Method and apparatus for substrate alignment

Abstract

A semiconductor wafer transport apparatus having a transport arm and at least one end effector. An optical edge detection sensor is coupled to the transport arm and is configured so as to register and effect edge detection of a wafer supported by the end effector. An illumination source illuminates a surface of the wafer and is disposed with respect to the optical edge detection sensor so that the surface directs reflected surface illumination, from the illumination source, toward the optical edge detection sensor, and optically blanks, at the peripheral edge of the wafer, background reflection light of a background, viewed by the optical edge detection sensor coincident with linear traverse of the wafer supported by the at least one end effector. The peripheral edge of the wafer is defined in relief in image contrast to effect edge detection coincident with traverse of the wafer supported by the end effector.

Description

[Technical Field]

[0001] The exemplary embodiments generally relate to a semiconductor processing apparatus, and more specifically to semiconductor substrate alignment. [Previous Technology]

[0002] In semiconductor manufacturing, substrates such as semiconductor wafers need to be aligned to a specific orientation before numerous operations, including processing and identification tracking. Typically, this is done by aligning the substrate with a rotary aligner or by imaging the substrate against a backlight. The rotary aligner rotates the edge of the substrate, which is then observed by an imaging system to identify the outline of a notch on the substrate. Imaging the backlight substrate also involves using an imaging system to identify the outline of the notch. However, it is not necessary to rotate the substrate as with a rotary aligner. These alignment processes work well for the front-end operations of substrates on the production line, but can cause problems for the back-end substrate processing.

[0003] In the back-end substrate processing, the substrate can be in the form of a molded substrate. A molded substrate is, for example, a standard substrate that already has a top or front surface covered with epoxy resin during the molding process, making only the bottom side of the substrate visible. The molding process also fills the notches in the substrate with epoxy resin, which prevents the aforementioned rotational alignment method and backlight alignment method from identifying the outline of the notches (i.e., the outline of the notches is no longer visible or difficult to detect). [Summary of the Invention]

[0004] A semiconductor wafer transfer apparatus includes: a frame; a transfer arm movably mounted to the frame and having at least one terminator movably mounted to the transfer arm, such that the at least one terminator is linearly lateralized relative to the frame; an optical edge detection sensor coupled to the transfer arm and configured to register and perform edge detection of a wafer supported by the at least one terminator; and an illumination source connected to the frame, the illumination source being configured to illuminate a surface of the wafer supported by the at least one terminator, the surface depicting a peripheral edge of the wafer, the illumination source being configured relative to the optical edge detection sensor such that surface illumination reflected by the surface is directed from the illumination source to the optical edge detection sensor, and background reflections of the background at the peripheral edge of the wafer are optically blanked, the background reflections of the background being observed by the optical edge detection sensor to coincide with the linear lateralization of the wafer supported by the at least one terminator; The peripheral edge of the wafer is defined in an image contrast, formed by the reflection of the wafer surface and the optically blanked background, and is registered by the optical edge detection sensor between the reflection of the wafer surface and the optically blanked background to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

Implementation Method

[0031] Figures 1A, 1B, and 1C illustrate exemplary substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165 according to the present disclosure. Although various aspects of the present disclosure will be described with reference to the figures, it should be understood that various aspects of the present disclosure may be embodied in a variety of forms. In addition, any suitable size, shape, or type of element or material may be used.

[0032] This disclosure provides an apparatus and method for aligning a substrate S. The substrate S can be any suitable substrate, including but not limited to semiconductor wafers, flat panel displays, or any other suitable semiconductor substrate. The embodiments of this disclosure can also be employed in one or more semiconductor processes. For example, the embodiments of this disclosure can be employed in the front end of a production line process 140 (e.g., typically including thin film processes using vacuum, such as etching, chemical vapor deposition, plasma vapor deposition, implantation, metering, rapid thermal processing, dry stripping of atomic layers, oxidation / diffusion, nitride formation, photolithography, epitaxy, or other thin film processes for fabricating various semiconductor structures patterned in a semiconductor, but excluding the deposition of metal interconnect layers). The embodiments of this disclosure can be employed in the back end of a production line process 160 (e.g., typically associated with the fabrication of metal interconnect layers of the semiconductor structure formed by the front end of the production line process 140, and including any suitable processing steps up to and including the final passivation layer fabrication at the front end of the production line process). The various samples disclosed herein can be employed in back-end processing 170 (e.g., typically including substrate testing, substrate back-side surface polishing, die separation, die testing, integrated circuit (IC) packaging, and final testing).

[0033] In one embodiment, this disclosure provides an in-situ alignment device on a substrate conveyor 180 for onboard alignment of the substrate S during transport / during linear and / or arcuate lateral movements of the substrate S (i.e., simultaneously while being carried / held by a substrate holder of the substrate conveyor 180), held by the substrate conveyor 180 from one substrate holding position to another. Another embodiment of this disclosure provides a fixed substrate alignment stage to which the substrate transport device 180 transports a fixed substrate S for alignment.

[0034] Various embodiments of this disclosure include a machine vision system that provides a controlled high-contrast image of at least a portion of a substrate S to identify notches 350 (FIG. 3A) and / or other suitable features in the substrate, regardless of whether the outline of the notches and / or other features is blocked / filled by epoxy resin (e.g., molding material 370 (FIG. 3A) used in back-end processing 170) covering the front surface TS of the substrate S (i.e., whether the substrate is a molded substrate or not). The machine vision system includes elements such as the contrast surface described herein that provide a controlled (e.g., without features that would obscure the notches 350 and / or other features) contrast image of a highly reflective surface (e.g., the bottom surface BS in the case of back-end processing 170, or, in the case of front-end processing 140 and back-end processing 160, for example, the front surface TS or the bottom surface BS of the substrate S) so that an image of that portion of the substrate S can be captured and analyzed in any suitable manner to identify the location of the notches 350 and / or other features of the substrate S. The misalignment angle and alignment offset of the center SC of the substrate S, along with the edge shape of the substrate S (e.g., including the diameter of the substrate S), can be determined in any suitable manner from the image of that portion of the substrate S and the position of the notch 350.

[0035] Referring to FIG. 1A, the substrate processing apparatus 100 includes a vacuum isolation chamber port 120, a transfer chamber 130, and any suitable production line processing front end 140 as described above. The vacuum isolation chamber port 120 is coupled to the transfer chamber 130 and configured to interface any suitable substrate carrier 110 to the transfer chamber 130. The transfer chamber 130 is coupled to the production line processing front end 140 and includes any suitable openings and / or valves through which substrates are passed between the transfer chamber 130 and the production line processing front end 140. The transfer chamber 130 includes a substrate conveyor 180 configured to transfer substrates between the carrier 110 and the production line processing front end 140. The carrier 110 can be any suitable carrier 110, such as a front-opening carrier (shown in FIG. 1A and FIG. 1B – a suitable example is a front-opening unified pod (FOUP)) or a bottom-opening carrier (a suitable example is a standard mechanical interface (SMIF) pod). In one embodiment, carrier 110 may be substantially similar to the carrier described in U.S. Patent No. 9,105,673, issued August 11, 2015 (titled “Side Opening Unified Pod”), the disclosure of which is incorporated herein by reference in its entirety. In one embodiment, transfer chamber 130 has the same atmosphere (e.g., a vacuum atmosphere) as the production line processing front end 140. In other embodiments, transfer chamber has an atmospheric environment, and production line processing front end 140 includes any suitable vacuum isolation chamber for transferring substrate S between production line processing front end 140 and transfer chamber 130 without degrading the processing atmosphere of production line processing front end 140.

[0036] Referring to FIG1B, as described above, the substrate processing apparatus 150 includes a vacuum isolation chamber port 120, a transfer chamber 130, and any suitable production line processing end point 160. The vacuum isolation chamber port 120 is coupled to the transfer chamber 130 and configured to connect any suitable substrate carrier 110 to the transfer chamber 130. The transfer chamber 130 is coupled to the production line processing end point 160 and includes any suitable openings and / or valves through which substrates are passed between the transfer chamber 130 and the production line processing end point 160. The transfer chamber 130 includes a substrate conveyor 180 configured to transfer substrates between the carrier 110 and the production line processing end point 160. The carrier 110 can be any suitable carrier 110, such as a front-opening carrier (shown in FIG1A and FIG1B – a suitable example is a front-opening unified pod (FOUP)) or a bottom-opening carrier (a suitable example is a standard mechanical interface (SMIF) pod). In one embodiment, the carrier 110 may be substantially similar to those described in U.S. Patent No. 9,105,673, entitled “Side-Opening Uniform Container,” issued August 11, 2015, the disclosure of which is incorporated herein by reference in its entirety. In one embodiment, the transfer chamber 130 has the same atmosphere (e.g., a vacuum atmosphere) as the production line processing back-end 160; while in other embodiments, the transfer chamber has an atmospheric environment, and the production line processing back-end 160 includes any suitable vacuum isolation chamber for transferring the substrate S between the production line processing back-end 160 and the transfer chamber 130 without degrading the processing atmosphere of the production line processing back-end 160.

[0037] Referring to FIG1C, as described above, the substrate processing apparatus 165 includes a vacuum isolation chamber port 120, a transfer chamber 130, and any suitable back-end processing 170. The vacuum isolation chamber port 120 is coupled to the transfer chamber 130 and configured to connect any suitable substrate carrier 110 to the transfer chamber 130. The transfer chamber 130 is coupled to the back-end processing 170 and includes any suitable openings and / or valves through which substrates are passed between the transfer chamber 130 and the back-end processing 170. The transfer chamber 130 includes a substrate conveyor 180 configured to convey substrates between the carrier 110 and the back-end processing 170. The carrier 110 can be any suitable carrier, such as a front-opening carrier (shown in FIG1A and FIG1B – a suitable example is a front-opening unified pod (FOUP)) or a bottom-opening carrier (a suitable example is a standard mechanical interface (SMIF) pod). In one embodiment, the carrier 110 may be substantially similar to those described in U.S. Patent No. 9,105,673, entitled “Side-Opening Uniform Container”, issued August 11, 2015, the disclosure of which is incorporated herein by reference in its entirety.

[0038] Referring now to FIG. 2J, various embodiments of the present disclosure will be described relative to an atmospheric transfer robot 180 (referred to herein as substrate transfer), but it should be understood that the embodiments disclosed are equivalently applicable to a vacuum transfer robot. It will be appreciated that the substrate transferor 180 is mounted to a linear slider (described in more detail below) or a boom (as described in U.S. Patent Application Serial No. 14 / 377,987, filed August 11, 2014, entitled “Substrate Processing Apparatus,” the disclosure of which is incorporated herein by reference in its entirety), thereby allowing movement at least in the X and / or Y directions; while in other embodiments, the substrate transferor 180 is mounted such that the base 240 of the substrate transferor 180 is fixed so as not to move in the X and / or Y directions. The configurations shown are representative for illustrative purposes only, and the arrangement, shape, and placement of the shown components may be varied as needed without departing from the scope of the invention.

[0039] As can be seen in Figure 2J, in one embodiment, the substrate conveyor 180 is movably mounted to the frame 130F of the transfer chamber 130, or in other embodiments, the substrate conveyor 180 is movably mounted to the frame of any suitable module of the substrate handling tool, such as a frame at the front end of a production line processing module or a frame at the rear end of a production line processing module. In this embodiment, the substrate conveyor 180 includes any suitable number of drive shafts to move substrates along one or more of the X, Y, Z, θ, and R (substrate holder or terminator extension) axes. For example, the substrate conveyor 180 includes a conveyor arm 180TA, which in one embodiment is mounted to a bracket 241 such that the conveyor arm 180TA is movably mounted to the frame 130F. In one embodiment, the bracket 241 is mounted to a slider 241S to be movable in the X direction. In other embodiments, the bracket 241 is mounted to the frame 130F to be fixed in the X direction (and / or Y direction). In one configuration, any suitable actuator 242 is mounted to the frame 130F and drivenly connected to the bracket 241 by any suitable transmission 242T for moving the base 240 in the X direction. In this configuration, the transmission 242T is a pulley drive and the actuator 242 is a rotary actuator; however, in other configurations, the actuator 242 is a linear actuator, drivenly connected to the bracket 241 by any suitable transmission or without a transmission (e.g., if the bracket includes a drive portion of a linear actuator).

[0040] Referring also to FIG. 2A, a substrate conveyor 180 according to the present disclosure is shown. The substrate conveyor 180 includes any suitable conveying arm 180TA, for example, the linear sliding conveying arm 214 shown in FIG. 2D, or any other suitable arm with any suitable arm linkage mechanism (e.g., those shown in FIG. 2C-2F). Suitable examples of arm linkage mechanisms may be found, for example, in U.S. Patent No. 7,578,649, granted August 25, 2009; U.S. Patent No. 5,794,487, granted August 18, 1998; U.S. Patent No. 7,946,800, granted May 24, 2011; U.S. Patent No. 6,485,250, granted November 26, 2002; U.S. Patent No. 7,891,935, granted February 22, 2011; U.S. Patent No. 8,419,341, granted April 16, 2013; and U.S. Patent Application Serial No. 13 / 10, filed November 10, 2011, entitled "Dual-Arm Robot". The entire contents of U.S. Patent Application Serial No. 293,717, entitled “Linear Vacuum Robot with Z-Motion and Articulated Arm”, filed September 5, 2013; U.S. Patent No. 7,648,327, entitled “Wafer Engine”, granted January 19, 2010; U.S. Patent Application Serial No. 16,257,595, entitled “Automatic Wafer Alignment Method and Apparatus”, filed January 25, 2019; and U.S. Patent Application Serial No. 14,928,352, entitled “Wafer Aligner”, filed October 30, 2015, are incorporated herein by reference.

[0041] In various embodiments disclosed herein, at least one transfer arm 180TA may be or be derived from a known selectively compliant articulated robot arm (SCARA) type design (see SCARA arm 219 in FIG. 2G), which includes an upper arm, a driven forearm, and a constrained end-joint, or from a telescopic arm or any other suitable arm design, such as a Cartesian linear sliding arm (see FIG. 2A), wherein any such design configuration as further described herein also includes a slider 220, an aligner 181, and substrate holders 200A and 200B. For example, in one embodiment, the slider 220 is mounted to the arm link of any suitable articulated transfer arm. Suitable examples of transfer arms can be found, for example, in U.S. Patent Application Serial No. 12 / 117,415, filed May 8, 2008, entitled “Baseboard Transfer Device with Multiple Movable Arms Utilizing a Mechanical Switching Mechanism,” and U.S. Patent No. 7,648,327, granted January 19, 2010, the entire disclosure of which is incorporated herein by reference. The operation of the transfer arms can be independent of each other (e.g., the extension / retraction of each arm is independent of the others), can be operated by an invalid transfer switch, or can be operably linked in any suitable manner so that the arms share at least one common drive shaft. In other embodiments, the transfer arms can have any other desired arrangement, such as a frog-leg arm 216 (FIG. 2C) configuration, a jumping frog arm 217 (FIG. 2F) configuration, or a double-symmetric arm 218 (FIG. 2E).Suitable examples of conveyor arms may be found in U.S. Patent No. 6,231,297, issued May 15, 2001; U.S. Patent No. 5,180,276, issued January 19, 1993; U.S. Patent No. 6,464,448, issued October 15, 2002; U.S. Patent No. 6,224,319, issued May 1, 2001; U.S. Patent No. 5,447,409, issued September 5, 1995; U.S. Patent No. 7,578,649, issued August 25, 2009; U.S. Patent No. 5,794,487, issued August 18, 1998; and U.S. Patent No. 7,946,800, issued May 24, 2011. The entire contents of U.S. Patent No. 6,485,250, issued November 26, 2002; U.S. Patent No. 7,891,935, issued February 22, 2011; U.S. Patent Application Serial No. 16 / 257,595, filed January 25, 2019 (titled “Automatic Wafer Alignment Method and Apparatus”); U.S. Patent Application Serial No. 13 / 293,717, filed November 10, 2011 (“Dual-Arm Robot”); and U.S. Patent Application Serial No. 13 / 270,844, filed October 11, 2011 (titled “Coaxial Driven Vacuum Robot”) are incorporated herein by reference.

[0042] Referring again to FIG2A, the substrate conveyor 180 includes a rotary driver 262, a Z-drive post 280, a slider 220, and one or more substrate holders 200A and 200B (also referred to as terminators). The rotary driver 262 is any suitable rotary driver mounted to a frame 130F of the conveyor chamber 130 or a sliding frame 241 of the conveyor chamber 130, wherein the sliding frame 241 is configured to linearly move the substrate conveyor 180 along the length of the conveyor chamber 130. The substrate conveyor may include a Z-drive post 280 mounted to the output of the rotary driver 262 for rotation about an θ axis (e.g., the θ direction – see also FIG2H) in the direction of arrow T. The slider 220 is movably mounted to the Z-drive post 280, wherein the Z-drive post 280 includes any suitable drive motor and / or transmission for moving the slider 220 in the Z direction. It can be recognized that the relative position of the Z-drive column 280 with respect to the slider 220 provides sufficient clearance to allow the substrate holder 200A, substrate holder 200B and substrate S to move sufficiently to achieve substrate detection by the alignment device 181, as further described below.

[0043] One or more (at least one) substrate holders 200A and 200B are movably mounted to the slider 220 in any suitable manner, thereby extending and retracting along the R direction. Although two substrate holders 200A and 200B are shown for illustrative purposes only, it should be understood that any suitable number of substrate holders can be mounted to the slider 220 (i.e., coupled to the slider 220 to be attached to and move / slide along the slider 220). For example, in one embodiment, a single substrate holder is present mounted to the slider 220 for transferring and aligning the substrate(s) in the manner described herein. In other embodiments, more than two substrate holders are mounted to the slider 220 for transferring and aligning the substrates in the manner described herein.

[0044] It will be appreciated that one or more substrate holders 200A and 200B are laterally moved as a unit with the transfer arm 180TA in a first direction (e.g., one or more of the X, Y, and Z directions) relative to the frame 130F, and linearly laterally moved relative to the transfer arm 180TA in a second direction (e.g., the R direction) different from the first direction. The slider 220 includes one or more linear actuators 225 configured to independently move each substrate holder 200A and 200B in the R direction. The one or more linear actuators 225 are any suitable actuators having any suitable drive mechanism that is substantially similar in one form to, for example, U.S. Patent No. 10,134,621 (titled “Substrate Transfer Apparatus”), issued November 20, 2018, the entire contents of which are incorporated herein by reference. The substrate holders 200A and 200B are arranged on the slider 220 such that they are stacked on top of each other, thus having a common extension and retraction R-axis.

[0045] According to embodiments of the present disclosure, substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165 include an aligner 181 for aligning substrates, as will be described herein. In one embodiment, the aligner 181 may be in situ on the substrate conveyor 180; in other embodiments, at least a portion of the aligner 181 may be disposed outside the substrate conveyor 180, or the aligner 181 may be a fixed substrate alignment stage. It should be noted that although the substrate conveyor 180 and the aligner 181 are shown as being located within the transfer chamber 130, in other embodiments, the substrate conveyor 180 and the aligner 181 may be located in any suitable portion of the substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165, which include, but are not limited to, processing modules of the front-end processing 140, processing modules of the back-end processing 160, and / or processing modules of the back-end processing 170.

[0046] The aligner 181 is an alignment / machine vision system that includes one or more image sensors 270 and one or more controlled surfaces 271 (also referred to herein as contrast surfaces). In one embodiment, referring to Figures 2A and 2B, the aligner 181 includes one or more image sensors 270 mounted on a transfer arm 180TA (e.g., on a slider 220) and one or more controlled surfaces 271. In one embodiment, the image sensors 270 are mounted on the transfer arm 180TA such that one or more image sensors 270 move relative to the frame 130F as a unit with the transfer arm 180TA; while in other embodiments, one or more image sensors 270 are fixed to the frame 130F, thereby allowing the transfer arm 180TA to move independently of the image sensors 270. It should be noted that one or more image sensors 270 may be calibrated differently (e.g., calibrated in a reference frame for substrate transfer or in an overall reference frame), depending on whether one or more image sensors 270 are mounted to the transfer arm 180TA or fixed to the frame 130F, as will be described herein.

[0047] One or more image sensors 270 (also referred to herein as optical edge detection sensors) can be any suitable imaging sensor / camera. For example, the imaging sensor / camera can be an analog or digital device having an interlaced or progressive scan configuration employing area or line scan. The imaging sensor / camera can be configured to capture monochrome or color images. The imaging sensor / camera can be configured with a bulk shutter (e.g., for high-speed movement) or a rolling shutter. The imaging sensor / camera can have any suitable frame rate and resolution to capture features of the substrate S described herein. Suitable examples of imaging sensors / cameras include, but are not limited to, charge-coupled device (CCD) sensors / imagers, complementary metal-oxide-semiconductor (CMOS) sensors / imagers, or any other suitable imaging sensor.

[0048] Referring again to Figures 2A and 2B, in one embodiment, one or more image sensors 270 are coupled to a transfer arm 180TA and are arranged to register and perform edge detection of a substrate S supported by at least one substrate holder 200A and substrate holder 200B. The one or more image sensors 270 are configured to measure / detect the edge SE of the substrate S to determine one or more predetermined characteristics of the substrate S, such as wafer diameter, location of a fiducial datum (FID) position (e.g., notch / plane, mark, or other feature), location of the wafer centerline, location of the wafer center SC, or any other suitable information relating to the wafer carried by the substrate holders 200A and 200B. It can be understood that in this configuration, one or more image sensors 270 are mounted to the transfer arm 180TA, such that the one or more image sensors 270 move relative to the frame 130F as a unit with the transfer arm 180. The one or more image sensors 270 are common sensors (e.g., common for each substrate holder 200A, substrate holder 200B and the substrate S carried thereon), enabling instantaneous edge detection / alignment of each substrate of one or more wafers S supported simultaneously by one or more substrate holders 200A, substrate holder 200B.

[0049] As will be described in more detail below, one or more image sensors 270 are configured such that real-time edge detection of each substrate is achieved by linear lateral movement of each of the substrate holders 200A and 200B in a second direction on the substrate transporter 180 and coincides with the linear lateral movement of each of the substrate holders 200A and 200B in the second direction on the substrate transporter 180. For example, each substrate holder 200A and 200B linearly transports the corresponding substrate S located on the substrate holders 200A and 200B of one or more substrates S simultaneously supported by the substrate holders 200A and 200B in the second direction (e.g., along the axis of extension and retraction R) relative to the one or more image sensors 270 that realize at least one edge SE detection of the substrate S.

[0050] As described above, one or more image sensors 270 are imaging devices configured to measure / detect the edge position of a wafer and / or a wafer reference (e.g., a notch), as will be described in more detail below. In one embodiment, the image sensor 270 is configured to detect any suitable portion (such as the leading and trailing edges) of the edge SE of the substrate S and identify therefrom the substrate position and misalignment relative to a predetermined reference frame, such as the reference frame of the substrate conveyor 180, the overall reference frame of the substrate processing apparatus 100, the substrate processing apparatus 150, the substrate processing apparatus 165, and / or the reference frame of any suitable substrate holding stage. As an example, the image sensor 270 is configured to detect the arc of the edge SE of the substrate S (e.g., see Figures 3B and 6A) (e.g., by detecting multiple points defining the arc of the edge SE of the substrate S, or multiple points of a continuous or substantially continuous scan of the arc of the edge SE of the substrate S). In another embodiment, the image sensor 270 may also be configured to read, for example, substrate identification marking features, such as alphanumeric identifiers, QR codes, or other suitable identification marks located on the substrate S; and so on. In yet another embodiment, an identification reader 230 (separate from and different from one or more image sensors 270) may be provided on the substrate transmitter 180 to read substrate identification marking features.

[0051] In some samples, since the front surface TS of the substrate S can be covered with epoxy resin, one or more image sensors 270 are configured in one sample to scan / image the bottom surface BS (e.g., the highly reflective side of the substrate S facing the substrate holders 200A and 200B on which the substrate S is located) and the peripheral edge SE of the substrate S, so that substrate alignment can be performed at each of the back-end processing 170, the production line processing back-end 160, and the production line processing front-end 140; while in other samples, the outer surface of the substrate S is indicated. Artifacts 222 and 223 of the peripheral edge SE and / or notch 350, which exist in the molding material 370 of the back-end processing 170 (see FIG. 2X, and as described in further detail herein), may be generated by one or more image sensors 270, which may be configured to scan / image the front surface TS (e.g., the side of the substrate S opposite to / on which the substrate holders 200A and 200B are located) to identify the peripheral edge SE and / or notch 350 for determining predetermined characteristics of the substrate S as described herein. In other embodiments, one or more image sensors 270 may be configured to scan / image the front surface TS (e.g., which may be highly reflective in the case of the front end of the production line processing 140 and the back end of the production line processing 160) and the peripheral edge SE of the substrate S (in a manner substantially similar to that described herein), so that substrate alignment can be achieved at the front end of the production line processing 140 and the back end of the production line processing 160.

[0052] In one embodiment, referring also to Figures 2H and 2I, the aligner 181 includes any suitable rotary chuck 260 (e.g., also referred to as a rotator) connected to the slider 220, thereby moving as a unit with the slider 220. The rotary chuck 260 is disposed on the substrate conveyor 180 to cooperate with each substrate holder 200A, substrate holder 200B and to realize the rotation of the corresponding wafer located on the substrate holder 200A, substrate holder 200B. The rotary chuck 260 can be used to rotate the substrate S, such as for finding and reading optical character identification marks on the substrate S (e.g., substrate identification), and to rotate and position the wafer in a predetermined orientation (e.g., repositioning for wafer alignment in response to notch detection of one or more image sensors 270). Rotary chuck 260 is rotatably mounted to slide body 220 such that the rotation center θ2 of the chuck substantially coincides with the center line CL of substrate holders 200A and 200B, while in other configurations, the rotary chuck 260 and the center line CL of substrate holders 200A and 200B have any suitable spatial relationship to allow transfer of substrate S between each of substrate holders 200A and 200B and the rotary chuck 260.

[0053] In one embodiment, the rotary chuck 260 is an active edge-gripping chuck (the chuck includes a movable gripper that grips the edge of the wafer), a passive-gripping chuck (e.g., the wafer is placed on a passive support pad of the chuck), or a vacuum chuck. In one embodiment, the rotary chuck 260 includes at least two degrees of freedom. For example, the rotary chuck 260 is rotatable about an axis θ2 and linearly movable in the Z direction along the axis θ2. The rotary chuck 260 includes a chuck driver 260D, which includes a rotary driver 275 and a Z-axis driver 276 that respectively drive the drive shaft 277 to rotate and to move linearly. For example, the chuck driver 260D includes a rotary spline bearing 278 in which the drive shaft 277 is located. The drive shaft 277 includes a spline that engages with the spline of the rotary spline bearing 278, such that as the rotary spline bearing 278 rotates, the drive shaft 277 rotates accordingly. Pulley 278P is fixed to rotary spline bearing 278 and driven by rotary drive 275 via transmission 275T. It will be understood that as pulley 278P rotates, rotary spline bearing 278 rotates accordingly. Drive shaft 277 is supported in the Z-direction within rotary spline bearing 278 by bracket 277C, for example, fixed to belt 276TB of vertical drive transmission 276T, so that bracket 277C moves with belt 276TB as it moves in the Z-direction. Belt 276TB is driven by Z-axis drive 276 via pulley or any other suitable means. Bracket 277C includes any suitable bearing 279 (e.g., thrust bearing) configured to support drive shaft 277 within bracket 277C. In other embodiments, transmission 276T, transmission 275T, and drives 275 and 276 have any suitable configuration for moving drive shaft 277 and the rotary chuck 260 mounted thereon on the θ2 and Z axes. It should be understood that although the chuck drive 260D is shown below the slider 220 in other embodiments, at least a portion of the chuck drive 260D is located on one side of the slider 220.

[0054] In other embodiments, the substrate conveyor 180 may not include the rotary chuck 260. For example, any suitable rotary chuck (i.e., a non-onboard chuck) may be located in the transfer chamber 130 or in a module at the front end of the production line 140 or at the back end of the production line 160. The substrate conveyor 180 may be configured to communicate the position / orientation of the substrate S notch to the controller 199 of the substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165, so that the controller 199 may command the non-onboard chuck to rotate the substrate S to the desired orientation based on the position / orientation of the substrate S notch determined by one or more image sensors 270 of the substrate conveyor 180.

[0055] Referring to Figures 2A, 2B, and 3A to 3C, in the configuration shown in Figures 2A and 2B, the aligner 181 includes at least one illumination source 271AL, illumination source 271BL, and a foreground controlled contrast surface or contrast face 271A mounted to the slider 220. In one configuration, at least one illumination source 271AL or illumination source 271BL may include a backlit foreground contrast surface (see Figures 2A, 12B, and 13B, for example, when the light source 271AL is placed after the foreground controlled contrast surface or contrast face 271A, contrast surface or contrast face 271A', or contrast surface or contrast face 271A”) or a backlit background contrast surface (see Figures 12D and 13D, such as when the illumination source 271BL is placed after the background controlled contrast surface or contrast face 271B, contrast surface or contrast face 271B', or contrast surface or contrast face 271B”). The backlit contrast surface may be referred to as a self-illuminating contrast surface. In other cases, the illumination source includes a projector / radiant light (e.g., see illumination source Figures 2L, 2N-2U, 12A, 12C, 13A, and 13C, where light is radiated from or projected onto the contrast surface).

[0056] In one embodiment, at least one illumination source 271AL and illumination source 271BL may include any suitable diffuser to direct light emitted from at least one illumination source 271AL and illumination source 271BL as scattered light directed in any suitable manner to at least the corresponding contrasting surface. For example, in the case where illumination sources 271AL and illumination sources 271BL backlight the contrasting surface, the contrasting surface diffuses the light emitted from illumination sources 271AL and illumination sources 271BL. In the case where illumination sources 271AL and illumination sources 271BL are projectors / radiant light diffusers 1200 (Figures 12A, 12C, 13A, 13C), they may be positioned in the optical path to diffuse the light. In order to guide the light to at least the corresponding contrasting surface, illumination sources 271AL and illumination sources 271BL may include any suitable reflector 1210 (Figures 12A-12D, 13A-13D) configured to guide the light to the corresponding contrasting surface. In one state, the scattered light can be guided by the illumination source 271AL, the illumination source 271BL to the front surface TS or the bottom surface BS of the substrate S, wherein the light is reflected from the wafer surface toward the corresponding contrast surface to illuminate the corresponding contrast surface.

[0057] One or more illumination sources 271AL and 271BL may have sufficient brightness to overcome any ambient light surrounding the substrate S, thereby optically blanking background reflections or substantially uniformly reflecting the contrast surface onto the substrate surface, thus producing the image contrast described above. In one embodiment, illumination brightness that overcomes ambient light can be obtained by setting the illumination time of the image sensor 270 or by any other suitable means. One or more illumination sources 271AL and 271BL may generate light in a spectrum determined based on ambient light and surface conditions around the substrate S, thereby optically blanking background reflections or substantially uniformly reflecting the image onto the substrate surface from the contrast surface, thus producing the image contrast described above.

[0058] In one embodiment, illumination sources 271AL and 271BL (directly or indirectly) are connected to frame 130F and configured to illuminate a contrast surface reflected from the surface of substrate S (e.g., see Figures 2A and 2B, and Figures 12A, 12B, 13A, and 13B), supported by at least one substrate holder 200A and substrate holder 200B, which delineates the peripheral edge SE of substrate S. The contrast surface is positioned relative to image sensor 270 such that the contrast surface guided from the surface of image sensor 270 is optically blanked at the peripheral edge SE of substrate S, and the background light reflection from the surface of substrate observed by image sensor 270 (as described herein) coincides with the linear lateral movement of substrate S supported by at least one substrate holder. Here, the peripheral edge SE of substrate is defined concave-convexly in image contrast, formed by the reflective contrast surface and the illuminated background, and registered by image sensor 270 between the reflective contrast surface and the illuminated background.

[0059] In one embodiment, illumination sources 271AL and 271BL (directly or indirectly) are connected to frame 130F and configured to illuminate the surface of the substrate (e.g., bottom surface BS or front surface TS), supported by at least one substrate holder 200A, substrate holder 200B (whose surface delineates the peripheral edge SE of substrate S) and / or a contrast surface (which is not reflected by substrate S) (see, for example, Figures 12C, 12D, 13C, and 13D). One illumination source 271AL or 271BL is positioned relative to image sensor 270 such that illumination from the reflective surfaces of illumination sources 271AL and 271BL is directed to image sensor 270, and the optical blanking of the background reflected light of background 267 observed by image sensor 270 at the peripheral edge of substrate S coincides with the linear lateral movement of substrate S supported by at least one substrate holder 200A or substrate holder 200B.

[0060] Referring to Figures 2A, 2B, 12A-12D and 13A-13D, the foreground controlled contrast surfaces 271A, 271A', and 271A” and the corresponding image sensor 270 are positioned relative to each other and the substrate S, such that the reflection 300 of the foreground contrast surfaces 271A, 271A', and 271A” reflected by the bottom surface BS (or front surface TS) of the substrate S is visible to the image sensor 270, wherein the peripheral edge SE of the substrate is defined concave and convex in the image contrast, formed by the wafer surface reflection and the optically blanked background and is registered by the image sensor 270 between the wafer surface reflection and the optically blanked background to achieve edge detection and coincidence with the linear lateral movement of the substrate S supported by at least one substrate holder 200A and substrate holder 200B. For example, the reflection 300 of the foreground-controlled contrast surface 271A extends along / adjacent to the peripheral edge SE of the substrate S to provide an optically blanking reflection / appearance on the bottom surface BS (or front surface TS) of the substrate S, adjacent to and including the edge SE (e.g., optical blanking is the appearance / reflection of light from a background without features registered to the image sensor within the sensor's field of view - the reflective surface of the substrate is presented as substantially monochromatic without other objects being reflected, but rather the featureless foreground-controlled contrast surface 271A is reflected).

[0061] In one state, the aligner 181 may further include a contrast surface disposed in the background 267 (on the side of the substrate opposite to the foreground-controlled contrast surface 271A) and arranged to optically blank (again, optical blanking is the rendering of appearance / reflected light in the sensor's field of view from a background without the sensor's registration features) the background reflected light observed by the image sensor 270. For example, the contrast-controlled contrast surface or facet 271B, contrast surface or facet 271B', and contrast surface or facet 271B” shown in Figures 2A and 2B are the inner surface 130S of the transfer chamber 130; however, in other forms, the contrast-controlled contrast surface 271B may be any other surface mounted to or separated from the substrate transferor 180, which is at least partially disposed on the substrate S in the field of view (FOV) of the image sensor 270 and configured to produce a substantially uniform image background that has no features (i.e., is blanked) and has a contrast color relative to the color of the foreground-controlled contrast surfaces 271A, 271A', and 271A”.

[0062] In one state sample (for example, see Figures 12A, 12B, 13A, and 13B), the contrast-foreground controlled contrast surfaces or planes 271A, 271A', and 271A" at least partially form light reflections from the opposite surfaces of the background controlled contrast surfaces 271B, 271B', and 271B" disposed on the substrate, so that in the image of the substrate S (see images 399 and 399' in Figures 3A and 4B), the background appears darker, while the reflecting foreground controlled contrast surfaces 271A, 271A', and 271A" are relatively dark compared to the dark background. The substrate S appears bright. In another state (for example, see Figures 12C, 12D, 13C, and 13D), the contrast-controlled contrast surfaces or planes 271B, 271B', and 271B'" at least partially form an illuminated background disposed on the side of the substrate opposite to the foreground-controlled contrast surfaces 271A, 271A', and 271A'", such that in the image of the substrate S (see image 399" in Figure 5B), the background appears bright, and the foreground-controlled contrast surfaces 271A and 271A' reflected on the substrate S appear darker relative to the light background. It can be recognized that, compared with the substrate S, the background-controlled contrast surface or plane 271B, contrast surface or plane 271B', and contrast surface or plane 271B" may be too large (for example, the contrast background-controlled contrast surface or plane 271B, contrast surface or plane 271B', and contrast surface or plane 271B" have a size larger than that of the substrate S, so that when observed by the image sensor 270, the contrast background-controlled contrast surface or plane 271B, contrast surface or plane 271B', and contrast surface or plane 271B" extend beyond the peripheral edge SE of the substrate S to form the blanking background of the image captured by the image sensor 270).

[0063] One or more of the foreground controlled contrast surface 271A, contrast surface 271A' and background controlled contrast surface 271B, contrast surface 271B' are grayscale or dark, and the contrast surfaces are grayscale or dark to form an image contrast between the wafer surface reflection and the optically blanked background (e.g., formed by the background controlled contrast surface 271B, contrast surface 271B') and the optically blanked background. This image contrast is registered by an optical edge detection sensor of the peripheral edge SE defined by the unevenness (in images 399, 399', and 399") to form an image contrast between the wafer surface reflection and the optically blanked background. Image contrast is formed between wafer surface reflection and optics. Here, as an example, in image 399 captured by image sensor 270, substrate S and its edge SE appear as a bright, solid-color surface, and the area of ​​image 399 behind substrate S appears as a dark, contrasting background. It will be appreciated that other combinations of contrasting colors can be used, such as dark reflection on the bottom surface BS of substrate S and a bright colored background, or any other color / brightness combination that provides image contrast between the reflective bottom surface BS of substrate S and the space 291 (e.g., the space above or behind substrate S) on the opposite side (e.g., the front surface TS) of substrate S.

[0064] In one state, the aforementioned image contrast can be provided by illuminating one of the foreground-controlled contrast surface 271A and the background-controlled contrast surface 271B while the other of the foreground-controlled contrast surface 271A and the background-controlled contrast surface 271B is illuminated less (lower brightness) or not at all. For example, the foreground-controlled contrast surface 271A may be illuminated by ambient light illuminating the background-controlled contrast surface 271B by light illuminating the background ...

[0065] In one embodiment, as shown in Figures 2A and 2B, the light source 271AL is closer to the bottom surface BS of the substrate S than the background-controlled contrast surface 271B. It can be understood that, according to the inverse square law of light, the surface closer to the light source 271AL (i.e., the bottom BS of the substrate) receives higher brightness than the background-controlled contrast surface 271B (i.e., light attenuation), making the bottom BS of the substrate S appear brighter than the relatively darker surface of the background-controlled contrast surface 271B (see Figure 3A). In other embodiments, the image sensor 270 may include an aperture size and / or a shutter speed (i.e., imaging time) configured to achieve (in conjunction with or instead of the light source 271AL) image contrast between the reflections of the foreground-controlled contrast surface 271A and the background-controlled contrast surface 271B reflected by the bottom surface BS of the substrate S. In one state, where the inverse square law of light, aperture size and / or shutter speed are used to generate image contrast, the contrast surface 271B of the background controlled surface can be ignored.

[0066] In other embodiments, the contrast between the reflections of the foreground controlled contrast surface 271A and the background controlled contrast surface 271B reflected by the bottom surface BS of the substrate S can be generated by illuminators of different colors configured to backlight or illuminate (e.g., illuminate) one of the foreground controlled contrast surface 271A and the background controlled contrast surface 271B. For example, the light source 271AL can have a warm color (e.g., red, yellow, or orange) projected onto the foreground controlled contrast surface 271A, while another light source 271BL can have a cool color (e.g., blue, green, or purple, a color contrasting with the warm color) projected onto the background controlled contrast surface 271B (e.g., the foreground controlled contrast surface 271A is displayed as red in image 399, while the background controlled contrast surface 271B is displayed as blue in image 399). In other embodiments, the light source 271AL can have a cool color, while the illumination source 271BL can have a warm color. In other configurations, illumination sources 271AL and 271BL can be the same color, but have different brightness levels that produce different contrasts between the corresponding foreground controlled contrast surface 271A and background controlled contrast surface 271B in image 399 (e.g., the brightness of light source 271A is stronger than that of illumination source 271BL, and vice versa). Note that as long as there is sufficient contrast in image 399 between the reflective bottom surface BS of substrate S and the background controlled contrast surface 271B, the illumination of the foreground controlled contrast surface 271A and the background controlled contrast surface 271B does not necessarily have to be uniform, so that the edge SE and notch 350 of substrate S can be identified in image 399.

[0067] In other states, contrast can be generated by the corresponding colors of the foreground-controlled contrast surface 271A and the background-controlled contrast surface 271B. For example, the foreground-controlled contrast surface 271A can be a warm color or white, while the background-controlled contrast surface 271B can be a cool color or a black / gray shadow, or vice versa.

[0068] Still referring to FIG. 3A, the image contrast generated in the manner described above allows the notch 350 to be identified in the image regardless of whether the notch 350 is filled with molding material 370 (e.g., see FIG. 3A). For example, the reflection of the contrast surface 271 on the bottom surface BS of the substrate S effectively forms a dark or light non-mirror surface on the substrate S that contrasts with the color of the molding material 370, so that the molding posture that determines the feature of the substrate S (e.g., notch 350) is compared with the non-mirror surface formed by the reflection of the contrast surface on the bottom surface BS of the substrate S. In one state, a non-mirror surface formed on a substrate S, for example, by a foreground-controlled contrast surface 271A or 271A', can be light-colored compared to a dark background formed by, for example, a background-controlled contrast surface 271B (see images 399 and 399' in Figures 3A and 4B); while in other states, a non-mirror surface formed on a substrate S, for example, by a foreground-controlled contrast surface 271A or 271A', can be dark-colored compared to, for example, a background-controlled contrast surface 271B (see, for example, image 399" in Figure 5B). For example, the reflection from the molding material 370 and one or more background-controlled contrast surfaces 271B and the bottom BS of the substrate S... The outline of the molding material 370 extending beyond the edge SE of the substrate S is identified by the color / brightness contrast between the reflections of the foreground controlled contrast surface 271B (e.g., in the production line processing back end 160); the molding material 370 filling the notch 350 is identified by the color / brightness contrast between the molding material 370 and the reflections of the foreground controlled contrast surface 271B reflected in the bottom BS of the substrate S (e.g., in the production line processing back end 160); and / or the notch 350 is identified by the color / brightness contrast between the reflections of the foreground controlled contrast surface 271B reflected in the bottom BS of the substrate S and the background controlled contrast surface 271B (e.g., in the production line processing front end 140).

[0069] Referring to Figures 2K, 4A, and 4B, in one embodiment, a substrate conveyor 180 is shown having both a foreground-controlled contrast surface 271A and a contrast surface 271A' mounted on the substrate conveyor 180, and a background-controlled contrast surface 271B'. For example, the foreground-controlled contrast surface 271A, contrast surface 271A', and background-controlled contrast surface 271B' can be mounted to any suitable portion of the substrate conveyor 180, such as the slider 220 and / or the Z-drive post 280. In one embodiment, the foreground-controlled contrast surface 271A, contrast surface 271A', and background-controlled contrast surface 271B' are mounted to the slider. In other embodiments, the foreground-controlled contrast surface 271A and contrast surface 271A' are mounted to the slider, while the background-controlled contrast surface 271B' is mounted to the Z-drive post 280 (e.g., cantilevered from the Z-drive post 280). Foreground-controlled contrast surfaces 271A and 271A', and background-controlled contrast surface 271B' are configured to provide contrast in the image 399' obtained by one or more image sensors 270 in a manner substantially similar to that described above.

[0070] In one embodiment (e.g., shown in Figures 4A and 4B), the foreground controlled contrast surface 271A' is shown as a disk with a central aperture 400; however, in other embodiments, the foreground controlled contrast surface 271A' can have any suitable shape and size. The foreground controlled contrast surface 271A' can be centered along the center line CL of the substrate holders 200A and 200B, such that as the center SC of the substrate S passes over or near the center of the central aperture 400, reflections from the foreground controlled contrast surface 271A' are provided on the substrate S. In other embodiments, the foreground controlled contrast surface 271A' can have any suitable spatial relationship relative to the substrate holders 200A and 200B, provided that a corresponding portion of the foreground controlled surface 271A' is reflected by the substrate S along and near the edge SE of the substrate S to each corresponding image sensor 270. Here, the foreground-controlled contrast surface 271A' may be common to each of the one or more image sensors 270 mounted to the slider 220; while in other cases, the foreground-controlled contrast surface 271A' may be a segmented surface, wherein each image sensor 270 images a portion of the segmented surface. In other cases, the foreground-controlled contrast surface 271A' may be substantially similar to the foreground-controlled contrast surface 271A described above. In one case, similar to the light source described above, any suitable light source may be set to backlight or illuminate one or more of the foreground-controlled contrast surface 271A' and the background-controlled contrast surface 271B'. Note that the substrate S is shown in Figures 4A and 4B as a standard (unmolded) substrate used in the front end of the production line processing 140; however, it should be understood that in other cases, the substrate may be a molded wafer used in the back end of the production line processing 160.

[0071] Through the central aperture 400 of the foreground-controlled contrast surface 271A' (as shown in image 399' in FIG4B), one or more image sensors 270 may be positioned to image the edge SE of the substrate S and the reflection thereon on the foreground-controlled contrast surface 271A'; in other cases, one or more image sensors 270 may be positioned radially outward on the foreground-controlled contrast surface 271A' (e.g., without viewing the substrate S through the central aperture 400 - see, for example, FIG13A-FIG13D) for image of the edge SE of the substrate and the reflection thereon on the foreground-controlled contrast surface 271A'.

[0072] In this embodiment, the background-controlled contrast surface 271B' is shown as a disk extending radially beyond the edge SE of the substrate to be in the field of view of one or more image sensors 270; however, in other embodiments, the background-controlled contrast surface 271B' may have any suitable shape (segmented or continuous) and size, as long as the background-controlled contrast surface 271B' provides contrast with the reflection of the foreground-controlled contrast surface 271A, contrast surface 271A' on the bottom surface BS of the substrate S in the image 399, the image 399'.

[0073] Referring to Figures 2L to 2R, other exemplary configurations of the imaging system are shown, wherein the field of view (FOV) of the image sensor 270 can be directed to the back surface BS of the substrate S supported on substrate holders 200A and 200B with a background formed by a contrast surface disposed on the substrate S (e.g., on the front side of the substrate, where the front side is the side opposite to the bottom), and / or to the front surface TS of the substrate S supported on substrate holders 200A and 200B with a background formed by a contrast surface disposed under the substrate S. For example, as described below, in one embodiment, one or more contrast surfaces can be mounted to a transfer arm such that the contrast surface and the transfer arm 180TA move as a unit relative to the frame 130F. In one embodiment, the contrast surface forms a common background for enabling edge detection of each of more than one substrate S simultaneously supported by at least one substrate holder 200A and substrate holder 200B. In one embodiment, at least one contrast surface is fixedly mounted to the frame 130F, and this contrast surface enables edge detection of the substrate S supported by substrate holders 200A and 200B to coincide with the linear lateral movement of the wafer passing through the contrast surface. In another embodiment, an illumination source 271AL is mounted to a transfer arm 180TA, such that the illumination source 271AL and the transfer arm move relative to the frame 130F as a unit. In another embodiment, the illumination source 271AL provides common illumination for edge detection of each of more than one substrate S simultaneously supported by at least one substrate holder 200A and 200B. In yet another embodiment, the illumination source 271AL is fixedly mounted to the frame 130F, and the illumination source 271AL enables edge detection of the substrate supported by substrate holders 200A and 200B to coincide with the linear lateral movement of the substrate passing through the illumination source 271AL.

[0074] Referring to Figures 2N, 2Q, 2R, and 2W, in one embodiment, a substrate transporter 180 can be configured such that an image sensor 270 is fixed (so as not to move with the substrate transporter 180) to a frame 130F, and at least one contrast surface is coupled to a transport arm 180TA and moves with the transport arm 180TA. Here, the image sensor 270 is fixedly mounted to the frame 130F, and through the field of view (FOV) of the image sensor 270, edge detection and linear lateral movement of the substrate S supported by substrate holders 200A and 200B are achieved. For example, Figure 2N shows that the image sensor 270 and the foreground-controlled contrast surface 271A' are fixed to the frame 130F, while the background-controlled contrast surface 271B' is coupled to the transfer arm 180TA (e.g., to the Z-drive column 280 or the slider 220) to move with the transfer arm 180TA. (In other configurations, the foreground-controlled contrast surface 271A' may be coupled to the transfer arm 180TA as shown in Figure 2Q, while the background-controlled contrast surface 271B' may be fixed to the frame 130F, as shown in Figure 2R.) Figure 2Q shows that the image sensor 270 is fixed to the frame 130F, while both the foreground-controlled contrast surface 271A' and the background-controlled contrast surface 271B' are coupled to the transfer arm 180TA (e.g., to the Z-drive column 280 or the slider 220). Figure 2R shows the image sensor 270, with each of the foreground-controlled contrast surface 271A' and the background-controlled contrast surface 271B' fixed to the frame 130F. Figure 2W is the same configuration as Figure 2A; however, in this configuration, the image sensor 270 is configured to image the front surface TS of the substrate instead of the bottom surface BS. In Figure 2W, both the foreground-controlled contrast surface 271A and the image sensor 270 are fixed to the frame 130F, while the background-controlled contrast surface 271B is fixed to the transfer arm 180TA (in this case, the background-controlled contrast surface 271B can be formed by the slider 220). It can be understood that the imaging systems shown in Figures 2N, 2Q, 2R and 2W are configured to image the front surface TS of the substrate S; however, in other cases, the imaging system may be configured to image the back surface BS of the substrate S in the order of, for example, the inverted image sensor 270, the foreground-controlled contrast surface 271A' and the background-controlled contrast surface 271B', as shown in Figures 2S-2U, 12A-12D and 13A-13D.

[0075] In other configurations, referring to Figures 2L, 2M, 2O, 2P, and 2V, the image sensor 270 may be coupled to and move with the transfer arm 180TA, and at least one contrast surface is fixed to the frame 130F, wherein the image sensor 270 is configured to image the bottom surface BS of the substrate S (see Figures 2L and 2M) and / or the front surface TS of the substrate S (see Figures 2O and 2P). For example, Figure 2L shows the image sensor 270 mounted to the slider 220 while both the foreground-controlled contrast surface 271A' and the background-controlled contrast surface 271B' are fixed to the frame 130F. Figure 2M shows the image sensor 270 and the foreground-controlled contrast surface 271A' mounted to the slider 220 while the background-controlled contrast surface 271B' is fixed to the frame 130F. Figure 20 shows the image sensor 270 and the background controlled contrast surface 271B' mounted to the Z-drive post 280 (note that the background controlled contrast surface 271B' can be mounted to the slider 220) while the foreground controlled contrast surface 271A' is fixed to the frame 130F. Figure 2P shows the image sensor 270 mounted to the Z-drive post 280 when both the foreground controlled contrast surface 271A' and the background controlled contrast surface 271B' are fixed to the frame 130F. Figure 2V is a diagram showing the same configuration as Figure 2A. However, in this configuration, the image sensor 270 is configured to image the front surface TS of the substrate instead of the bottom surface BS of the substrate. In Figure 2V, the foreground controlled contrast surface 271A' and the image sensor 270 are both fixed to the Z-drive post 280 while the background controlled contrast surface 271B is fixed to the slider 220 (in this case, the background controlled contrast surface 271B can be formed by the slider 220). In one configuration, when mounted to the Z-drive post 280, one or more of the image sensor 270, background-controlled contrast surfaces 271B, 271B', 271B" and foreground-controlled contrast surfaces 271A, 271A', 271A" mounted to the Z-drive post can be set to a fixed height (i.e., not moving along the Z direction). In other configurations, one or more of the image sensor 270, background-controlled contrast surfaces 271B, 271B', 271B" and foreground-controlled contrast surfaces 271A, 271A', 271A" mounted to the Z-drive post can be configured. The substrate holders 200A and 200B move on a movable bracket to move along the Z direction together with the substrate holders 200A and 200B or independently of the substrate holders 200A and 200B.

[0076] It will be appreciated that the various embodiments of the present disclosure shown in Figures 2K-2W are exemplary and can be combined with each other in any suitable manner in other respects. In other embodiments, the image sensor 270, the foreground-controlled contrast surface 271A, contrast surface 271A', contrast surface 271A" and the background-controlled contrast surface 271B, contrast surface 271B', contrast surface 271B" can have any suitable arrangement for imaging the substrate S in the manner described herein.

[0077] Referring to Figures 2N-2R, 2V, 2W, 2X, 12A-12D, and 13A-13D, the image sensor 270 positioned for imaging the front surface TS of the substrate S can, for example, image the molding material 370 (see Figure 2X) in the back-end processing 170. Here, the image contrast provided by the illumination source 271AL, illumination source 271BL, foreground controlled contrast surface 271A, contrast surface 271A', contrast surface 271A”, and background controlled contrast surface 271B, contrast surface 271B', contrast surface 271B” can be artifacts 222 and 223 that enable the identification of the substrate S through the molding material 370. For example, in one embodiment, the molding material 370 may include raised portions and / or recessed portions 222A corresponding to the peripheral edge SE of the substrate S, such as wherein the molding material transitions outward from the front surface TS of the substrate S to form an artifact 222 that follows the contour / shape of the peripheral edge SE. Similarly, the molding material 370 may include raised portions and / or recessed portions 223A corresponding to the notch 350 of the substrate S, such as wherein the molding material transitions outward from the front surface TS and enters the notch region of the substrate S to form an artifact 223 that conforms to the contour / shape of the notch 350. Illumination of the substrate S by illumination sources 271AL and 271BL (direct illumination of the front surface TS or the back surface BS or illumination from reflection from the contrasting surface) causes a change in contrast (e.g., shadow lines and brightness lines) corresponding to the protrusions 222A and / or the recesses 223A, wherein the image sensor 270 and the controller 199 are configured to identify the change in contrast and the corresponding peripheral edges SE and / or notches 350.

[0078] In another embodiment, artifacts 222 and 223 may be generated by the translucency of the molding material 370, wherein the portions of the molding material 370 not bonded to the front surface TS of the substrate S (such as the molding material 370 filling the notch 350 and the molding material 370 extending beyond the peripheral edge SE) appear lighter (e.g., when backlit by illumination sources 271AL and 271BL). Illumination of the substrate S by illumination sources 271AL and 271BL (direct illumination of the front surface TS or the rear surface BS or illumination by reflection from the contrasting surfaces) causes varying contrast (e.g., the bright and dark portions of the translucent molding material 370, similar to the contrast between the molding material 370 and the substrate S shown in FIG. 3A), wherein the image sensor 270 and the controller 199 are configured to identify the varying contrast and the corresponding peripheral edge SE and / or notch 350.

[0079] As described above, one or more image sensors 270 (and imaging systems) may be calibrated differently depending on whether one or more image sensors 270 are mounted to the transfer arm 180TA or fixed to the frame 130F (e.g., calibrated in the reference frame for substrate transfer or calibrated in the overall reference frame). For example, mounting one or more image sensors 270 to the transfer arm 180TA may calibrate one or more image sensors 270 (and imaging systems) to identify one or more predetermined characteristics of the substrate S in the reference frame of the substrate transferor 180, wherein any suitable controller 199 may, as needed, transform substrate S information (e.g., notch position, substrate offset, substrate centerline, etc., as described with respect to FIG. 6A) into the overall reference frame of the substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165 for placing (e.g., automatic substrate alignment according to any suitable automatic substrate alignment algorithm as described below) the substrate S at the substrate holding position of the substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165. For example, one or more image sensors 270 are fixed to frame 130F. One or more image sensors 270 (and imaging system) can be calibrated to identify one or more predetermined characteristic images of substrate S in the overall reference frame of substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165, wherein any suitable controller 199 will, as needed, transform substrate S information (e.g., notch position, substrate offset, substrate centerline, etc., as described with respect to FIG. 6A) into a substrate transfer reference frame for placing (e.g., auto substrate centering according to any suitable auto substrate centering algorithm such as those described below) substrate S at the substrate holding position of substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165.

[0080] Referring to Figures 5A and 5B, a substrate alignment stage 500 is shown. The substrate alignment stage 500 includes a foreground controlled contrast surface 271A” and a background controlled contrast surface 271B” mounted to a frame 500F of the substrate alignment stage 500. The foreground controlled contrast surface 271A” and the background controlled contrast surface 271B” can be substantially similar to the foreground controlled contrast surface 271A, contrast surface 271A' and the background controlled contrast surface 271B, contrast surface 271B' described above, and are configured to provide contrast in the image 399” obtained by one or more image sensors 270 in a manner substantially similar to that described above. Here, one or more image sensors 270 and the foreground controlled contrast surface 271A” are disposed on the substrate S, while the background controlled contrast surface 271A” is disposed under the substrate S (i.e., the substrate alignment stage 500 is configured to image the front surface TS of the substrate S in the production line processing front end 140); however, in other cases, one or more image sensors 270 and the foreground controlled contrast surface 271A” are disposed under the substrate S, and the background controlled contrast surface 271A” is placed on the substrate S (i.e., the substrate alignment stage 500 is configured to image the bottom BS of the substrate S in the production line processing back end 160).

[0081] Referring to Figures 2A, 2B, 3A-3C, 4B, 5B, 6A-6B, and 7, images 399, 399', and 399" captured by one or more image sensors 270 are analyzed by any suitable controller, such as controller 199. Controller 199 is programmed using any suitable image processing software configured to identify at least one or more of the angle β relative to the notch 350 of the predetermined reference frame and the center SC of the substrate S. Such as the center point 600 of the substrate holding position relative to the substrate holders 200A and 200B and / or the center line 601 of the substrate holders 200A and 200B. For illustrative purposes, the identification of the angle β and / or center SC of the substrate S includes transforming images 399, 399', and 399" into polar coordinate space 330 (see Figures 3C, 5B, and 6B), template matching (Figure 3B), and / or measuring brightness along the edge SE of the substrate S to identify the notch 350.

[0082] FIG3A shows an exemplary image 399 (similar to image 399', image 399") captured by one or more image sensors 270. FIG3B shows a processed image 399P of a template 310 displaying an edge (e.g., a protruding substrate edge), based on a substrate with a calibrated substrate radius (or diameter D) centered on, for example, substrate holders 200A and 200B. The processed image 399P also shows the observed edge 315 of the substrate S obtained from image 399, which is modeled... Board 310 covers the processed image 399P. Controller 199 determines points in the processed image 399P that belong to the observation edge 315 of the substrate S (Fig. 7, block 700) and are not noisy surfaces in the processed image 399P. To determine which points in the processed image 399P belong to the observation edge 315 of the substrate S, curved endpoints 320 and 321 defined by the observation edge 315 are determined. For illustrative purposes, endpoint 320 will be referred to as the right boundary point, and endpoint 321 will be referred to as the left boundary point.

[0083] To determine the positions of the left and right boundary points 320 and 321, the rightmost point 320' and the leftmost point 321' of the observation edge 315 are used to calculate the center 600' of the circle, using the radius passing through the rightmost point 320' and the leftmost point 321'. The rightmost point 320' remains fixed along the observation edge 315, while for each movement of the leftmost point 321', the leftmost point 321' moves along the observation edge 315 toward the rightmost point 320' of the calculated center 600A (for example, using the radius passing through each position of the fixed rightmost point 320' and the moving leftmost point 321'). Center points 600 and 600A are compared, and if the positions of center points 600 and 600A relative to each other are outside a predetermined tolerance, then points along the left side of the observation edge 315 are considered noise and discarded until center points 600 and 600A become stable or converge to each other (i.e., the leftmost point 321' moves towards the rightmost point 320' to a position along the observation edge 315 where center points 600 and 600A are within a predetermined tolerance). The position of the leftmost point 321' where center points 600 and 600A become stable (e.g., converge to each other) marks the leftmost boundary point 321 of the effective substrate edge in the processed image 399P.

[0084] The leftmost point 321' remains fixed along the observation edge 315, while for each movement of the rightmost point 320', the rightmost point 320' moves along the observation edge 315 toward the leftmost point 321' of the calculation center 600B (e.g., using the radius of each position passing through the fixed leftmost point 321' and the moving rightmost point 320'). The center points 600 and 600B are compared, and if the positions of the center points 600 and 600B relative to each other are outside the predetermined tolerance, then the point on the right side of the observation edge 315 is considered noise and is discarded until the center points 600 and 600B become stable or converge to each other (i.e., the rightmost point 320' moves toward the leftmost point 321' to a position along the observation edge 315, where the center points 600 and 600B are within the predetermined tolerance). The position of the rightmost point 320' where centers 600 and 600B become stable is marked as the rightmost boundary point 320 of the effective substrate edge in the processed image 399P. In other samples, boundary points 320 and 321 can be determined in any suitable manner.

[0085] The controller 199 determines (Fig. 7, block 710) the substrate offset XC or deviation YC by comparing the detected substrate center 600 with the calibrated substrate holding position 660 of the substrate holders 200A and 200B (Fig. 6A).

[0086] The starting angle αS and ending angle αE of the arc segment formed by the observed edge 315 are determined in any suitable manner based on the rightmost boundary point 320 and the leftmost boundary point 321 (see Figures 3B and 6A) (Figure 7, block 720). The processed image 399P is converted to polar coordinate space 330 (Figure 7, block 730) in any suitable manner, for example by using a partially linear polar coordinate algorithm, to translate the observed edge 315 into a substantial straight line. The partially linear polar coordinate algorithm is an extension of existing Cartesian polar coordinate transformations, such as the "warpPolar" or "linearPolar" functions provided in the Python™ programming language. In contrast, conventional Cartesian polar coordinate transformations (such as the warpPolar and LinearPolar functions) map the input image to polar coordinates of a complete 0-2π radian circle with a radius of 0-Rmax (radius defined by the user). The linear polar coordinate algorithm maps the input image to a subset of polar coordinates, as shown in Figures 6A and 6B. In one instance, the transformation to polar coordinate space can be performed in a manner substantially similar to that described in U.S. Patent No. 5,825,913, granted October 20, 1998 (titled “System for Finding Orientation of Wafers”), which is incorporated herein by reference in its entirety.

[0087] As an example of polar coordinate transformation, a processed image 399P is known, which contains a portion of a circle (e.g., representing the edge SE of the substrate S), a starting angle αS, and a ending angle αE. The center point XC, YC, and radius R of this circle map each (x', y') point in the processed image 399P to a corresponding (x, y) point in the polar coordinate space image 331, where:

[0088] x' = r * cos(angle along the observation edge 315) + XC

[0089] Furthermore, the width W of the polar space image 331 is determined by an input scaling factor applied to the widths of the angles αS and αE provided as input, and

[0090] Y' = r * sin(angle along the observation edge 315) + YC

[0091] Furthermore, the height H of the polar space image 331 is determined by an input scaling factor applied to the start and end points of the polar radius, which are provided as inputs r_start and r_end.

[0092] Controller 199 may include any suitable detection algorithm for detecting / determining the presence and location of a notch 350 (FIG. 7, block 740) in the polar space image 331. For illustrative purposes only, controller 199 may analyze the polar space image 331 to determine the highest point 333 located at Xmax and Ymax. Starting from the highest point 333, controller 199 is configured to measure the slope 334 of each point to the left of the highest point 333 until, for example, half the width of the SEMI standard notch, stopping prematurely if the end of the image is reached. If the measured slope 334 is outside a predetermined range or tolerance of a function (e.g., an equation) describing the shape of the SEMI standard notch, controller 199 adds a value to an accumulated error variable. If the accumulated error variable exceeds an acceptable percentage of error points in the total number of observed points, the image does not contain the notch 350. Calculate the sum of the slopes of the highest point 333 at each measurement point to determine how high the highest point 333 rises from the remaining observation edge 315 (e.g., height H1). If the height H1 is not within the predetermined range or tolerance of the SEMI standard notch depth, the image will not include the notch 350.

[0093] If analysis of the measurement points to the left of the highest point 333 determines that the image contains a notch 350, then the points to the right of the highest point 333 are analyzed to verify that the notch 350 is indeed present in the image. Starting from the highest point 333, the controller 199 is configured to measure the slope 335 of each point to the right of the highest point 333 until, for example, half the width of the SEMI standard notch, stopping prematurely if the end of the image is reached. If the measured slope 335 is outside a predetermined range or tolerance of a function (e.g., an equation) describing the shape of the SEMI standard notch, the controller 199 adds a value to a cumulative error variable. If the cumulative error variable exceeds an acceptable percentage of error points in the total number of observed points, then the image does not contain the notch 350. The sum of the slopes of each measurement point to the right of the highest point 333 is calculated to determine how high the highest point 333 rises from the remaining observed edge 315 (e.g., height H1). If the height H1 is not within a predetermined range or tolerance of the SEMI standard notch depth, then the image does not contain the notch 350. If the existence of notch 350 is confirmed based on the analysis of the measurement point to the right of the highest point 333, then the angle β of notch 350 in the processed image 399P (see Figure 6A) has the following equation:

[0094] β = ((Xmax / W) * (α S- α E)) +α S

[0095] The alignment offset for the final stage adjustment is determined in any suitable manner based on the wafer offset XC, the offset YC, the measured notch angle β, and the desired notch angle (Figure 7, block 750). A suitable example of determining the alignment offset after the final stage adjustment can be found in U.S. Patent No. 7,925,378, issued April 12, 2011; U.S. Patent No. 10,134,623, issued November 20, 2018; and U.S. Patent Application Serial No. 16 / 257,595, filed January 25, 2019 (titled “Automatic Wafer Centering Method and Apparatus”), the entire disclosure of which is incorporated herein by reference.

[0096] For example, referring to FIGS. 2A-2U and FIG. 8, a method for detecting the peripheral edge SE of a substrate S will be described. A transfer arm 180TA (FIG. 8, block 800) is provided and movably mounted to the frame 130F. The transfer arm 180TA has substrate holders 200A and 200B movably mounted to the transfer arm 180TA, such that at least one substrate holder 200A or substrate holder 200B is linearly lateralized relative to the frame 130F. An image sensor 270 coupled to the transfer arm 180TA is registered and performs edge detection of the substrate S (FIG. 8, block 810) supported by at least one substrate holder 200A or substrate holder 200B. An illumination source 271AL illuminates the surface of the substrate S supported by at least one substrate holder 200A or substrate holder 200B, the surface of which delineates the peripheral edge SE of the substrate S. An illumination source 271AL is positioned relative to an image sensor 270, such that the surface guides illumination from the reflective surface of the illumination source 271AL onto the image sensor 270, and optically blanks the background reflected light of the background image observed by the image sensor at the peripheral edge SE of the substrate S, aligning it with the linear lateral movement of the substrate S supported by at least one substrate holder 200A and substrate holder 200B. The peripheral edge SE of the substrate S is defined in image contrast by the reflection from the substrate surface and the optically blanked background, and is registered between the substrate surface reflection and the optically blanked background by the image sensor 270 to achieve edge detection and alignment with the linear lateral movement of the substrate supported by at least one substrate holder 200A and substrate holder 200B.

[0097] For example, referring to FIGS. 2A-2U and FIG. 9, a method for detecting the peripheral edge SE of a substrate S will be described. A transfer arm 180TA is provided (FIG. 9, block 900) and movably mounted to the frame 130F. The transfer arm 180TA has at least one substrate holder 200A and substrate holder 200B movably mounted on the transfer arm 180TA, such that at least one substrate holder 200A and substrate holder 200B are linearly transversely moved relative to the frame 130F. An image sensor 270 coupled to the transfer arm 180TA is registered and performs edge detection of the substrate S (FIG. 9, block 910) supported by at least one substrate holder 200A and substrate holder 200B. An illumination source 271AL illuminates a contrast surface (FIG. 9, block 920) reflected from the surface of the substrate S supported by at least one substrate holder 200A and substrate holder 200B, which depicts the peripheral edge SE of the substrate S. The contrast surface is positioned relative to the image sensor 270, causing the surface-guided reflective contrast surface at the peripheral edge SE of the substrate S to optically blank. The background light reflected from the surface of the substrate S, as observed by the image sensor 270, coincides with the linear lateral shift of the substrate S supported by at least one substrate holder 200A and substrate holder 200B. The peripheral edge SE of the substrate S is defined concave-convexly in the contrast, formed by the reflective contrast surface and the illuminated background, and is registered between the reflective contrast surface and the illuminated background by the image sensor 270 to achieve edge detection and coincidence with the linear lateral shift of the substrate S supported by at least one substrate holder 200A and substrate holder 200B.

[0098] Referring to Figures 2A-2U and 14, a method for aligning (e.g., instantaneous alignment) a wafer S is provided. The method includes setting a transfer arm 180TA (Figure 14, block 1400) movably mounted to a frame 130F. The transfer arm 180TA has at least one substrate holder 200A and substrate holder 200B movably mounted on the transfer arm 180TA, such that at least one substrate holder 200A and substrate holder 200B are linearly lateralized relative to the frame 130F. The method includes registering and implementing edge detection of the wafer S (Figure 14, block 1410) supported by at least one substrate holder 200A and substrate holder 200B in a first position relative to a predetermined reference position (e.g., any suitable substrate holding stage, where the first position may be an misaligned position relative to the substrate holding stage). The wafer S moves at least partially with the transfer arm 180TA to achieve an alignment change of the wafer S (FIG. 14, block 1420) relative to a predetermined reference position from a first (misaligned) position to a second position (where the second position is the position where the wafer S is aligned with, for example, a substrate holder stage, so as to place the wafer S at a predetermined position and orientation on the substrate holder stage) based on edge detection data from the optical edge detection sensor 270. Here, the edge detection data is generated by illuminating (as described herein) the surface of the wafer supported by at least one substrate holder 200A, substrate holder 200B using illumination sources 271AL and 271BL connected to the frame 130F (the surface depicting the peripheral edge SE of the wafer S). The illumination sources 271AL and 271BL are positioned relative to the optical edge detection sensor 270 such that the surface is guided by the reflective surface illumination from the illumination sources 271AL and 271BL. At or toward the optical edge detection sensor 270, and at the peripheral edge SE of the wafer S, the background reflected light observed by the optical edge detection sensor 270 is optically blanked to coincide with the linear lateral movement of the wafer S supported by at least one substrate holder 200A and substrate holder 200B. The peripheral edge SE of the substrate S is defined in contrast by the wafer surface reflection and the optically blanked background, and is registered by the image sensor 270 between the wafer surface reflection and the optically blanked background to achieve edge detection and coincidence with the linear lateral movement of the wafer S supported by at least one substrate holder 200A and substrate holder 200B.

[0099] Referring again to Figures 2A-2U and Figure 14, a method for aligning (e.g., real-time alignment) a wafer S is provided. The method includes setting a transfer arm 180TA (Figure 14, block 1400) movably mounted to a frame 130F, and having at least one terminator 200A and terminator 200B movably mounted to the transfer arm 180TA, such that at least one terminator 200A and terminator 200B is linearly lateralized relative to the frame 130F. The method also includes registering and implementing edge detection of the wafer S (Figure 14, block 1410) supported by at least one terminator 200A and terminator 200B using an optical edge detection sensor 270 coupled to the transfer arm 180TA, wherein wafer alignment data transmitted to the transfer arm 180TA is determined (e.g., by means of a controller 199 or any other suitable controller) from the edge detection data of the optical edge detection sensor 270. The surface of wafer S (Fig. 14, block 1430) is illuminated by illumination sources 271AL and 271BL connected to frame 130F. Wafer S is supported by at least one terminator 200A and terminator 200B. This surface delineates the peripheral edge SE of wafer S. Illumination sources 271AL and 271BL are positioned relative to optical edge detection sensor 270 such that the surfaces illuminate or guide the optical edge detection sensor 270 with the reflective surfaces of illumination sources 271AL and 271BL, and optically blank the background reflected light of the background observed by optical edge detection sensor 270 at the peripheral edge SE of wafer S, coinciding with the linear lateral movement of wafer S supported by at least one terminator 200A and terminator 200B. The peripheral edge SE of wafer S is defined in a concave-convex manner in contrast (as described herein), formed by the reflection of the wafer surface and the background of the optical blanking, and registered by image sensor 270 between the reflection of the wafer surface and the background of the optical blanking to achieve edge detection and linear lateral movement of substrate S supported by at least one substrate holder 200A and substrate holder 200B.

[0100] Referring to Figures 2A-2U, 10A, and 10B, it is possible to achieve the advantages of on-the-fly alignment as described herein with respect to a significant reduction in the time spent by each substrate S in, for example, transfer chamber 130 (e.g., EFEM or other suitable transfer chamber) while being sorted, aligned, and / or identified. This reduction in time is related to the higher throughput achievable by on-the-fly alignment as described herein and / or a significant reduction in the time spent on the protective cladding provided by the substrate carrier 110 for a given substrate. This advantage is particularly evident for a general sorting formulation that provides alignment and / or optical character recognition (OCR) readings for all wafers in a given substrate carrier 110. For example, referring to Figure 10B, conventional system 870 typically relies on dual fixed aligners 800A and aligner 800B to achieve a higher overall throughput, but this architecture results in greater substrate travel distance, robot movement, and time spent by each substrate in a micro-environment. For example, Figure 10B illustrates a known exemplary transport path for transporting substrates within a transport chamber 130 for sorting, aligning, and / or identifying wafers. The substrate transport path TP1-TP8 proceeds from predetermined reference positions DL1 and DL2 in one of the substrate carriers 110A and 110B to predetermined reference positions DL3 and DL4 in one of the fixed aligners 800A and 800B, then to predetermined reference positions DL5 and DL6 in one of the vacuum isolation chambers 11010A and 11010B, or returns to predetermined reference positions DL1 and DL2 in one of the substrate carriers 110A and 110B. In contrast, referring to FIG10A, according to various configurations of the system in this disclosure, the wafer transfer paths TP10-TP13 of system 869 (which are substantially similar to the aforementioned substrate processing apparatus 100, substrate processing apparatus 150, and substrate processing apparatus 165 – see FIG1A-1C) are shown for transferring substrates within transfer chamber 130 for sorting, aligning, and / or identifying substrates S. As shown in FIG10A, the length of any transfer path TP10-TP15 is shorter than any of the conventional transfer paths TP1-TP8 shown in FIG10B. It can be recognized that transport paths TP14 and TP15 are the shortest paths, and as shown in Figure 10B, the corresponding path from substrate carrier 110A, substrate carrier 110B to one of aligners 800A, aligners 800B, and then back to one of substrate carrier 110A, substrate carrier 110B is the shortest. In this transport path, the substrate S is sorted and placed back into the substrate carrier from which the substrate S is picked up, or placed in an adjacent vacuum isolation chamber port.For example, when sorting according to transport paths TP14 and TP15 in FIG. 10A, substrate holders 200A and 200B sequentially pick up substrates S from a common substrate carrier such as substrate carrier 110A or substrate carrier 110B (in order to shuffle the substrates S). As each substrate S is picked up sequentially, as described above, during the retraction of each substrate S from substrate carrier 110A or substrate carrier 110B, each substrate S passes through image sensor 270 to detect the peripheral edge SE of substrate S. The substrates S are shuffled on substrate conveyor 180, so that each substrate is sequentially aligned. The aligned substrates are placed in one or more substrate carriers 110A or substrate carrier 110B in a predetermined sorting order.

[0101] Referring to FIG11, the time spent by the substrate in the transfer chamber 130 within system 869 is shorter than that of the conventional system 870 using dual fixed aligners 800A and aligner 800B. For example, the table in FIG11 shows each transfer operation relative to the conventional transfer / alignment system 870 of FIG10B (e.g., "conventional transfer time"), each transfer operation having a specified transfer time. The table in FIG11 also shows transfer operations relative to the transfer / alignment system 869 of FIG10A according to the present disclosure, each transfer operation having a specified transfer time. As can be seen from the table, both the conventional transfer / alignment system 870 and system 869 include the time associated with picking up one or more substrates S from substrate carriers 110A and 110B, and the time associated with placing one or more substrates S into vacuum isolation chambers 11010A and 11010B. However, in the latter case, this is where a similar point in the transfer time ends. For example, unlike the conventional system 869, which substantially directly transfers the substrate from substrate carriers 110A and 110B to a substrate holding position (where the substrate holding position is one or more substrate carriers in a vacuum isolation chamber port from which the substrate is removed, a different substrate carrier in an adjacent vacuum isolation chamber and a vacuum isolation chamber), the conventional system includes additional transfer time for transferring the substrate to a predetermined reference position DL3, predetermined reference position DL4 of one of the fixed aligners 800A and 800B, and removing the substrate from the predetermined reference position DL3, predetermined reference position DL4 of one of the fixed aligners 800A and 800B. Additionally, the conventional system 870 includes an ineffective transfer time during which the substrate S is located within and aligned in the aligners 800A and 800B. In system 869, this "alignment time" is essentially eliminated because the substrate is aligned during transport while simultaneously located on substrate holders 200A and 200B of substrate transporter 180, and at predetermined reference positions DL1, DL2, DL5, DL6 (transferring the substrate to the vacuum isolation chamber) and DL1, DL2 (returning the substrate to the substrate carrier during sorting, for example). Furthermore, even though the wafer is fixedly aligned in system 869 by substrate transport device holding slider 220 (e.g., in front of vacuum isolation chambers 11010A and 11010B), the time to transfer the substrate from substrate holders 200A and 200B to rotary chuck 260 (see FIG. 2I) is much shorter than the time to transfer the substrate from conventional substrate holders to fixed aligners 800A and 800B due to the shorter travel distance, for example, in the Z direction.For example, according to the embodiments of this disclosure, in order to perform substrate alignment and identification, the rotary chuck 260 moves a small amount Z1 along the Z direction (e.g., less than about 20 mm) from a fully lowered reference position CD (FIG. 2I), and the substrate holders 200A and 200B extend only partially in the R direction to transfer the substrate S between the substrate holders 200A and 200B and the rotary chuck 260. In contrast, the substrate transfer without immediate alignment in the embodiments of this disclosure requires a larger Z-stroke to transfer the substrate S from, for example, a predetermined wafer transfer plane, the transfer chamber 130, to the level of the wafer support surface of the fixed aligners 800A and 800B. Furthermore, while aligning the reference surface of the substrate holder with the reference positions DL3 and DL4 of the aligners 800A and 800B through additional movement, for example, along one or more axes of the X, Y, and θ axes, the substrate holder must be fully extended to align the reference surface with the reference position in the R direction.

[0102] It can be appreciated that the reduced wafer transfer time of the system 869 according to the present disclosure allows for a reduction in the elapsed time of the door opening of the substrate carrier 110. This reduced "carrier door open" time reduces contamination within the substrate carrier 110, for example, from the atmospheric environment, and provides enhanced inert gas protection for the interior of the substrate carrier 110 and the substrate S located therein. It can be appreciated that the reduced "carrier door open" time minimizes environmental changes and contamination within the substrate carrier 110, and also reduces the inert gas recovery time (and the amount of inert gas required for recovery) within the substrate carrier 110. In turn, environmental disturbances in the transfer chamber 130 are also reduced. As can be seen from the above, the embodiments of the present disclosure described herein not only provide higher wafer yield, but also provide improved cleanliness and reduced environmental exposure of the substrate S.

[0103] According to one or more embodiments of the present disclosure, a semiconductor wafer transfer device includes:

[0104] A frame;

[0105] A transfer arm movably mounted to a frame and having at least one terminator movably mounted to the transfer arm, such that the at least one terminator is linearly lateral relative to the frame.

[0106] An optical edge detection sensor coupled to the transfer arm and configured to register and perform edge detection on a wafer supported by the at least one terminator; and

[0107] An illumination source connected to a frame, the illumination source being configured to illuminate the surface of a wafer supported by at least one terminator, the surface depicting the peripheral edge of the wafer, the illumination source being positioned relative to an optical edge detection sensor such that the surface is directed from the reflective surface illumination of the illumination source toward or towards the optical edge detection sensor, and optically blanking the background reflected light of the background at the peripheral edge of the wafer, the background reflected light of the background being observed by the optical edge detection sensor to coincide with the linear lateral movement of the wafer supported by the at least one terminator;

[0108] Wherein, the peripheral edge of the substrate is defined concave and convex in the image contrast, formed by the background of wafer surface reflection and optical blanking, and registered by the optical edge detection sensor between the background of wafer surface reflection and optical blanking to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

[0109] According to one or more of the present disclosure, the terminator is linearly lateral relative to the frame in a first direction with the transfer arm as a unit.

[0110] According to one or more of the present disclosure, the terminator is linearly lateral relative to the transmission arm in a second direction.

[0111] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that edge detection of each wafer is achieved by lateral movement of each terminator of at least one terminator on the transfer arm in a second direction and the edge detection of each wafer coincides with the lateral movement of each terminator of at least one terminator on the transfer arm in the second direction.

[0112] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a conveyor arm, such that the optical edge detection sensor and the conveyor arm move as a unit relative to the frame.

[0113] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the optical edge detection sensor is a common sensor that realizes edge detection of each of more than one wafer simultaneously supported by at least one terminator.

[0114] According to one or more embodiments of the present disclosure, an optical edge detection sensor is fixedly mounted to the frame, and the optical edge detection sensor realizes the edge detection of the wafer supported by the terminator and the linear lateral displacement of the wafer through the field of view of the optical edge detection sensor.

[0115] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is aligned with the back surface of the wafer supported by the terminator, and the background is on the wafer.

[0116] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed toward the front surface of the wafer supported by the terminator, and the background is below the wafer.

[0117] According to one or more embodiments of the present disclosure, the semiconductor wafer transfer apparatus further includes: a contrast surface disposed in the background and arranged to optically blank the background reflected light observed by the optical edge detection sensor.

[0118] According to one or more of the present disclosure, the contrast surface is grayscale or dark, thereby forming an image contrast between the wafer surface reflection and the optically blanked background, the image contrast being registered by the optical edge detection sensor that unevenly defines the peripheral edge.

[0119] According to one or more embodiments of the present disclosure, the comparison surface is mounted to the conveyor arm, such that the comparison surface and the conveyor arm move relative to the frame as a unit.

[0120] According to one or more embodiments of the present disclosure, a contrast surface is mounted to a transfer arm such that the transfer arm moves relative to the frame as a unit, and the contrast surface forms a common background, thereby enabling at least one terminator to simultaneously support edge detection of each of more than one wafer.

[0121] According to one or more embodiments of the present disclosure, the contrast surface is fixedly mounted to the frame, and the contrast surface enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer to coincide with the contrast surface.

[0122] According to one or more embodiments of the present disclosure, the lighting source includes a backlight foreground contrast surface.

[0123] According to one or more embodiments of the present disclosure, the lighting source includes a foreground contrast surface and a projector.

[0124] According to one or more embodiments of the present disclosure, a lighting source is mounted to a conveyor arm, such that the lighting source and the conveyor arm move relative to the frame as a unit.

[0125] According to one or more embodiments of the present disclosure, an illumination source is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the illumination source forms a common illumination that enables edge detection of each wafer of more than one wafer to be simultaneously supported by at least one terminator.

[0126] According to one or more embodiments of the present disclosure, the illumination source is fixedly mounted to the frame, and the illumination source enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the illumination source.

[0127] According to one or more embodiments of the present disclosure, a semiconductor wafer transfer device includes:

[0128] Framework;

[0129] A conveyor arm movably mounted to a frame and having at least one terminator movably mounted to the conveyor arm, such that at least one terminator is linearly lateral relative to the frame.

[0130] An optical edge detection sensor coupled to the transfer arm and configured to register and perform edge detection on a wafer supported by the at least one terminator; and

[0131] An illumination source connected to a frame, the illumination source being configured to illuminate a contrast surface reflected from a surface of a wafer supported by the at least one terminator, the surface delineating the peripheral edge of the wafer, the contrast surface being positioned relative to an optical edge detection sensor such that the reflected contrast surface optically blanks at or toward the optical edge detection sensor, as observed from the wafer surface at the peripheral edge of the wafer, the background light reflected by the optical edge detection sensor coincides with the linear lateral movement of the wafer supported by the at least one terminator;

[0132] wherein the peripheral edge of the wafer is defined concave-convexly in image contrast, formed by a reflective contrast surface and an illuminated background, and is registered by an optical edge detection sensor between the reflective contrast surface and the illuminated background to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

[0133] According to one or more of the present disclosure, the terminator is linearly lateral relative to the frame in a first direction with the transmission arm as a unit.

[0134] According to one or more of the present disclosure, the terminator is linearly lateral relative to the transmission arm in a second direction.

[0135] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that edge detection of each wafer is achieved by lateral movement of each terminator of at least one terminator on the transfer arm in a second direction and the edge detection of each wafer coincides with the lateral movement of each terminator of at least one terminator on the transfer arm in the second direction.

[0136] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a conveyor arm, such that the optical edge detection sensor and the conveyor arm move as a unit relative to the frame.

[0137] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the optical edge detection sensor is a common sensor that realizes edge detection of each of more than one wafer simultaneously supported by at least one terminator.

[0138] According to one or more embodiments of the present disclosure, an optical edge detection sensor is fixedly mounted to the frame, and the optical edge detection sensor realizes the edge detection of the wafer supported by the terminator and the linear lateral displacement of the wafer through the field of view of the optical edge detection sensor.

[0139] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is aligned with the back surface of the wafer supported by the terminator, and the contrast surface is below the wafer.

[0140] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed to the front surface of the wafer supported by the terminator, and the contrast surface is on the wafer.

[0141] According to one or more embodiments of the present disclosure, the semiconductor wafer transfer apparatus further includes, according to one or more embodiments of the present disclosure, a background contrast surface that at least partially forms an illuminated background is disposed on the side of the wafer opposite to the contrast surface.

[0142] According to one or more of the present disclosure, the contrast surface is grayscale or dark, thereby forming an image contrast formed by the reflection of the wafer surface and the optically blanked background, and between the reflection of the wafer surface and the optically blanked background, the image contrast being registered by the optical edge detection sensor that defines the peripheral edge in an uneven manner.

[0143] According to one or more embodiments of the present disclosure, the comparison surface is mounted to the conveyor arm, such that the comparison surface and the conveyor arm move relative to the frame as a unit.

[0144] According to one or more embodiments of the present disclosure, the contrast surface is fixedly mounted to the frame, and the contrast surface enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer to coincide with the contrast surface.

[0145] According to one or more embodiments of the present disclosure, the illumination source is configured to backlight the contrast surface.

[0146] According to one or more embodiments of the present disclosure, a lighting source is mounted to a conveyor arm, such that the lighting source and the conveyor arm move relative to the frame as a unit.

[0147] According to one or more embodiments of the present disclosure, an illumination source is mounted to a transfer arm so that the transfer arm moves relative to the frame as a unit, and the illumination source forms common illumination to realize edge detection of each of more than one wafer simultaneously supported by at least one terminator.

[0148] According to one or more embodiments of the present disclosure, the illumination source is fixedly mounted to the frame, and the illumination source enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the illumination source.

[0149] According to one or more samples of this disclosure, a method for detecting the edge of a wafer includes:

[0150] A conveyor arm is provided, which is movably mounted to a frame and has at least one terminator movably mounted to the conveyor arm, such that the at least one terminator is linearly lateral relative to the frame.

[0151] Edge detection of a wafer supported by at least one terminator is registered and implemented using an optical edge detection sensor coupled to the transfer arm; and

[0152] Using an illumination source connected to a frame, a wafer surface supported by at least one terminator is illuminated, the surface delineating the peripheral edge of the wafer, the illumination source being positioned relative to an optical edge detection sensor such that the surface is guided from the reflective surface of the illumination source to the optical edge detection sensor or toward the optical edge detection sensor, and background reflection light at the peripheral edge of the wafer is optically blanked, the background reflection light of the background being observed by the optical edge detection sensor to coincide with the linear lateral movement of the wafer supported by the at least one terminator;

[0153] wherein the peripheral edge of the wafer is defined concave-convexly in the image contrast, formed by the wafer surface reflection and the optically blanking background and is registered by the optical edge detection sensor between the wafer surface reflection and the optically blanking background to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

[0154] According to one or more of the present disclosure, the terminator is linearly lateral relative to the frame in a first direction with the transmission arm as a unit.

[0155] According to one or more of the present invention, the terminator is linearly lateralized relative to the transmission arm in a second direction.

[0156] According to one or more embodiments of the present disclosure, edge detection of each wafer is achieved by lateral movement of each terminator of at least one terminator on the transfer arm in a second direction and the edge detection of each wafer coincides with the lateral movement of each terminator of at least one terminator on the transfer arm in the second direction.

[0157] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a conveyor arm, such that the optical edge detection sensor and the conveyor arm move as a unit relative to the frame.

[0158] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the optical edge detection sensor is a common sensor that realizes edge detection of each of more than one wafer simultaneously supported by at least one terminator.

[0159] According to one or more embodiments of the present disclosure, an optical edge detection sensor is fixedly mounted to the frame, and the optical edge detection sensor realizes the edge detection of the wafer supported by the terminator and the linear lateral displacement of the wafer through the field of view of the optical edge detection sensor.

[0160] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is aligned with the back surface of the wafer supported by the terminator, and the background is on the wafer.

[0161] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed toward the front surface of the wafer supported by the terminator, and the background is below the wafer.

[0162] According to one or more of the present disclosure, a contrast surface is disposed in the background and arranged to optically blank the background observed by the optical edge detection sensor.

[0163] According to one or more of the present disclosure, the contrast surface is grayscale or dark, thereby forming an image contrast formed by the reflection of the wafer surface and the optically blanked background and between the reflection of the wafer surface and the optically blanked background, the image contrast being registered by the optical edge detection sensor that unevenly defines the peripheral edge.

[0164] According to one or more embodiments of the present disclosure, the comparison surface is mounted to the conveyor arm, such that the comparison surface and the conveyor arm move relative to the frame as a unit.

[0165] According to one or more embodiments of the present disclosure, a contrast surface is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the contrast surface forms a common background for edge detection of each wafer that is simultaneously supported by at least one terminator for more than one wafer.

[0166] According to one or more embodiments of the present disclosure, the contrast surface is fixedly mounted to the frame, and the contrast surface enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer to coincide with the contrast surface.

[0167] According to one or more embodiments of the present disclosure, the lighting source includes a backlight foreground contrast surface.

[0168] According to one or more embodiments of the present disclosure, the lighting source includes a foreground contrast surface and a projector.

[0169] According to one or more embodiments of the present disclosure, a lighting source is mounted to a conveyor arm, such that the lighting source and the conveyor arm move relative to the frame as a unit.

[0170] According to one or more embodiments of the present disclosure, an illumination source is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, the illumination source forming a common illumination to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

[0171] According to one or more embodiments of the present disclosure, the illumination source is fixedly mounted to the frame, and the illumination source enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the illumination source.

[0172] According to one or more embodiments of the present disclosure, a method for detecting the edge of a wafer includes:

[0173] A conveyor arm is provided, which is movably mounted to a frame and has at least one terminator movably mounted to the conveyor arm such that the at least one terminator is linearly lateral relative to the frame.

[0174] Edge detection of a wafer supported by at least one terminator is registered and implemented using an optical edge detection sensor coupled to the transfer arm; and

[0175] Using an illumination source connected to the frame, illumination is provided from a contrast surface reflected from the wafer surface supported by at least one terminator, the terminator delineating the peripheral edge of the wafer, the contrast surface being positioned relative to an optical edge detection sensor so as to optically blank the background light reflected from the wafer surface at the peripheral edge of the wafer from the contrast surface reflected at or toward the optical edge detection sensor, the background reflected light of the background being observed by the optical edge detection sensor to coincide with the linear lateral movement of the wafer supported by the at least one terminator;

[0176] wherein the peripheral edge of the wafer is defined concave-convexly in image contrast, formed by a reflective contrast surface and an illuminated background, and is registered by the optical edge detection sensor between the reflective contrast surface and the illuminated background to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

[0177] According to one or more of the present disclosure, the terminator is linearly lateral relative to the frame in a first direction with the transmission arm as a unit.

[0178] According to one or more of the present disclosure, the terminator is linearly lateral relative to the transmission arm in a second direction.

[0179] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that edge detection of each wafer is achieved by lateral movement of each terminator of at least one terminator on the transfer arm in a second direction and the edge detection of each wafer coincides with the lateral movement of each terminator of at least one terminator on the transfer arm in the second direction.

[0180] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a conveyor arm, such that the optical edge detection sensor and the conveyor arm move as a unit relative to the frame.

[0181] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the optical edge detection sensor is a common sensor that realizes edge detection of each of more than one wafer simultaneously supported by at least one terminator.

[0182] According to one or more embodiments of the present disclosure, an optical edge detection sensor is fixedly mounted to the frame, and the optical edge detection sensor realizes the edge detection of the wafer supported by the terminator and the linear lateral shift of the wafer through the field of view of the optical edge detection sensor.

[0183] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is aligned with the back surface of the wafer supported by the terminator, and the contrast surface is below the wafer.

[0184] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed to the front surface of the wafer supported by the terminator, and the contrast surface is on the wafer.

[0185] According to one or more embodiments of the present disclosure, a background contrast surface that at least partially forms the illuminated background is disposed on the side of the wafer opposite to the contrast surface.

[0186] According to one or more of the present disclosure, the contrast surface is grayscale or dark, thereby forming an image contrast formed by the reflection of the wafer surface and the optically blanked background, and between the reflection of the wafer surface and the optically blanked background, the image contrast being registered by the optical edge detection sensor that defines the peripheral edge in an uneven manner.

[0187] According to one or more embodiments of the present disclosure, the contrast surface is mounted to the conveyor arm, such that the contrast surface and the conveyor arm move relative to the frame as a unit.

[0188] According to one or more embodiments of the present disclosure, the contrast surface is fixedly mounted to the frame, and the contrast surface enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the contrast surface.

[0189] According to one or more embodiments of the present disclosure, the illumination source is configured to backlight the contrast surface.

[0190] According to one or more embodiments of the present disclosure, a lighting source is mounted to a conveyor arm, such that the lighting source and the conveyor arm move relative to the frame as a unit.

[0191] According to one or more embodiments of the present disclosure, an illumination source is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, the illumination source forming a common illumination to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

[0192] According to one or more embodiments of the present disclosure, the illumination source is fixedly mounted to the frame, and the illumination source enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the illumination source.

[0193] According to one or more embodiments of the present disclosure, a method for aligning wafers is provided. The method includes:

[0194] A conveyor arm is provided, which is movably mounted to a frame and has at least one terminator movably mounted to the conveyor arm, such that the at least one terminator is linearly lateral relative to the frame.

[0195] An optical edge detection sensor coupled to a transfer arm is used to register and realize edge detection of a wafer supported by at least one terminator, and the wafer is in a first position relative to a predetermined reference position; and

[0196] The wafer is moved at least partially by a transfer arm so that the alignment of the wafer relative to a predetermined reference position is changed from a first position to a second position based on edge detection data from the optical device edge detection sensor;

[0197] Among them:

[0198] By illuminating a wafer surface supported by at least one terminator with an illumination source connected to a frame, the surface delineating the peripheral edge of the wafer, the illumination source being positioned relative to an optical edge detection sensor, such that the surface guides reflective surface illumination from the illumination source to or toward the optical edge detection sensor, and optically blanks background reflections at the peripheral edge of the wafer, the background reflections observed by the optical edge detection sensor coinciding with the linear lateral movement of the wafer supported by the at least one terminator; and

[0199] The peripheral edge of the wafer is defined in an image contrast, formed by the wafer surface reflection and the optically blanked background, and is registered by the optical edge detection sensor between the wafer surface reflection and the optically blanked background to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

[0200] According to one or more of the present disclosure, the terminator is linearly lateral relative to the frame in a first direction with the transmission arm as a unit.

[0201] According to one or more of the present disclosure, the terminator is linearly lateralized relative to the transmission arm in a second direction.

[0202] According to one or more embodiments of the present disclosure, edge detection of each wafer is achieved by lateral movement in a second direction of at least one terminator on the transfer arm and coinciding with lateral movement in a second direction of at least one terminator on the transfer arm.

[0203] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a conveyor arm, such that the optical edge detection sensor and the conveyor arm move as a unit relative to the frame.

[0204] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the optical edge detection sensor is a common sensor that realizes edge detection of each of more than one wafer simultaneously supported by at least one terminator.

[0205] According to one or more embodiments of the present disclosure, an optical edge detection sensor is fixedly mounted to the frame, and the optical edge detection sensor realizes the edge detection of the wafer supported by the terminator and the linear lateral displacement of the wafer through the field of view of the optical edge detection sensor.

[0206] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is aligned with the back surface of the wafer supported by the terminator, and the background is on the wafer.

[0207] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed toward the front surface of the wafer supported by the terminator, and the background is below the wafer.

[0208] According to one or more of the present disclosure, a contrast surface is disposed in the background and arranged to optically blank the background observed by an optical edge detection sensor.

[0209] According to one or more of the present disclosure, the contrast surface is grayscale or dark, thereby forming an image contrast between the wafer surface reflection and the optically blanked background, the image contrast being registered by the optical edge detection sensor that unevenly defines the peripheral edge.

[0210] According to one or more embodiments of the present disclosure, the comparison surface is mounted to the conveyor arm, such that the comparison surface and the conveyor arm move relative to the frame as a unit.

[0211] According to one or more embodiments of the present disclosure, a contrast surface is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the contrast surface forms a common background for edge detection of each wafer that is simultaneously supported by at least one terminator.

[0212] According to one or more embodiments of the present disclosure, the contrast surface is fixedly mounted to the frame, and the contrast surface enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the contrast surface.

[0213] According to one or more embodiments of the present disclosure, the lighting source includes a backlight foreground contrast surface.

[0214] According to one or more embodiments of the present disclosure, the lighting source includes a foreground contrast surface and a projector.

[0215] According to one or more embodiments of this disclosure, a lighting source is mounted to a conveyor arm, such that the lighting source and the conveyor arm move as a unit relative to the frame.

[0216] According to one or more embodiments of the present disclosure, an illumination source is mounted to a conveyor arm to move relative to the frame as a unit with the conveyor arm, the illumination source forming a common illumination, realizing edge detection that coincides with the linear lateral movement of each wafer simultaneously supported by at least one terminator.

[0217] According to one or more embodiments of the present disclosure, the illumination source is fixedly mounted to the frame, and the illumination source enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the illumination source.

[0218] According to one or more embodiments of the present disclosure, a method for aligning wafers is provided. The method includes:

[0219] A transfer arm is provided, which movably transfers the arm frame and has at least one terminator that movably transfers the arm to allow the at least one terminator to laterally move linearly relative to the frame.

[0220] Edge detection and registration of a wafer supported by at least one terminator are performed using an optical edge detection sensor coupled to a transfer arm, wherein edge detection data from the optical edge detection sensor determines the wafer alignment data to be transferred to the transfer arm; and

[0221] Using an illumination source connected to a frame, a wafer surface supported by at least one terminator is illuminated, the surface delineating the peripheral edge of the wafer, the illumination source being positioned relative to an optical edge detection sensor such that the surface is directed from the reflective surface illumination of the illumination source toward or towards the optical edge detection sensor, and the background reflected light at the peripheral edge of the wafer is optically blanked, the background reflected light of the background being observed by the optical edge detection sensor to coincide with the linear lateral movement of the wafer supported by the at least one terminator;

[0222] wherein the peripheral edge of the wafer is defined concave-convexly in the image contrast, formed by the wafer surface reflection and the optically blanking background and is registered by the optical edge detection sensor between the wafer surface reflection and the optically blanking background to achieve edge detection that coincides with the linear lateral movement of the wafer supported by the at least one terminator.

[0223] According to one or more of the present disclosure, the terminator is linearly lateral relative to the frame in a first direction with the transmission arm as a unit.

[0224] According to one or more of the present disclosure, the terminator is linearly lateralized relative to the transmission arm in a second direction.

[0225] According to one or more embodiments of the present disclosure, edge detection of each wafer is achieved by lateral movement of each terminator of at least one terminator on the transfer arm in a second direction and the edge detection of each wafer coincides with the lateral movement of each terminator of at least one terminator on the transfer arm in the second direction.

[0226] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a conveyor arm, such that the optical edge detection sensor and the conveyor arm move as a unit relative to the frame.

[0227] According to one or more embodiments of the present disclosure, an optical edge detection sensor is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the optical edge detection sensor is a common sensor that realizes edge detection of each of more than one wafer simultaneously supported by at least one terminator.

[0228] According to one or more embodiments of the present disclosure, an optical edge detection sensor is fixedly mounted to the frame, and the optical edge detection sensor realizes the edge detection of the wafer supported by the terminator and the linear lateral displacement of the wafer through the field of view of the optical edge detection sensor.

[0229] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is aligned with the back surface of the wafer supported by the terminator, and the background is on the wafer.

[0230] According to one or more embodiments of the present disclosure, the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed toward the front surface of the wafer supported by the terminator, and the background is below the wafer.

[0231] According to one or more of the present disclosure, a contrast surface is disposed in the background and arranged to optically blank the background observed by the optical edge detection sensor.

[0232] According to one or more of the present disclosure, the contrast surface is grayscale or dark, thereby forming an image contrast between the wafer surface reflection and the optically blanked background, the image contrast being registered by the optical edge detection sensor that defines the peripheral edge in an uneven manner.

[0233] According to one or more embodiments of the present disclosure, the comparison surface is mounted to the conveyor arm, such that the comparison surface and the conveyor arm move relative to the frame as a unit.

[0234] According to one or more embodiments of the present disclosure, a contrast surface is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, and the contrast surface forms a common background for edge detection of each wafer that is simultaneously supported by at least one terminator for more than one wafer.

[0235] According to one or more embodiments of the present disclosure, the contrast surface is fixedly mounted to the frame, and the contrast surface enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the contrast surface.

[0236] According to one or more embodiments of the present disclosure, the lighting source includes a backlight foreground contrast surface.

[0237] According to one or more embodiments of the present disclosure, the lighting source includes a foreground contrast surface and a projector.

[0238] According to one or more embodiments of the present disclosure, a lighting source is mounted to a conveyor arm, such that the lighting source and the conveyor arm move relative to the frame as a unit.

[0239] According to one or more embodiments of the present disclosure, an illumination source is mounted to a transfer arm to move relative to the frame as a unit with the transfer arm, the illumination source forming a common illumination that enables edge detection of each wafer simultaneously supporting at least one terminator for more than one wafer.

[0240] According to one or more embodiments of the present disclosure, the illumination source is fixedly mounted to the frame, and the illumination source enables edge detection of the wafer supported by the terminator and linear lateral movement of the wafer through the illumination source.

[0241] It should be understood that the above description is merely an illustration of various aspects of this disclosure. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of this disclosure. Therefore, the various aspects of this disclosure are intended to cover all such alternatives, modifications, and variations falling within the scope of the appended claims. Furthermore, the mere fact that different features are described in appendices or independent claims of different claims does not imply that combinations of these features cannot be advantageously used, such combinations still falling within the scope of this disclosure.

[0242] refers to the scope of the patent application. [Simplified Explanation of the Diagram]

[0005] The foregoing features and other characteristics of the disclosed embodiments are explained in the following description in conjunction with the accompanying drawings, wherein:

[0006] The figures [Figure 1A], [Figure 1B] and [Figure 1C] are exemplary substrate processing systems incorporating the present disclosure;

[0007] [Figure 2A] is a schematic perspective view of a portion of the substrate transmitter of the present disclosure incorporating Figures 1A-1C;

[0008] [Fig. 2B] is a schematic perspective view of a portion of the substrate transmitter of FIG. 2A incorporating the present disclosure;

[0009] [Figure 2C]-[Figure 2G] are schematic diagrams of a substrate transfer arm according to the present disclosure;

[0010] [Figure 2H] and [Figure 2I] are schematic diagrams of partial substrate transfers according to the present disclosure in Figures 1A-1C;

[0011] [Fig. 2J] is a schematic diagram of the substrate transmission according to the present disclosure of FIG. 1A-1C;

[0012] [Figure 2K]-[Figure 2W] are schematic diagrams of the transfer of some substrates in Figures 1A-1C;

[0013] [Figure 2X] is a schematic diagram of substrate feature artifacts in the molding material of a molded wafer detected according to the present disclosure;

[0014] [Fig. 3A] is a schematic diagram of a portion of the substrate as seen through the imager of the substrate transmitter of FIG. 2A according to the present disclosure;

[0015] [Fig. 3B] is a schematic diagram of a processed image of a portion of the substrate shown in Fig. 3A according to the present disclosure;

[0016] [Figure 3C] is a schematic diagram of the processed image of Figure 3B according to the present disclosure being transformed into polar coordinate space;

[0017] [Figure 4A] is a schematic diagram of a portion of the substrate transmitter of the present disclosure combined with Figures 1A and 1B;

[0018] [Fig. 4B] is a schematic diagram of a portion of the substrate as seen through the imager of the substrate transmitter of FIG. 2A according to the present disclosure;

[0019] [Figure 5A] is a schematic diagram of a portion of the aligner of the present disclosure in combination with Figures 1A and 1B;

[0020] [Fig. 5B] is a schematic diagram of a portion of the substrate as seen through the imager of the aligner in FIG. 5A according to the present disclosure;

[0021] [Figure 6A] and [Figure 6B] are respectively a schematic diagram of the substrate according to the present disclosure and a schematic diagram of the transformation of a portion of the substrate to polar coordinate space;

[0022] [Figure 7] is a flowchart of the method for presenting the state pattern according to the present disclosure;

[0023] [Figure 8] is a flowchart of the method for presenting the state pattern according to the present disclosure;

[0024] [Figure 9] is a flowchart of the method for processing according to the present disclosure;

[0025] [Figure 10A] is a schematic diagram of an exemplary processing system according to the present disclosure;

[0026] [Figure 10B] is a schematic diagram of an exemplary prior art processing system;

[0027] [Figure 11] is a graph comparing the transmission times of the processing systems of Figures 10A and 10B according to the present disclosure;

[0028] [Figures 12A] to [Figures 12D] are schematic diagrams of a portion of a machine vision system according to the present disclosure;

[0029] [Figures 13A] to [Figures 13D] are schematic diagrams of a portion of a machine vision system according to the present disclosure; and

[0030] [Figure 14] is a flowchart of the method of the present disclosure.

Claims

1. A semiconductor wafer transfer device, comprising: a frame; a transfer arm movably mounted to the frame and having at least one terminator movably mounted to the transfer arm, such that the at least one terminator is laterally movable relative to the frame. An optical edge detection sensor is connected to the frame and communicatively coupled to a static wafer alignment stage on the frame. The optical edge detection sensor is configured to register and perform edge detection of the wafer supported by the at least one terminator. An illumination source, connected to the frame, is configured to illuminate the surface of the wafer supported by the at least one terminator, the surface delineating the peripheral edge of the wafer. The illumination source is positioned relative to the optical edge detection sensor such that the surface reflects surface illumination from the illumination source and guides it to the optical edge detection sensor, optically masking background reflections of the background at the peripheral edge of the wafer, which are observed by the optical edge detection sensor to coincide with the lateral movement of the wafer supported by the at least one terminator to the static wafer alignment stage. The peripheral edge of the wafer is defined in an image contrast, formed by wafer surface reflections and the optically masked background, and is registered by the optical edge detection sensor between the wafer surface reflections and the optically masked background to achieve edge detection coinciding with the lateral movement of the wafer supported by the at least one terminator.

2. The semiconductor wafer transfer apparatus according to claim 1, wherein the least one terminator is linearly transverse relative to the frame.

3. The semiconductor wafer transfer apparatus according to claim 1, wherein the least one terminator is transversely moved in an arc shape relative to the frame.

4. The semiconductor wafer transfer apparatus according to claim 1, wherein the terminator is laterally moved relative to the frame in a first direction as a unit with the transfer arm.

5. The semiconductor wafer transfer apparatus according to claim 4, wherein the terminator is laterally moved relative to the transfer arm in a second direction.

6. The semiconductor wafer transfer apparatus according to claim 5, wherein the optical edge detection sensor is configured such that the edge detection of each wafer is achieved by lateral movement of each terminator of the at least one terminator on the transfer arm in the second direction and the edge detection of each wafer coincides with the lateral movement of each terminator of the at least one terminator on the transfer arm in the second direction.

7. The semiconductor wafer transfer apparatus according to claim 1, wherein the optical edge detection sensor is mounted to the transfer arm such that the optical edge detection sensor and the transfer arm move as a unit relative to the frame.

8. The semiconductor wafer transfer apparatus according to claim 1, wherein the optical edge detection sensor is mounted to the transfer arm to move relative to the frame as a unit with the transfer arm, and the optical edge detection sensor is a common sensor that performs edge detection of each of more than one wafer simultaneously supported by the at least one terminator.

9. The semiconductor wafer transfer apparatus according to claim 1, wherein the optical edge detection sensor is fixedly mounted to the frame, and the optical edge detection sensor realizes the edge detection of the wafer supported by the terminator and the wafer lateral movement through the field of view of the optical edge detection sensor coincides.

10. The semiconductor wafer transfer apparatus according to claim 1, wherein the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed toward the back surface of the wafer supported by the terminator, and the background is on the wafer.

11. The semiconductor wafer transfer apparatus according to claim 1, wherein the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed toward the front surface of the wafer supported by the terminator, and the background is under the wafer.

12. The semiconductor wafer transfer apparatus of claim 1 further includes: a contrast surface disposed in the background and arranged to optically mask the background reflected light observed by the optical edge detection sensor.

13. The semiconductor wafer transfer apparatus of claim 12, wherein the contrast surface is grayscale or dark to form an image contrast formed by reflections from the wafer surface and the optically occluded background, and between the reflections from the wafer surface and the optically occluded background, the image contrast being registered by the optical edge detection sensor that convexly and concavely defines the peripheral edge.

14. The semiconductor wafer transfer apparatus according to claim 12, wherein the contrasting surface is mounted to the transfer arm such that the contrasting surface and the transfer arm move relative to the frame as a unit.

15. The semiconductor wafer transfer apparatus of claim 12, wherein the contrasting surface is mounted to the transfer arm to move relative to the frame as a unit with the transfer arm, the contrasting surface forming a common background for edge detection of each wafer simultaneously supported by the at least one terminator.

16. The semiconductor wafer transfer apparatus according to claim 12, wherein the contrasting surface is fixedly mounted to the frame, and the contrasting surface enables the edge detection of the wafer supported by the terminator to coincide with the wafer traversing the contrasting surface.

17. The semiconductor wafer transfer apparatus according to claim 1, wherein the illumination source includes a backlight foreground contrast surface.

18. The semiconductor wafer transfer apparatus of claim 1, wherein the illumination source includes a foreground contrast surface and a projector.

19. The semiconductor wafer transfer apparatus of claim 1, wherein the illumination source is mounted to the transfer arm such that the illumination source and the transfer arm move as a unit relative to the frame.

20. A semiconductor wafer transfer apparatus according to claim 1, wherein the illumination source is mounted to the transfer arm to move relative to the frame as a unit with the transfer arm, the illumination source forming a common illumination for edge detection of each wafer simultaneously supported by the at least one terminator.

21. The semiconductor wafer transfer apparatus according to claim 1, wherein the illumination source is fixedly mounted to the frame, and the illumination source enables the edge detection of the wafer supported by the terminator to coincide with the wafer traversing past the illumination source.

22. A semiconductor wafer transfer apparatus comprising: a frame; an optical edge detection sensor connected to the frame and communicatively coupled to a static wafer alignment stage on the frame, the optical edge detection sensor being configured to register and perform edge detection of a wafer supported by the at least one terminator. And an optical edge detection sensor, which is coupled to the transfer arm and configured to register and perform edge detection on the wafer supported by the at least one terminator; And an illumination source connected to the frame, the illumination source being configured to illuminate a contrast surface reflected from the surface of the wafer supported by the at least one terminator, the surface depicting the peripheral edge of the wafer, the contrast surface being positioned relative to the optical edge detection sensor such that the reflected contrast surface, guided from the surface to the optical edge detection sensor, is optically concealed at the peripheral edge of the wafer from background light reflected from the surface of the wafer, the background light reflection being observed by the optical edge detection sensor to coincide with the lateral movement of the wafer supported by the at least one terminator to the static wafer alignment stage; wherein the peripheral edge of the wafer is defined concave-convexly in image contrast, formed by the reflected contrast surface and the illuminated background and is registered by the optical edge detection sensor between the reflected contrast surface and the illuminated background to achieve edge detection coinciding with the lateral movement of the wafer supported by the at least one terminator.

23. The semiconductor wafer transfer apparatus according to claim 22, wherein the lesser terminator is linearly lateral relative to the frame.

24. The semiconductor wafer transfer apparatus according to claim 22, wherein the least one terminator is transversely moved in an arc shape relative to the frame.

25. The semiconductor wafer transfer apparatus according to claim 22, wherein the terminator is laterally moved relative to the frame in a first direction as a unit with the transfer arm.

26. The semiconductor wafer transfer apparatus according to claim 25, wherein the terminator is laterally moved relative to the transfer arm in a second direction.

27. The semiconductor wafer transfer apparatus of claim 26, wherein the optical edge detection sensor is configured such that the edge detection of each wafer is achieved by lateral movement of each terminator of the at least one terminator on the transfer arm in the second direction and the edge detection of each wafer coincides with the lateral movement of each terminator of the at least one terminator on the transfer arm in the second direction.

28. The semiconductor wafer transfer apparatus of claim 22, wherein the optical edge detection sensor is mounted to the transfer arm such that the optical edge detection sensor and the transfer arm move as a unit relative to the frame.

29. The semiconductor wafer transfer apparatus of claim 22, wherein the optical edge detection sensor is mounted to the transfer arm to move relative to the frame as a unit with the transfer arm, and the optical edge detection sensor is a common sensor that performs edge detection of each of more than one wafer simultaneously supported by the at least one terminator.

30. The semiconductor wafer transfer apparatus of claim 22, wherein the optical edge detection sensor is fixedly mounted to the frame, and the optical edge detection sensor realizes the edge detection of the wafer supported by the terminator and the wafer lateral movement through the field of view of the optical edge detection sensor coincides.

31. The semiconductor wafer transfer apparatus according to claim 22, wherein the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed to the back surface of the wafer supported by the terminator, and the contrast surface is under the wafer.

32. The semiconductor wafer transfer apparatus according to claim 22, wherein the optical edge detection sensor is configured such that the field of view of the optical edge detection sensor is directed to the front surface of the wafer supported by the terminator, and the contrast surface is on the wafer.

33. The semiconductor wafer transport apparatus according to claim 22 further includes a background contrast surface that at least partially forms the illuminated background and is disposed on the side of the wafer opposite to the contrast surface.

34. A semiconductor wafer transfer apparatus according to claim 33, wherein the contrast surface is grayscale or dark to form an image contrast formed by the reflective contrast surface and the illuminated background and between the reflective contrast surface and the illuminated background, the image contrast being registered by the optical edge detection sensor that unevenly defines the peripheral edge.

35. The semiconductor wafer transfer apparatus of claim 22, wherein the contrasting surface is mounted to the transfer arm such that the contrasting surface and the transfer arm move relative to the frame as a unit.

36. The semiconductor wafer transfer apparatus according to claim 22, wherein the contrasting surface is fixedly mounted to the frame, and the contrasting surface enables the edge detection of the wafer supported by the terminator to coincide with the wafer traversing the contrasting surface.

37. The semiconductor wafer transfer apparatus according to claim 22, wherein the illumination source is configured to backlight the contrast surface.

38. The semiconductor wafer transfer apparatus of claim 22, wherein the illumination source is mounted to the transfer arm such that the illumination source and the transfer arm move as a unit relative to the frame.

39. A semiconductor wafer transfer apparatus according to claim 22, wherein the illumination source is mounted to the transfer arm to move relative to the frame as a unit with the transfer arm, and the illumination source forms common illumination to realize edge detection of each wafer simultaneously supported by the at least one terminator.

40. The semiconductor wafer transfer apparatus according to claim 22, wherein the illumination source is fixedly mounted to the frame, and the illumination source enables the edge detection of the wafer supported by the terminator to coincide with the wafer traversing past the illumination source.

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