Integrated circuit including multi-height cell

TW202628690APending Publication Date: 2026-07-01SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
TW114149559
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-24
Filing Date
2025-12-17
Publication Date
2026-07-01
Patent Text Reader

Abstract

An integrated circuit includes a multi-height cell, a plurality of cells, and at least one filler cell. The multi-height cell includes at least one normal active pattern having a first width and at least one wide active pattern having a second width greater than the first width, where the at least one normal active pattern and the at least one wide active pattern respectively extend in a first direction. The plurality of cells are adjacent to one another in a second direction crossing the first direction, where each of the plurality of cells includes at least one active pattern having the first width. The at least one filler cell is arranged between an adjacent cell of the plurality of cells and the multi-height cell in the first direction.
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