Composite microparticles

Abstract

In one embodiment, this invention relates to a composite microparticle, wherein at least a portion of the surface of copper microparticles is coated with a sulfur-containing organic compound, and the sulfur atom content in the sulfur-containing organic compound coating the composite microparticles is 1.0% by mass or more and 7.0% by mass or less. Furthermore, this invention relates to a method for manufacturing the aforementioned composite microparticles, a composite microparticle dispersion comprising the aforementioned composite microparticles, a method for manufacturing a conjugate using the composite microparticle dispersion, and a method for manufacturing an electronic or electrical machine using the composite microparticle dispersion.