Inspection apparatus for semiconductor wafer

Abstract

This disclosure provides a semiconductor wafer inspection apparatus. The inspection apparatus includes a wafer chuck for carrying a semiconductor wafer, an imaging unit for imaging the semiconductor wafer on the wafer chuck, a body having a horizontal section and a vertical section extending upward from the horizontal section, a horizontal movement module for supporting the imaging unit so that the imaging unit mounted thereon can reciprocate along the transverse direction, a wafer holder coupled to the upper surface of the horizontal section and rotatable around a preset angle about a vertical axis, and an imaging holder coupled to the front surface of the vertical section and rotatable around a preset angle about a longitudinal axis.