Plasma treatment equipment and power supply system

TW202628186APending Publication Date: 2026-07-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114140114
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-24
Filing Date
2025-10-17
Publication Date
2026-07-01
Patent Text Reader

Abstract

This invention provides a technique for improving the plasma processing performance of a plasma processing apparatus. The plasma processing apparatus of this invention includes a chamber, a substrate support, a lower electrode, a refrigerant flow path, a gas supply section, an RF signal generator, and a voltage pulse signal generator. The RF signal has a first electrical level in a first period included in each of a plurality of cycles, a second electrical level in a second period included in each of a plurality of cycles, and a third electrical level in a third period included in each of a plurality of cycles, wherein the second and third electrical levels are lower than the first electrical level. The voltage pulse signal has a reference voltage level in the first period, a sequence of voltage pulses having the first voltage level in the second period, and a reference voltage level in the third period, wherein the absolute value of the first voltage level is greater than the absolute value of the reference voltage level.
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