Multilayer circuit boards and flexible multilayer circuit boards
TW202628496APending Publication Date: 2026-07-01NITTO DENKO CORP
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Patent Information
- Application Number
- TW114135268
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-09-17
- Filing Date
- 2025-09-15
- Publication Date
- 2026-07-01
Abstract
A multilayer for a circuit board includes a metal layer and an insulating layer disposed on one side of the metal layer in the thickness direction. The insulating layer has a porous insulating region and a non-porous insulating region. In a cross-section of the insulating layer that is orthogonal to the thickness direction, the insulating layer has portions arranged in the length direction in the order of the porous insulating region, the non-porous insulating region, and the porous insulating region.
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