Hot pressing cushioning material and manufacturing method of multilayer substrate

TW202626322APending Publication Date: 2026-07-01YAMAUCHI CORP
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Patent Information

Application Number
TW114130154
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-08-09
Filing Date
2025-08-07
Publication Date
2026-07-01
Patent Text Reader

Abstract

The objective of the present invention is to make the cushioning material used in pin lamination-type hot pressing of hot pressing that is capable of utilizing for long periods of repeated hot pressing by avoiding damage when inserting guide pin. A hot pressing cushioning material 1 is flat plate-shaped and used in pin lamination-type hot pressing that is performed by inserting a guide pin 51 for position aligning into a through-hole disposed on workpiece. the hot pressing cushioning material 1 includes a cushioning material body 2 with a plurality of through-holes 2a for inserting the guide pin 51 formed along thickness direction at predetermined positions near an outer edge 2d, a cover member 4 having an outer side surface that contacts the side surface of the through-hole 2a, and includes a fixing member 5 that fixes the outer side surface of the cover member 4 and the side surface of the through-hole 2a.
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