Curable perfluoropolyether gel composition, cured perfluoropolyether gel product, and electric / electronic component sealed using said cured product

Abstract

This invention provides a curable perfluoropolyether adhesive composition containing the following components (A) to (D): (A) 10 to 90 parts by mass of a linear perfluoropolyether compound having two or more alkenyl groups in one molecule and no branched structure in the main chain; (B) 10 to 90 parts by mass of a linear perfluoropolyether compound having no reactive functional groups in one molecule (wherein the total of components (A) and (B) is 100 parts by mass); (C) a curing effective amount of an organohydrogen polysiloxane having two or more Si-H groups in one molecule; and (D) a catalyst amount of a hydrosilicification reaction catalyst; and the viscosity of the aforementioned composition is less than 1000 mPa·s and can impart a cured perfluoropolyether adhesive with a resin modulus of 0.1 to 200 kPa·s. This provides a curable perfluoropolyether composition that imparts excellent heat resistance and other properties to the cured material, while exhibiting low viscosity and good defoaming before curing. none

Description

[Technical Field]

[0001] This invention relates to a curable perfluoropolyether adhesive composition, a cured perfluoropolyether adhesive formed by curing the composition, and electrical and electronic components sealed by the cured adhesive. The curable perfluoropolyether adhesive composition exhibits excellent heat resistance, chemical resistance, low-temperature properties, and sealing properties after curing. In particular, it has low viscosity before curing, so even when used as an embedding, sealing, or coating material for electrical and electronic components, it still exhibits good debubbling performance in a short time, making it suitable for improving productivity. [Previous Technology]

[0002] Cured silicone, with its excellent electrical and thermal insulation properties, stable electrical characteristics, and flexibility, can be used as a material for embedding or sealing electrical and electronic components, or as a coating material to protect control circuit components such as power transistors, ICs, and capacitors from external thermal or mechanical damage. In particular, the low modulus of the gel-like cured material is especially useful in the above applications.

[0003] A representative example of a silicone composition that forms such a gel-like cured material is an addition-curing type organopolysiloxane composition. For example, a known composition of this addition-curing type organopolysiloxane composition contains an organopolysiloxane having vinyl groups bonded to silicon atoms and an organohydrogen polysiloxane having hydrogen groups bonded to silicon atoms, and a silicone is obtained by performing a crosslinking reaction in the presence of a platinum-based catalyst (Patent Documents 1, 2, 3). Furthermore, as a chlorosilicone composition, a known composition contains an organopolysiloxane having trichloropropyl groups (Patent Document 4).

[0004] However, silicone obtained by these addition-curing organopolysiloxane compositions still has the following problems: it is easy to cause swelling or deterioration due to strong alkalis, strong acids and other chemicals, toluene, ethanol and gasoline and other solvents, so it is difficult to maintain its performance.

[0005] Therefore, in order to solve this problem, a fluororubber composition and a fluororubber-like cured product formed by curing it have been proposed. The fluororubber composition uses a divalent perfluoropolyether group having two alkenyl groups in one molecule as the main agent, and contains an organohydrogen polysiloxane having hydrogen atoms bonded to silicon atoms and a platinum catalyst (Patent Document 5).

[0006] However, when the adhesive described above is used for the mounting of electrical and electronic components, it requires more than 10 minutes to remove air bubbles generated during injection, which reduces productivity. Furthermore, the possibility of forcibly removing air bubbles by applying decompression treatment to each part after injection of the composition has been discussed, but this still results in a reduction in productivity due to the time-consuming decompression and atmospheric venting process, requiring the preparation of a dedicated device. [Prior Art Documents] (Patent Documents)

[0007] Patent Document 1: Japanese Patent Application Publication No. 56-143241. Patent Document 2: Japanese Patent Application Publication No. 63-35655. Patent Document 3: Japanese Patent Application Publication No. 63-33475. Patent Document 4: Japanese Patent Application Publication No. 7-324165. Patent Document 5: Japanese Patent Application Publication No. 11-116685. [Summary of the Invention]

[0008] [Problem to be Solved by the Invention] The present invention was made in view of the above-mentioned circumstances, and its object is to provide a curable perfluoropolyether adhesive composition, a cured perfluoropolyether adhesive formed from the composition, and electrical and electronic components sealed from the cured adhesive. This curable perfluoropolyether adhesive composition exhibits excellent heat resistance, chemical resistance, low-temperature properties, and adhesion after curing. In particular, its low viscosity before curing allows for good degassing even when used as an embedding, sealing, or coating material for electrical and electronic components, thus improving productivity. [Technical Means for Solving the Problem]

[0009] To solve the above problems, the present invention provides a curable perfluoropolyether adhesive composition containing the following components (A) to (D): (A) 10 to 90 parts by mass of a linear perfluoropolyether compound, one molecule of which has at least two alkenyl groups and a perfluoropolyether structure comprising repeating units including -CaF2aO- in the main chain, wherein the main chain does not have a branched structure, and a is an integer from 1 to 6; (B) 10 to 90 parts by mass of a linear perfluoropolyether compound, one molecule of which has a perfluoropolyether structure without reactive functional groups, wherein the total of components (A) and (B) is 100 parts by mass; (C) a curing effective amount of an organohydrogen polysiloxane, one molecule of which has at least two hydrogen atoms bonded to silicon atoms; and (D) a catalyst amount of a hydrogenation reaction catalyst; and, The curable perfluoropolyether adhesive composition has a viscosity (at 23°C) of less than 1000 mPa·s before curing and can impart a cured perfluoropolyether adhesive with a resin modulus of 0.1 to 200 kPa·s after curing at 25°C.

[0010] Any curable perfluoropolyether adhesive composition containing components (A) to (D) as described in this invention can be a curable perfluoropolyether adhesive composition (fluorinated curable adhesive composition). After curing, it exhibits excellent heat resistance, chemical resistance, low-temperature properties, moisture resistance, and low gas permeability. In particular, its viscosity is low before curing, so even when used in the embedding, sealing, or coating of electrical and electronic components, it still exhibits good degassing in a short time, making it suitable for improving productivity.

[0011] In addition, a curable perfluoropolyether adhesive composition as described above is provided, wherein the aforementioned component (A) is a linear perfluoropolyether compound represented by the following general formula (1), CH 2=CH-(X') p-Rf 1-(X') p-CH=CH 2(1) [In the general formula (1), X' is a group represented by -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- (however, Y' is -CH 2- or a group represented by the following structural formula (Z'), (dimethylphenylsilenyl represented by ortho, meta or para position), R 2 is a hydrogen atom, methyl, phenyl or allyl), p is independently 0 or 1, and Rf1 is a group represented by the general formula -[CaF 2aO] w-CF 2-(in the general formula, a represents an integer from 1 to 6, w represents an integer from 1 to 300 and has no branched structure)] represents the perfluoropolyether structure.

[0012] Any curable perfluoropolyether adhesive composition containing such component (A) can be a fluorinated curable adhesive composition. After curing, it has excellent heat resistance, chemical resistance, low temperature characteristics, moisture resistance, and low gas permeability. In particular, it has low viscosity before curing, so it has good degassing in a short time and can be used to improve productivity.

[0013] In addition, a curable perfluoropolyether adhesive composition is provided, wherein the aforementioned component (B) is at least one linear perfluoropolyether compound selected from the group consisting of compounds represented by the following general formulas (2) and (3): A-O-(CF 2CF 2CF 2O) b-A(2) (in general formula (2), A is independently a base represented by general formula C sF 2s+1- (s is an integer from 1 to 3), and b is an integer from 1 to 200); A-O-(CF 2O) d(CF 2CF 2O) e-A(3) (in general formula (3), A is as described above, d and e are each an integer from 0 to 200 and d+e=1 to 250).

[0014] Any curable perfluoropolyether adhesive composition containing such component (B) will become an adhesive composition and a cured adhesive composition. While maintaining the physical properties such as heat resistance and chemical resistance, the viscosity and modulus of the adhesive composition will be moderately reduced.

[0015] In addition, a curable perfluoropolyether adhesive composition is provided, which may further contain, as desired, an (E) component, which is a polyfluoromonoolefin compound represented by the following general formula (4): Rf2-(X') p'-CH=CH2(4) [in general formula (4), X' is -CH2-, -OCH2-, -CH2OCH2- or -CO-NR2-Y'- (however, Y' is -CH2- or a group represented by the following structural formula (Z'), (dimethylphenylsilylene represented by ortho, meta or para position), R2 is a hydrogen atom, methyl, phenyl or allyl), p' is 0 or 1, Rf2 is a compound represented by the general formula F-[CF(CF3)CF2O] w'-CF(CF 3) – (in the general formula, w' represents an integer from 1 to 300) represents the perfluoropolyether structure.

[0016] Any curable perfluoropolyether adhesive composition containing such component (E) will become a cured adhesive, in which the crosslinking density will be moderately reduced while maintaining chemical resistance and other physical properties.

[0017] Furthermore, it is preferable that the above-described curable perfluoropolyether adhesive composition can impart a perfluoropolyether adhesive curing material with an insertion angle of 5 to 80 in ASTM (American Society for Testing and Materials) D-1403 (1 / 4 cone).

[0018] Any curable perfluoropolyether adhesive composition can impart a moderately flexible cured adhesive.

[0019] In addition, the present invention provides a perfluoropolyether adhesive curable material, which is formed by curing the above-mentioned curable perfluoropolyether adhesive composition.

[0020] As long as it is such a perfluoropolyether adhesive cured material, it has excellent heat resistance, chemical resistance, low temperature characteristics, and sealing properties, and is useful as an embedding, sealing material, and coating material for electronic components.

[0021] Furthermore, the present invention provides an electrical and electronic component that is sealed by a cured product of the aforementioned curable perfluoropolyether adhesive composition (i.e., perfluoropolyether adhesive). The electrical and electronic component is particularly a barometric pressure sensor, a hydraulic pressure sensor, a temperature sensor, a humidity sensor, a rotation sensor, a gravity sensor (G-sensor), a timing sensor, an air flow meter, an electronic circuit, a computer control unit, and a semiconductor module.

[0022] Thus, by using the curable perfluoropolyether adhesive composition of the present invention, which can quickly remove air bubbles generated during mixing and thereby improve production efficiency, and by using the cured perfluoropolyether adhesive formed by curing this composition to seal electrical and electronic components, it is possible to manufacture electrical and electronic components with excellent heat resistance, chemical resistance, low-temperature characteristics, and sealing properties. [Effects of the Invention]

[0023] As described above, as long as it is a curable perfluoropolyether adhesive composition of the present invention, it can impart to a curable perfluoropolyether adhesive composition that is excellent in terms of heat resistance, chemical resistance, low temperature characteristics, and adhesion. In particular, the viscosity before curing is low, so even when used as an embedding, sealing material, or coating material for electrical and electronic components, the degassing is still good in a short time, and it can be used to improve productivity.

Implementation Method

[0025] As described above, it is sought to develop an electrical and electronic component comprising a fluorinated curable adhesive composition and its cured form. The fluorinated curable adhesive composition exhibits excellent heat resistance, chemical resistance, low-temperature properties, moisture resistance, and low gas permeability after curing. In particular, it has low viscosity before curing, so even when used as an embedding, sealing, or covering material for electrical and electronic components, it still exhibits good degassing in a short time, making it suitable for improving productivity.

[0026] In order to achieve the above-mentioned objective, the inventors have devoted themselves to research and found that, as long as it is a specific perfluoropolyether adhesive composition in this invention, compared with conventional fluorinated adhesive compositions, a perfluoropolyether adhesive composition can be given a low viscosity while maintaining chemical resistance and solvent resistance, which helps to improve productivity. In particular, a composition can be obtained that can give a hardened material without bubbles after curing. Based on the above discovery, this invention was completed.

[0027] That is, the present invention is a curable perfluoropolyether adhesive composition containing the following components (A) to (D): (A) 10 to 90 parts by mass of a linear perfluoropolyether compound, one molecule of which has at least two alkenyl groups and a perfluoropolyether structure comprising repeating units including -CaF2aO- in the main chain, wherein the main chain does not have a branched structure, and a is an integer from 1 to 6; (B) 10 to 90 parts by mass of a linear perfluoropolyether compound, one molecule of which has a perfluoropolyether structure without reactive functional groups, wherein the total of components (A) and (B) is 100 parts by mass; (C) a curing effective amount of an organohydrogen polysiloxane, one molecule of which has at least two hydrogen atoms bonded to silicon atoms; and, (D) a catalyst amount of a hydrogenation reaction catalyst; and, The curable perfluoropolyether adhesive composition has a viscosity (23°C) of less than 1000 mPa·s before curing and can impart a perfluoropolyether adhesive cured product with a resin modulus of 0.1 to 200 kPa·s at 25°C after curing.

[0028] The present invention will now be described in detail, but it is not limited thereto. Furthermore, in this specification, "at least" is a term indicating the lower limit of a numerical range. For example, phrases such as "at least two" and "at least one" respectively mean "two or more" and "one or more".

[0029] [(A) Component] The (A) component contained in the curable perfluoropolyether adhesive composition of the present invention is a linear perfluoropolyether compound that acts as the main agent (base polymer) of the curable perfluoropolyether adhesive composition of the present invention. It has a perfluoropolyether structure with at least two alkenyl groups per molecule and repeating units including -CaF2aO- in the main chain (however, the main chain does not have a branched structure, and a is an integer from 1 to 6), that is, a linear perfluoropolyether compound with a divalent perfluorooxyalkylene structure. The number of alkenyl groups in one molecule of the aforementioned compound is two or more, with no particular upper limit. For example, it can be set to 2 to 12, preferably 2 to 8, and more preferably 2 to 6.

[0030] Here, as a perfluorooxylenane structure, a repeating structure comprising a plurality of oxylenane units represented by -CaF2aO- (where a in each unit is an integer from 1 to 6 independently) can be exemplified by, for example, those represented by the following general formula (I). -[CaF2aO]w-CF2-(I) (in general formula (I), w is an integer from 1 to 300, preferably an integer from 2 to 300, more preferably an integer from 5 to 250, and even more preferably an integer from 10 to 200.)

[0031] Examples of the repeating structures – CaF2aO- (i.e., oxo-extrin units) constituting the perfluorooxy-extrin ether structure represented by the above general formula (I) include the structures described below. Furthermore, the above perfluoroalkyl ether structure may be composed of a single repeating structure or a combination of two or more repeating structures.

[0032] -CF 2O- -CF 2CF 2O- -CF 2CF 2CF 2O- -CF 2CF 2CF 2CF 2O- -CF 2CF 2CF 2CF 2CF 2CF 2O-

[0033] Of these, the following structure is particularly suitable: -CF₂O- -CF₂CF₂O- -CF₂CF₂CF₂O-

[0034] Furthermore, in this invention, the term "straight-chain" refers to the case where the repeating units - CaF2aO- (oxy-extrin units) of the perfluoropolyether structure (perfluorooxy-extrin structure) constituting the main chain are bonded to each other in a straight-chain manner. On the other hand, the term "branched structure" in this invention refers to the case where the repeating units - CaF2aO- (oxy-extrin units) of the perfluoropolyether structure (perfluorooxy-extrin structure) constituting the main chain are themselves branched oxy-extrin units (e.g., -CF(CF3)CF2O-, -C(CF3)2O-, etc.), and the term "without branched structure" in the main chain refers to the case where the perfluorooxy-extrin units of the perfluoropolyether structure (perfluorooxy-extrin structure) constituting the main chain are unbranched perfluorooxy-extrin units (e.g., straight-chain perfluorooxy-extrin units such as -CF2CF2O-, -CF2CF2CF2O-, etc.).

[0035] In this invention, the main chain of component (A) must be a perfluoropolyether structure without branching (i.e., without branched oxoalkyl units). Generally, it is known that in linear perfluoropolyether structures, the viscosity of perfluoropolyether compounds with branching structures is higher than that of perfluoropolyethers without branching structures. Therefore, by using a perfluoropolyether without branching structures in component (A), it is possible to achieve the desired low viscosity of the component required to improve productivity.

[0036] The alkenyl group in the linear perfluoropolyether compound that is the component (A) is preferably one with 2 to 8 carbons, especially 2 to 6 carbons, and having a CH 2=CH- structure at the end, such as vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, etc., with a CH 2=CH- structure at the end, and is particularly preferred to be vinyl, allyl, etc. The alkenyl group can be directly bonded to the ends of the perfluoropolyether structure constituting the main chain of the linear perfluoropolyether compound, particularly the divalent perfluorooxyalkylene structure, or it can be bonded through a divalent linker, such as -CH 2-, -OCH 2-, -CH 2OCH 2-, or -Y-NR-CO- [However, Y is -CH 2- or a group represented by the following structural formula (Z) (dimethylphenylsilenyl represented by ortho, meta, or para positions), and R is a hydrogen atom, methyl, phenyl, or allyl.]. Furthermore, component (A) has at least two alkenyl groups in one molecule.

[0037] As component (A), polyfluorinated diene compounds represented by the following general formulas (5) or (6) can be listed: CH 2=CH-(X) p-Rf 1-(X') p-CH=CH 2(5) CH 2=CH-(X) p-Q-Rf 1-Q-(X') p-CH=CH 2(6) [In the general formula, X is independently -CH 2-, -CHO 2-, -CH 2OCH 2- or -Y-NR 1-CO- (however, Y is -CH 2- or a group represented by the following structural formula (Z), and R 1 is a hydrogen atom, methyl, phenyl or allyl), X' is -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- (however, Y' is -CH 2- or a group represented by the following structural formula (Z'), and R 1 is a hydrogen atom, methyl, phenyl or allyl), X' is -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- (however, Y' is -CH 2- or a group represented by the following structural formula (Z'), R 1 is a hydrogen atom, methyl, phenyl or allyl), and R 1 is a hydrogen atom, methyl, phenyl or allyl. 2 represents a hydrogen atom, methyl, phenyl, or allyl group.

[0038] (Dimethylphenylsilenyl represented by ortho, meta, or para positions) (Dimethylsilenylphenyl represented by ortho, meta, or para positions)

[0039] Rf 1 is a divalent perfluoropolyether structure (perfluorooxyalkylene structure), preferably represented by the above general formula (I), i.e., -[CaF 2aO] w-CF 2-. Q is a divalent hydrocarbon group having 1 to 15 carbon atoms, which may contain an ether bond, specifically an alkylene group or an alkylene group containing an ether bond, and p is independently 0 or 1.

[0040] A linear perfluoropolyether compound that is such a component (A) can be represented by the following general formula (1): CH 2=CH-(X') p-Rf 1-(X') p-CH=CH 2(1) [in general formula (1), X', Rf 1, and p are the same as above]; preferably, it is a polyfluorodiene-based compound represented by the following general formula (1'): CH=CH 2-(X') p-CF 2O(CF 2CF 2O) g(CF 2O) hCF 2-(X') p-CH=CH 2(1') [In general formula (1'), X' and p are the same as described above, g and h each represent an integer from 0 to 200, preferably an integer from 1 to 150, more preferably an integer from 5 to 120, further preferably an integer from 10 to 100, g+h=1 to 250, preferably 5 to 240, more preferably 10 to 220, further preferably 40 to 200, and is a perfluoropolyether structure without branching structure.]

[0041] Furthermore, of the total 100 parts by mass of component (A) and component (B) described later, the proportion of component (A) is 10 to 90 parts by mass, preferably 15 to 85 parts by mass. If the amount is less than 10 parts by mass, the modulus of the resulting composition will become extremely low, raising concerns about its fluidity; if it exceeds 90 parts by mass, the modulus will become high, raising concerns about reduced adhesion to the substrate.

[0042] The linear perfluoropolyether compound of the above general formula (1) has a weight-average molecular weight (WMA) of 3,000 to 100,000, particularly 4,000 to 50,000, when measured by gel permeation chromatography (GPC) with a fluorinated solvent as the developing solvent. As long as the WMA is 3,000 or higher, the swelling of gasoline and various solvents will be small. In particular, the swelling of gasoline will be less than 6%, which meets the requirements for components that require gasoline resistance. Furthermore, as long as the WMA is 100,000 or lower, the viscosity will not be too high and the workability will be excellent, thus making it practical. Moreover, the degree of polymerization (m+n) of the linear perfluoropolyether compound of the above general formula (1) can also be obtained by measuring the molecular weight distribution of the compound by gel permeation chromatography (GPC) with a fluorinated solvent as the developing solvent, as the number-average degree of polymerization or the weight-average degree of polymerization, etc., when measured by gel permeation chromatography (GPC) with a fluorinated solvent as the developing solvent. Furthermore, the number-average degree of polymerization and the number-average degree of polymerization can also be calculated from the ratio of terminal structures to repeating unit structures obtained from 19F-NMR spectra.

[0043] Furthermore, in this invention, in order to adjust the linear perfluoropolyether compound of the above general formula (1) to the desired weight average molecular weight as needed, the following product can also be used as component (A). This product is obtained by first subjecting the linear perfluoropolyether compound as described above to a hydrogenation reaction with an organosilicon compound containing two SiH groups in the molecule, and then extending the chain by conventional methods and conditions. Furthermore, the linear perfluoropolyether compound of component (A) can be used alone or in combination with two or more.

[0044] [(B) Component] Component (B) of the present invention is a linear perfluoropolyether compound, one molecule of which has a perfluoropolyether structure without reactive functional groups. By formulating the aforementioned linear perfluoropolyether compound, not only are physical properties not impaired, but also a composition with excellent chemical resistance, solvent resistance, and low-temperature properties and low viscosity can be imparted. Furthermore, in the present invention, "without reactive functional groups" means that the molecule does not have the following groups: hydrogen atoms (silicon hydrogen group represented by SiH) that participate in silane addition reactions and are bonded to alkenyl and silicon atoms, and binding functional groups with heteroatoms (epoxy group, alkoxysilyl group, amino group, mercapto group, etc.). Component (B) is clearly distinguishable from component (A) and components (C) and (E) described below based on the fact that the molecule does not have reactive functional groups.

[0045] As component (B), one or more linear perfluoropolyether compounds selected from the group consisting of compounds represented by the following general formulas (2) and (3) (one or more alone) can be used.

[0046] A-O-(CF 2CF 2CF 2O) b-A(2) (In general formula (2), A is independently the basis represented by general formula C sF 2s+1-(s is an integer from 1 to 3), and b is an integer from 1 to 200); A-O-(CF 2O) d(CF 2CF 2O) e-A(3) (In general formula (3), A is as described above, d and e are each an integer from 0 to 200 and d+e=1 to 250).

[0047] As a specific example of component (B), the following components can be listed. (Furthermore, the sum of b or d and e below satisfies the above requirements.)

[0048] CF 3O-(CF 2CF 2CF 2O) b-CF 2CF 3 CF 3-O-[(CF 2O) d(CF 2CF 2O) e]-CF 3 (b=1~200 integer, preferably 2~150 integer, more preferably 5~120 integer, further preferably 10~100 integer, d and e are each 0~200 integer, preferably 1~100 integer, more preferably 5~80 integer, further preferably 10~60 integer, d+e=1~250, preferably 5~200, more preferably 10~150, further preferably 40~100).

[0049] Furthermore, of the total 100 parts by mass of component (A) and component (B), the proportion of component (B) is 10 to 90 parts by mass, preferably 15 to 85 parts by mass, and more preferably 20 parts by mass or more. If the amount is less than 10 parts by mass, there is a concern that the viscosity of the resulting composition will be high, making it difficult to remove air bubbles, and there is a concern that the modulus will be extremely high, reducing the adhesion to the substrate. If it exceeds 90 parts by mass, there is a concern that the modulus will be low, making it difficult to exhibit flowability.

[0050] [(C) component] Component (C) is a crosslinking agent and / or chain extender that acts as component (A) or component (E) described later. Component (C) is an organohydrogen polysiloxane having at least two, preferably three or more, hydrogen atoms (silanol groups represented by SiH) bonded to silicon atoms in one molecule. The number of alkenyl groups in one molecule of the aforementioned component (C) is two or more, and there is no particular upper limit, but it can be, for example, 2 to 50, preferably 3 to 30, and more preferably 3 to 20. Common organosilicone compounds described in the aforementioned Patent Document 5 can be listed as component (C), but there is no particular limitation.

[0051] Furthermore, from the viewpoint of compatibility, dispersibility, and uniformity of the cured adhesive with component (A) or component (E) described later, fluorinated organohydrogen polysiloxanes can be appropriately used, wherein one molecule of the organohydrogen polysiloxane has one or more monovalent perfluoroalkyl, monovalent perfluorooxyalkyl, divalent perfluoropyranyl and / or divalent perfluorooxypyranyl.

[0052] Examples of the monovalent or divalent fluorinated organic groups include perfluoroalkyl, perfluorooxyalkyl, perfluoroextrinyl and perfluorooxyextrinyl groups represented by the following general formula.

[0053] C gF 2g+1- -C gF 2g- (In the general formula, g is an integer from 1 to 20, preferably an integer from 2 to 10.)

[0054] (In the general formula, f is an integer from 1 to 200, preferably an integer from 1 to 100, and h is an integer from 1 to 3.)

[0055] (In the general formula, i and j are each integers greater than or equal to 1, preferably integers from 1 to 100, and the average of i+j is 2 to 200, preferably 2 to 100.)

[0056] -(CF 2O) d-(CF 2CF 2O) e-CF 2- (In the general formula, d and e are each integers from 1 to 50, preferably integers from 1 to 40.)

[0057] Furthermore, it is preferable that the perfluoroalkyl, perfluorooxyalkyl, perfluoropyranyl or perfluorooxypyranyl groups are bonded to silicon atoms by a divalent linking group. The divalent linking group can be: pyranyl, pyranylaryl and combinations thereof; or, ether bond oxygen atom, amide bond, carbonyl bond, ester bond, diorganopyranyl silyl group etc. are formed in the middle of such groups. Examples of divalent linking groups with 2 to 12 carbon atoms are given, but not limited to these. -CH 2CH 2-、 -CH 2CH 2CH 2-、 -CH 2CH 2CH 2OCH 2-、 -CH 2CH 2CH 2-NH-CO-、 -CH 2CH 2CH 2-N(Ph)-CO-、 -CH 2CH 2CH 2-N(CH 3)-CO-、 -CH 2CH 2CH 2-N(CH 2CH 3)-CO-、 -CH 2CH 2-Si(CH 3) 2-Ph'-N(CH 3)-CO-、 -CH 2CH 2CH 2-Si(CH 3) 2-Ph'-N(CH 3)-CO-、 -CH 2CH 2CH 2-O-CO- (where Ph is phenyl, Ph' is exenylphenyl.)

[0058] Furthermore, in the fluorinated organohydrogen polysiloxane of component (C), the monovalent or divalent fluorinated organic groups and the monovalent substituents bonded to silicon atoms other than the hydrogen atoms bonded to silicon atoms can be, for example: alkyl groups such as methyl, ethyl, propyl, butyl, hexyl, cyclohexyl, octyl, decyl; alkenyl groups such as vinyl and allyl; aryl groups such as phenyl, tolyl, and naphthyl; aralkyl groups such as benzyl and phenethyl; and those in which some or all of the hydrogen atoms are replaced by chlorine atoms, cyano groups, etc., such as chloromethyl, chloropropyl, cyanoethyl, etc., which are unsubstituted or substituted monovalent hydrocarbon groups with 1 to 20 carbon atoms, preferably 1 to 12.

[0059] The fluorinated organohydrogen polysiloxane as component (C) can be cyclic, linear, branched, three-dimensional network, or any combination thereof. The number of silicon atoms in the fluorinated organohydrogen polysiloxane is not particularly limited, but is typically around 2 to 60, preferably around 3 to 30.

[0060] Examples of compounds that have a monovalent or divalent fluorinated organic group and a silicon atom bonded to a hydrogen atom are as follows. These compounds can be used alone or in combination of two or more. Furthermore, in the following formulas, Me represents methyl and Ph represents phenyl.

[0061]

[0062]

[0063]

[0064]

[0065]

[0066]

[0067]

[0068]

[0069]

[0070]

[0071]

[0072] The amount of component (C) described above is the effective amount for curing component (A) and component (E) described later, i.e., the effective curing amount. In particular, relative to the total alkenyl group 1 mole of component (A) and component (E) when component (E) is present in this composition, the amount of silicate groups (Si-H) in component (C) is preferably 0.2 to 4 moles, more preferably 0.5 to 3 moles. As long as the amount of silicate groups (Si-H) is 0.2 moles or more, the degree of crosslinking is sufficient, and there is no concern that a cured product cannot be obtained. Furthermore, as long as the amount of silicate groups (Si-H) is 4 moles or less, there is no concern that foaming will occur during curing.

[0073] (C) The ingredient can be used alone or in combination of two or more.

[0074] [(D) Component] The hydrosiliconization catalyst (addition reaction catalyst) of component (D) of the present invention is a catalyst that promotes the addition reaction between the alkenyl group in component (A) or the alkenyl group in component (E) described later and the silanyl group in component (C). This hydrosiliconization catalyst is generally a compound of a noble metal (platinum group metals), which is expensive; therefore, platinum or platinum compounds, which are more readily available, are often used.

[0075] Examples of platinum compounds include: chloroplatinic acid or complexes of chloroplatinic acid with olefins such as ethylene, and complexes with ethylene silicates; platinum metal supported on silicon dioxide, aluminum oxide, carbon, etc. Other platinum group metal catalysts besides platinum compounds include rhodium, ruthenium, iridium, and palladium compounds, such as: RhCl(PPh 3) 3, RhCl(CO)(PPh 3) 2, Ru 3(CO) 12, IrCl(CO)(PPh 3) 2, Pd(PPh 3) 4, etc.

[0076] The amount of the hydrosiliconization catalyst can be set as the catalyst amount, but it is generally preferred to prepare it at a ratio of 0.1 to 500 ppm (mass conversion of platinum group metals) relative to the total mass of components (A), (C), and (E), and more preferably at a ratio of 0.1 to 100 ppm. The hydrosiliconization catalyst of component (D) can be used alone or in combination of two or more.

[0077] [(E) Component] In the curable perfluoropolyether adhesive composition of the present invention, component (E) is a polyfluorinated monoalkenyl compound, which is any component used to reduce the crosslinking density and make it low modulus, having one alkenyl group in one molecule and having a perfluoropolyether structure in the main chain. In particular, it is preferably a polyfluorinated monoalkenyl compound of the following general formula (4). Rf 2-(X') p'-CH=CH 2(4) [In general formula (4), X' is -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- (however, Y' is -CH 2- or a group represented by the following structural formula (Z'), R 2 is a hydrogen atom, methyl, phenyl or allyl), p' is 0 or 1, Rf2 is a perfluoropolyether structure represented by the general formula F-[CF(CF 3)CF 2O] w '-CF(CF 3)- (in the general formula, w' represents an integer from 1 to 300). ] (Dimethylphenylsilene group represented by ortho, meta or para position)

[0078] As a specific example of a polyfluorinated monoolefin compound represented by the above general formula (4), the following compounds can be listed as examples.

[0079]

[0080] (In the above general formula, m is an integer from 1 to 200, especially an integer from 2 to 100.)

[0081] When the polyfluorinated monoolefin compound of the above general formula (4) is formulated, its amount in the curable perfluoropolyether adhesive composition can be selected as 0 to 100 parts by mass relative to the total of 100 parts by mass of the above (A) and (B) components in the composition, and is preferably 1 to 50 parts by mass.

[0082] Furthermore, the polyfluorinated monoolefin compound of component (E) can be used alone or in combination with two or more.

[0083] [Other ingredients] In addition to the ingredients (A) to (E) mentioned above, various formulation agents may be added to this composition as desired.

[0084] ((F) Component) Component (F) is a control agent (hardening control agent) for the hydrosilicification reaction catalyst, and can also be any component. It can be added before heat hardening, for example, when blending the above composition or when using the composition, to prevent the above composition from becoming viscous or initiating gelation. Examples of such components include: 1-ethynyl-1-hydroxycyclohexane, 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-penten-3-ol, phenylbutynol, etc.; 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne, etc.; or polymethyl methacrylate cycloalkanes, organophosphorus compounds, etc.

[0085] The amount of component (F) is in the range of 0 to 5 parts by mass relative to the total of 100 parts by mass of components (A), (B) and (E). When blending, it is preferably in the range of 0.01 to 5 parts by mass, and more preferably in the range of 0.02 to 4 parts by mass. As long as the amount of blending is less than 5 parts by mass, there is no concern about a decrease in the hardening properties of the obtained composition.

[0086] (Filler) Other inorganic fillers include, for example, the following components, and the addition of these components can adjust the hardness and mechanical strength of the gel-cured product obtained from this composition. These components are: aerogel silica (fuming silica, dry silica), precipitated silica (wet silica), colloidal silica, sol-gel silica, crystalline silica (fine quartz powder), fused silica, crushed silica, and other silica fillers with untreated or hydrophobically treated surfaces; iron oxide, zinc oxide, titanium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, carbon black, etc. Hollow inorganic fillers or rubbery spherical fillers can also be added.

[0087] (Adhesive agent) In addition, in order to impart adhesiveness, conventional adhesive agents containing epoxy groups, alkoxy groups, etc. can also be added.

[0088] (Surfactant) Furthermore, in order to impart defoaming properties, conventional surfactants containing fluorine groups can also be added.

[0089] The amount of these formulation components used is arbitrary, depending on the characteristics of the obtained composition and the physical properties of the hardened material.

[0090] Furthermore, the viscosity of the components in this invention at 23°C must be 1000 mPa·s or less. If the viscosity is higher than this, there are concerns that the removal time for air bubbles generated during coating and injection onto substrates such as electronic components will be longer. The above viscosity can be measured according to Japanese Industrial Standard JIS K6249 using a TV-10M type rotational viscosifier.

[0091] The curable perfluoropolyether adhesive composition of the present invention can impart a curable perfluoropolyether adhesive to a curable perfluoropolyether adhesive, which is formed by curing the curable perfluoropolyether adhesive composition. Among these, it is preferred to impart a curable perfluoropolyether adhesive with an insertion angle of 5 to 80 in ASTM D-1403 (1 / 4 cone).

[0092] Any curable perfluoropolyether adhesive composition can impart a curable adhesive with appropriate softness.

[0093] [Cured] By hardening the composition containing the above-mentioned components, a cure with excellent solvent resistance, chemical resistance, etc., can be formed.

[0094] The formation of the cured material can be carried out by the following conventional methods: injecting the composition into a suitable mold and then curing; or, coating the composition onto a suitable substrate and then curing. Curing can be easily carried out by heat treatment at a temperature of 60 to 150°C for 30 to 180 minutes.

[0095] Furthermore, the cured form of the composition in this invention must have a resin modulus of 0.1 to 200 kPa·s at 25°C. If it is less than 0.1 kPa·s, there is a concern that it may be difficult to maintain the shape as an adhesive, and if it exceeds 200 kPa·s, there is a concern that the adhesion to the substrate may be reduced, thereby compromising reliability.

[0096] Furthermore, in this invention, the so-called resin modulus refers to the storage elastic modulus (G') at a certain temperature, which is obtained by measuring the sample (composition, hardened material) under shear conditions with a thickness of 1.0 mm, a diameter of 20 mm, and a frequency of 1 Hz using a conventional dynamic viscoelasticity measuring device.

[0097] [Electrical and Electronic Components] Furthermore, examples of electrical and electronic components sealed by the hardened material of this composition include: barometric pressure sensors, hydraulic pressure sensors, temperature sensors, humidity sensors, rotation sensors, gravity sensors, timing sensors, air flow meters, electronic circuits, semiconductor modules, computer control units, and various other control units. [Example]

[0098] Hereinafter, embodiments and comparative examples will be shown to specifically illustrate the present invention, but the present invention is not limited to the following embodiments. Furthermore, in the following examples, % represents mass%.

[0099] [Examples 1-4, Comparative Examples 1-4] Using the following raw materials, curable perfluoropolyether adhesive compositions as shown in Table 1 were prepared. Viscosity, foaming, and thermal shock tests were performed on each composition using the methods described below. Furthermore, the adhesive compositions were cured at 150°C for 60 minutes, and then the penetration depth, solvent resistance, dynamic viscoelasticity, and DSC tests were performed on each cured product using the methods described below. The results are presented in Table 1.

[0100] Raw material (A) linear perfluoropolyether compound (a-1) difunctional perfluoropolyether (perfluoropolyether 1) CH 2=CH―CH 2―O―CH 2―Rf―CH 2―O-CH 2―CH=CH 2 (Rf:-CF 2O(CF 2CF 2O) 21(CF 2O) 22CF 2-, but the repeating units CF 2CF 2O and CF 2O are arranged randomly)

[0101] (a-2) Difunctional perfluoropolyether (perfluoropolyether 2) CH 2=CH―CH 2―O―CH 2―Rf―CH 2―O-CH 2―CH=CH 2 (Rf:-CF 2O(CF 2CF 2O) 91(CF 2O) 83CF 2-, but the repeating units CF 2CF 2O and CF 2O are arranged randomly)

[0102] (a-3) Difunctional perfluoropolyether (perfluoropolyether 3)

[0103] (a-4) Difunctional perfluoropolyether (perfluoropolyether 4) CH 2=CH―CH 2―O―CH 2―Rf―CH 2―O-CH 2―CH=CH 2 (In the general formula, Rf: -CF 2O(CF 2CF 2CF 2CF 2O) 1(CF 2CF 2CF 2O) 1(CF 2CF 2O) 39(CF 2O) 19CF 2-, but the arrangement of each repeating unit CF 2CF 2CF 2CF 2O, CF 2CF 2CF 2O, CF 2CF 2O and CF 2O is random)

[0104] (B) Nonfunctional perfluoropolyether compound (b-1) Perfluoropolyether 5 CF 3O-(CF 2CF 2CF 2O) b-C 2F 5 (in the general formula, b=27)

[0105] (b-2) Perfluoropolyether 6 CF 3-O-[(CF 2O) d(CF 2CF 2O) e]-CF 3 (d+e=60, d=20, e=40 (average))

[0106] (C) Organohydrosiloxane (c-1) Organohydrosiloxane 1

[0107] (c-2)organohydrosiloxane 2

[0108] (D) Addition reaction catalyst (platinum compound): CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd., trade name)

[0109] (E) Monofunctional perfluoropolyether compound (perfluoropolyether 7)

[0110] (F) Hardening control agent: Ethynylcyclohexanol

[0111] Viscosity was measured at 23°C for the hardening compositions obtained by means of the examples and comparative examples described in Table 1. Furthermore, the viscosity was measured in accordance with Japanese Industrial Standard JIS K6249 using a TV-10M type rotational viscometer.

[0112] Fogging Test: 12g of the obtained composition was placed into a φ30×14mm glass petri dish and left to stand for 5 minutes. Then, the entire glass petri dish was placed in a desiccator for degassing under reduced pressure. Those that did not produce foam were marked as ○, and those that produced foam were marked as ×.

[0113] Penetration Determination: The obtained components were placed into φ30×14mm glass petri dishes and hardened into samples at 150°C for 60 minutes, and then the penetration was measured. Furthermore, the penetration of the hardened samples was measured according to ASTM D-1403 using a 1 / 4 cone.

[0114] Solvent resistance test (weight change) After filling 3g of the composition of Examples 1 to 4 and Comparative Examples 1 and 4 into a 32φ×15mm glass container, a hardened sample was prepared at 150°C for 60 minutes. The sample was then immersed in xylene at 25°C for 7 days, and the weight change rate before and after immersion was measured.

[0115] Dynamic viscoelasticity was measured using a dynamic viscoelasticity measuring apparatus. The components other than Comparative Example 2 were measured under the following conditions: thickness 1.0 mm, diameter 20 mm, frequency 1 Hz, deformation 10%, temperature 150°C, and time 60 minutes. After hardening, the components were cooled and the resin modulus (storage elastic modulus G') at 25°C was measured again under the same conditions.

[0116] Glass transfer point determination: For the hardened products of each component, the glass transfer point is determined by DSC (differential scanning calorimetry) in the range of -130℃ to 25℃ (heating rate 5℃ / min).

[0117] The thermal shock test involves filling the air flow meter 1 shown in Figure 1 with each component, and performing 1000 cycles of -30°C (1 hour) and 150°C (1 hour). Those without any abnormality of peeling from the substrate are marked with ○, and those with peeling are marked with ×. Furthermore, the air flow meter 1 is equipped with a detection unit 3, and each component 2 is filled in such a way that it partially covers the detection unit 3.

[0118] [Table 1] Element (parts by weight) Example Comparative example 1 2 3 4 1 2 3 4 a-1 Perfluoropolyether 1 80 95 80 a-2 Perfluoropolyether 2 45 20 5 a-3 Perfluoropolyether 3 45 a-4 Perfluoropolyether 4 50 b-1 Perfluoropolyether 5 20 80 5 20 95 55 b-2 Perfluoropolyether 6 55 50 E Perfluoropolyether 7 5 2 5 2 5 c-1 Organohydrosiloxane 1 13.4 11.4 23.1 22.3 11.9 c-2 Organohydrosiloxane 2 4.5 1.3 D platinum compounds 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 F Hardening control agent 0.33 0.33 0.33 0.33 0.33 0.33 0.33 0.33 Viscosity (mPa·s) 106 722 350 150 165 85.2 174 1520 Foaming test ○ ○ ○ ○ ○ ○ ○ × Needle penetration 15 35 70 20 3 Unable hardening Unable Measurement 58 Solvent resistance (%) xylene 0.5 1.5 2.3 1.1 0.1 - - 0.9 Resin Modulus (G', kPa・s, 25℃) 35 11 0.8 18 230 - 0.05 6.7 Glass transfer point (°C) -109 -97 -78 -101 -115 - - -64 thermal shock test ○ ○ ○ ○ × - - ○

[0119] As shown in Table 1, adhesives such as those used in Examples 1 to 4 of the curable perfluoropolyether adhesive composition of the present invention exhibit good adhesion in degassing and thermal shock tests after injection into the substrate. Furthermore, the cured products obtained from the above examples have an appropriate insertion depth, possess flexibility suitable for the embedding of electrical and electronic components, and even though the molecule contains component (B) of a linear perfluoropolyether compound without reactive functional groups (i.e., not participating in crosslinking reactions), it still exhibits sufficient solvent resistance and a low glass transition temperature, thus demonstrating excellent low-temperature properties. Furthermore, the resin modulus has an appropriate range, resulting in excellent shape retention and adhesion to the substrate as an adhesive. Moreover, the composition of the present invention has a perfluoropolyether structure, therefore the cured products obtained from this composition (cured perfluoropolyether adhesives) exhibit excellent chemical resistance. In contrast, Comparative Example 1, which excessively contains component (A), an essential component of the present invention, exhibits a high resin modulus and reduced adhesion. Comparative Example 3, which excessively contains component (B), an essential component of the present invention, shows a significantly reduced resin modulus, resulting in deteriorated shape retention as an adhesive. Furthermore, Comparative Example 2, which does not contain component (C), an essential component, fails to cure at all. In Comparative Example 4, the perfluoropolyether composition with a branched structure in the main chain of component (A), the viscosity is high and defoaming is poor, thus foaming was confirmed during vacuum treatment.

[0120] Based on the above results, it can be seen that the present invention will become a fluorinated curable adhesive composition, which not only has excellent heat resistance, chemical resistance, low temperature characteristics and sealing properties after curing, but also has low viscosity before curing. Therefore, even when used as an embedding, sealing material, or coating material for electrical and electronic components, it still has good degassing in a short time, and can be used to improve productivity.

[0121] Furthermore, the present invention is not limited to the above-described embodiments. The above-described embodiments are examples; all embodiments having a structure substantially the same as the technical concept described in the claims of the present invention and capable of performing the same effects are included within the technical scope of the present invention. [Simplified Explanation of the Diagram]

[0024] Figure 1 is a schematic diagram showing an air flow meter used for thermal shock testing. [Biomaterial Storage]

[0123] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A curable perfluoropolyether adhesive composition comprising the following components (A) to (D): (A) 10 to 90 parts by mass of a linear perfluoropolyether compound, wherein one molecule has two or more alkenyl groups and a perfluoropolyether structure comprising repeating units including -CaF2aO- in the main chain (however, the main chain does not have a branched structure, and a is an integer from 1 to 6); (B) 10 to 90 parts by mass of a linear perfluoropolyether compound, wherein one molecule has a perfluoropolyether structure without reactive functional groups (wherein, (A) The total of components (B) is 100 parts by mass; (C) A curing effective amount of organohydrogen polysiloxane, one molecule of which has two or more hydrogen atoms bonded to silicon atoms; and (D) A catalyst amount of hydrogen silane reaction catalyst; and the curing perfluoropolyether adhesive composition has a viscosity (23°C) of less than 1000 mPa·s before curing and can impart a perfluoropolyether adhesive cured product, the perfluoropolyether adhesive cured product having a resin modulus of 0.1 to 200 kPa·s at 25°C after curing.

2. The curable perfluoropolyether adhesive composition as described in claim 1, wherein, The aforementioned component (A) is a linear perfluoropolyether compound represented by the following general formula (1): CH 2=CH-(X') p-Rf 1-(X') p-CH=CH 2(1) [In general formula (1), X' is -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- (however, Y' is -CH 2- or a group represented by the following structural formula (Z'), (dimethylphenylsilenyl represented by ortho, meta or para position), R 2 is a hydrogen atom, methyl, phenyl or allyl) p is independently 0 or 1, R f1 is a perfluoropolyether structure represented by the general formula -[CaF 2aO] w-CF 2- (in the general formula, a represents an integer from 1 to 6, w represents an integer from 1 to 300 and has no branched structure).

3. The curable perfluoropolyether adhesive composition as described in claim 1, wherein, The aforementioned component (B) is one or more linear perfluoropolyether compounds selected from the group consisting of compounds represented by the following general formulas (2) and (3): A-O-(CF 2CF 2CF 2O)b-A(2) (in general formula (2), A is independently a base represented by the general formula C sF 2s+1- (s is an integer from 1 to 3), and b is an integer from 1 to 200); A-O-(CF 2O)d(CF 2CF 2O)e-A(3) (in general formula (3), A is as described above, d and e are each an integer from 0 to 200 and d+e=1 to 250).

4. The curable perfluoropolyether adhesive composition as described in claim 2, wherein, The aforementioned component (B) is one or more linear perfluoropolyether compounds selected from the group consisting of compounds represented by the following general formulas (2) and (3): A-O-(CF 2CF 2CF 2O)b-A(2) (in general formula (2), A is independently a base represented by the general formula C sF 2s+1- (s is an integer from 1 to 3), and b is an integer from 1 to 200); A-O-(CF 2O)d(CF 2CF 2O)e-A(3) (in general formula (3), A is as described above, d and e are each an integer from 0 to 200 and d+e=1 to 250).

5. The curable perfluoropolyether adhesive composition as described in claim 1, wherein, Further comprising a polyfluorinated monoolefin compound represented by the following general formula (4) as component (E): Rf 2-(X') p'-CH=CH 2(4) [in general formula (4), X' is -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- (however, Y' is -CH 2- or a group represented by the following structural formula (Z'), (dimethylphenylsilenyl represented by ortho, meta or para position), R 2 is a hydrogen atom, methyl, phenyl or allyl), p' is 0 or 1, R f2 is a perfluoropolyether structure represented by the general formula F-[CF(CF 3)CF 2O] w'-CF(CF 3)- (in the general formula, w' represents an integer from 1 to 300).

6. The curable perfluoropolyether adhesive composition as described in claim 2, wherein, Further comprising a polyfluorinated monoolefin compound represented by the following general formula (4) as component (E): Rf 2-(X') p'-CH=CH 2 (4) [in general formula (4), X' is -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- ((however, Y' is -CH 2- or a group represented by the following structural formula (Z'), (dimethylphenylsilenyl represented by ortho, meta or para position), R 2 is a hydrogen atom, methyl, phenyl or allyl), p' is 0 or 1, R f2 is a perfluoropolyether structure represented by the general formula F-[CF(CF 3)CF 2O] w'-CF(CF 3)- (in the general formula, w' represents an integer from 1 to 300).] 7. The curable perfluoropolyether adhesive composition as described in claim 3, wherein, Further comprising a polyfluorinated monoolefin compound represented by the following general formula (4) as component (E): Rf 2-(X') p'-CH=CH 2(4) [in general formula (4), X' is -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- (however, Y' is -CH 2- or a group represented by the following structural formula (Z'), (dimethylphenylsilenyl represented by ortho, meta or para position), R 2 is a hydrogen atom, methyl, phenyl or allyl), p' is 0 or 1, R f2 is a perfluoropolyether structure represented by the general formula F-[CF(CF 3)CF 2O] w'-CF(CF 3)- (in the general formula, w' represents an integer from 1 to 300).

8. The curable perfluoropolyether adhesive composition as described in claim 4, wherein, Further comprising a polyfluorinated monoolefin compound represented by the following general formula (4) as component (E): Rf 2-(X') p'-CH=CH 2(4) [in general formula (4), X' is -CH 2-, -OCH 2-, -CH 2OCH 2- or -CO-NR 2-Y'- (however, Y' is -CH 2- or a group represented by the following structural formula (Z'), (dimethylphenylsilenyl represented by ortho, meta or para position), R 2 is a hydrogen atom, methyl, phenyl or allyl), p' is 0 or 1, R f2 is a perfluoropolyether structure represented by the general formula F-[CF(CF 3)CF 2O] w'-CF(CF 3)- (in the general formula, w' represents an integer from 1 to 300).

9. A curable perfluoropolyether adhesive composition as described in any one of claims 1 to 8, which can impart a curable perfluoropolyether adhesive with an insertion angle of 5 to 80 in ASTM D-1403 (1 / 4 cone).

10. A perfluoropolyether adhesive curable material, which is formed by curing the curable perfluoropolyether adhesive composition described in any one of claims 1 to 9.

11. An electrical and electronic component formed by sealing with a perfluoropolyether adhesive cured as described in claim 10.

12. The electrical and electronic components as described in claim 11, wherein, The aforementioned electrical and electronic components are selected from any one of the group consisting of barometric pressure sensors, hydraulic sensors, temperature sensors, humidity sensors, rotation sensors, gravity sensors, timing sensors, air flow meters, electronic circuits, computer control units, and semiconductor modules.

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