Semiconductor device and method for fabricating the same
TW202628571APending Publication Date: 2026-07-01SK HYNIX INC
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Patent Information
- Application Number
- TW114142866
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-30
- Filing Date
- 2025-11-04
- Publication Date
- 2026-07-01
Abstract
A semiconductor device including high-integrated memory cells and a method for fabricating the semiconductor device is provided. The semiconductor device includes a vertical arrangement and a horizontal arrangement of nano sheets; horizontal conductive lines that surround the horizontal arrangement of the nano sheets; pads coupled to edge portions of the horizontal conductive lines; inter-pad dielectric layers disposed between the pads; contact plugs each coupled to a different one of the pads; and contact spacers each including a first low-k material and each formed on a sidewall of each of the contact plugs.
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