Processing equipment, cleaning method, and electrostatic chuck

Abstract

This invention relates to a processing apparatus comprising: a chamber, an electrostatic chuck, a first power supply, and a control unit. The electrostatic chuck is disposed within the chamber and has a substrate mounted thereon. The first power supply plasmas the gas within the chamber by supplying an electrical signal, which is either RF (Radio Frequency) power or DC (Direct Current) pulse, to the chamber. Furthermore, the electrostatic chuck comprises: an electrostatic chuck body, a first electrode, and a second electrode. The first electrode is arranged in a ring along the outer side wall of the electrostatic chuck body. The second electrode is disposed along the surface of the electrostatic chuck body on which the substrate is mounted and is surrounded by the first electrode. The control unit is configured such that, during cleaning within the chamber, the first power supply is controlled by supplying an electrical signal to the first electrode to plasmaize the cleaning gas within the chamber.