2011-132215.

[0183] Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (3) below. The bond represented by "*" in formula (3) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (3), the benzene ring with "-*" in formula (3) is directly bonded to the carbonyl group with "-*" in formula (1).

[0184] [Chemical 19]

[0185] In formula (3), R5 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. When the group represented by R5 has an alkyl moiety, the alkyl moiety may be branched or cyclic. The hydrogen atom of the group represented by R 5 may be substituted with R 21, OR 21, COR 21, SR 21, NR 22R 23, CONR 22R 23, -NR 22-OR 23, -N(COR 22)-OCOR 23, NR 22COR 21, OCOR 21, COOR 21, -C(=N-OR 21)-R 22, -C(=N-OCOR 21)-R 22, SCOR 21, OCSR 21, COSR 21, CSOR 21, hydroxyl, nitro, CN, halogen atom, or COOR 21. R 21, R 22, and R 23 have the same meaning as described above. The hydrogen atom of the group represented by R 21, R 22, or R 23 may be substituted with CN, halogen atom, hydroxyl, or carboxyl group. When the groups represented by R 21, R 22, and R 23 have an alkyl moiety, the alkyl moiety may be interrupted 1 to 5 times by -O-, -S-, -COO-, -OCO-, -NR 24-, -NR 24CO-, -NR 24COO-, -OCONR 24-, -SCO-, -COS-, -OCS-, or -CSO-. R 24 has the same meaning as described above. When the groups represented by R 21, R 22, and R 23 have an alkyl moiety, the alkyl moiety may be branched or cyclic. In addition, R 22 and R 23 may form a ring together. R6, R7, R8, and R9 independently represent R61, OR61, SR61, COR62, CONR63, R64, NR65, COR61, OCOR61, COOR62, SCOR61, OCSR61, COSR62, CSOR61, hydroxyl, nitro, CN, or halogen atom, respectively. R61, R62, R63, R64, and R65 independently represent hydrogen atom, alkyl group with 1 to 20 carbon atoms, aryl group with 6 to 30 carbon atoms, arylalkyl group with 7 to 30 carbon atoms, or heterocyclic group with 2 to 20 carbon atoms, respectively. The hydrogen atom of the base represented by R 61, R 62, R 63, R 64 or R 65 may be substituted with OR 21, COR 21, SR 21, NR 22Ra 23, CONR 22R 23, -NR 22-OR 23, -N(COR 22)-OCOR 23, -C(=N-OR 21)-R 22, -C(=N-OCOR 21)-R 22, CN, a halogen atom, or COOR 21.R6 and R7, R7 and R8, and R8 and R9 can each form a ring together. * indicates a bond with the first molecular structure of the oxime compound (1).

[0186] The examples of alkyl groups with 1 to 20 carbons, aryl groups with 6 to 30 carbons, aralkyl groups with 7 to 30 carbons, and heterocyclic groups with 2 to 20 carbons represented by R5, R21, R22, R23, R24, R61, R62, R63, R64 and R65 in formula (3) are the same as the examples of R11, R12, R13, R21, R22, R23 and R24 in formula (1).

[0187] In Equation (3), R 22 and R 23 can form a ring together, meaning that R 22 and R 23 can form a ring together with the nitrogen atom, carbon atom, or oxygen atom they are connected to. The examples of rings that R 22 and R 23 can form together in Equation (3) are the same as the examples of rings that Ra 12 and Ra 13 and Ra 22 and Ra 23 can form together in Equation (1).

[0188] As examples of halogen atoms represented by R6, R7, R8 and R9 in formula (3), halogen atoms that can replace hydrogen atoms of R5, R21, R22, R23, R61, R62, R63, R64 and R65 can be listed as: fluorine atom, chlorine atom, bromine atom and iodine atom.

[0189] In view of solubility in solvent (J) and / or developability of the composition, in a preferred form, R5 is the base represented by the following formula (3-1).

[0190] [Chemical 20] [In Formula (3-1), Z represents a group formed by removing one hydrogen atom from an alkyl group having 1 to 20 carbon atoms, a group formed by removing one hydrogen atom from an aryl group having 6 to 30 carbon atoms, a group formed by removing one hydrogen atom from an aralkyl group having 7 to 30 carbon atoms, or a group formed by removing one hydrogen atom from a heterocyclic group having 2 to 20 carbon atoms. When the group represented by Z has an alkyl extension moiety, the alkyl extension moiety may be interrupted 1 to 5 times by -O-, -S-, -COO-, -OCO-, -NR 24-, -NR 24COO-, -OCONR 24-, -SCO-, -COS-, -OCS-, or -CSO-. The alkyl extension moiety may be branched or cyclic. R 21, R 22, and R 24 have the same meaning as described above.]

[0191] With regard to the same viewpoint as described above, Z in formula (3-1) is preferably methylene, ethyl, or phenyl. With regard to the same viewpoint as described above, R21 and R22 in formula (3-1) are preferably alkyl groups having 1 to 20 carbon atoms or aryl groups having 6 to 30 carbon atoms, more preferably methyl, ethyl, or phenyl. With regard to the same viewpoint as described above, in another preferred embodiment, R7 is nitro.

[0192] There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (3). For example, it can be manufactured by the method described in Japanese Patent Application Publication No. 2000-80068 and Japanese Patent Application Publication No. 2011-178776.

[0193] Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (4) below. The bond represented by "*" in formula (4) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (4), the benzene ring with "-*" in formula (4) is directly bonded to the carbonyl group with "-*" in formula (1).

[0194] [Chemistry 21]

[0195] In formula (4), R 71 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. When the group represented by R 71 has an alkyl moiety, the alkyl moiety may be branched or cyclic. The hydrogen atom of the group represented by R 71 may be substituted with R 21, OR 21, COR 21, SR 21, NR 22R 23, CONR 22R 23, -NR 22-OR 23, -N(COR 22)-OCOR 23, NR 22COR 21, OCOR 21, COOR 21, -C(=N-OR 21)-R 22, -C(=N-OCOR 21)-R 22, SCOR 21, OCSR 21, COSR 21, CSOR 21, hydroxyl, nitro, CN, halogen atom, or COOR 21. R 21, R 22, and R 23 have the same meaning as described above. The hydrogen atom of the group represented by R 21, R 22, or R 23 may be substituted with CN, halogen atom, hydroxyl, or carboxyl group. When the groups represented by R 21, R 22, and R 23 have an alkyl moiety, the alkyl moiety may be interrupted 1 to 5 times by -O-, -S-, -COO-, -OCO-, -NR 24-, -NR 24CO-, -NR 24COO-, -OCONR 24-, -SCO-, -COS-, -OCS-, or -CSO-. R 24 has the same meaning as described above. When the groups represented by R 21, R 22, and R 23 have an alkyl moiety, the alkyl moiety may be branched or cyclic. In addition, R 22 and R 23 may form a ring together. R 72, R 73, and the three R 74s independently represent R 61, OR 61, SR 61, COR 62, CONR 63, R 64, NR 65, COR 61, OCOR 61, COOR 62, SCOR 61, OCSR 61, COSR 62, CSOR 61, hydroxyl, nitro, CN, or halogen atom, respectively. R 61, R 62, R 63, R 64, and R 65 independently represent hydrogen atom, alkyl group with 1 to 20 carbon atoms, aryl group with 6 to 30 carbon atoms, arylalkyl group with 7 to 30 carbon atoms, or heterocyclic group with 2 to 20 carbon atoms, respectively. The hydrogen atom of the base represented by R 61, R 62, R 63, R 64 or R 65 may be substituted with OR 21, COR 21, SR 21, NR 22Ra 23, CONR 22R 23, -NR 22-OR 23, -N(COR 22)-OCOR 23, -C(=N-OR 21)-R 22, -C(=N-OCOR 21)-R 22, CN, a halogen atom, or COOR 21.R 72 and R 73, as well as the two R 74, can each form a ring together. * indicates a bond with the first molecular structure of the oxime compound (1).

[0196] The examples of alkyl groups with 1 to 20 carbons, aryl groups with 6 to 30 carbons, aralkyl groups with 7 to 30 carbons, and heterocyclic groups with 2 to 20 carbons represented by R 71, R 21, R 22, R 23, R 24, R 61, R 62, R 63, R 64 and R 65 in formula (4) are the same as those for R 11, R 12, R 13, R 21, R 22, R 23 and R 24 in formula (1).

[0197] In Equation (4), R 22 and R 23 can form a ring together, meaning that R 22 and R 23 can form a ring together with the nitrogen atom, carbon atom, or oxygen atom they are connected to. The examples of rings that R 22 and R 23 can form together in Equation (4) are the same as the examples of rings that Ra 12 and Ra 13 and Ra 22 and Ra 23 can form together in Equation (1).

[0198] As examples of halogen atoms represented by R 72, R 73 and R 74 in formula (4), and halogen atoms that can replace hydrogen atoms of R 71, R 21, R 22, R 23, R 61, R 62, R 63, R 64 and R 65, the following can be listed: fluorine atom, chlorine atom, bromine atom and iodine atom.

[0199] There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (4), for example, it can be manufactured by the method described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0200] Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (5) below. The bond represented by "*" in formula (5) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (5), the pyrrole ring with "-*" in formula (5) is directly bonded to the carbonyl group with "-*" in formula (1).

[0201] [Chemical 22]

[0202] In formula (5), R 81 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. When the group represented by R 81 has an alkyl moiety, the alkyl moiety may be branched or cyclic. The hydrogen atom of the group represented by R 81 may be substituted with R 21, OR 21, COR 21, SR 21, NR 22R 23, CONR 22R 23, -NR 22-OR 23, -N(COR 22)-OCOR 23, NR 22COR 21, OCOR 21, COOR 21, -C(=N-OR 21)-R 22, -C(=N-OCOR 21)-R 22, SCOR 21, OCSR 21, COSR 21, CSOR 21, hydroxyl, nitro, CN, halogen atom, or COOR 21. R 21, R 22, and R 23 have the same meaning as described above. The hydrogen atom of the group represented by R 21, R 22, or R 23 may be substituted with CN, halogen atom, hydroxyl, or carboxyl group. When the groups represented by R 21, R 22, and R 23 have an alkyl moiety, the alkyl moiety may be interrupted 1 to 5 times by -O-, -S-, -COO-, -OCO-, -NR 24-, -NR 24CO-, -NR 24COO-, -OCONR 24-, -SCO-, -COS-, -OCS-, or -CSO-. R 24 has the same meaning as described above. When the groups represented by R 21, R 22, and R 23 have an alkyl moiety, the alkyl moiety may be branched or cyclic. In addition, R 22 and R 23 may form a ring together. R 82, R 83, R 84, R 85, and R 86 independently represent R 61, OR 61, SR 61, COR 62, CONR 63, R 64, NR 65, COR 61, OCOR 61, COOR 62, SCOR 61, OCSR 61, COSR 62, CSOR 61, hydroxyl, nitro, CN, or halogen atom, respectively. R 61, R 62, R 63, R 64, and R 65 independently represent hydrogen atom, alkyl group with 1 to 20 carbon atoms, aryl group with 6 to 30 carbon atoms, arylalkyl group with 7 to 30 carbon atoms, or heterocyclic group with 2 to 20 carbon atoms, respectively. The hydrogen atom of the base represented by R 61, R 62, R 63, R 64 or R 65 may be substituted with OR 21, COR 21, SR 21, NR 22Ra 23, CONR 22R 23, -NR 22-OR 23, -N(COR 22)-OCOR 23, -C(=N-OR 21)-R 22, -C(=N-OCOR 21)-R 22, CN, a halogen atom, or COOR 21.R83 and R84, R84 and R85, and R85 and R86 can each form a ring together. * indicates a bond with the first molecular structure of the oxime compound (1).

[0203] The examples of alkyl groups with 1 to 20 carbons, aryl groups with 6 to 30 carbons, aralkyl groups with 7 to 30 carbons, and heterocyclic groups with 2 to 20 carbons represented by R 81, R 21, R 22, R 23, R 24, R 61, R 62, R 63, R 64 and R 65 in formula (5) are the same as those for R 11, R 12, R 13, R 21, R 22, R 23 and R 24 in formula (1).

[0204] In Equation (5), R 22 and R 23 can form a ring together, meaning that R 22 and R 23 can form a ring together with the nitrogen atom, carbon atom, or oxygen atom they are connected to. The examples of rings that R 22 and R 23 can form together in Equation (5) are the same as the examples of rings that Ra 12 and Ra 13 and Ra 22 and Ra 23 can form together in Equation (1).

[0205] As examples of halogen atoms represented by R 82, R 83, R 84, R 85 and R 86 in formula (5), halogen atoms that can replace hydrogen atoms of R 81, R 21, R 22, R 23, R 61, R 62, R 63, R 64 and R 65 can be listed as: fluorine atom, chlorine atom, bromine atom and iodine atom.

[0206] There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (5), for example, it can be manufactured by the method described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0207] Another example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (6) below. The bond represented by "*" in formula (6) is directly bonded to the bond represented by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (6), the benzene ring with "-*" in formula (6) is directly bonded to the carbonyl group with "-*" in formula (1).

[0208] [Chemical 23]

[0209] In formula (6), the four R 91, R 92, R 93, R 94, R 95, R 96 and R 97 independently represent R 61, OR 61, SR 61, COR 62, CONR 63, R 64, NR 65, COR 61, OCOR 61, COOR 62, SCOR 61, OCSR 61, COSR 62, CSOR 61, hydroxyl, nitro, CN or halogen atom. R 61, R 62, R 63, R 64 and R 65 independently represent hydrogen atom, alkyl group with 1 to 20 carbon atoms, aryl group with 6 to 30 carbon atoms, arylalkyl group with 7 to 30 carbon atoms or heterocyclic group with 2 to 20 carbon atoms. The hydrogen atoms of the groups represented by R 61, R 62, R 63, R 64, or R 65 may be substituted with OR 21, COR 21, SR 21, NR 22Ra 23, CONR 22R 23, -NR 22-OR 23, -N(COR 22)-OCOR 23, -C(=N-OR 21)-R 22, -C(=N-OCOR 21)-R 22, CN, halogen atoms, or COOR 21. R 21, R 22, and R 23 have the same meaning as described above. R 92 and R 93, R 94 and R 95, R 95 and R 96, and R 96 and R 97 may form rings together. * indicates a bond with the first molecular structure of the oxime compound (1).

[0210] The examples of alkyl groups with 1 to 20 carbons, aryl groups with 6 to 30 carbons, aralkyl groups with 7 to 30 carbons, and heterocyclic groups with 2 to 20 carbons represented by R 21, R 22, R 23, R 61, R 62, R 63, R 64 and R 65 in formula (6) are the same as those for R 11, R 12, R 13, R 21, R 22 and R 23 in formula (1).

[0211] In Equation (6), R 22 and R 23 can form a ring together, meaning that R 22 and R 23 can form a ring together with the nitrogen atom, carbon atom, or oxygen atom they are connected to. The examples of rings that R 22 and R 23 can form together in Equation (6) are the same as the examples of rings that Ra 12 and Ra 13 and Ra 22 and Ra 23 can form together in Equation (1).

[0212] As examples of halogen atoms represented by R 91, R 92, R 93, R 94, R 95, R 96 and R 97 in formula (6), and halogen atoms that can replace hydrogen atoms of R 21, R 22, R 23, R 61, R 62, R 63, R 64 and R 65, the following can be listed: fluorine atom, chlorine atom, bromine atom and iodine atom.

[0213] There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (6), for example, it can be manufactured by the method described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0214] Other examples of photopolymerization initiators are photopolymerization initiators other than oxime compounds (1). Examples of other photopolymerization initiators include: oxime compounds other than oxime compounds (1), benzyl ketone compounds, biimidazole compounds, triazine compounds, and acetylenol compounds.

[0215] Oxime compounds other than oxime compound (1) can be listed as oxime compounds having a partial structure represented by the following formula (d1). * indicates a bond.

[0216] [Chemical 24]

[0217] Examples of oxime compounds having a partial structure represented by formula (d1) include: N-benzoyloxy-1-(4-phenylthiophenyl)butan-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)-3-cyclopentylpropan-1-one-2-imine, N-acetoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethane-1-imine, N-acetoxy-1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl-2,4-di-di-2-yl ... Compounds including: (oxacyclopentylmethyloxy)benzoyl)-9H-carbazole-3-yl]ethane-1-imine, N-acetyoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-3-cyclopentylpropane-1-imine, N-benzoyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-3-cyclopentylpropane-1-one-2-imine; compounds described in Japanese Patent Application Publication No. 2011-132215, International Publication No. 2008 / 78678, International Publication No. 2008 / 78686, and International Publication No. 2012 / 132558. Commercially available products such as Irgacure (registered trademark) OXE01, Irgacure OXE02, Irgacure OXE03 (all manufactured by BASF); N-1919, NCI-930, NCI-831 (all manufactured by ADEKA) are also available.

[0218] The oxime compound having the partial structure represented by formula (d1) is preferably selected from at least one of the group consisting of N-benzoyloxy-1-(4-phenylthiophenyl)butane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine and N-benzoyloxy-1-(4-phenylthiophenyl)-3-cyclopentylpropane-1-one-2-imine, more preferably N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine.

[0219] A benzyl ketone compound is a compound having a partial structure represented by formula (d2) or a partial structure represented by formula (d3). In these partial structures, the benzene ring may have substituents.

[0220] [Chemical 25]

[0221] Examples of compounds having the structure represented by formula (d2) include: 2-methyl-2-morpholino-1-(4-methylthiophenyl)propane-1-one, 2-dimethylamino-1-(4-morpholinophenyl)-2-benzylbutane-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholino)phenyl]butane-1-one, etc. Commercially available products such as OMNIRAD (registered trademark) 369, OMNIRAD 907, and OMNIRAD 379 (all manufactured by IGM Resins) may also be used.

[0222] Examples of compounds having the structure represented by formula (d3) include: 2-hydroxy-2-methyl-1-phenylpropane-1-one, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]propane-1-one, 1-hydroxycyclohexylphenyl ketone, oligomers of 2-hydroxy-2-methyl-1-(4-isopropenylphenyl)propane-1-one, α,α-diethoxyacetophenone, benzyl dimethyl ketal, etc.

[0223] In terms of sensitivity, as a benzyl ketone compound, it is preferred to be a compound having the structure represented by formula (d2).

[0224] As a biimidazole compound, for example, compounds represented by formula (d5) can be listed.

[0225] [Chemical 26] [In formula (d5), RE~RJ represent aryl groups with 6 to 10 carbon atoms that may have substituents]

[0226] Examples of aryl groups having 6 to 10 carbon atoms include phenyl, toluene, xylene, ethylphenyl, and naphthyl, with phenyl being preferred. Examples of substituents include halogen atoms and alkoxy groups having 1 to 4 carbon atoms. Examples of halogen atoms include fluorine, chlorine, bromine, and iodine, with chlorine being preferred. Examples of alkoxy groups having 1 to 4 carbon atoms include methoxy, ethoxy, propoxy, and butoxy, with methoxy being preferred.

[0227] Examples of biimidazole compounds include: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (for example, see Japanese Patent Application Publication No. 06-75372, Japanese Patent Application Publication No. 06-75373, etc.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl) Imidazoles, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(dialkoxyphenyl)biimidazoles, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)biimidazoles (e.g., see Japanese Patent Publication No. 48-38403, Japanese Patent Publication No. 62-174204, etc.), and imidazole compounds in which the phenyl group at the 4,4',5,5'-position is substituted with a carboalkoxy group (e.g., see Japanese Patent Publication No. 7-10913, etc.). Preferably, these are compounds represented by the formulas below or mixtures thereof.

[0228] [Chemical 27]

[0229] Examples of triazine compounds include: 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)- 6-[2-(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine, etc. Among these, 2,4-bis(trichloromethyl)-6-piperyl-1,3,5-triazine is preferred.

[0230] Examples of phosphine compounds include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide. Commercially available products such as OMNIRAD (registered trademark) 819 (manufactured by IGM Resins) may also be used.

[0231] Other examples of photopolymerization initiators besides oxime compounds (1) include, for example: benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone compounds such as methyl benzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, and 4,4'-bis(diethylamino)benzophenone; quinone compounds such as 9,10-phenanthroquinone, 2-ethylanthraquinone, and camphorquinone; and 10-butyl-2-chloroacridone, benzoin, methyl phenylglyoxylate, and titanium decene compounds.

[0232] When the composition includes a polymerization initiator (F), the content of the polymerization initiator (F) in the composition is preferably 0.1 parts by mass or more and preferably 300 parts by mass or less, more preferably 200 parts by mass or less, relative to 100 parts by mass of the polymerizable compound (E). Furthermore, the content of the polymerization initiator (F) in the composition is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, more preferably 30 parts by mass or less, more preferably 20 parts by mass or less, relative to 100 parts by mass of the resin (D) and the polymerizable compound (E). If the content of the polymerization initiator (F) is within the aforementioned range, there is a tendency for the composition to have higher sensitivity and shorten the exposure time, thus leading to a tendency to improve the productivity of the film.

[0233] [8] Polymerization Initiator (F1) The composition may further include both a polymerization initiator (F) and a polymerization initiator (F1). The polymerization initiator (F1) is a compound or sensitizer used to promote the polymerization of a polymerizable compound (E) initiated by the polymerization initiator (F). Examples of polymerization initiators (F1) include amine compounds, alkoxyanthracene compounds, thioxanthone compounds, and carboxylic acid compounds. The composition may also contain two or more polymerization initiators (F1).

[0234] As amine compounds, examples include: triethanolamine, methyl diethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, ethyl 2-dimethylaminobenzoate, ethylhexyl 4-dimethylaminobenzoate, N,N-dimethyl-p-toluidine, 4,4'-bis(dimethylamino)benzophenone (commonly known as Michler's ketone), 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(ethylmethylamino)benzophenone, etc.

[0235] Examples of alkoxyanthracene compounds include: 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, 9,10-dibutoxyanthracene, 2-ethyl-9,10-dibutoxyanthracene, etc.

[0236] Examples of thioxanthone compounds include: 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, etc.

[0237] As a carboxylic acid compound, examples include: phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methyl ethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine, phenoxyacetic acid, naphthioacetic acid, N-naphthylglycine, naphthoxyacetic acid, etc.

[0238] When the composition includes a polymerization initiator (F1), the content of the polymerization initiator (F1) in the composition is preferably 0.1 parts by mass or more and 300 parts by mass or less, more preferably 0.1 parts by mass or more and 200 parts by mass or less, relative to 100 parts by mass of the polymerizable compound (E). Furthermore, the content of the polymerization initiator (F1) in the composition is preferably 0.1 parts by mass or more and 30 parts by mass or less, more preferably 1 part by mass or more and 20 parts by mass or less, relative to 100 parts by mass of the resin (D) and the polymerizable compound (E). If the content of the polymerization initiator (F1) is within the aforementioned range, further enhancement of the sensitivity of the composition can be achieved.

[0239] [9] Antioxidant (H) The composition may further include an antioxidant (H). As an antioxidant (H), there are no particular limitations on the antioxidant commonly used in industry, such as phenolic antioxidants, phosphorus antioxidants, phosphorus / phenolic complex antioxidants and sulfur antioxidants. The composition may also contain two or more antioxidants (H).

[0240] Phosphorus / phenol complex antioxidants are, for example, compounds having one or more phosphorus atoms and phenol structures in their molecules. Among these, from the viewpoint of the developability of the composition and the luminescence intensity of the composition or film, the antioxidant (H) is preferably a phosphorus / phenol complex antioxidant.

[0241] As phenolic antioxidants, examples include: Irganox 1010 (registered trademark: pentaerythritol tetratetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF), Irganox 1076 (octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, manufactured by BASF), Irganox 1330 (3,3',3'',5,5',5''-hexa-tert-butyl-a,a',a''-(trimethylbenzene-2,4,6-triyl)tri-p-cresol, manufactured by BASF), and Irganox 3114 (Irganox... 3114: 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF (s.). Irganox 3790: 1,3,5-tris((4-tert-butyl-3-hydroxy-2,6-dimethyl)methyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF (s.). Irganox 1035: thiodiethyl bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF (s.). Irganox 1135: Irganox 1035. 1135: 3,5-bis(1,1-dimethylethyl)-4-hydroxy-C7-C9 alkyl ester of phenylpropionic acid, manufactured by BASF (s.). Irganox 1520L (4,6-bis(octylthiomethyl)-o-cresol, manufactured by BASF (s.). Irganox 3125 (Irganox 3125, manufactured by BASF (s.). Irganox 565 (2,4-bis(n-octylthio)-6-(4-hydroxy-3',5'-di-tertiary butylaniline)-1,3,5-triazine, manufactured by BASF (s.). Adekastab (registered trademark) AO-80. AO-80: 3,9-bis(2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid)-1,1-dimethylethyl)-2,4,8,10-tetraoxazolo(5,5) Undecane, manufactured by ADEKA (stock), Sumilizer (registered trademark) BHT, Sumilizer GA-80, Sumilizer GS (all manufactured by Sumitomo Chemical (stock), Cyanox 1790 (registered trademark, manufactured by Cytec (stock), Vitamin E (manufactured by Eisai (stock), etc.)

[0242] As phosphorus-based antioxidants, examples include: Irgafos 168 (a registered trademark: tris(2,4-di-tert-butylphenyl)phosphite, manufactured by BASF), Irgafos 12 (a 2-[[2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxane-6-yl]oxy]ethyl]amine, manufactured by BASF), and Irgafos 38 (a phosphite-based antioxidant). 38: Bis(2,4-bis(1,1-dimethylethyl)-6-methylphenyl)ethyl phosphite (manufactured by BASF), Adekastab (registered trademark) 329K, Adekastab PEP36, Adekastab PEP-8 (and above, manufactured by ADEKA), Sandstab P-EPQ (manufactured by Clariant), Weston (registered trademark) 618, Weston 619G (and above, manufactured by GE), Ultranox 626 (manufactured by GE), etc.

[0243] As a phosphorus / phenol complex antioxidant, examples include Sumilizer (registered trademark) GP (6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][1.3.2]dioxaphosphazenecycloheptane) (manufactured by Sumitomo Chemical Co., Ltd.).

[0244] As sulfur-based antioxidants, examples include: dialkyl thiodipropionate compounds such as dilauryl thiodipropionate, dimyristyl thiodipropionate, or distearate thiodipropionate, and β-alkyl mercaptopropionate compounds of polyols such as tetra[methylene(3-dodecylthio)propionate]methane.

[0245] The content of antioxidant (H) in the composition is, for example, more than 1 part by mass and less than 50 parts by mass relative to 100 parts by mass of resin (D), and more preferably more than 5 parts by mass and less than 40 parts by mass from the viewpoint of the luminescence and heat resistance of the film, and more preferably more than 7 parts by mass and less than 30 parts by mass.

[0246]

[10] Leveling Agent (I) The composition may further include a leveling agent (I). Examples of leveling agents (I) include silicone surfactants, fluorinated surfactants, and silicone surfactants having fluorine atoms. These may also have polymerizable groups on their side chains. From the viewpoint of the developability of the composition and the luminescence intensity of the composition or film, a fluorinated surfactant (I) is preferred. The composition may also contain two or more leveling agents (I).

[0247] As silicone-based surfactants, examples include surfactants with intramolecular siloxane bonds. Specifically, examples include: Toray silicone DC3PA, Toray silicone SH7PA, Toray silicone DC11PA, Toray silicone SH21PA, Toray silicone SH28PA, Toray silicone SH29PA, Toray silicone SH30PA, and Toray silicone SH8400 (trade name: Toray Dow Corning). KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452 and TSF4460 (manufactured by Momentive Performance Materials Japan Co., Ltd.), etc.

[0248] As fluorinated surfactants, examples include surfactants with intramolecular fluorocarbon chains. Specific examples include: Fluorad (registered trademark) FC430, Fluorad FC431 (manufactured by Sumitomo 3M), Megafac (registered trademark) F142D, Megafac F171, Megafac F172, Megafac F173, Megafac F177, Megafac F183, Megafac F554, Megafac F575, Megafac R30, and Megafac (…). Megafac RS-718-K (manufactured by DIC Corporation), Eftop EF301, Eftop EF303, Eftop EF351, Eftop EF352 (manufactured by Mitsubishi Materials Electronics & Chemicals Corporation), Surflon S381, Surflon S382, Surflon SC101, Surflon SC105 (manufactured by Asahi Glass Corporation), and E5844 (manufactured by Daikin Fine Chemicals Research Institute Corporation), etc.

[0249] As silicone-based surfactants containing fluorine atoms, examples include surfactants with intramolecular siloxane bonds and fluorocarbon chains. Specifically, examples include Megafac (registered trademark) R08, Megafac BL20, Megafac F475, Megafac F477, and Megafac F443 (manufactured by DIC).

[0250] When the composition includes a leveling agent (I), the content of the leveling agent (I) in the composition relative to the total amount of the composition is, for example, 0.001% by mass or more and 1.0% by mass or less, preferably 0.005% by mass or more and 0.75% by mass or less, more preferably 0.01% by mass or more and 0.5% by mass or less, and even more preferably 0.05% by mass or more and 0.5% by mass or less. If the content of the leveling agent (I) is within the aforementioned range, the flatness of the film can be improved.

[0251]

[11] Solvent (J) The composition may contain one or more solvents (J). Solvent (J) is preferably a solvent for dissolving resin (D), polymerizable compound (E) and polymerization initiator (F). Examples of solvents (J) include: ester solvents (solvents containing -COO- but not -O- in the molecule), ether solvents (solvents containing -O- but not -COO- in the molecule), ether ester solvents (solvents containing -COO- and -O- in the molecule), ketone solvents (solvents containing -CO- but not -COO- in the molecule), alcohol solvents (solvents containing OH but not -O-, -CO- and COO- in the molecule), aromatic hydrocarbon solvents, amide solvents, dimethyl sulfoxide, etc.

[0252] As ester solvents, examples include: methyl lactate, ethyl lactate, n-butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, isopropyl butyrate, ethyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexanol acetate, and γ-butyrolactone, etc.

[0253] As an ether solvent, examples include: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenethyl ether, and methyl anisole, etc.

[0254] As an ether ester solvent, examples include: methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, and diethylene glycol monobutyl ether acetate, etc.

[0255] As ketone solvents, examples include: 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone and isophorone, etc.

[0256] As alcohol solvents, examples include: methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, and glycerol.

[0257] As solvents for aromatic hydrocarbons, examples include: benzene, toluene, xylene, and mesitylene, etc.

[0258] Examples of acetylamine solvents include: N,N-dimethylmethamide, N,N-dimethylacetylamine and N-methylpyrrolidone.

[0259] As a solvent (J), it is preferably one or more of the group consisting of propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4-methyl-2-pentanone, and aromatic hydrocarbon solvents.

[0260] In a preferred embodiment, the solvent (J) comprises one or more selected from the group consisting of propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and 4-hydroxy-4-methyl-2-pentanone, and an aromatic hydrocarbon solvent.

[0261] In other preferred embodiments, the solvent (J) comprises propylene glycol monomethyl ether acetate and an aromatic hydrocarbon solvent. The aromatic hydrocarbon solvent is preferably a solvent with a boiling point of 100°C or higher and 150°C or lower, such as toluene or xylene. By using an aromatic hydrocarbon solvent, the solubility of the luminescent organic compound (B) can be improved.

[0262] Solvent (J) is a component other than the solid component. For example, solvents contained in dispersions of semiconductor particles (A) or solutions of resin (D) are also included in solvent (J). The content of solvent (J) in the composition is the ratio of the total mass of all solvents contained in the composition to the total mass of the composition. Preferably, it is 40% by mass or more and 95% by mass or less, more preferably 55% by mass or more and 90% by mass or less, and even more preferably 70% by mass or more and 80% by mass or less. In other words, the solid component of the composition is preferably 5% by mass or more and 60% by mass or less, more preferably 10% by mass or more and 45% by mass or less, and even more preferably 20% by mass or more and 40% by mass or less. If the content of solvent (J) is within the above range, there is a tendency for the flatness of the composition layer during coating to become better, and for a film of appropriate thickness to be formed more easily. In addition, setting the solid content of the composition to a low level (e.g., below 40% by mass) is advantageous in ensuring complete dissolution of the luminescent organic compound (B) or increasing the amount of solubility.

[0263]

[12] Other components may also include polymerization inhibitors, fillers, other polymer compounds, adhesion promoters, light stabilizers, chain transfer agents and other additives known in the art, as needed.

[0264] <Method for manufacturing the composition> The composition can be manufactured by a method including the step of mixing the specified components and other components used as needed. The method for manufacturing the composition may further include the step of preparing a luminescent organic compound (B), the step of preparing a resin (D), etc.

[0265] <Membrane and Method for Manufacturing the Same> The membrane of the present invention (hereinafter also simply referred to as "membrane") is a membrane formed from the composition of the present invention. The membrane can be obtained, for example, by a method including the step of coating the composition onto a substrate and then drying it. The membrane is not limited thereto and may also contain a solvent (J).

[0266] In one embodiment, the composition of the present invention is a resin composition R1 that further includes a resin (D). A resin film formed from the resin composition R1 can be formed by coating the composition onto a substrate and then drying it. In other embodiments, the composition of the present invention is a curing composition R2 that further includes one or more polymeric compounds selected from polymeric compounds (E) and thermally polymeric compounds, and one or more polymerization initiators selected from polymerization initiators (F) and thermally polymeric initiators. The curing composition R2 may also further include a resin (D). The film of the present invention formed from the curing composition R2 is a curing film. The curing film can be obtained by coating the curing composition R2 onto a substrate, drying it, and then curing it using light and / or heat. One form of the curing composition R2 is a photocurable composition R3 that further includes a polymeric compound (E) and a polymerization initiator (F). The photocurable composition R3 may also further include a resin (D).

[0267] The film may be formed on the entire surface of the substrate, or it may be formed on a portion of the substrate in a patterned manner. Examples of methods for forming the film in a patterned manner include photolithography, inkjet printing, and printing. Examples of printing methods include stencil printing, screen printing, and printing coating using a coating apparatus.

[0268] As a substrate, examples include: quartz glass, borosilicate glass, alumina silicate glass, soda-lime glass with silicon dioxide coating on the surface, etc.; or resin plates such as polycarbonate, polymethyl methacrylate, polyethylene terephthalate, etc.; silicon; and aluminum, silver, silver / copper / palladium alloy thin films formed on the substrate, etc.

[0269] A patterned resin film formed from resin composition R1 can be fabricated as follows. First, a barrier mask is used to coat resin composition R1 onto a substrate to form a patterned composition layer. Examples of resin composition coating methods include spin coating, slot coating, and a combination of slot and spin coating.

[0270] Next, a resin film is obtained by drying the composition layer (removing volatile components such as solvents). Examples of drying methods include heat drying, reduced pressure drying, or combinations thereof. The temperature for heat drying is preferably 30°C or higher and 250°C or lower, more preferably 50°C or higher and 235°C or lower. The heating time is preferably 10 seconds or higher and 180 minutes or lower, more preferably 30 seconds or higher and 90 minutes or lower. In the case of reduced pressure drying, it is preferably carried out at a pressure of 50 Pa or higher and 150 Pa or lower. Regarding the drying of the composition layer, multiple drying steps with different drying temperatures can be performed in multiple stages.

[0271] Regarding the patterned curing film formed from the photocurable composition R3, if we take the photolithography method as an example, it can be fabricated in the following manner. First, the photocurable composition R3 is coated onto a substrate, and volatile components such as solvents are removed by heating and drying (pre-baking) and / or vacuum drying to obtain the composition layer. As a coating method, the same method as described above can be cited.

[0272] The temperature for heat drying is preferably 30°C or higher and 120°C or lower, more preferably 50°C or higher and 110°C or lower. The heating time is preferably 10 seconds or higher and 60 minutes or lower, more preferably 30 seconds or higher and 30 minutes or lower. In the case of vacuum drying, it is preferably carried out at a pressure of 50 Pa or higher and 150 Pa or lower, and at a temperature range of 20°C or higher and 25°C or lower.

[0273] Next, the photomask used to form the target pattern shape is exposed to the constituent layer. Preferably, the light source used in the exposure is a light source that produces light with wavelengths of 250 nm or more and 450 nm or less. For example, depending on the absorption wavelength of the polymerization initiator (F), a bandpass filter can be used to selectively extract light near 436 nm, 408 nm, or 365 nm from that wavelength. Examples of suitable light sources include mercury lamps, light-emitting diodes, metal halide lamps, and halogen lamps.

[0274] In order to uniformly irradiate the entire exposed surface with parallel light, or to accurately align the photomask with the substrate on which the constituent layer is formed, it is preferable to use an exposure apparatus such as a mask aligner and a stepper. The exposed constituent layer is hardened by polymerization of polymeric compounds (E) contained in the constituent layer.

[0275] The exposed constituent layer is brought into contact with a developing solution for development, whereby the unexposed portions of the constituent layer dissolve in the developing solution and are removed, thereby obtaining a patterned hardened film. Examples of developing solutions include aqueous solutions or organic solvents of alkaline compounds such as potassium hydroxide, sodium bicarbonate, sodium carbonate, and tetramethylammonium hydroxide. The concentration of the alkaline compound in the aqueous solution is preferably 0.01% by mass or more and 10% by mass or less, more preferably 0.03% by mass or more and 5% by mass or less. Examples of organic solvents are those similar to the solvent (J). The developing solution may also contain a surfactant. The developing method can be any of the following: immersion method, dipping method, or spray method. Furthermore, during development, the substrate can be tilted at any angle.

[0276] Preferably, the patterned film obtained by development is further heated (post-baked). The heating temperature is preferably 150°C or higher and 250°C or lower, more preferably 160°C or higher and 235°C or lower. The heating time is preferably 1 minute or higher and 120 minutes or lower, more preferably 10 minutes or higher and 60 minutes or lower. By heating after development, unreacted polymeric compounds (E) contained in the film can be polymerized, thus obtaining a cured film with better chemical resistance. Even without development, it is preferable to further heat (post-bake) the exposed composition layer.

[0277] On the other hand, as a method for forming a hardened film on the entire surface of a substrate, the following methods can be listed: coating a hardening composition onto the substrate, drying it as needed to form a composition layer, heating the composition layer and / or exposing the entire surface of the composition layer.

[0278] The hardened film formed from the hardening composition R2 comprises a hardening reaction product of the polymerizable compound and the polymerization initiator contained in the hardening composition R2. This hardening reaction product is a substance containing a structure derived from the polymerizable compound and the polymerization initiator. The structure derived from the polymerizable compound and the polymerization initiator may be, for example, a framework structure other than the hardening reaction site of the polymerizable compound and the polymerization initiator, or a portion thereof.

[0279] The thickness of the membrane of the present invention is not particularly limited, and can be appropriately selected according to the purpose. For example, it is 1 μm or more and 20 μm or less, preferably 1.5 μm or more and 18 μm or less, more preferably 2 μm or more and 14 μm or less, and even more preferably 2 μm or more and 12 μm or less. If the thickness of the membrane is too small, the total amount of luminescent organic compound (B) and light scattering agent (C) (if included) in the thickness direction of the membrane will be less. Therefore, when the membrane is irradiated with excitation light, the excitation light is not sufficiently absorbed and scattered by the membrane, and there is a tendency for the proportion of light transmitted through the membrane to increase. The shape and size of the patterned membrane are not particularly limited. For example, the patterned membrane has a square shape when viewed from above.

[0280] By irradiating the film with ultraviolet or visible light (e.g., blue light), light of a different wavelength than the irradiated light can be emitted. By selecting the composition or particle size of the semiconductor particles (A), the wavelength of the emitted light can be selected. Since the film has the function of converting the wavelength of the irradiated light, it can be used as a color conversion layer in a display device, etc. The film of the present invention can exhibit good luminous intensity.

[0281] The film may have a maximum emission peak in its emission spectrum with a wavelength of 480 nm or more and 560 nm or less, or 570 nm or more and 680 nm or less. In one embodiment, the film comprises the semiconductor particles (A-1) and has an emission peak in its emission spectrum with a maximum wavelength of 480 nm or more and 560 nm or less, preferably 500 nm or more and 560 nm or less, and more preferably 520 nm or more and 550 nm or less. In other embodiments, the film comprises the semiconductor particles (A-2) and has an emission peak in its emission spectrum with a maximum wavelength of 570 nm or more and 680 nm or less, preferably 590 nm or more and 660 nm or less, and more preferably 600 nm or more and 650 nm or less. The half-peak amplitude of the emission peak of the film is preferably 50 nm or less, and more preferably 45 nm or less. The half-peak amplitude may be 20 nm or more or 30 nm or more. The emission spectrum of the membrane can be determined according to the measurement method described in the Example 1 section below.

[0282] <Display Device> The film of the present invention exhibits good luminous intensity and is therefore effectively used as a color conversion layer (wavelength conversion layer) in display devices, particularly liquid crystal display devices, organic electroluminescence (EL) display devices, or inorganic EL display devices. Examples of such display devices include those described in Japanese Patent Application Publication No. 2006-309219, Japanese Patent Application Publication No. 2006-310303, Japanese Patent Application Publication No. 2013-15812, Japanese Patent Application Publication No. 2009-251129, and Japanese Patent Application Publication No. 2014-2363.

[0283] The display device of the present invention includes the film, and typically further includes a light source. The display device may further include, for example, a light absorption layer, a light reflection member (reflective film, etc.), a diffusion film, a brightness enhancement part, a prism, a light guide plate, a dielectric material layer between components, etc.

[0284] The light-absorbing layer is a layer that has wavelength selectivity, transmitting light within a specific wavelength range and absorbing light within other wavelength ranges. The light-absorbing layer is typically a layer containing colorants such as dyes or pigments, and can be disposed on the film. As a light-absorbing layer, those previously known as color filters can be used.

[0285] The light-reflecting component is a component used to reflect light from a light source toward the hardened film, and may be a mirror, a film of reflective particles, a reflective metal film, or a reflector, etc. The diffusion film is a film used to diffuse light from a light source or light emitted from the film, and may be an amplifying diffusion film, etc. The brightness enhancement section is a component used to reflect and return a portion of the light in the direction of light transmission.

[0286] A typical prism has a substrate portion and a prism portion. The substrate portion may be omitted depending on the adjacent component. The prism can be attached to the adjacent component via any suitable adhesive layer (e.g., an adhesive layer, a bonding agent layer). The prism is constructed by arranging multiple unit prisms protruding towards the opposite side (back side) of the viewing side. By arranging the convex portion of the prism towards the back side, the light passing through the prism is easily focused. In addition, if the convex portion of the prism is arranged towards the back side, compared with the case where the convex portion is arranged towards the viewing side, less light is reflected that does not incident on the prism, resulting in a display device with high brightness.

[0287] Any suitable light guide plate can be used as the light guide plate. For example, in order to deflect light from the lateral direction in the thickness direction, a light guide plate with a lens pattern formed on the back side or a light guide plate with a prism shape formed on the back side and / or the viewing side is used.

[0288] The display device may include a layer containing one or more dielectric materials in the optical path between adjacent components (layers). One or more dielectric materials may include, for example, vacuum, air, gas, optical materials, adhesives, optical adhesives, glass, polymers, solids, liquids, gels, hardening materials, optical bonding materials, refractive index matching or mismatched materials, refractive index gradient materials, cladding or anti-cladding materials, spacers, silicone, brightness enhancing materials, scattering or diffusing materials, reflective or antireflective materials, wavelength selective materials, wavelength selective antireflective materials, or other suitable media known in the art, but are not limited to these, and may also include any suitable material.

[0289] Specific examples of display devices include devices that include wavelength conversion materials for EL displays or liquid crystal displays. Specifically, examples include: a display device in which the film serving as a wavelength conversion layer is disposed between a blue light source and a light guide plate along the end face (side) of a light guide plate, serving as a backlight emitting white light (on-edge type backlight), and a light absorption layer is disposed on the side of the light guide plate; a display device in which the film serving as a wavelength conversion layer is disposed on a light guide plate, serving as a backlight emitting white light from a blue light source placed on the end face (side) of the light guide plate via the light guide plate, and a light absorption layer is disposed on the wavelength conversion layer; and a display device in which the film is disposed near the light-emitting portion of a blue light source and serves as a wavelength conversion layer, serving as a backlight emitting white light from the irradiated light (crystal luminescent material). A display device comprising an on-chip backlight and a light absorption layer disposed on a wavelength conversion layer; including a blue light source having distinct regions, namely a first region, a second region, and a third region; a first wavelength conversion layer disposed on the first region of the blue light source and serving as a film emitting red light; a second wavelength conversion layer disposed on the second region of the blue light source and serving as a film emitting green light; a first light absorption layer disposed on the first wavelength conversion layer as needed and transmitting red light; and a second light absorption layer disposed on the second wavelength conversion layer as needed and transmitting green light, thus comprising a red emitting region (i.e., the first region), a green emitting region (i.e., the second region), and a blue emitting region (i.e., the third region). [Example]

[0290] Hereinafter, the present invention will be described in more detail by way of examples. Unless otherwise specified, "%" and "parts" in the examples refer to mass percentage and mass parts.

[0291] <Measurement> (1) Film thickness The thickness of the film (hardened film) was measured using a film thickness measuring device (DEKTAK XT manufactured by Bruker Corporation).

[0292] (2) The emission spectrum of semiconductor particles (A) was measured using an absolute PL quantum yield measuring apparatus ("C9920-02" manufactured by Hamamatsu Photonics, excitation light 450 nm, room temperature, atmospheric conditions) to measure the emission spectrum of a dispersion b of semiconductor particles (A-1) diluted with propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA") with an absorbance of 0.4 at a wavelength of 450 nm. The emission spectrum of a dispersion bb of semiconductor particles (A-2) was also measured in the same manner. Semiconductor particles (A-1) have an emission peak with a maximum wavelength of 542 nm. Semiconductor particles (A-2) have an emission peak with a maximum wavelength of 637 nm.

[0293] (3) The emission spectrum of the luminescent organic compound (B) was measured using an absolute PL quantum yield measuring device ("C9920-02" manufactured by Hamamatsu Photonics, excitation light 450 nm, room temperature, atmospheric conditions) to measure the emission spectrum of a sample in which the luminescent organic compound (B) was placed on a glass substrate with an absorbance of 0.1 or more and 0.5 or less at a wavelength of 450 nm.

[0294] (4) Emission Spectrum of the Film The glass substrate and hardened film laminate prepared in the examples or comparative examples described later were used as the test sample. The emission spectrum of the test sample was measured using an absolute PL quantum yield measuring device ("C9920-02" manufactured by Hamamatsu Photonics, excitation light 450 nm, room temperature, atmospheric conditions). Based on the obtained emission spectrum, the maximum wavelength (λmax) of the emission peak with a maximum wavelength of 480 nm or more and 560 nm or less, or 570 nm or more and 680 nm or less, and the full amplitude of the emission peak were determined.

[0295] (5) The absorption spectrum of semiconductor particles (A) was obtained by adding PGMEA to the dispersion b of semiconductor particles (A-1) and adjusting the absorbance to a value of 4 or less in the wavelength region between 250 nm and 800 nm. The absorption spectrum of the sample was measured using a UV-Vis-NIR spectrophotometer ("UV-3600" manufactured by Shimadzu Corporation) including an integrating sphere (measurement wavelength interval: 0.5 nm). The background was obtained using PGMEA solvent. The absorption spectrum of the dispersion bb of semiconductor particles (A-2) was also measured in the same manner. Semiconductor particles (A-1) have an absorption peak with a maximum wavelength of 498 nm (rounded). Semiconductor particles (A-2) have an absorption peak with a maximum wavelength of 605 nm (rounded).

[0296] (6) Absorption spectrum of luminescent organic compound (B) A solution was obtained by dissolving luminescent organic compound (B) in a solvent capable of dissolving it. The concentration of luminescent organic compound (B) in the solution was adjusted such that the highest absorbance at the time of measurement was 4 or less in the wavelength region between 250 nm and 800 nm. The solution was coated onto a glass substrate and dried to obtain a laminate of glass substrate and coating, which was used as the test sample. In cases where a smooth film could not be obtained by coating and drying the solution, the solution itself was used as the test sample. The absorption spectrum of the test sample was measured using a UV-Vis-NIR spectrophotometer ("UV-3600" manufactured by Shimadzu Corporation) including an integrating sphere (measurement wavelength interval: 0.5 nm). The measured values ​​are expressed as rounded values. The background was obtained using a glass substrate without any coating and an elemental solvent used to dissolve the luminescent organic compound (B).

[0297] (7) Absorption Spectrum of the Film The laminate of the glass substrate and the hardened film prepared in the examples or comparative examples described later was used as the test sample. The absorption spectrum of the test sample was measured using a UV-Vis-NIR spectrophotometer ("UV-3600" manufactured by Shimadzu Corporation, Inc.) including an integrating sphere (measurement wavelength interval: 0.5 nm). The background was obtained from the glass substrate. The absorbance at a wavelength of 450 nm was determined based on the obtained absorption spectrum. The measured values ​​are expressed as rounded values.

[0298] (8) The luminous intensity EI' of the film is formed by placing a light diffuser plate on a backlight with a blue light-emitting diode (LED) lamp with a peak wavelength of 450 nm as a point light source, thus forming a backlight section. The backlight section is placed with the light diffuser plate facing upwards, and a spectroradiometer ("SR-UL1R" manufactured by Topcon) is set at a height of 60 cm from the surface of the light diffuser plate. The glass substrate and hardened film laminate prepared in the following examples or comparative examples are used as the test sample, and the test sample is placed on the surface of the light diffuser plate with the hardened film facing upwards. With the backlight illuminated in this state, the spectroradiometer is used to measure the spectroradiometer spectrum of the light emitted from the hardened film (measurement wavelength interval: 1 nm). Based on this spectrum, the integral value of the emission peak with a maximum wavelength of 480 nm or more and 560 nm or 570 nm or more and 680 nm obtained in (4) is calculated relative to the wavelength region of 400 nm or more and 500 nm or less measured without a sample. Furthermore, assuming a light source of 1.0 × 10⁴ μW·cm⁻², and assuming excitation light emitted from 1 cm² of the surface of the light source, the luminous intensity EI (μW) of the film is calculated by multiplying the ratio by 1.0 × 10⁴. Then, based on the following formula, the obtained EI is normalized using a film thickness of 5 μm or 4 μm to obtain EI' (EI when the film thickness is 5 μm or 4 μm). EI' (μW) = EI (μW) × 5 or 4 (μm) / film thickness (μm)

[0299] (9)Weight-average molecular weight Mw and number-average molecular weight Mn of resin The weight-average molecular weight Mw and number-average molecular weight Mn of resin were determined by GPC method under the following conditions (conversion to standard polystyrene). Apparatus: K2479 (manufactured by Shimadzu Corporation) Column: Shimadzu Shim-pack GPC-80M Column temperature: 40℃ Solvent: Tetrahydrofuran Flow rate: 1.0 mL / min Detector: RI (Refractive Index) Calibration standard materials: TSK standard polystyrene F-40, F-4, F-288, A-2500, A-500 (manufactured by Tosoh Corporation)

[0300] (10)The acid value of the resin is accurately measured by weighing 3 g of resin solution and dissolving it in a mixed solvent of 90 g of acetone and 10 g of water. A KOH aqueous solution of 0.1 is used as the titrant. The acid value of the resin solution is determined by using an automatic titration device ("COM-555" manufactured by Hiranuma Sangyo Co., Ltd.) and the acid value of each 1 g of solid component (mgKOH / g) is calculated based on the acid value of the solution and the solid component of the solution.

[0301] (11) The solid component of the resin solution is determined by measuring about 1 g of resin solution in an aluminum cup, drying it at 180°C for 1 hour, and then measuring its mass. The solid component (mass %) of the resin solution is calculated based on the amount of mass reduction.

[0302] <Manufacturing Example 1-1: Preparation of a Dispersion of Semiconductor Particles (A-1)> A toluene dispersion a of semiconductor particles (A-1) [green luminescent InP / ZnSeS quantum dots] coordinated with oleic acid as an organic ligand (Ga) was prepared. The toluene was removed by vacuum distillation of dispersion a. 70 parts of xylene were added relative to 30 parts of solids to obtain a dispersion b of semiconductor particles (A-1) (30% solids).

[0303] Regarding the content of organic ligands (Ga) in the curable resin composition shown in Table 1, the concentration of organic ligands (Ga) in the dispersion a of semiconductor particles (A-1) was determined according to the following method, and calculated accordingly. That is, after the dispersion a of semiconductor particles (A-1) was vacuum dried at 150°C to remove the solvent, the weight change of the remaining solid components was measured using a thermogravimetric analyzer "TGDTA6200" at a heating rate of 5°C / min from 50°C to 550°C. The weight change from 50°C to 500°C was taken as the weight of the organic ligands (Ga), and the concentration of organic ligands (Ga) in the dispersion a of semiconductor particles (A-1) was calculated.

[0304] <Manufacturing Example 1-2: Preparation of Dispersion of Semiconductor Particles (A-2)> A toluene dispersion aa of semiconductor particles (A-2) [red luminescent InP / ZnSeS quantum dots] coordinated with oleic acid as an organic ligand (Ga) was prepared. The dispersion aa was subjected to vacuum distillation to remove toluene. 70 parts of xylene were added relative to 30 parts of solids to obtain a dispersion bb of semiconductor particles (A-2) (30% solids). The content of organic ligand (Ga) in the curable resin composition shown in Table 2 was calculated in the same manner as in Manufacturing Example 1-1.

[0305] <Manufacturing Example 2: Preparation of a dispersion of light scattering agent (C-1)> 3 parts of DISPERBYK 21116 (manufactured by BYK-Chemie Japan) based on solid content were added to 70 parts of titanium dioxide nanoparticles, and PGMEA was added in a total amount of 100 parts. The mixture was then stirred using a coating shaker until it was fully dispersed to obtain a dispersion of light scattering agent (C-1) (73% solid content).

[0306] <Manufacturing Example 3: Preparation of Resin (D-1) Solution> In a flask including a stirrer, a reflux cooling tube with a thermometer, a dropping funnel, and a nitrogen inlet tube, 110 parts of PGMEA were added, and the mixture was stirred while being purged with nitrogen, and the temperature was raised to 80°C. 25 parts of dicyclopentyl methacrylate, 26 parts of methyl methacrylate, 16 parts of methacrylic acid, and 11 parts of 2,2'-azobis(2,4-dimethylpentanilide) were dissolved in 110 parts of PGMEA to obtain a solution. The solution was added dropwise to the flask using the dropping funnel, and the mixture was stirred at 80°C for 3 hours. Next, 16 parts of glycidyl methacrylate, 0.4 parts of 2,2'-methylenebis(4-methyl-6-tert-butylphenol), and 0.8 parts of triphenylphosphine were added to a flask, heated to 110°C, and stirred for 8 hours to allow the carboxylic acid and epoxy groups in the polymer to react, thereby introducing polymerizable unsaturated bonds. Then, 17 parts of 1,2,3,6-tetrahydrophthalic anhydride were added, and the reaction continued for 3 hours to introduce carboxylic acid groups into the side chains. The reaction solution was cooled to room temperature to obtain a resin (D-1) solution. Regarding resin (D-1), the weight-average molecular weight (Mw) converted from standard polystyrene is 7600, the molecular weight distribution is 2.1, the acid value is 100 mgKOH / g, and the solid content in the resin (D-1) solution is 40% by mass.

[0307] <Examples 1 to 3, Comparative Example 1> (1) Preparation of curable resin composition The dispersion b of semiconductor particles (A-1) obtained in Manufacturing Example 1-1, the dispersion of light scattering agent (C-1) obtained in Manufacturing Example 2, the resin (D-1) solution obtained in Manufacturing Example 3, and other components shown in Table 1 are mixed in a specified amount to prepare a curable resin composition.

[0308] The content of each component in the curable resin composition, determined based on the amount added, is shown in Table 1. In Table 1, the content of components other than solvent (J) is the content converted from solid components (unit: parts by mass). The unit of solvent (J) content is parts by mass. For example, regarding semiconductor particles (A-1), they are prepared in the form of a dispersion of semiconductor particles (A-1) in the preparation of the curable resin composition, but the content shown in Table 1 is the amount of semiconductor particles (A-1) contained in the dispersion itself. The solvent (J) in Table 1 includes the solvent contained in the dispersion or solution used in the preparation of the curable resin composition.

[0309] (2) The film was formed by spin-coating a curable resin composition onto a 5 cm square glass substrate (Corning Eagle 2000) and pre-baking it at 100°C for 3 minutes. For the substrate with the curable composition layer formed, an exposure machine (Ushio Electric Co., Ltd. manual mask aligner (UPE-1255MA)) was used to irradiate the substrate under atmospheric conditions with an exposure dose of 40 mJ / cm2 (based on 365 nm). After development, the substrate was baked at 180°C for 30 minutes to form a curable film.

[0310] Regarding the films (hardened films) obtained in Examples 1 to 3 and Comparative Example 1, the thickness, the half-peak amplitude of the emission peak with the maximum wavelength (λmax) shown in Table 1, the absorbance at a wavelength of 450 nm, and the emission intensity EI' (EI when the film thickness is 5 μm) were determined. These results are shown in Table 1.

[0311] [Table 1] Example Comparative example 1 2 3 1 Composition Semiconductor particles (A) A-1 5.5 5.5 5.5 5.5 A-2 - - - - Organic ligands (G) Ga 2.0 2.0 2.0 2.0 Luminescent organic compounds (B) B-1 0.0011 0.0053 0.0319 - B-2 - - - - Light scattering agent (C) C-1 1.0 1.0 1.0 1.0 Resin (D) D-1 7.2 7.2 7.2 7.2 Polymerizable compounds (E) E-1 1.6 1.6 1.6 1.6 E-2 1.5 1.5 1.5 1.5 Polymerization initiator (F) F-1 0.2 0.2 0.2 0.2 Antioxidants (H) H-1 0.7 0.7 0.7 0.7 Leveling agent (I) I-1 0.3 0.3 0.3 0.3 total 20 20 20 20 Solvent (J) J-1 30 30 30 30 J-2 50 50 50 50 Solid components of the composition (quality%) 20 20 20 20 membrane thickness (μm) 4.9 4.9 3.7 5.0 absorbance at 450 nm 0.83 0.81 0.71 0.76 Maximum wavelength λmax of emission peak (nm) 542 542 540 542 Emission peak half peak full amplitude (nm) 38 38 40 39 Luminous intensity EI' (μW) 1918 1916 1974 1627

[0312] The details of the abbreviations of the components shown in Table 1 (and similarly for Table 2) are as follows. 〔1〕Organic ligand (Ga): Oleic acid 〔2〕Luminescent organic compound (B-1): A luminescent organic polymer (100% solid content) containing the constituent units M1, M2 and M4 in a molar ratio of 50 / 45 / 5. It was manufactured according to the method described in Synthesis Example 1 of Japanese Patent Application Publication No. 2008-133346. The polystyrene-converted weight average molecular weight Mw of the luminescent organic compound (B-1) is 2.6 × 10⁵, and the number average molecular weight Mn is 1.1 × 10⁵. Furthermore, the emission spectrum of the luminescent organic compound (B-1) was measured, and it showed a maximum emission peak at a wavelength of 485 nm, and the absorption spectrum was measured, showing a maximum absorption peak at a wavelength of 390 nm. [3] Luminescent organic compound (B-2): The compound represented by the following formula (100% solid content). The emission spectrum of the luminescent organic compound (B-2) was measured, and the result showed an emission peak with a maximum wavelength of 520 nm. The absorption spectrum was measured, and the result showed an absorption peak with a maximum wavelength of 500 nm.

[0313] [Chemical 28]

[0314] 〔4〕Polymerizable compound (E-1): Photopolymerizable compound. M-510 (Carboxyl-modified polyacid acrylate, manufactured by Toa Synthetic Co., Ltd., 100% solids content) 〔5〕Polymerizable compound (E-2): Photopolymerizable compound. A-9550 (Dipentaerythritol polyacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., 100% solids content) 〔6〕Polymerization initiator (F-1): Photopolymerization initiator. The compound represented by the following formula (100% solids content). Manufactured using the method described in Japanese Patent Application Publication No. 2011-132215.

[0315] [Chemistry 29]

[0316] 〔7〕Antioxidant (H-1): Sumilizer-GP (phosphorus / phenolic complex antioxidant, manufactured by Sumitomo Chemical Co., Ltd., 100% solid content) 〔8〕Leveling agent (I-1): F-554 (fluorinated leveling agent, manufactured by DIC Co., Ltd., 100% solid content) 〔9〕Solvent (J-1): PGMEA (propylene glycol monomethyl ether acetate) 〔10〕Solvent (J-2): Xylene

[0317] <Examples 4~Examples 6, Comparative Example 2> (1) Preparation of curable resin composition The dispersion of semiconductor particles (A-2) obtained in Manufacturing Examples 1-2, the dispersion of light scattering agent (C-1) obtained in Manufacturing Example 2 (Example 4 only), the resin (D-1) solution obtained in Manufacturing Example 3, and other components shown in Table 2 were mixed in a specified amount to prepare a curable resin composition.

[0318] The content of each component in the curable resin composition, determined based on the amount added, is shown in Table 2. In Table 2, the content of components other than solvent (J) is the content converted from solid components (unit: parts by mass). The unit of solvent (J) content is parts by mass. For example, regarding semiconductor particles (A-2), they are prepared in the form of a dispersion of semiconductor particles (A-2) in the preparation of the curable resin composition, but the content shown in Table 2 is the amount of semiconductor particles (A-2) contained in the dispersion itself. The solvent (J) in Table 2 includes the solvent contained in the dispersion or solution used in the preparation of the curable resin composition.

[0319] (2)The membrane was formed in the same manner as in Examples 1 to 3 and Comparative Example 1, forming a hardened membrane.

[0320] Regarding the films (hardened films) obtained in Examples 4 to 6 and Comparative Example 2, the thickness, the half-peak amplitude of the emission peak with the maximum wavelength (λmax) shown in Table 2, the absorbance at a wavelength of 450 nm, and the emission intensity EI' (EI when the film thickness is 4 μm) were determined. These results are shown in Table 2.

[0321] [Table 2] Example Comparative example 4 5 6 2 Composition Semiconductor particles (A) A-1 - - - - A-2 8.5 8.5 8.5 8.5 Organic ligands (G) Ga 1.5 1.5 1.5 1.5 Luminescent organic compounds (B) B-1 - - - - B-2 0.0011 0.011 0.053 - Light scattering agent (C) C-1 2.5 - - - Resin (D) D-1 13.1 14.6 14.6 14.6 Polymerizable compounds (E) E-1 1.0 1.1 1.1 1.1 E-2 7.2 7.9 7.9 7.9 Polymerization initiator (F) F-1 0.2 0.2 0.2 0.2 Antioxidants (H) H-1 0.7 0.8 0.8 0.8 Leveling agent (I) I-1 0.3 0.3 0.3 0.3 total 35 35 35 35 Solvent (J) J-1 30 30 30 30 J-2 50 50 50 50 Solid components of the composition (quality%) 30 30 30 30 membrane thickness (μm) 4.1 4.2 4.1 4.2 absorbance at 450 nm 0.84 0.42 0.42 0.41 Maximum wavelength λmax of emission peak (nm) 637 636 635 634 Emission peak half peak full amplitude (nm) 42 44 43 44 Luminous intensity EI' (μW) 2030 1753 1856 1699

[0322] <Manufacturing Example 1-3: Preparation of Dispersion of Semiconductor Particles (A-1)> A toluene dispersion a of semiconductor particles (A-1) [green luminescent InP / ZnSeS quantum dots] coordinated with oleic acid as an organic ligand (Ga) was prepared. The toluene was removed by vacuum distillation of dispersion a. 50 parts of xylene were added relative to 50 parts of solids to obtain a dispersion b' of semiconductor particles (A-1) (50% solids).

[0323] <Manufacturing Examples 1-4: Preparation of Dispersion of Semiconductor Particles (A-2)> A toluene dispersion aa of semiconductor particles (A-2) [red luminescent InP / ZnSeS quantum dots] coordinated with oleic acid as an organic ligand (Ga) was prepared. The dispersion aa was subjected to vacuum distillation to remove toluene. 50 parts of xylene were added relative to 50 parts of solids to obtain a dispersion bb' of semiconductor particles (A-2) (50% solids).

[0324] <Examples 7~Examples 10, Comparative Example 3> (1) Preparation of the composition The dispersion b' of semiconductor particles (A-1) obtained in Manufacturing Examples 1-3 and other components shown in Table 3 were mixed in specified amounts to prepare a composition as a solution. The values ​​related to each component in Table 3 are mixing amounts, in parts by mass. The solvent (J-2) in Table 3 refers to xylene contained in the dispersion b' of semiconductor particles (A-1).

[0325] (2) Preparation of the membrane: Two roughly square glass plates are prepared. A binder containing silicon dioxide particles (particle size 100 μm to 200 μm) is placed at the four corners of one glass plate, and the other glass plate is overlapped with the binder in between. The composition obtained in (1) is injected into the gap between the two glass plates, and a membrane of the composition is formed between the glass plates by utilizing capillary action. The thickness of the membrane is about 100 μm.

[0326] (3) Measurement of the absorbance of the membrane The membrane obtained in (2) and sandwiched between glass plates is used as the test sample, and the spectroradiometer is measured according to the measurement method described above. The same measurement is performed without a test sample, and this is used as the background. The absorbance of the membrane is calculated according to the following formula based on the integral value S1 of the wavelength region above 380 nm and below 470 nm in the spectroradiometer of the test sample and the integral value S2 of the wavelength region above 380 nm and below 470 nm in the spectroradiometer of the background. The results are shown in Table 3. Absorbance of membrane A (%) = 100 × (S2 - S1) / S2

[0327] (4) Measurement of the emission spectrum of the film The film obtained in (2) and sandwiched between glass plates was used as the test sample. The emission spectrum of the film was measured using an absolute PL quantum yield measuring device ("C9920-02" manufactured by Hamamatsu Photonics, excitation light 450 nm, room temperature, atmospheric conditions). The same measurement was performed without the test sample and used as the background. The ratio B (%) of the integral value in the wavelength region of 470 nm to 780 nm relative to the background spectrum to the integral value in the same wavelength region of the emission spectrum obtained for the test sample was calculated. In addition, based on the emission spectrum obtained for the test sample, the full amplitude of the emission peak with a maximum wavelength of 480 nm to 560 nm was calculated. The results are shown in Table 3.

[0328] [Table 3] Example Comparative example 7 8 9 10 3 Composition Semiconductor particles (A) A-1 2.9 2.9 2.9 2.9 2.9 Organic ligands (G) Ga 1.1 1.1 1.1 1.1 1.1 Luminescent organic compounds (B) B-1 2 - - - - B-3 - 2 - - - B-4 - - 2 - - B-5 - - - 2 - Solvent (J) J-2 4 4 4 4 4 J-3 90 90 90 90 92 membrane Absorbance A (%) 41 twenty three 35 twenty four 20 The proportion of the integral value of the emission spectrum B (%) 11.44 8.48 10.25 8.55 8.45 Emission peak half peak full amplitude (nm) 46 48 44 44 42

[0329] The details of the abbreviations of the components shown in Table 3 (and similarly for Table 4) are as follows. 〔1〕Organic ligand (Ga): Oleic acid 〔2〕Luminescent organic compound (B-1): Same as the luminescent organic compound (B-1) used in Example 1, etc. 〔3〕Luminescent organic compound (B-3): A luminescent organic polymer (100% solid content) containing the constituent units M3, M2, and M4 in a molar ratio of 50 / 45 / 5. It was manufactured according to the method described in Synthesis Example 1 of Japanese Patent Application Publication No. 2008-133346. The polystyrene-converted weight average molecular weight Mw of the luminescent organic compound (B-3) is 1.9 × 10⁵, and the number average molecular weight Mn is 7.5 × 10⁴. Furthermore, the emission spectrum of the luminescent organic compound (B-3) was measured, and it showed a maximum emission peak at a wavelength of 480 nm. The absorption spectrum was also measured, and it showed a maximum absorption peak at a wavelength of 395 nm. [4] Luminescent organic compound (B-4): A luminescent organic polymer (100% solid content) containing the aforementioned constituent units M1, M2, M3, and M4 in a molar ratio of 50 / 22.5 / 22.5 / 5. It was manufactured according to the method described in Synthesis Example 1 of Japanese Patent Application Publication No. 2008-133346. The polystyrene-converted weight average molecular weight Mw of the luminescent organic compound (B-4) was 7.2 × 10⁵, and the number average molecular weight Mn was 1.9 × 10⁵. Furthermore, the emission spectrum of the luminescent organic compound (B-4) was measured, and it showed a emission peak with a maximum wavelength of 470 nm. The absorption spectrum was also measured, and it showed an absorption peak with a maximum wavelength of 385 nm. [5] Luminescent organic compound (B-5): A luminescent organic polymer (100% solid content) containing the aforementioned constituent units M1, M3, M5, and M6 in a molar ratio of 50 / 35 / 10 / 5. It was manufactured according to the method described in Synthesis Example 1 of Japanese Patent Application Publication No. 2008-133346. The polystyrene-converted weight average molecular weight Mw of the luminescent organic compound (B-5) was 3.4 × 10⁵, and the number average molecular weight Mn was 1.5 × 10⁵. Furthermore, the emission spectrum of the luminescent organic compound (B-5) was measured, and it showed a emission peak with a maximum wavelength of 445 nm. The absorption spectrum was also measured, and it showed an absorption peak with a maximum wavelength of 390 nm. [6] Solvent (J-2): Xylene [7] Solvent (J-3): Anisole

[0330] <Examples 11 to 14, Comparative Example 4> (1) Preparation of the composition The dispersion bb' of semiconductor particles (A-2) obtained in Manufacturing Examples 1-4 and other components shown in Table 4 were mixed in specified amounts to prepare a composition as a solution. The values ​​related to each component in Table 4 are mixing amounts, in parts by mass. The solvent (J-2) in Table 4 refers to xylene contained in the dispersion bb' of semiconductor particles (A-2).

[0331] (2) Fabrication of the membrane and determination of its absorbance and emission spectra: In addition to using the components prepared in (1), the membrane was fabricated in the same manner as in Example 7, and the spectroradiometric and emission spectra of the membrane were measured in the same manner as in Example 7. In the same manner as in Example 7, the absorbance A (%) obtained from the spectroradiometric spectrum, the proportion B (%) of the integral value obtained from the emission spectrum, and the full amplitude of the emission peak with a maximum wavelength of 570 nm or more and 680 nm or less were determined. The results are shown in Table 4.

[0332] [Table 4] Example Comparative example 11 12 13 14 4 Composition Semiconductor particles (A) A-2 3.4 3.4 3.4 3.4 3.4 Organic ligands (G) Ga 0.6 0.6 0.6 0.6 0.6 Luminescent organic compounds (B) B-1 2 - - - - B-3 - 2 - - - B-4 - - 2 - - B-5 - - - 2 - Solvent (J) J-2 4 4 4 4 4 J-3 90 90 90 90 92 membrane Absorbance A (%) 39 34 47 31 20 The proportion of the integral value of the emission spectrum B (%) 9.03 8.59 9.38 7.96 6.64 Emission peak half peak full amplitude (nm) 43 42 43 43 41 [Simplified Explanation of the Diagram]

[0008] None

Claims

1. A composition comprising: luminescent inorganic semiconductor particles (A) and luminescent organic compound (B).

2. The composition as claimed in claim 1, wherein the luminescent inorganic semiconductor particle (A) has a maximum emission peak in its emission spectrum with a wavelength of 480 nm or more and 560 nm or less, or 570 nm or more and 680 nm or less.

3. The composition as claimed in claim 1, wherein the luminescent organic compound (B) has an absorption peak in its absorption spectrum with a maximum wavelength of 350 nm or more and 550 nm or less.

4. The composition as described in claim 1 further comprises a light scattering agent (C).

5. The composition as described in claim 1, further comprising resin (D).

6. The composition as described in claim 1 further comprises a polymerizable compound (E) and a polymerization initiator (F).

7. A membrane formed from any one of claims 1 to 6.

8. The membrane of claim 7, wherein the membrane has an emission peak in its emission spectrum with a maximum wavelength of 480 nm or more and 560 nm or less, or 570 nm or more and 680 nm or less, and the full amplitude of the emission peak is less than 50 nm.

9. A display device comprising the film as described in claim 7.