Chucking of high-warp substrates using multizonal chucks

Abstract

Disclosed systems and techniques are directed to improving chucking of substrates in device manufacturing systems. The techniques include identifying deformation of a substrate and applying, based on the identified deformation, a plurality of time-dependent voltage signals to a multizonal chuck to attract the substrate to the multizonal chuck. Each voltage signal of the plurality of time-dependent voltage signals is applied to one or more electrodes of the multizonal chuck. The techniques further include performing one or more processing operations in association with the substrate attracted to the multizonal chuck.