Semiconductor device and method of manufacturing semiconductor device

TW202628582APending Publication Date: 2026-07-01SK HYNIX INC
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114130306
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-24
Filing Date
2025-08-08
Publication Date
2026-07-01
Patent Text Reader

Abstract

A semiconductor device includes a gate structure including a source select line, a drain select line, and word lines stacked between the source select line and the drain select line; a second channel layer penetrating through the source select line and including polysilicon; a third channel layer penetrating through the drain select line and including polysilicon; a first channel layer penetrating through the word lines, connected between the second channel layer and the third channel layer, and including molybdenum disulfide (MoS2); and an insulating core disposed inside the first channel layer.
Need to check novelty before this filing date? Find Prior Art