Integrated circuit including multi-height cell
TW202628690APending Publication Date: 2026-07-01SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- TW114149559
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-24
- Filing Date
- 2025-12-17
- Publication Date
- 2026-07-01
Abstract
An integrated circuit includes a multi-height cell, a plurality of cells, and at least one filler cell. The multi-height cell includes at least one normal active pattern having a first width and at least one wide active pattern having a second width greater than the first width, where the at least one normal active pattern and the at least one wide active pattern respectively extend in a first direction. The plurality of cells are adjacent to one another in a second direction crossing the first direction, where each of the plurality of cells includes at least one active pattern having the first width. The at least one filler cell is arranged between an adjacent cell of the plurality of cells and the multi-height cell in the first direction.
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