Semiconductor device and method for fabricating the same
TW202628083APending Publication Date: 2026-07-01SK HYNIX INC
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Patent Information
- Application Number
- TW114142858
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-30
- Filing Date
- 2025-11-04
- Publication Date
- 2026-07-01
Abstract
A method for fabricating a semiconductor device including high-integrated memory cells and the semiconductor device is provided. The method includes forming a horizontal arrangement of nano sheet target patterns over a substrate, wherein the nano sheet target patterns include initial sheets that are horizontally oriented and sheet expansion tabs disposed on both sides of each of the initial sheets; performing a surface treatment on the nano sheet target patterns to form a horizontal arrangement of narrow sheets and nano sheet dielectric layers, each of the nano sheet dielectric layers surrounding a different one of the narrow sheets; and forming a horizontal conductive line on the nano sheet dielectric layers, the horizontal conductive line surrounding the narrow sheets.
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