Semiconductor structure and method for forming the same

TW202628653APending Publication Date: 2026-07-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
TW114119341
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-20
Filing Date
2025-05-22
Publication Date
2026-07-01
Patent Text Reader

Abstract

A method includes: providing a plurality of fins that extend vertically above a substrate and a contiguous gate structure that extends over the plurality of fins; forming an opening in the contiguous gate structure with a metal gate cut between a pair of fins, wherein forming the opening includes etching a partial opening to a current depth and performing an etching cycle including: depositing a protective layer on sidewalls of the partial opening; and extending, via etching, the partial opening a predetermined incremental depth below the current depth; and repeating the etching cycle for at least 10 cycles to achieve a desired gate cut length.
Need to check novelty before this filing date? Find Prior Art