Resin composition, cured material, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device, and semiconductor device.

Abstract

The present invention provides a resin composition, a cured product formed by curing the resin composition, a laminate containing the cured product, a method for manufacturing the cured product, a method for manufacturing the laminate, a method for manufacturing a semiconductor device including the method for manufacturing the cured product, and a semiconductor device containing the cured product. The resin composition comprises resin A, photosensitizer B, and solvent C, wherein resin A contains at least one selected from the group consisting of acetate structures and acetic acid structures, the viscosity change rate of the resin composition after adjusting to 38°C for 3 days is within ±10%, and the acid value of the acid groups in resin A containing acid groups with a neutralization point in the range of 7.0 to 12.0 is in the range of 0.0010 to 0.3000 mmol / g.