Stacked semiconductor device and method of manufacturing the stacked semiconductor device
TW202628619APending Publication Date: 2026-07-01SAMSUNG ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114127449
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-11
- Filing Date
- 2025-07-21
- Publication Date
- 2026-07-01
Abstract
Provided is a stacked semiconductor device which includes: a substrate; a 1st source / drain region on the substrate; and a 2nd source / drain region vertically above the 1st source / drain region, the 2nd source / drain region vertically overlapping a 1st portion, among the 1st portion and a 2nd portion, of the 1st source / drain region, wherein a 1st portion of a top surface of the substrate vertically below the 1st portion of the 1st source / drain region and a 2nd portion of the top surface of the substrate vertically below the 2nd portion of the 1st source / drain region are coplanar or aligned.
Need to check novelty before this filing date? Find Prior Art