Method for applying a reflective layer to a front side of a substrate wafer and for passivating exposed surfaces of the substrate wafer

Abstract

The invention relates to a method for applying a reflective layer (110) to a front side (12) of a substrate wafer (10) and for passivating exposed surfaces (44) of the substrate wafer (10). In this case, at least the following method steps are run through: According to a) trenches (36) are introduced on the front side (12) of the substrate wafer (10) and an ALD coating (46) is applied at least to the sidewalls (40) thereof. Subsequently, according to b) trenches (36) introduced according to a) are temporarily filled with a filling layer (50, 52). According to c) a coating comprising a reflective layer (110) and an electrically conductive protective layer (62) is applied to the front side (12) of the substrate wafer (10) and according to d) a protective wafer (66) is temporarily applied to the front side (12) already coated according to c) and all exposed surfaces (44) are passivated using an ALD coating (46, 82).