Electronic component handling apparatus and electronic component testing apparatus

Abstract

An electronic component handling apparatus that handles a pressed body including a DUT or a carrier accommodating the DUT, includes: a pressing device that electrically connects the DUT to a socket by pressing the pressed body toward the socket, and includes: a contact plate that contacts the pressed body; and a retainer that holds the contact plate, the contact plate being separated from the retainer while the contact plate contacts the pressed body, and the contact plate being held by the retainer while the contact plate is separated from the pressed body.

Description

[Technical Field]

[0001] The present invention relates to an electronic component processing apparatus and an electronic component testing apparatus for testing electronic components under test (hereinafter referred to as "DUT") such as semiconductor integrated circuit elements. [Previous Technology]

[0002] An electronic component testing apparatus includes a contact arm that contacts an IC device with a contact portion of a test head, a contact pusher that pushes the IC device while being mounted on the tip of the contact arm, and a heater that applies heat to the IC device while being mounted on the contact arm (for example, see Patent Document 1). The contact pusher of this electronic component testing apparatus includes: a first stamping portion on the top of the IC device's package that is mounted on the base of the contact arm and, while being fastened to the base by bolts (for example, Patent Document 1 (

[0038] paragraphs, and Figure 4)). [Prior Art Documents] [Patent Documents]

[0003] Patent Document 1: International Publication No. 2007 / 094034. [Summary of the Invention]

[0004] [The problem the invention aims to solve]

[0005] In the aforementioned contact-type thruster, the heater heats the IC device via the first stamping section. However, since the first stamping section is fixed to the base by bolts, heat dissipates from the first stamping section to the base when the first stamping section is heated to a predetermined temperature, thus increasing the amount of heat required to heat the first stamping section to the predetermined temperature. Therefore, there is a problem of deteriorated temperature control responsiveness of the IC device.

[0006] The problem this invention aims to solve is to provide an electronic component processing apparatus and an electronic component testing apparatus capable of improving the responsiveness of temperature control. [Means for solving the problem]

[0007] [1] The electronic component processing apparatus of the present invention is an electronic component processing apparatus for processing a push body containing a DUT or a carrier that houses the DUT, and it includes: a pushing device for electrically connecting the DUT to the socket by pushing the push body to the socket, wherein the pushing device includes: a contact plate that contacts the push body and a retainer for holding the contact plate, wherein when the contact plate contacts the push body, the contact plate separates from the retainer, and when the contact plate does not contact the push body, the contact plate is held by the retainer.

[0008] [2] In the above invention, the aforementioned pressing device may include a temperature adjustment device, which adjusts the temperature of the aforementioned pressed body via the aforementioned contact plate.

[0009] [3] In the above invention, the aforementioned pushing device may have a biasing mechanism that biases the aforementioned temperature adjustment device toward the aforementioned contact plate, wherein the aforementioned temperature adjustment device is frequently in contact with the aforementioned contact plate by means of the biasing mechanism.

[0010] [4] In the above invention, the aforementioned temperature adjustment device may include a heating unit as a heating source and a cooling unit as a cooling source, wherein the aforementioned heating unit is biased by the aforementioned bias mechanism and is frequently in contact with the aforementioned contact plate, and wherein the aforementioned cooling unit is biased by the aforementioned bias mechanism and is frequently in contact with the aforementioned heating unit.

[0011] [5] In the above invention, the aforementioned contact plate may have a contact surface that contacts the aforementioned pushed body and a locking surface connected to the aforementioned contact surface, wherein the aforementioned retainer has a retaining portion that retains the aforementioned contact plate by locking it to the aforementioned locking surface.

[0012] [6] In the above invention, the aforementioned retaining part can have a plurality of claw parts that are spaced apart from each other and arranged in a ring shape while being locked to the aforementioned locking surface.

[0013] [7] In the above invention, the aforementioned locking surface may have an annular shape surrounding the aforementioned contact surface, and the aforementioned plurality of claws are arranged to surround the aforementioned contact plate along the aforementioned locking surface.

[0014] [8] In the above invention, the aforementioned claw portion may have an opening portion.

[0015] [9] In the above invention, the aforementioned pushing device may have an adsorption pad that holds and adsorbs the aforementioned pushed object, wherein the aforementioned adsorption pad may be disposed on the aforementioned claw portion.

[0016]

[10] In the above invention, the aforementioned contact surface may protrude relative to the lower end surface of the aforementioned retainer.

[0017]

[11] In the above invention, the aforementioned locking surface can be tilted in such a way that the width of the aforementioned contact plate widens as it separates from the aforementioned contact surface.

[0018]

[12] In the above invention, the following equations (1) and (2) can be satisfied. WD>WC… (1) WR>WC… (2) Wherein, in the above equation (1), WD is the width of the aforementioned pushed body, WR is the width of the aforementioned retainer, and in the above equation (2), WC is the width of the aforementioned contact surface of the aforementioned contact plate.

[0019]

[13] In the above invention, a space is formed between the aforementioned retainer and the aforementioned temperature adjustment device.

[0020]

[14] The electronic component testing apparatus of the present invention is an electronic component testing apparatus for testing DUTs, and includes the above-mentioned electronic component processing device and a tester with a socket. [Effects of the Invention]

[0021] In the electronic component processing apparatus and electronic component testing apparatus of the present invention, the contact plate separates from the holder when it comes into contact with the object being pressed. Therefore, heat loss from the contact plate to the holder can be suppressed, thereby improving the responsiveness of temperature control.

Implementation Method

[0023] [Form used to implement the invention]

[0024] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0025] Figure 1 is a block diagram showing an example of the electronic component testing apparatus constituting this embodiment. Figure 2 is a cross-sectional view showing the state before the DUT (Device Under Test) of the adsorption and holding actuator in this embodiment, and Figure 3 is a cross-sectional view showing the state after the DUT of the adsorption and holding actuator is applied. Figure 4(a) is an enlarged cross-sectional view of part IVa in Figure 2, and Figure 4(b) is an enlarged cross-sectional view of part IVb in Figure 3. Figure 5 is a perspective view of the holder from below in this embodiment.

[0026] The electronic component testing apparatus 100 shown in Figure 1 of this embodiment is an apparatus for testing the electrical characteristics of the DUT 300. Specific examples of the DUT 300 as the test object may include SoC (System on a chip), logic devices, or memory devices. As shown in Figure 2, the DUT 300 of this embodiment includes a substrate 301, an IC chip 302, a temperature detection circuit 303, a modeling resin 304, and a plurality of terminals 305. Furthermore, the DUT 300 of this embodiment corresponds to an example of the "push-on body" in this invention.

[0027] In this DUT 300, an IC chip 302 and a temperature detection circuit 303 are mounted on the substrate 301, and the IC chip 302 and the temperature detection circuit 303 are covered by molding resin 304. Furthermore, terminals 305 that electrically connect the IC chip 302 and the temperature detection circuit 303 are provided on the underside of the substrate 301, and these terminals 305 contact and are electrically connected to the socket 2 described later. In this embodiment, the temperature detection circuit 303 and the IC chip 302 are described as separate electronic components, but this is not a limitation; the temperature detection circuit 303 may also be included within the IC chip 302.

[0028] As shown in Figure 1, the electronic component testing apparatus 100 includes: a tester 1 for testing a DUT 300, a socket 2 for electrically connecting the DUT 300 to the tester 1, and a processor 3 for conveying the DUT 300 and pushing it to the socket 2.

[0029] The tester 1 includes: a main frame 11 and a test head 12. The main frame 11 is connected to the test head 12 via a cable 13. The main frame 11 sends a test signal to the DUT 300 via the test head 12 to test the DUT 300, and evaluates the DUT 300 based on the test results. The test head 12 is connected to the main frame 11 via a cable 13, and sends the test signal output from the main frame 11 to the DUT 300 during the test of the DUT 300.

[0030] As shown in Figure 3, the test head 12 is electrically connected to the DUT 300 via the socket 2. This socket 2 includes a socket body 21 and a contact 22. The socket body 21 is fixed to the top of the test head 12. The contact 22 is disposed on this socket body 21. Although not specifically shown, the contact 22 is electrically connected to the load plate disposed on the top of the test head 12, and also electrically connected to the DUT 300 by contacting the terminal 305 of the DUT 300. In this embodiment, a pogo pin is used as the contact 22, but other than a pogo pin can also be used. For example, a cantilever-type probe, anisotropic conductive rubber sheet, or a membrane contact with bumps formed on an insulating film can also be used.

[0031] As shown in Figure 1, the DUT 300 is pushed toward the socket 2 by the processor 3. This processor 3 includes: a thermostatic bath 4, a contact arm 5, a pusher 6, and a refrigerant supply unit 9. In addition, the processor 3 in this embodiment is equivalent to an example of the "electronic component processing device" in this invention, and the pusher 6 in this embodiment is equivalent to an example of the "pushing device" in this invention.

[0032] The thermostatic bath 4 can adjust the internal environment temperature to the desired temperature, applying high or low temperatures to the DUT 300. The thermostatic bath 4 is not particularly limited, but for example, its temperature can be adjusted within a range of -55°C to +155°C. This thermostatic bath 4 houses the contact arm 5 and the actuator 6. Furthermore, the thermostatic bath 4 receives the socket 2 via an opening formed at its bottom. Alternatively, the processor 3 may not have the thermostatic bath 4.

[0033] The contact arm 5 is supported by a track (not shown) provided by the processor 3. This contact arm 5 is equipped with a brake (not shown) for horizontal movement, and can move back, forth, left, and right along the track. In addition, this contact arm 5 is equipped with a brake (not shown) for vertical drive, and can move in the vertical direction.

[0034] A thruster 6 is disposed at the lower end of the contact arm 5. As shown in Figure 2, the thruster 6 includes: a thruster body 61, a contact plate 62, a retainer 63, an adsorption pad 68, a vertical guide 69, a temperature adjustment device 7, and a biasing mechanism 8.

[0035] As shown in Figure 2, the thruster body 61 in this embodiment has: a plurality of (two in this example) first suction holes 611, a first refrigerant supply hole 612, and a plurality of (two in this example) first refrigerant recovery holes 613. The first suction hole 611 is a through hole opening on the underside of the thruster body 61, and this opening is connected to the second suction hole 67 of the retainer 63 (described later). This first suction hole 611 is connected to a vacuum pump (not shown), and the interior of the first suction hole 611 is made negative pressure by the vacuum pump.

[0036] The first refrigerant supply hole 612 is also a through hole opening on the lower part of the thruster body 61. The supply-side cylindrical portion 772 (described later) of the refrigerant guide portion 77 (described later) is inserted into this first refrigerant supply hole 612. Refrigerant is supplied to this first refrigerant supply hole 612 from the refrigerant supply source 200 provided outside the processor 3. In addition, the first refrigerant recovery hole 613 is also a through hole opening on the lower part of the thruster body 61. The recovery-side cylindrical portion 773 (described later) of the refrigerant guide portion 77 (described later) is inserted into this first refrigerant recovery hole 613. This first refrigerant recovery hole 613 recovers the refrigerant used by the temperature adjustment device 7. In addition, the first suction hole 611, the first refrigerant supply hole 612, and the first refrigerant recovery hole 613 may also be provided in parts other than the thruster body 61.

[0037] As shown in Figure 2, the contact plate 62 has a convex shape that is bent downwards. As shown in Figure 3, the contact plate 62 is a component that directly contacts the DUT 300 when the pusher 6 holds the DUT 300. Furthermore, the temperature adjustment device 7 heats or cools the DUT 300 via this contact plate 62.

[0038] As the material constituting this contact plate 62, a metal with an insulating coating formed on its surface can be used. Specifically, for example, aluminum with an anodized coating can be used. In order to transfer heat from the temperature adjustment device 7 to the DUT 300, the contact plate 62 is preferably made of a metal material with high thermal conductivity. In addition, by using a metal with an insulating coating formed on its surface, electromagnetic noise generated from the thruster 6 can be shielded from the DUT 300, while the thruster 6 is electrically insulated from the DUT 300. In addition, in order to prevent electrostatic discharge (ESD), although not specifically shown, the contact plate 62 can also be electrically grounded.

[0039] This contact plate 62 has a contact portion 621 and a side portion 622. The contact portion 621 extends in a generally parallel direction relative to the DUT 300. This contact portion 621 has a contact surface 621a that contacts the DUT 300. In this embodiment, the contact surface 621a is the lower surface of the contact portion 621, as shown in Figure 3, which contacts and pushes the DUT 300 while the pusher 6 is holding the DUT 300. Furthermore, the temperature adjustment device 7 applies heat to the DUT 300 via this contact surface 621a. As shown in Figure 4(a), the thickness T1 of this contact portion 621 is not particularly limited, but can be set to 500μm to 550μm (500μm≦T1≦550μm).

[0040] As shown in Figure 2, the width Wc of this contact surface 621a is smaller than the width WD of the DUT 300, as shown in equation (1) below, and is also smaller than the width WR of the retainer, as shown in equation (2) below. In this way, by making the contact surface 621a of the contact plate 62 smaller, the heat capacity of the contact portion 621 can be reduced, and the temperature of the DUT 300 can be controlled by the temperature adjustment device 7, thereby increasing the rate of temperature change of the contact portion 621. That is, the responsiveness of the temperature adjustment by the actuator 6 can be improved. WD>WC… (1) WR>WC… (2) Wherein, in equation (1) above, WD is the width of the DUT 300, WC is the width of the contact surface 621a of the contact plate 62, and in equation (2) above, WR is the width of the retainer 63.

[0041] The side portion 622 of the contact plate 62 connects to the outer peripheral end of the contact portion 621 and extends in a generally vertical direction relative to the contact portion 621. This side portion 622 has a locking surface 622a and a side surface 622b. In this embodiment, the locking surface 622a is the lower surface of the side portion 622. This locking surface 622a is an inclined surface having an annular shape surrounding the contact surface 621a, and is inclined in such a way that the width of the contact plate 62 widens as it separates from the contact surface 621a. As shown in Figures 2 and 4(a), this locking surface 622a is the surface that contacts the retainer 63. Furthermore, the side surface 622b is a side surface connected to the upper end of the locking surface 622a and extends in a generally vertical direction relative to the contact portion 621. This side surface 622b is often separated from the retainer 63.

[0042] The retainer 63 is a component that retains the contact plate 62. As shown in Figure 2, this retainer 63 is disposed below the propeller body 61. As shown in Figures 2 and 5, the retainer 63 in this embodiment has an annular shape, surrounding the contact plate 62. Furthermore, as shown in Figure 2, the retainer 63 is separated from the temperature adjustment device 7, forming a space S between the retainer 63 and the temperature adjustment device 7. Through this space S, since heat generated from the temperature adjustment device 7 is difficult to transfer to the retainer 63, the temperature adjustment of the DUT 300 can be performed more efficiently.

[0043] As shown in Figure 5, this retainer 63 includes: a frame-shaped portion 64, a retaining portion 65, and a plurality of second suction holes 67. The frame-shaped portion 64 has an annular shape. As shown in Figure 2, this frame-shaped portion 64 is fixed to the underside of the thruster body 61. In addition, although not particularly limited, the frame-shaped portion 64 can be fixed to the thruster body 61 by fasteners such as bolts.

[0044] As shown in Figures 2 and 5, a retaining portion 65 is formed on the underside of this frame-shaped portion 64 to contact and hold the contact plate 62. In this embodiment, the retaining portion 65 has a plurality of claw portions 66a to 66d (hereinafter, they are sometimes collectively referred to as claw portions 66).

[0045] The claw portion 66 protrudes downward from below the frame-shaped portion 64. This claw portion 66 is arranged to surround the four sides of the contact plate 62. In this embodiment, a pair of claw portions 66a and 66b are arranged opposite each other, while a pair of claw portions 66c and 66d are arranged opposite each other.

[0046] Furthermore, while these claws 66a-66d are spaced apart from each other, they surround the contact plate 62 along the annular locking surface 622a of the contact plate 62. In this way, by holding the contact plate 62 with the spaced-apart claws 66, the contact area between the holding part 65 and the contact plate 62 can be reduced, making it difficult for heat to escape from the contact plate 62 to the holding part 65. Therefore, the temperature adjustment of the DUT 300 can be performed effectively.

[0047] Furthermore, as shown in Figure 5, the claw portion 66 has a protrusion 661 and an opening 662. In this embodiment, the protrusion 661, as shown in Figure 4(a), is disposed at the lower part of the claw portion 66 and protrudes toward the contact plate 62. The protrusion 661 in this embodiment has a retaining surface 661a. This retaining surface 661a is an inclined surface that faces the locking surface 622a of the contact plate 62 and is substantially parallel to the locking surface 622a of the contact plate 62. When the contact plate 62 is not in contact with the DUT 300, the retaining surface 661a can be used to support the contact plate 62 from below. At this time, the locking surface 622a of the contact plate 62 is not fixed to the retaining surface 661a of the retainer 63 by adhesive, screws, or the like, but rather the contact plate 62 and the retainer 63 can remain separated.

[0048] As shown in Figure 5, the claws 66a and 66b have openings 662. These openings 662 extend horizontally through the claws 66a and 66b. Through these openings 662, heat is difficult to dissipate from the contact plate 62 to the claws 66a and 66b, and the holder 63 is also made lighter.

[0049] The second suction hole 67 penetrates the frame-shaped portion 64 and the claw portions 66c and 66d. The upper end of this second suction hole 67 is connected to the first suction hole 611 of the thruster body 61. This second suction hole 67 is connected to a vacuum pump (not shown) via the first suction hole 611, so the interior of the second suction hole 67 is under negative pressure.

[0050] As shown in Figures 3 and 4(b), an adsorption pad 68 is disposed at the lower end of the second suction hole 67. This adsorption pad 68, by contacting the DUT 300, forms a space surrounded by the adsorption pad 68 and the DUT 300. Since this space is connected to the second suction hole 67, the DUT 300 can be adsorbed and held in the lower end face 66e of the claws 66c and 66d.

[0051] As shown in Figure 4(b), when the adsorption pad 68 is adsorbing the DUT 300, the contact surface 621a of the contact plate 62 is in contact with the DUT 300. At this time, since the locking surface 622a of the contact plate 62 is not fixed to the holding surface 661a of the holder 63, the contact plate 62 is pushed upward by the DUT 300, and the contact plate 62 separates from the holder 63.

[0052] As shown in Figures 2 and 3, a temperature adjustment device 7 is disposed on the inner side of the contact plate 62. This temperature adjustment device 7 adjusts the temperature of the DUT 300 via the contact plate 62.

[0053] Figure 6 is an enlarged cross-sectional view of the contact plate and temperature adjustment device in this embodiment, and Figure 7 is an enlarged cross-sectional view of part VII in Figure 6. Figure 8 is a plan view showing an example of the heating unit constituting this embodiment. As shown in Figure 6, the temperature adjustment device 7 includes a heating unit 71 as a heating source and a cooling unit 75 as a cooling source.

[0054] The heating unit 71 is disposed on the contact portion 621 of the contact plate 62. The heating unit 71 is a sheet-like laminate of a laminated planar heater 72, a first heat transfer material 73, and a second heat transfer material 74. The thickness T2 of this heating unit 71 is not particularly limited, but can be 400 μm or less (T2 ≦ 400 μm).

[0055] As shown in Figures 6 to 8, the surface heater 72 has a surface shape (sheet shape). Because the surface heater 72 is thin, its heat capacity is smaller than that of a ceramic heater or the like. Therefore, the responsiveness can be improved because the heating rate of the temperature adjustment device 7 can be increased.

[0056] As shown in Figure 6, the thickness T3 of such a planar heater 72, while not particularly limited, can be set to 100μm to 150μm (100μm≦T3≦150μm). Furthermore, as the planar heater 72, for example, a resin film heater such as a polyimide heater or a polyester heater can be used. In particular, it is preferable to use a polyimide heater as the planar heater 72. Polyimide heaters, among resin-based heaters, have excellent heat resistance. Furthermore, since polyimide heaters are cheaper than ceramic heaters, costs can be reduced.

[0057] As shown in Figure 8, the surface heater 72 has a heater section 72a and a pull-out section 72b. The heater section 72a is part of the heating contact plate 62. On the other hand, the pull-out section 72b has a strip shape extending from the heater section 72a and is a part connected to a power source for supplying power to the surface heater 72.

[0058] As shown in Figures 6 and 8, this planar heater 72 includes: a resin layer 721, metal wiring 724, and terminals 725 (refer to Figure 8). The resin layer 721 is a planar layer. As shown in Figure 7, the resin layer 721 includes: a first resin layer 722 and a second resin layer 723 laminated on the first resin layer 722. The first resin layer 722 and the second resin layer 723 are not particularly limited, but can be resin films and bonded together by an adhesive (not shown). Alternatively, the first and second resin layers 722 and 723 can also be partially bonded by an adhesive. The first and second resin layers 722 and 723 can be, for example, made of resin materials such as polyimide and polyester. In particular, from the viewpoint of heat resistance, it is preferable to use polyimide as the resin material.

[0059] A metal wire 724 is sandwiched between the first and second resin layers 722 and 723. This metal wire 724 is made of, for example, stainless steel or other metal. As shown in Figure 8, the metal wire 724 meanders in the heater section 72a and connects to a terminal 725 in the extraction section 72b. This terminal 725 is electrically connected to the aforementioned power supply.

[0060] The heating unit 71 of the temperature adjustment device 7 has a surface heater 72. Because this surface heater 72 is thin, its heat capacity is smaller than that of the ceramic heater. Therefore, the responsiveness can be improved by increasing the heating rate of the heating unit 71.

[0061] As shown in Figures 6 to 8, a first heat transfer material 73 is disposed on the first main surface (top) 721a of the planar heater 72. Furthermore, a second heat transfer material 74 is disposed on the second main surface (bottom) 721b of the planar heater 72. These first and second heat transfer materials 73 and 74 are thermally conductive materials that release heat generated by the planar heater 72 from the planar heater 72. While not particularly limited, the thicknesses T4 and T5 of these first and second heat transfer materials 73 and 74 can be set to 50 μm to 100 μm (50 μm ≤ T4, T5 ≤ 100 μm).

[0062] In such a planar heater, the metal wiring generates heat, causing a localized temperature rise near the metal wiring. This leads to excessively high temperatures in the resin layer near the metal wiring, potentially causing it to burn out. On the other hand, in the heating unit 71 of this embodiment, by using the first and second heat transfer materials 73 and 74 to diffuse heat to areas outside the vicinity of the metal wiring 724, the localized temperature rise near the metal wiring 724 can be suppressed, and the burning out of the resin layer 721 can be prevented.

[0063] As the first and second heat transfer materials 73 and 74, for example, TIM (Thermal Interface Material) can be used. As TIM, for example, metal foils made of aluminum, copper, etc., graphite sheets, silicone rubber sheets containing thermally conductive fillers that are dispersed, carbon nanotubes (CNTs), and gels that disperse thermally conductive fillers can be used.

[0064] The first and second heat transfer materials 73 and 74 are preferably designed to preferentially diffuse heat from the planar heater 72 in a first direction (horizontal direction in this example) parallel to the first and second main surfaces 721a and 721b of the planar heater 72. Furthermore, a heat transfer material that preferentially diffuses heat in the first direction refers to a heat transfer material whose thermal conductivity in the first direction is greater than that in the direction perpendicular to the first direction when pressed under a predetermined pressure. Such materials can be the aforementioned graphite sheets, sheets manufactured by bundling CNTs extending along the first direction, etc.

[0065] As shown in Figure 7, due to the heating of the metal wiring 724 in the planar heater 72, heat tends to concentrate in the first portion 73a located near the metal wiring 724 of the first heat transfer material 73. On the other hand, heat is less likely to concentrate in the second portion 73b, which is separated from the metal wiring 724 of the first heat transfer material 73. Therefore, as in this embodiment, by using the first heat transfer material 73 that preferentially diffuses heat in the first direction, heat can be preferentially transferred from the first portion 73a to the second portion 73b, thus suppressing overheating of the first portion 73a. Therefore, the portion near the metal wiring 724 of the planar heater 72 can be effectively prevented from becoming a localized high temperature. Furthermore, the second heat transfer material 74 can also effectively prevent the portion near the metal wiring 724 of the planar heater 72 from becoming a localized high temperature for the same reason.

[0066] As shown in Figures 2 and 6, a cooling unit 75 is disposed on the heating unit 71. This cooling unit 75 cools the heating unit 71 during heating and adjusts the temperature of the heating unit 71 to the desired temperature. In addition, the DUT 300 can also be cooled by means of this cooling unit 75, via the heating unit 71 and the contact plate 62.

[0067] As shown in Figures 2 and 6, this cooling unit 75 includes: a cold plate 76, a refrigerant guide 77, a nozzle component 78, and a flow channel 79. The cold plate 76 is a cylindrical plate with a bottom. This cold plate 76 is disposed on the heating unit 71 and is a component that contacts and cools the heating unit 71. As the material constituting this cold plate 76, a metal or the same as the contact plate 62 described above, with an insulating coating formed on its surface, can be used.

[0068] The thickness T6 of the cold plate 76 is, for example, 300μm to 400μm (300μm ≤ T6 ≤ 400μm). Furthermore, the total thickness T7 of the cold plate 76 (T6), the heating unit 71 (T2), and the contact plate (T1) is 2mm or less (T6 + T2 + T1 ≤ 2mm). In this way, the responsiveness of temperature adjustment can be improved by shortening the distance between the cold plate 76 and the DUT 300.

[0069] Furthermore, this cold plate 76 has a first opposite side 76a that is opposite to the nozzle component 78. This first opposite side 76a is a plane.

[0070] A refrigerant guide 77 is configured to fit into the opening at the top of the cold plate 76, thereby sealing the internal space of the cold plate 76. This refrigerant guide 77, as shown in Figure 2, guides refrigerant supplied from the first refrigerant supply hole 612 of the propeller body 61 to the interior of the cooling unit 75, and also guides refrigerant used for cooling to the first refrigerant recovery hole 613 of the propeller body 61.

[0071] As shown in Figures 2 and 6, this refrigerant guide 77 has: a pushing part 771, a supply-side cylindrical part 772, and a plurality of recovery-side cylindrical parts 773. The pushing part 771 is the body of the refrigerant guide 77, which pushes the nozzle part 78 downward.

[0072] As shown in Figures 2 and 6, a supply-side cylindrical portion 772 is disposed approximately at the center of the upper surface of the pusher portion 771. As shown in Figure 2, the supply-side cylindrical portion 772 is a cylindrical component extending upward from the upper surface of the pusher portion 771 and is inserted into the first refrigerant supply hole 612 of the pusher body 61. Inside this supply-side cylindrical portion 772, a second refrigerant supply hole 772a is formed, constituting part of the flow channel 79, and this second refrigerant supply hole 772a extends to the lower surface of the pusher portion 771.

[0073] A plurality of recovery-side cylindrical portions 773 are disposed on the upper surface of the pusher portion 771. As shown in Figure 2, the recovery-side cylindrical portion 773 is a cylindrical component extending upward from the upper surface of the pusher portion 771 and is inserted into the first refrigerant recovery hole 613 of the pusher body 61. Inside the recovery-side cylindrical portion 773, a second refrigerant recovery hole 773a is formed, constituting part of the flow channel 79, and this second refrigerant recovery hole 773a extends to the lower surface of the pusher portion 771.

[0074] As shown in Figures 2 and 6, the nozzle component 78 is located between the cold plate 76 and the refrigerant guide portion 77. This nozzle component 78 is used to spray refrigerant onto the cold plate 76. As shown in Figure 6, this nozzle component 78 has: a through hole 781, a spray port 782, and a protrusion 785. The through hole 781 is connected to the second refrigerant supply port 772a of the refrigerant guide portion 77. The through hole 781 forms part of the flow channel 79. The spray port 782 is formed approximately at the center of the lower end face (second opposite face 78a) of this through hole 781. This spray port 782 is separated from the cold plate 76 and sprays the refrigerant supplied from the second refrigerant supply port 772a of the refrigerant guide portion 77 onto the cold plate 76.

[0075] Furthermore, the nozzle component 78 has a second opposite side 78a separated from the first opposite side 76a of the cold plate 76. Therefore, an air gap 791 is formed between the first opposite side 76a and the second opposite side 78a. This air gap 791 also constitutes part of the flow channel 79, through which the refrigerant injected from the injection port 782 flows after reaching the first opposite side 76a of the cold plate 76. By allowing the refrigerant to flow through the air gap 791 on the cold plate 76, the cooling speed can be increased because the refrigerant can be accelerated on the first opposite side 76a. Therefore, the responsiveness to temperature adjustment can be improved.

[0076] The refrigerant flowing through the air gap 791 is recovered to the second refrigerant recovery hole 773a through the gap between the side of the nozzle component 78 and the cold plate 76, and the gap between the top of the nozzle component 78 and the refrigerant guide 77.

[0077] Figure 9 is a perspective view of the nozzle component 78 from below in this embodiment. The second opposite side 78a is a plane. This second opposite side 78a includes: a plurality of grooves 783 (4 in this example) and a step 784. The plurality of grooves 783 extend radially outward from the injection port 782. By providing such grooves 783, the refrigerant injected from the injection port 782 can be guided to the grooves 783 and flow radially outward.

[0078] Furthermore, the width of the groove 783 increases as it approaches the center of the second opposite side 78a. Therefore, even at the tip of the groove 783, the refrigerant can flow at a high speed.

[0079] Furthermore, the plurality of grooves 783 are arranged at approximately equal intervals along the circumference of the injection port 782, with the injection port 782 as the center. In the air gap 791, the refrigerant can flow uniformly outward in the radial direction.

[0080] A step 784 is formed on the outer side of this groove 783. This step 784 has an annular shape. The second opposite side 78a is divided by this step 784 and includes an outer opposite side 78b located outside the step 784 and an inner opposite side 78c located inside the step 784. As shown in Figure 6, the height H1 of the outer opposite side 78b is higher than the height H2 of the inner opposite side 78c. That is, the thickness of the air gap 791 is greater at the outer opposite side 78b and smaller at the inner opposite side 78c. By providing such a step 784, the refrigerant at the outer periphery of the second opposite side 78a can be accelerated.

[0081] Furthermore, the thickness T8 of the air gap 791 can be appropriately set according to the pressure of the supplied refrigerant, but it can be set to, for example, 1 mm or less (T8 ≤ 1 mm). If the thickness T8 of the air gap 791 is 1 mm or less, the cooling speed can be improved because the refrigerant flowing through the air gap 791 can be accelerated. Therefore, the responsiveness of temperature adjustment can be improved.

[0082] As shown in Figures 6 and 9, a plurality of protrusions 785 are disposed on the second opposite side 78a. These protrusions 785 serve as spacers between the first opposite side 76a and the second opposite side 78a, separating the first and second opposite sides 76a and 78a. The tips of the protrusions 785 contact the first opposite side 76a of the cold plate 76, defining the aforementioned air gap 791.

[0083] As shown in Figure 2, the biasing mechanism 8 is located between the propeller body 61 and the refrigerant guide 77 of the temperature adjustment device 7. This biasing mechanism 8 biases the cooling unit 75 toward the heating unit 71 by biasing the refrigerant guide 77 downward. In this embodiment, the biasing mechanism 8 is a spring such as a helical spring. Alternatively, the biasing mechanism 8 can be other elastic materials such as rubber. Furthermore, the biasing mechanism 8 can be part of the balance ring structure.

[0084] The cold plate 76 of the cooling unit 75, which is biased by the biasing mechanism 8, constantly pushes the heating unit 71 toward the contact plate 62. In this way, by pushing the heating unit 71 toward the contact plate 62 on the cold plate 76, the first and second heat transfer materials 73 and 74 are closely attached to the surface heater 72, thus promoting the heat release from the surface heater 72 to the first and second heat transfer materials 73 and 74.

[0085] As shown in Figure 2, the vertical guide 69 is disposed on the outside of the retainer 63. This vertical guide 69 is fixed to the underside of the thruster body 61 and extends downward from the underside of the thruster body 61. In addition, although not particularly limited, the vertical guide 69 can be fixed to the thruster body 61 by fasteners such as bolts. As shown in Figure 3, when the thruster 6 adsorbs and holds the DUT 300, this vertical guide 69, by contacting the DUT 300, can position the DUT 300 relative to the thruster 6 in both the vertical and horizontal directions.

[0086] Returning to Figure 1, the refrigerant supply unit 9 supplies refrigerant to the propeller 6. This refrigerant supply unit 9 includes: a connection 91, a valve 92, and a valve control unit 93. The connection 91 is connected to a refrigerant supply source 200 located outside the electronic component testing device 100. The refrigerant supplied to this refrigerant supply source 200 may be compressed dry air, liquid nitrogen, etc. When the refrigerant supply source 200 supplies compressed dry air, the refrigerant supply source 200 may include, for example, a compressor that draws in and compresses external air, or a dryer that dries the compressed air. Alternatively, the refrigerant supply source 200 may be an existing factory piping capable of supplying compressed dry air. When the refrigerant supply source 200 supplies liquid nitrogen, the refrigerant supply source 200 may be, for example, a pressure vessel for storing liquid nitrogen under high pressure, or a factory piping for supplying liquid nitrogen.

[0087] A downstream valve 92 is provided at the connection part 91. This valve 92 adjusts the flow rate of refrigerant supplied from the refrigerant supply source 200. The refrigerant passing through this valve 92, as shown in Figure 2, is supplied to the first refrigerant supply port 612 of the propeller body 61.

[0088] As shown in Figure 1, the valve control unit 93 controls the opening and closing of the valve 92. In this embodiment, the valve control unit 93 receives the detection value from the temperature detection circuit 303 of the DUT 300 (see Figure 2). The valve control unit 93 performs PID control to make the temperature of the DUT 300 reach the desired value based on the input detection value. Furthermore, the control method of the valve control unit 93 is not limited to PID control; other control methods may also be used.

[0089] In the electronic component testing apparatus 100 of this embodiment described above, when the contact plate 62 contacts the DUT 300, the contact plate 62 separates from the holder 63. When the temperature of the DUT 300 is controlled by the temperature adjustment device 7, heat loss to the holder 6 can be prevented. That is, since the heat capacity of the components between the temperature adjustment device 7 and the DUT 300 can be reduced, the responsiveness of temperature adjustment can be improved.

[0090] Furthermore, in the electronic component testing apparatus 100 of this embodiment, since ceramic heaters, which are prone to becoming heavy, are not used, the thruster 6 can be made lighter.

[0091] Furthermore, the embodiments described above are merely for the purpose of facilitating understanding of the present invention and are not intended to limit the present invention. Therefore, each element disclosed in the above embodiments includes all technical modifications, equivalents, etc., that fall within the technical scope of the present invention.

[0092] For example, in the above embodiment, the pusher 6 is used to hold the DUT 300, but it is not limited to this. The pusher 6 can also be a carrier that holds the DUT. There is no particular limitation on such a carrier, but carriers described in, for example, Japanese Patent Application Laid-Open No. 2019-197012 and Japanese Patent Application Laid-Open No. 2013-79860 can be used. In addition, in this example, the carrier that holds the DUT is equivalent to an example of the "push-up body" in this invention.

[0093] Furthermore, the pusher 6 can be used to push the plurality of DUTs 300 mounted on a test tray. In this case, the processor 3 has a plurality of pushers 6, each of which pushes the plurality of DUTs 300 mounted on the test tray. In this case, all pushers 6 can also have the configuration of this embodiment as described above. [Simplified Explanation of the Diagram]

[0022] Figure 1 is a block diagram showing an example of an electronic component testing apparatus constituting an embodiment of the present invention. Figure 2 is a cross-sectional view showing the state before the DUT of the adsorption-holding propeller in an embodiment of the present invention. Figure 3 is a cross-sectional view showing the state after the DUT of the adsorption-holding propeller in an embodiment of the present invention. Figure 4(a) is an enlarged cross-sectional view of part IVa in Figure 2, and Figure 4(b) is an enlarged cross-sectional view of part IVb in Figure 3. Figure 5 is a perspective view showing the holder from below in an embodiment of the present invention. Figure 6 is an enlarged cross-sectional view of the contact plate and temperature adjustment device in an embodiment of the present invention. Figure 7 is an enlarged cross-sectional view of part VII in Figure 6. Figure 8 is a plan view showing an example of a heating unit constituting an embodiment of the present invention. Figure 9 is a perspective view showing the nozzle component from below in an embodiment of the present invention.

Claims

1. An electronic component processing apparatus, comprising: processing a push body including a device for mounting ...

2. The electronic component processing apparatus as claimed in claim 1, wherein the aforementioned pressing device includes a temperature adjustment device that adjusts the temperature of the aforementioned pressed body via the aforementioned contact plate.

3. The electronic component processing apparatus as claimed in claim 2, wherein the aforementioned pushing device includes a biasing mechanism that biases the aforementioned temperature adjusting device toward the aforementioned contact plate, wherein the aforementioned temperature adjusting device is in frequent contact with the aforementioned contact plate by means of the aforementioned biasing mechanism.

4. The electronic component processing apparatus as claimed in claim 3, wherein the aforementioned temperature adjustment device includes a heating unit as a heating source and a cooling unit as a cooling source, wherein the aforementioned heating unit is biased by the aforementioned biasing mechanism and is in frequent contact with the aforementioned contact plate, and wherein the aforementioned cooling unit is biased by the aforementioned biasing mechanism and is in frequent contact with the aforementioned heating unit.

5. The electronic component processing apparatus as claimed in claim 1, wherein the contact plate has a contact surface that contacts the push body and a locking surface connected to the contact surface, wherein the retainer has a retaining portion that retains the contact plate by locking it to the locking surface.

6. The electronic component processing apparatus as claimed in claim 5, wherein the aforementioned holding portion, while locked to the aforementioned locking surface, has a plurality of claw portions spaced apart from each other and arranged in an annular shape.

7. The electronic component processing apparatus as claimed in claim 6, wherein the aforementioned locking surface has an annular shape surrounding the aforementioned contact surface, and the aforementioned plurality of claws are arranged such that they surround the aforementioned contact plate along the aforementioned locking surface.

8. The electronic component processing apparatus as claimed in claim 6, wherein the aforementioned claw portion has an opening.

9. The electronic component processing apparatus as claimed in claim 6, wherein the aforementioned pressing device includes an adsorption pad for adsorbing and holding the aforementioned pressed object, wherein the aforementioned adsorption pad is disposed on the aforementioned claw portion.

10. The electronic component processing apparatus as claimed in claim 5, wherein the aforementioned contact surface protrudes relative to the lower end surface of the aforementioned holder.

11. The electronic component processing apparatus as claimed in claim 5, wherein the aforementioned locking surface is inclined such that the width of the aforementioned contact plate widens as it separates from the aforementioned contact surface.

12. An electronic component processing apparatus as described in any one of claims 5 to 11, wherein the electronic component processing apparatus satisfies the following equations (1) and (2): WD>WC… (1) WR>WC… (2) Wherein, In equation (1) above, WD is the width of the aforementioned pushed body, WR is the width of the aforementioned retainer, and in equation (2) above, WC is the width of the aforementioned contact surface of the aforementioned contact plate.

13. The electronic component processing apparatus as described in any one of claims 2 to 4, wherein a space is formed between the aforementioned holder and the aforementioned temperature adjustment device.

14. An electronic component testing apparatus for testing a DUT, comprising an electronic component handling apparatus as described in any one of claims 1 to 13 and a tester having a socket.

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