Ultrapure water supplying apparatus, substrate processing system, and substrate processing method
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2022-09-20
- Publication Date
- 2023-09-16
Smart Images
Figure TWG2TA000924628_001 
Figure TWG2TA000924628_002 
Figure TWG2TA000924628_003
Abstract
Description
[Technical Field]
[0001] This disclosure relates to an ultrapure water supply device, a substrate processing system including the same, and a substrate processing method using the same; more specifically, it relates to an ultrapure water supply device, a substrate processing system including the same, and a substrate processing method using the same, having a backup function to prepare for unexpected pressure drops. [Cross-Reference to Related Applications]
[0002] This U.S. non-provisional patent application claims priority over Korean Patent Application No. 10-2022-0027913, filed on March 4, 2022, with the Korean Intellectual Property Office, based on 35 USC 119, the entire contents of which are hereby incorporated by reference. [Previous Technology]
[0003] Semiconductor devices are manufactured using various processes. For example, the manufacture of a semiconductor device may include lithography, etching, deposition, polishing, and cleaning processes performed on a wafer (e.g., a silicon wafer). At least one of these processes may include steps performed using ultrapure water (UPW). Ultrapure water has low conductivity and extremely low impurity concentration. Ultrapure water can be generated by a specific process. It is necessary to control the flow rate of the ultrapure water supplied to the substrate processing equipment during the process within a desired range. [Summary of the Invention]
[0004] Embodiments of the present invention provide an ultrapure water supply apparatus configured to stably supply ultrapure water at a specific flow rate or higher (e.g., within a specific flow rate range), a substrate processing system including the present invention, and a substrate processing method using the present invention.
[0005] Embodiments of the present invention provide an ultrapure water supply apparatus configured to address and / or resolve technical problems that may arise when at least one of the pumps fails, a substrate processing system including the present invention, and a substrate processing method using the present invention.
[0006] Embodiments of the present invention provide an ultrapure water supply apparatus configured to address and / or resolve technical problems that may arise when a power supply component fails, a substrate processing system including the present invention, and a substrate processing method using the present invention.
[0007] According to an embodiment of the present invention, an ultrapure water supply device may include: an activated carbon filtration device; an ion exchange resin device connected to the activated carbon filtration device; a reverse osmosis membrane device connected to the ion exchange resin device; a hollow fiber membrane device connected to the reverse osmosis membrane device; a first fluid drive component located between the reverse osmosis membrane device and the hollow fiber membrane device; and a control unit configured to control the first fluid drive component. The first fluid drive component may include: a first pump connected to the reverse osmosis membrane device; a second pump connected to the reverse osmosis membrane device and arranged in parallel with the first pump; a third pump connected to the reverse osmosis membrane device and arranged in parallel with each of the first and second pumps; and a pressure sensor located between the first pump and the hollow fiber membrane device. The control unit may be configured to control each of the first, second, and third pumps based on signals emitted from the pressure sensor.
[0008] According to an embodiment of the present invention, a substrate processing system may include: a substrate processing apparatus; and an ultrapure water supply device configured to supply ultrapure water to the substrate processing apparatus. The ultrapure water supply device may include: a first filtration device; a second filtration device connected to the first filtration device; a fluid drive component located between the first filtration device and the second filtration device; a first power supply component connected to the fluid drive component; and a second power supply component connected to the fluid drive component and spaced apart from the first power supply component. The fluid drive component may include: a first pump connected to the first filtration device to receive power from the first power supply component; a second pump connected to the first filtration device to receive power from the second power supply component, the first pump and the second pump being arranged in parallel; and a pressure sensor located between the first pump and the second filtration device.
[0009] According to an embodiment of the present invention, a substrate processing method may include: supplying ultrapure water to a substrate processing apparatus using an ultrapure water supply device; and processing the substrate in the substrate processing apparatus using the ultrapure water. Supplying ultrapure water to the substrate processing apparatus using the ultrapure water supply device may include controlling a fluid driving component under the control of a control unit, such that fluid sequentially passes through an activated carbon filtration device, an ion exchange resin device, a reverse osmosis membrane device, and a hollow fiber membrane device of the ultrapure water supply device. The fluid driving component may include: a plurality of pumps arranged in parallel between the reverse osmosis membrane device and the hollow fiber membrane device; and a pressure sensor located between the pumps and the hollow fiber membrane device. Controlling the fluid driving component may include controlling each of the pumps based on signals transmitted from the pressure sensor to the control unit.
Implementation Method
[0011] Exemplary embodiments of the concept of the invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments are shown.
[0012] FIG1 is a diagram illustrating a substrate processing system according to a conceptual embodiment of the present invention.
[0013] Referring to FIG1, a substrate processing system PS can be provided. The substrate processing system PS can be configured to perform a specific process on a substrate, said specific process being one of the manufacturing processes of a semiconductor device. For example, the substrate processing system PS can be configured to perform a cleaning process and / or a polishing process on the substrate. In an embodiment, the substrate may be a silicon wafer, but the concept of the invention is not limited to this example. The substrate processing system PS may include an ultrapure water supply device A, a substrate processing equipment SA, a supply conduit 81, a flow control device 83, and a collection conduit 85.
[0014] The ultrapure water supply device A can be configured to generate and supply ultrapure water (UPW). Ultrapure water can be water prepared to have low conductivity and extremely low impurity concentration. For example, ultrapure water can be deionized water (DIW). Impurities can include, for example, ions (e.g., cations and / or anions), chlorine, organic materials, bacteria, and / or other particles. The ultrapure water supply device A can be connected to the substrate processing equipment SA. The ultrapure water generated by the ultrapure water supply device A can be supplied to the substrate processing equipment SA. The ultrapure water supply device A will be described in more detail with reference to FIG2.
[0015] The substrate processing equipment SA can be configured to perform specific processes on the substrate. For example, the substrate processing equipment SA can be configured to perform a cleaning process and / or a polishing process on the substrate. For example, the substrate processing equipment SA can be a cleaning device and / or a polishing device. In order to perform the aforementioned processes on the substrate, it may be necessary to supply ultrapure water to the substrate processing equipment SA. This ultrapure water can be supplied to the substrate processing equipment SA from an ultrapure water supply device A. The substrate processing equipment SA will be described in more detail with reference to Figures 4 and 5.
[0016] The supply conduit 81 can connect the ultrapure water supply device A to the substrate processing equipment SA. Ultrapure water generated in the ultrapure water supply device A can be supplied to the substrate processing equipment SA via the supply conduit 81.
[0017] A flow control device 83 may be placed on a supply conduit 81. The flow control device 83 may be configured to control the flow rate of fluid flowing through the supply conduit 81. For example, the flow control device 83 may be configured to supply ultrapure water from the supply conduit 81 to the substrate processing equipment SA at the flow rate required for the process in the substrate processing equipment SA. For this purpose, the flow control device 83 may include a liquid flow controller (LFC), but the inventive concept is not limited to this example.
[0018] The collection conduit 85 connects the flow control device 83 to the ultrapure water supply unit A. The collection conduit 85 can be a separate conduit from the supply conduit 81. For example, the collection conduit 85 and the supply conduit 81 can be connected to the ultrapure water supply unit A in parallel. A portion of the ultrapure water supplied from the supply conduit 81 but not required by the substrate processing equipment SA can be returned to the ultrapure water supply unit A via the collection conduit 85. This is beneficial for accurately supplying ultrapure water to the substrate processing equipment SA at the desired flow rate.
[0019] Figure 2 is a diagram illustrating an ultrapure water supply device according to a conceptual embodiment of the present invention.
[0020] Referring to Figure 2, the ultrapure water supply device A may include a supply tank 1, multiple filtration devices, a fluid drive component 2, a control unit C, a first power supply component PS1, and a second power supply component PS2.
[0021] Ordinal numbers (e.g., "first," "second," "third," etc.) can be simply used as labels for certain elements, steps, etc., to distinguish them from each other. Terms not described using "first," "second," etc., in the specification may still be referred to as "first" or "second" in the claims. In addition, terms referred to using a specific ordinal number (e.g., "first" in a specific claims) may be described elsewhere using a different ordinal number (e.g., "second" in the specification or another claims).
[0022] The supply tank 1 may contain a fluid for generating ultrapure water. In an embodiment, the fluid may include water. The supply tank 1 may be connected to an external source and may receive fluid from an external source. The fluid may be stored in the supply tank 1 for a period of time and may then be sent to a filtration device.
[0023] The filtration devices can be connected to the supply tank 1. Each of the filtration devices can be configured to remove impurities from the fluid. The fluid that has passed through the filtration devices can be used as ultrapure water. For example, the density of particles with a diameter of 0.1 micrometers or less in the fluid that has passed through the filtration devices can be less than or equal to 20 per cubic centimeter (ea / cm3). The filtration devices can be connected in series with each other. For example, the filtration devices can be arranged such that the fluid passes through the filtration devices sequentially. In an embodiment, four filtration devices can be provided. The four filtration devices can be a first filtration device 3, a second filtration device 5, a third filtration device 7, and a fourth filtration device 9. Each filtration device can include or may be one of an activated carbon filtration device, an ion exchange resin device, a reverse osmosis membrane device, a hollow fiber membrane device, a mill, a membrane degasifier (MDG), a vacuum degasifier (VDG), a continuous electrodeionization (CEDI), a heat exchanger, or a filter with particles of different sizes. In the following text, for ease of explanation, the first filtration device 3 may be referred to as an activated carbon filtration device 3. Additionally, the second filtration device 5 may be referred to as an ion exchange resin device 5. The third filtration device 7 may be referred to as a reverse osmosis membrane device 7. The fourth filtration device 9 may be referred to as a hollow fiber membrane device 9. For example, the first filtration device 3 may be an activated carbon filtration device, the second filtration device 5 may be an ion exchange resin device, the third filtration device 7 may be a reverse osmosis membrane device, and the fourth filtration device 9 may be a hollow fiber membrane device.
[0024] In the activated carbon filtration device 3, a filtration operation using activated carbon can be performed on the fluid. Therefore, the activated carbon filtration device 3 may include activated carbon. The activated carbon filtration device 3 may be connected to the supply tank 1. The fluid supplied from the supply tank 1 can be filtered as it passes through the activated carbon filtration device 3. For example, chlorine and / or organic matter in the fluid can be removed by adsorption while the fluid is passing through the activated carbon filtration device 3.
[0025] In the ion exchange resin device 5, ions can be removed from the fluid using ion exchange resin. For this purpose, the ion exchange resin device 5 may include cation exchange resin and / or anion exchange resin. Cation exchange resin and anion exchange resin may be alternately disposed in the ion exchange resin device 5. Additionally, the ion exchange resin device 5 may further include electrodes for applying a direct current (DC) voltage. The ion exchange resin device 5 may be connected to the activated carbon filter device 3. The fluid that has passed through the activated carbon filter device 3 can be filtered while passing through the ion exchange resin device 5. For example, ions can be removed from the fluid by means of the ion exchange resin device 5.
[0026] In the reverse osmosis membrane device 7, the reverse osmosis phenomenon can be used to perform fluid filtration. For this purpose, the reverse osmosis membrane device 7 may include a reverse osmosis membrane. The reverse osmosis membrane device 7 may be connected to the ion exchange resin device 5. Fluid that has passed through the ion exchange resin device 5 can be filtered when passing through the reverse osmosis membrane device 7. For example, ions and / or particles in the fluid can be removed by the reverse osmosis membrane device 7.
[0027] In the hollow fiber membrane device 9, a filtration operation using a hollow fiber membrane can be performed on the fluid. For this purpose, the hollow fiber membrane device 9 may include a hollow fiber membrane. The hollow fiber membrane device 9 may be connected to the reverse osmosis membrane device 7. The fluid that has passed through the reverse osmosis membrane device 7 can be filtered while passing through the hollow fiber membrane device 9. For example, bacteria and / or particles in the fluid can be removed by the hollow fiber membrane device 9. The fluid that has passed through the hollow fiber membrane device 9 can be supplied to the substrate processing equipment SA (for example, see FIG. 1).
[0028] The above description has been based on an example in which the activated carbon filtration device 3, the ion exchange resin device 5, the reverse osmosis membrane device 7, and the hollow fiber membrane device 9 are sequentially arranged; however, the concept of the present invention is not limited to this example. For instance, the arrangement or configuration of the activated carbon filtration device 3, the ion exchange resin device 5, the reverse osmosis membrane device 7, and the hollow fiber membrane device 9 may be changed depending on the details of the application design.
[0029] The fluid drive component 2 can be configured to move fluid. For example, the fluid drive component 2 can apply / provide driving force to the fluid. The fluid in the supply tank 1 can be passed through a filtration device by the driving force provided by the fluid drive component 2. In addition, the fluid can be supplied from the ultrapure water supply device A to the substrate processing device SA (for example, see FIG1) by the fluid drive component 2. In an embodiment, multiple fluid drive components 2 can be provided. The fluid drive components 2 can be arranged in series with each other. For example, four fluid drive components 2 can be provided. The four fluid drive components 2 can be a first fluid drive component 21, a second fluid drive component 23, a third fluid drive component 25, and a fourth fluid drive component 27.
[0030] The first fluid drive component 21 can be placed between the supply tank 1 and the activated carbon filter 3. The fluid in the supply tank 1 can be moved to the activated carbon filter 3 by the first fluid drive component 21.
[0031] The second fluid drive component 23 can be placed between the activated carbon filter device 3 and the ion exchange resin device 5. The fluid that has passed through the activated carbon filter device 3 can be moved to the ion exchange resin device 5 by means of the second fluid drive component 23.
[0032] The third fluid drive component 25 can be placed between the ion exchange resin device 5 and the reverse osmosis membrane device 7. The fluid that has passed through the ion exchange resin device 5 can be moved to the reverse osmosis membrane device 7 by means of the third fluid drive component 25.
[0033] The fourth fluid drive component 27 may be disposed between the reverse osmosis membrane device 7 and the hollow fiber membrane device 9. The fluid that has passed through the reverse osmosis membrane device 7 can be moved to the hollow fiber membrane device 9 by means of the fourth fluid drive component 27.
[0034] The above description has referred to an example in which four fluid drive components 2 are provided, but the concept of the present invention is not limited to this example. For example, the number of fluid drive components 2 may be one, two, three, five or more. In addition, the arrangement of the fluid drive components 2 may be different from the arrangement shown in FIG. 2. The fluid drive components 2 may include multiple pumps. In the fluid drive components 2, the pumps may be arranged in parallel. This will be described in more detail with reference to FIG. 3.
[0035] The control unit C may be configured to control the fluid drive component 2. For example, the control unit C may control the fluid drive component 2 based on pressure information provided by the fluid drive component 2. For this purpose, the control unit C may include a memory device and a processor. The memory device may be an integrated circuit (IC) chip configured to store programs, instructions, and data for various operations of the fluid drive component 2. The processor may generate control signals for controlling the fluid drive component 2 based on the programs, instructions, and data stored in the memory device. The memory and processor may be mounted on a printed circuit board (PCB) (not shown). The control unit C will be described in more detail below.
[0036] A first power supply component PS1 can provide power to the fluid drive component 2. In an embodiment, the power supplied from the first power supply component PS1 can be used to generate a driving force applied to the fluid from the fluid drive component 2. The first power supply component PS1 can be configured to selectively supply power to at least one of the pumps of the fluid drive component 2. This will be described in more detail below.
[0037] The second power supply component PS2 can provide power to the fluid drive component 2. In an embodiment, the power supplied from the second power supply component PS2 can be used to generate a driving force applied to the fluid from the fluid drive component 2. The second power supply component PS2 can be configured to supply power to at least one of the other pumps in the fluid drive component 2. For example, the second power supply component PS2 can supply power to a pump that is not powered by the first power supply component PS1. This will be explained in more detail below.
[0038] The above description has referred to an example in which two power supply components PS1 and PS2 are provided, but the concept of the present invention is not limited to this example. For example, in some embodiments, three or more power supply components may be provided. In some embodiments, four or five power supply components may be provided.
[0039] Figure 3 is an enlarged view of the portion "X" shown in Figure 2.
[0040] Referring to Figure 3, the fourth fluid drive component 27 may include multiple pumps, multiple conduits, multiple valves, connecting conduit Dx, and pressure sensor PT.
[0041] Pumps (e.g., P1, P2, etc.) may be arranged in parallel with each other. Pumps may be arranged in parallel between the reverse osmosis membrane unit 7 and the hollow fiber membrane unit 9. For example, pumps may be arranged to be connected in parallel to the reverse osmosis membrane unit 7, and pumps may be arranged to be connected in parallel to the hollow fiber membrane unit 9. In an embodiment, when fluid is supplied from the reverse osmosis membrane unit 7 to the hollow fiber membrane unit 9, the fluid may pass through only one of the pumps. In an embodiment, the number of pumps may be four. For example, a first pump P1, a second pump P2, a third pump P3, and a fourth pump P4 may be provided to, for example, a fourth fluid drive unit 27. In an embodiment, all of the first pump P1, the second pump P2, the third pump P3, and the fourth pump P4 may be provided to have the same size, but the inventive concept is not limited to this example. Since the first pump P1, the second pump P2, the third pump P3 and the fourth pump P4 are arranged in parallel, each of the first pump P1, the second pump P2, the third pump P3 and the fourth pump P4 can be connected to the reverse osmosis membrane equipment 7 and the hollow fiber membrane equipment 9.
[0042] The conduits (e.g., D1, D2, etc.) may be arranged in parallel with each other. Each of the conduits connects the reverse osmosis membrane device 7 to the hollow fiber membrane device 9. Each of the pumps may be coupled to a corresponding conduit. In an embodiment, the number of conduits may be four. For example, the four conduits may be connected in parallel between the reverse osmosis membrane device 77 and the hollow fiber membrane device 9. For example, a first conduit D1, a second conduit D2, a third conduit D3, and a fourth conduit D4 may be provided. A first pump P1 may be placed on and coupled to the first conduit D1. A second pump P2 may be placed on and coupled to the second conduit D2. A third pump P3 may be placed on and coupled to the third conduit D3. A fourth pump P4 may be placed on and coupled to the fourth conduit D4.
[0043] Each of the valves (e.g., V1, V2, etc.) may be placed on a corresponding one in the conduit. Each of the valves may be configured to open or close a corresponding one in the conduit. Thus, the flow rate of fluid flowing through the internal space of each of the conduits may be controlled, for example, by means of valves. In an embodiment, the number of valves may be four. For example, a first valve V1, a second valve V2, a third valve V3, and a fourth valve V4 may be provided. The first valve V1 may be placed on a first conduit D1. The second valve V2 may be placed on a second conduit D2. The third valve V3 may be placed on a third conduit D3. The fourth valve V4 may be placed on a fourth conduit D4.
[0044] A connecting conduit Dx may be placed between the pump and the hollow fiber membrane device 9. The connecting conduit Dx may be connected to each of the first conduit D1, the second conduit D2, the third conduit D3, and the fourth conduit D4. The first conduit D1, the second conduit D2, the third conduit D3, and the fourth conduit D4 may be connected to each other via the connecting conduit Dx. For example, fluids flowing through the first conduit D1, the second conduit D2, the third conduit D3, and the fourth conduit D4 may converge within the connecting conduit Dx. The connecting conduit Dx may connect each of the first conduit D1, the second conduit D2, the third conduit D3, and the fourth conduit D4 to the hollow fiber membrane device 9.
[0045] A pressure sensor PT may be placed between the pump and the hollow fiber membrane device 9. For example, the pressure sensor PT may be placed on the connecting conduit Dx. The pressure sensor PT may be configured to measure the pressure of the fluid in the connecting conduit Dx. The pressure sensor PT may include or may be an element for measuring the pressure of the liquid. For example, the pressure sensor PT may include or may be a piezoelectric sensor using the piezoelectric effect. Information about the pressure measured by the pressure sensor PT may be transmitted to the control unit C. For example, the pressure sensor PT may include a pressure transmitter. The pressure transmitter may be configured to transmit a signal (hereinafter referred to as a pressure signal) containing information about the pressure in the connecting conduit Dx to the control unit C. Figure 3 shows an example in which one pressure sensor PT is placed only on the connecting conduit Dx, but the concept of the invention is not limited to this example. For example, a pressure sensor PT may be placed on and coupled to each of the first catheter D1, the second catheter D2, the third catheter D3, and the fourth catheter D4.
[0046] Control unit C can control the first pump P1, the second pump P2, the third pump P3, and the fourth pump P4. For example, control unit C can control the on / off operation of each of the first pump P1, the second pump P2, the third pump P3, and the fourth pump P4 based on the pressure signal emitted by the connecting conduit Dx from the pressure sensor PT. Alternatively, control unit C can control the output of each of the first pump P1, the second pump P2, the third pump P3, and the fourth pump P4. Control unit C will be described in more detail below.
[0047] The first power supply component PS1 can be connected to the first pump P1 and the second pump P2. The first power supply component PS1 can supply power to each of the first pump P1 and the second pump P2. The first power supply component PS1 can not supply power to the third pump P3 and the fourth pump P4.
[0048] The second power supply component PS2 can be connected to the third pump P3 and the fourth pump P4. The second power supply component PS2 can supply power to each of the third pump P3 and the fourth pump P4. The second power supply component PS2 can not supply power to the first pump P1 and the second pump P2.
[0049] The second power supply component PS2 may be an independent component different from the first power supply component PS1. For example, the first power supply component PS1 may be separated from the second power supply component PS2. Therefore, even if one of the first power supply component PS1 and the second power supply component PS2 fails, the other can still operate normally.
[0050] So far, the fourth fluid drive component 27 has been described, but the first fluid drive component 21, the second fluid drive component 23 and the third fluid drive component 25 may be configured to have the same or similar structure as the fourth fluid drive component 27.
[0051] FIG4 is a cross-sectional view showing a substrate processing apparatus according to a conceptual embodiment of the present invention.
[0052] Referring to FIG4, a substrate processing apparatus SAa may be provided. The substrate processing apparatus SAa may be configured to perform a cleaning process on a substrate W. For example, the substrate processing apparatus SAa may be a substrate cleaning device / apparatus. The substrate processing apparatus SAa may include a cleaning chamber 41, a cleaning table 43, a rotary drive component 45, a bowl-shaped object 47, and a cleaning nozzle N1.
[0053] The cleaning chamber 41 may have a cleaning space 4h. A cleaning table 43 may be placed in the cleaning space 4h. The cleaning table 43 may support the substrate W. A rotation drive member 45 may be configured to rotate the cleaning table 43. The substrate W disposed on the cleaning table 43 may be rotated by the rotation drive member 45. A bowl-shaped object 47 may be configured to surround the cleaning table 43. A cleaning nozzle N1 may be spaced apart from the cleaning table 43 in an upward direction. For example, the cleaning nozzle N1 may be placed above the cleaning table 43. The cleaning nozzle N1 may be connected to an ultrapure water supply device A. The cleaning nozzle N1 may receive ultrapure water from the ultrapure water supply device A. The cleaning nozzle N1 may be configured to spray ultrapure water onto the substrate W disposed on the cleaning table 43. Since the rotation drive member 45 rotates the substrate W, the ultrapure water may move toward the edge of the substrate W, and the top surface of the substrate W may be cleaned during this process. For example, ultrapure water can be moved toward the edge of substrate W by centrifugal force to clean the top surface of substrate W.
[0054] For ease of explanation, spatial relative terms such as "below," "under," "lower," "above," and "upper" may be used in this document to describe positional relationships. It should be understood that, in addition to the orientations shown in the figures, spatial relative terms also encompass different orientations of the equipment.
[0055] FIG5 is a perspective view of a substrate processing apparatus according to a conceptual embodiment of the present invention.
[0056] Referring to FIG5, a substrate processing apparatus SAb may be provided. The substrate processing apparatus SAb may be configured to perform a polishing process on a substrate W. For example, the substrate processing apparatus SAb may be a substrate polishing device / apparatus. The substrate processing apparatus SAb may include a polishing head 61, a polishing table 63, a polishing pad 65, an adjustment disk 67, a head drive component HD, an adjustment drive component CD, a slurry supply component SLS, and a polishing nozzle N2.
[0057] The grinding head 61 can support the substrate W. The substrate W supported by the grinding head 61 can be ground by the grinding pad 65. The grinding table 63 can be configured to rotate the grinding pad 65. The grinding pad 65 can be configured to grind the surface of the substrate W while in contact with the substrate W. The adjustment disk 67 can be configured to improve the condition of the top surface of the grinding pad 65. For example, the adjustment disk 67 can grind the top surface of the grinding pad 65. The head drive component HD can be configured to rotate, move, transfer and / or translate the grinding head 61. The adjustment drive component CD can be configured to move the adjustment disk 67. The slurry supply component SLS can supply slurry to the grinding nozzle N2. The grinding nozzle N2 can be connected to the slurry supply component SLS and the ultrapure water supply device A. The ultrapure water supply device A can supply ultrapure water to the grinding nozzle N2. The grinding nozzle N2 can be configured to mix the slurry and ultrapure water supplied from the slurry supply unit SLS and the ultrapure water supply unit A respectively, and spray the mixture onto the grinding pad 65.
[0058] Figures 4 and 5 illustrate examples where the substrate processing apparatus SA shown in Figure 1 is a cleaning or polishing apparatus, but the concept of the present invention is not limited to these examples. For example, the substrate processing apparatus SA may include or may be another apparatus configured to perform a substrate processing process using ultrapure water.
[0059] FIG6 is a flowchart illustrating a substrate processing method according to a conceptual embodiment of the present invention.
[0060] Referring to FIG6, a substrate processing method S can be provided. The substrate processing method S can be used to process a substrate using the substrate processing system PS illustrated with reference to FIG1. The substrate processing method S may include supplying ultrapure water to a substrate processing apparatus (in S1) and processing the substrate in the substrate processing apparatus (in S2).
[0061] Supplying ultrapure water to the substrate processing equipment (in S1) may include controlling the fluid drive component (in S11).
[0062] Controlling the fluid drive component (in S11) may include transmitting a signal from the pressure sensor to the control unit (in S111), transmitting a signal from the pump to the control unit (in S113), executing a first mode (in S131), and executing a second mode (in S133).
[0063] Processing the substrate in the substrate processing apparatus (in S2) may include cleaning the substrate (in S21) or polishing the substrate (in S22).
[0064] In the following text, the substrate processing method S shown in FIG6 will be described in more detail with reference to FIGS. 7 to 9.
[0065] Figures 7 to 9 are diagrams showing the steps of the substrate processing method according to the flowchart shown in Figure 6 in sequence.
[0066] Referring to Figures 7 and 6, supplying ultrapure water to the substrate processing apparatus (in S1) may include extruding fluid F1 to sequentially pass through supply tank 1, activated carbon filter 3, ion exchange resin device 5, reverse osmosis membrane device 7, and hollow fiber membrane device 9. The fluid F1 that has sequentially passed through devices 1, 3, 5, 7, and 9 can be filtered to form ultrapure water. This process can be performed by controlling the fluid drive components (in S11).
[0067] Referring to Figure 8, the first pump P1, the second pump P2, and the third pump P3 can be operated by the control unit C. Simultaneously, the control unit C may not operate the fourth pump P4. This state can be referred to as the first mode. The fourth pump P4, which is not operated in the first mode, can be a standby pump.
[0068] Referring to Figure 9, the second pump P2, the third pump P3, and the fourth pump P4 can be operated by the control unit C. Simultaneously, the control unit C may not operate the first pump P1. This state can be referred to as the second mode. For example, the standby pump can be operated in the second mode.
[0069] Referring back to Figures 8 and 6, transmitting a signal from the pressure sensor to the control unit (in S111) may include transmitting a signal containing information about the pressure of the fluid in the connecting conduit Dx from the pressure sensor PT to the control unit C. In cases where the internal pressure of the connecting conduit Dx is not lower than a reference pressure, the pressure sensor PT may transmit a normal signal to the control unit C. In this case, under the control of the control unit C, the fluid drive component 2 may operate in a first mode. For example, if a normal signal is transmitted, the control unit C may control the fluid drive component 2 so that it operates in the first mode (in S131). The control unit C may not operate the standby pump.
[0070] Referring to Figures 9 and 6, in the case where the internal pressure of the connecting conduit Dx is lower than the reference pressure, the pressure sensor PT can send an abnormal signal to the control unit C. In this case, under the control of the control unit C, the fluid drive component 2 can operate in a second mode. For example, if an abnormal signal is sent, the control unit C can control the fluid drive component 2 so that it operates in the second mode (in S133). The presence of the abnormal signal can indicate a malfunction in at least one of the first pump P1, the second pump P2, or the third pump P3. In this case, the standby pump can operate under the control of the control unit C. Therefore, the internal pressure of the connecting conduit Dx can be restored to a specific level. Therefore, the flow rate of ultrapure water supplied by the ultrapure water supply device A can be maintained at a specific level or higher.
[0071] Referring back to FIG6, transmitting a signal from the pump to the control unit (in S113) may include or may include transmitting a signal from each of the pumps to the control unit C. Each of the pumps may send a signal containing information about its operating status to the control unit C. If the signal transmitted from the first pump P1, the second pump P2, or the third pump P3 indicates that the first pump P1, the second pump P2, or the third pump P3 is not to be operated during the first mode, then the operation may be switched to the second mode under the control of the control unit C. Therefore, the internal pressure of the connecting conduit Dx may be restored to a specific level (e.g., restored to the normal level). Therefore, the flow rate of ultrapure water supplied by the ultrapure water supply device A may be maintained at a specific level or higher (e.g., within the normal level range). Here, the control unit C may interrupt the power supply to the faulty pump. For example, if the first pump P1 is not working, the control unit C may interrupt the power supply to the first pump P1. As an alternative, the control unit C may close the first valve V1 to stop the operation of the first pump P1. In this scenario, fluid F1 may not be supplied to the first pump P1. Fluid F1 may flow only through the second pump P2, the third pump P3, and the fourth pump P4. The above description has referenced an example in which a valve (e.g., the first valve V1) is automatically opened and closed under the control of the control unit C, but the concept of the invention is not limited to this example. For instance, the valve (e.g., the first valve V1) may be a passive valve, whose opening / closing operation can be performed manually.
[0072] In the ultrapure water supply apparatus, the substrate processing system including it, and the substrate processing method using it according to embodiments of the present invention, multiple pumps can be arranged in parallel on the path for supplying ultrapure water. Therefore, even when at least one pump malfunctions, the total flow rate can be managed to a specific level (e.g., maintained within the normal range). This can be beneficial for stably supplying ultrapure water to the substrate processing equipment and thereby increasing the yield in the substrate fabrication process.
[0073] In the ultrapure water supply apparatus, the substrate processing system including it, and the substrate processing method using it according to embodiments of the present invention, a standby pump can be operated when a pressure sensor senses an undesirable decrease in total pressure. For example, if one of the pumps in the first mode operates abnormally or malfunctions, the pressure can be reduced. In this case, the pressure reduction can be sensed by the pressure sensor, and the standby pump can be operated by the control unit. This can be beneficial for supplying ultrapure water at a desired flow rate or a higher flow rate.
[0074] In the ultrapure water supply apparatus, the substrate processing system including it, and the substrate processing method using it according to a conceptual embodiment of the present invention, multiple power supply components can be used to supply power to each of the pumps arranged in parallel. Therefore, even if one of the power supply components malfunctions, the other power supply components can still be used to operate the pumps. This can help prevent the ultrapure water supplied to the substrate processing equipment from being interrupted.
[0075] In the ultrapure water supply apparatus, the substrate processing system including the same, and the substrate processing method using the same according to the present invention, ultrapure water may be supplied stably at a specific flow rate or a higher flow rate.
[0076] In the ultrapure water supply apparatus, the substrate processing system including it, and the substrate processing method using it according to the conceptual embodiments of the present invention, it may be possible to prepare for technical problems that may occur when at least one of the pumps fails.
[0077] In the ultrapure water supply device, the substrate processing system including the same, and the substrate processing method using the same according to the conceptual embodiments of the present invention, it may be possible to prepare for technical problems that may occur when the power supply component fails.
[0078] Although exemplary embodiments of the concept of the present invention have been specifically shown and described, those skilled in the art will understand that changes in form and detail may be made herein without departing from the spirit and scope of the appended claims. [Simplified Explanation of the Diagram]
[0010] FIG1 is a diagram illustrating a substrate processing system according to an embodiment of the present invention. FIG2 is a diagram illustrating an ultrapure water supply device according to an embodiment of the present invention. FIG3 is an enlarged view showing the portion "X" shown in FIG2. FIG4 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention. FIG5 is a perspective view showing a substrate processing apparatus according to an embodiment of the present invention. FIG6 is a flowchart showing a substrate processing method according to an embodiment of the present invention. FIG7 to FIG9 are diagrams showing the steps of the substrate processing method according to the flowchart shown in FIG6 in sequence.
Claims
1. An ultrapure water supply device, comprising: Activated carbon filtration equipment; An ion exchange resin device is connected to the activated carbon filter device; A reverse osmosis membrane device is connected to the ion exchange resin device; A hollow fiber membrane device is connected to the reverse osmosis membrane device; a first fluid drive component is located between the reverse osmosis membrane device and the hollow fiber membrane device; and a control unit configured to control the first fluid drive component, wherein the first fluid drive component includes: a first pump connected to the reverse osmosis membrane device; a second pump connected to the reverse osmosis membrane device and arranged in parallel with the first pump; a third pump connected to the reverse osmosis membrane device and arranged in parallel with each of the first pump and the second pump; and a pressure sensor located between the first pump and the hollow fiber membrane device, wherein the control unit is configured to control each of the first pump, the second pump and the third pump based on a signal emitted from the pressure sensor.
2. The ultrapure water supply device as claimed in claim 1, wherein the first fluid drive component comprises: A first conduit is coupled to the first pump; A second conduit is coupled to the second pump; A third conduit is coupled to the third pump; and a connecting conduit, connected to each of the first conduit, the second conduit and the third conduit, to connect each of the first conduit, the second conduit and the third conduit to the hollow fiber membrane device, wherein the pressure sensor is placed on the connecting conduit.
3. The ultrapure water supply device as claimed in claim 2, wherein the pressure sensor is configured to generate an abnormal signal when the pressure in the connecting conduit is lower than a reference pressure, the abnormal signal enabling the control unit to sense the abnormality.
4. The ultrapure water supply apparatus as claimed in claim 3, wherein the control unit is configured to selectively perform one of the following: a first mode of operating the first pump and the second pump but not the third pump; and a second mode of operating the third pump.
5. The ultrapure water supply device as claimed in claim 4, wherein the control unit is configured to execute the second mode when the abnormal signal from the pressure sensor is transmitted to the control unit.
6. A substrate processing system, comprising: Substrate processing equipment; An ultrapure water supply device is configured to supply ultrapure water to the substrate processing equipment, wherein the ultrapure water supply device includes: a first filtration device; a second filtration device connected to the first filtration device; a fluid drive component located between the first filtration device and the second filtration device; a first power supply component connected to the fluid drive component; and a second power supply component connected to the fluid drive component and spaced apart from the first power supply component, wherein the fluid drive component includes: a first pump connected to the first filtration device to receive power from the first power supply component; a second pump connected to the first filtration device to receive power from the second power supply component, the first pump and the second pump being arranged in parallel; and a pressure sensor located between the first pump and the second filtration device.
7. The substrate processing system of claim 6, wherein each of the first filtration device and the second filtration device comprises an activated carbon filtration device, an ion exchange resin device, a reverse osmosis membrane device, or a hollow fiber membrane device.
8. The substrate processing system of claim 6, wherein the fluid driving component comprises: A first conduit is coupled to the first pump; A second conduit is coupled to the second pump; And a connecting conduit, connected to each of the first conduit and the second conduit, to connect each of the first conduit and the second conduit to the second filtration device, wherein the pressure sensor is placed on the connecting conduit.
9. A substrate processing method, comprising: Ultrapure water is supplied to the substrate processing equipment using an ultrapure water supply unit; The substrate is processed in the substrate processing equipment using the ultrapure water, wherein supplying the ultrapure water to the substrate processing equipment using the ultrapure water supply device includes controlling a fluid driving component under the control of a control unit, such that the fluid sequentially passes through an activated carbon filtration device, an ion exchange resin device, a reverse osmosis membrane device, and a hollow fiber membrane device of the ultrapure water supply device, wherein the fluid driving component includes: a plurality of pumps arranged in parallel between the reverse osmosis membrane device and the hollow fiber membrane device; And a pressure sensor, located between the pump and the hollow fiber membrane device, wherein controlling the fluid drive components includes controlling each of the pumps based on signals emitted from the pressure sensor to the control unit.
10. The substrate processing method as claimed in claim 9, wherein the fluid driving component comprises: Multiple conduits are coupled to the pump, respectively; A connecting conduit is provided to each of the conduits connected to the hollow fiber membrane device, wherein the pressure sensor is placed on the connecting conduit. Controlling the fluid drive component includes transmitting a signal generated by the pressure sensor to the control unit. Transmitting the signal to the control unit includes transmitting a normal signal from the pressure sensor to the control unit when the pressure in the connecting conduit is not lower than a reference pressure. And when the pressure in the connecting conduit is lower than the reference pressure, an abnormal signal is transmitted from the pressure sensor to the control unit.