Wafer-level reflow soldering equipment

Abstract

This invention provides a wafer-level reflow soldering equipment, belonging to the field of reflow soldering technology. It solves the problems of low efficiency and poor wafer reflow soldering effect of existing reflow soldering equipment. It includes an EFEM system and a process area box located behind the EFEM system. Two wafer loading / unloading machines are located at the front of the EFEM system, and a control system is located on the side of the EFEM system. The EFEM system contains a handling robot and equipment fan filters. The process area box contains a rotary soldering system, a valve island box, a power supply box, a power distribution cabinet, an exhaust system, and a formic acid storage tank. The formic acid storage tank is connected to the rotary soldering system via a pipeline, and the inlet of the formic acid storage tank is connected to an external liquid nitrogen tank via a pipeline. This invention can stably handle and place wafers, perform pre-heating followed by cooling for uniform suspension heating, and rapid cooling for uniform suspension cooling, as well as achieve positioning loading and auxiliary cooling, ensuring high wafer processing efficiency and good processing effect.

Description

[Technical Field]

[0001] This invention belongs to the field of reflow soldering technology and relates to a wafer-level reflow soldering device. [Previous Technology]

[0002] With the continuous improvement of the miniaturization and integration of electronic components, the requirements for welding technology are becoming increasingly stringent. Traditional welding methods may not be able to meet the precise welding needs of micro-components. Formic acid reflow soldering, with its precise temperature control and excellent wettability, can ensure high-quality welding at the microscale, thereby meeting the manufacturing requirements of miniaturized and integrated components. As a highly efficient, high-quality, and environmentally friendly welding technology, formic acid reflow soldering equipment will have a broader development prospect in the future. At the same time, with continuous technological progress and innovation, formic acid reflow soldering equipment will also be continuously upgraded and improved, developing towards a more diversified and intelligent direction to better meet market demands.

[0003] Reflow soldering equipment is widely used in electronics, communications, computers, aerospace and other fields. Its working principle is to melt the metal powder in the solder paste by heating, and then gradually increasing the temperature to rapidly cool and solidify it, thereby achieving a firm connection between the assembly and the circuit board.

[0004] Based on this, the present invention proposes a wafer-level reflow soldering equipment, which can stably transport and place wafers, perform uniform heating treatment by first heating and then cooling, and perform uniform cooling treatment by rapid cooling, as well as achieve positioning loading and auxiliary cooling treatment, to ensure high wafer processing efficiency and good processing effect. [Summary of the Invention]

[0005] The purpose of this invention is to address the above-mentioned problems in the existing technology by proposing a wafer-level reflow soldering equipment. The technical problem to be solved by this invention is: how to achieve stable handling and placement of wafers, uniform heating treatment by first heating and then cooling, uniform cooling treatment by rapid cooling, and positioning loading and auxiliary cooling treatment, so as to ensure high wafer processing efficiency and good processing effect.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] A wafer-level reflow soldering equipment includes an EFEM system and a process area box located behind the EFEM system. Two wafer loading and unloading machines are provided on the front side of the EFEM system. A control system is provided on the side of the EFEM system. A handling robot and an equipment fan filter are provided inside the EFEM system. The process area box contains a rotary soldering system, a valve island box, a power supply box, a power distribution cabinet, an exhaust system, and a formic acid storage tank. The formic acid storage tank is connected to the rotary soldering system through a pipeline. The air inlet of the formic acid storage tank is connected to an external liquid nitrogen tank through a pipeline.

[0008] The working principle of this invention: Several wafers to be processed are placed on one of the wafer loading and unloading machines. A handling robot places the wafers to be processed sequentially into the rotary welding system. An external liquid nitrogen tank injects nitrogen into the formic acid storage tank. The nitrogen and formic acid form a mixed gas. The mixed gas is injected into the upper and lower sides of the rotary welding system through the valve island box and enters the interior of the rotary welding system. The wafers undergo a heating treatment followed by a cooling treatment. The heating treatment melts the metal powder in the solder paste, which can effectively reduce the height difference of each bump, reduce the surface roughness of the solder bumps, and remove the oxides contained in the solder. The wafer is rapidly cooled and solidified through a cooling process, achieving a firm connection between the assembly and the circuit board. During this process, gas injection from the bottom lifts the wafer, suspending and rotating it to ensure uniform heating. In this system, the equipment's fan filter operates continuously to ensure the cleanliness of the air inside the chamber. After cooling and solidification, the wafer is then placed onto another wafer loading / unloading machine by a handling robot. The exhaust system removes formic acid volatiles from the process area box and exhausts waste gas from the rotating welding system. The power supply box mainly provides operating power to various electrical appliances. The distribution cabinet is used to distribute power to various electrical appliances.

[0009] The EFEM system includes a lower EFEM housing and an upper EFEM housing located at the top of the lower EFEM housing. The lower EFEM housing contains a robot control box, and a handling robot is located inside the lower EFEM housing. Two wafer loading / unloading machines are located at the front of the lower EFEM housing. The front of the lower EFEM housing is equipped with a safety light curtain, an emergency stop switch, and a warning light. The safety light curtain is located at the front of the two wafer loading / unloading machines. The lower four corners of the lower EFEM housing are equipped with feet and casters. The side of the lower EFEM housing is equipped with a control touch screen and several control buttons. The equipment fan filter is located inside the upper EFEM housing. The front of the upper EFEM housing is equipped with a high-definition camera lens. The upper EFEM housing contains a camera and an edge finder.

[0010] With the above structure, the robot control box is used to control the handling robot to perform various actions, the safety light curtain can monitor the work area at all times to ensure the safety of mechanical equipment and improve equipment production efficiency; the high-definition camera lens is used to detect the external working environment, the emergency stop switch is used to stop the equipment in an emergency, the warning light flashes to warn in abnormal conditions, the control touch screen and several control buttons are used to set the operation information of each electrical device, the camera and edge finder work together to stably monitor the internal activities of the transmission space, and the edge finder can detect the edge of the wafer surface through the optical sensor to determine the position and orientation of the wafer, which greatly improves the transmission efficiency.

[0011] The control system mainly includes the FA factory end, CTC host computer and IAP slave computer. The CTC host computer mainly includes GUI and scheduling module. The IAP slave computer includes PLC module, wafer robot module and loading port module, and is responsible for controlling the transmission module.

[0012] With the above structure, the FA factory end is the factory application layer of the factory automation system. The FA factory end ensures that the automated equipment can work continuously and stably. The main functions of the CTC host computer are data acquisition and processing, monitoring and display, control and command issuance, system interaction and information management, alarm and fault handling, and ensuring the safe operation of the system. The main functions of the IAP slave computer are to receive and parse upgrade commands, perform firmware upgrade operations, provide feedback on upgrade status, and ensure system security and stability.

[0013] The process area box includes a lower process chamber and an upper process chamber located above the lower process chamber. Several differential pressure gauges are installed on the side of the upper process chamber. The formic acid storage tank, valve island box, power supply box, and distribution cabinet are all located inside the lower process chamber. The rotary welding system is located inside the rear side of the lower process chamber. The exhaust system includes a gas holder exhaust component, an electrical cabinet exhaust component, a process chamber exhaust component, and a process chamber exhaust pipe. The gas holder exhaust component consists of a gas holder, a gas holder exhaust pipe connected to the upper end of the gas holder, and a gas holder flange pipe connected to the upper end of the gas holder exhaust pipe. The gas holder is located inside the front side of the upper process chamber. The electrical cabinet exhaust component includes an electrical cabinet, an electrical cabinet exhaust pipe connected to the upper end of the electrical cabinet, and an electrical cabinet flange pipe connected to the upper end of the electrical cabinet exhaust pipe. The system comprises a gas holder and an electrical cabinet located at the front of the upper process chamber. The gas holder exhaust pipe, gas holder flange pipe, electrical cabinet exhaust pipe, and electrical cabinet flange pipe extend from the upper end of the upper process chamber. A process chamber exhaust pipe is connected to the upper end of the upper process chamber and is located directly above the rotating welding system. The process chamber exhaust system includes a connecting box located at the front of the upper process chamber. Two process chamber exhaust pipes are located at the lower end of the connecting box. One process chamber exhaust pipe is located above the formic acid storage tank, and the other process chamber exhaust pipe is equipped with a butterfly valve and a differential pressure gauge. The other process chamber exhaust pipe is connected to the rotating welding system. A process chamber flange pipe is located at the upper end of the connecting box, extending from the upper end of the upper process chamber.

[0014] With the above structure, several differential pressure gauges are used to monitor the internal air pressure of the process chamber. The gas cabinet of the gas cabinet exhaust component is mainly used to store gas circuit components and gas pipes. The exhaust operation refers to exhausting the gas when a gas leak occurs in the gas cabinet, so as to protect personnel safety and extend the service life of the equipment. Several electrical devices are installed inside the electrical cabinet. During the operation of the electrical devices, heat and potentially harmful gases will be generated. The exhaust of the electrical cabinet is to ensure the normal operation of the equipment and extend its service life.

[0015] One of the process chamber exhaust pipes is located above the formic acid storage tank and is used to discharge the formic acid volatilized from the formic acid storage tank to the connecting box, and then discharge it from the process chamber flange pipe. When the rotating welding system is venting, it discharges the gas through another process chamber exhaust pipe to the connecting box, and then discharges it from the process chamber flange pipe. The differential pressure gauge is used to monitor the gas pressure, and the butterfly valve is used to control the exhaust volume.

[0016] The rotary welding system includes a lower fixed plate, which is fixed to the bottom of the process chamber. The upper fixed plate is hinged to the upper fixed plate through two hinges. Two symmetrically arranged flipping power components are provided between the lower fixed plate and the upper fixed plate. A power motor is fixed to the middle of the lower end of the lower fixed plate. A sealing mounting seat is fixed on the output shaft of the power motor. A support turntable is fixed to the upper end of the sealing mounting seat. The support turntable is rotatably arranged between the upper fixed plate and the lower fixed plate. The lower end of the lower fixed plate is provided with six circumferentially distributed heating and cooling plates. Each heating and cooling plate is provided with a lifting chamber assembly at its lower end. Five of the heating and cooling plates are provided with heating and cooling plate units inside, and the other heating and cooling plate is provided with a loading cooling plate. The heating and cooling plate units and the loading cooling plate are both located above the lifting chamber assembly.

[0017] The upper end of the lower fixed plate is provided with a high-pressure L-shaped valve, a flap assembly, a cooling chamber and four heating upper chambers. The flap assembly is located at the upper end of the loading cooling plate. The cooling chamber and the four heating upper chambers are arranged clockwise and located at the upper end of the five heating cooling plate units. The upper end of the upper fixed plate and the four heating upper chambers is provided with a vacuum assembly. The vacuum assembly is connected to the exhaust pipe of another process chamber. The four heating upper chambers are connected to the formic acid storage tank and the heating cooling plate units below the four heating upper chambers are connected to the formic acid storage tank through valve island boxes. The heating cooling plate units below the cooling chamber and the loading cooling plate are connected to an external cold source. The upper end of the upper fixed plate is provided with an upper water pipe and the lower end of the lower fixed plate is provided with a lower water pipe. The lower water pipe is connected to the upper water pipe, and both the lower water pipe and the upper water pipe are connected to an external cold source.

[0018] Using the above structure, two flipping power components drive the upper fixed plate to open and close via two flip hinges at the upper end of the lower fixed plate; the flip plate assembly opens, and the handling robot places the wafers to be processed on the wafer loading and unloading machine onto the support turntable above the loading cooling plate. After the wafers to be processed are placed, the flip plate assembly closes; the external liquid nitrogen tank injects nitrogen into the formic acid storage tank, and the nitrogen and formic acid form a mixture, which is injected into the heating upper cavity through the valve island box; the output shaft of the power motor drives the sealing mounting seat to rotate intermittently, thereby driving the support turntable to open and close via the upper fixed plate and the lower fixed plate. The wafers rotate intermittently, passing between five heating and cooling wafers and corresponding four heating upper chambers and cooling chambers. The heating and cooling wafer units below the four heating upper chambers are connected to the valve island box via the formic acid storage tank. This process involves a preheating followed by cooling, which melts the metal powder in the solder paste, effectively reducing the height difference between the bumps, lowering the surface roughness of the solder bumps, and removing oxides from the solder. The cooling chambers are connected to an external cold source for rapid cooling and solidification of the wafer. The wafers then rotate back between the flip-up assembly and the loading cooling wafers for auxiliary cooling. After processing, the wafers are transferred to another wafer loading / unloading machine via a transport robot. Each time a wafer passes a heating / cooling tray, the lifting chamber assembly lifts the heating / cooling tray unit and the loading cooling tray. Then, an external liquid nitrogen tank injects nitrogen into the formic acid storage tank, forming a mixture. This mixture is injected into the heating / cooling tray unit through a valve island, blowing onto the wafers above the heating / cooling tray unit, causing them to suspend and rotate, ensuring uniform heating. The loading cooling tray is connected to an external cold source to ensure uniform cooling of the wafers. Then, the injection of the mixed gas stops, and the wafers fall back onto the heating / cooling tray unit and the loading cooling tray. The heating and cooling plate unit and the loading cooling plate are lowered onto the wafer, and the wafer is placed on the support turntable. The vacuum assembly is used to extract the waste gas generated after the working process between the four heating upper chambers and the corresponding heating and cooling plates. The waste gas is then discharged to the connecting box through another process chamber exhaust pipe, and then discharged from the process chamber flange pipe. The differential pressure gauge is used to monitor the gas pressure, and the butterfly valve is used to control the exhaust volume. During the operation, the external cold source is drawn into the lower water pipe, then enters the upper water pipe, and flows back to the external cold source for reuse.

[0019] The lower fixed plate has several through holes, and a sealing ring is provided on the upper outer edge of the lower fixed plate; the flipping power component includes a vertical plate and a hydraulic push rod. The vertical plate is fixed to the upper end of the upper fixed plate, and the two ends of the hydraulic push rod are respectively hinged to the lower fixed plate and the flipping bracket. The upper end of the upper fixed plate has a loading port and five placement slots, which are evenly distributed in a circle. The loading port is located above the loading cooling plate. The upper end of the upper fixed plate has an upper water pipe groove, which is engaged inside the upper water pipe groove. Several quick-clamping buckles are fixed to the upper end of the upper fixed plate, and the quick-clamping buckles are detachably engaged on the lower fixed plate; the flipping assembly includes a nitrogen pipe. The system includes a road flap and two flap brackets. The two flap brackets are fixed to the upper end of the upper fixed plate and are located on both sides of the loading port. One end of the nitrogen pipeline flap is hinged to the upper end of the upper fixed plate. Both sides of the other end of the nitrogen pipeline flap are equipped with flap cylinders between them and the flap brackets on the same side. The nitrogen pipeline flap is connected to an external cold source. The support turntable has six circumferentially distributed sealing holes and one mounting through hole. The mounting through hole is located in the middle of the support turntable and is connected to the upper end of the sealing mounting seat. Each sealing hole has a sealing ring inside, and each sealing ring has three circumferentially distributed pin engagement grooves. Each pin engagement groove can be detachably engaged with a pin support plate.

[0020] With the above structure, the hydraulic push rod extends, driving the upright plate to pull the upper fixed plate open through two hinges. Conversely, the hydraulic push rod retracts, and the upper fixed plate closes, facilitating installation. The loading port is used to place and remove wafers. The upper water pipe is engaged inside the upper water pipe groove for cooling. Several quick-release clips are used to lock the upper and lower fixed plates, ensuring stable locking. When placing and removing wafers, when the flip-plate cylinder retracts, it drives the nitrogen pipeline flip-plate to rotate and open. Conversely, when the flip-plate cylinder extends, the nitrogen pipeline flip-plate rotates and closes, contacting the loading port. The nitrogen pipeline flip-plate is connected to an external cold source, allowing the nitrogen pipeline flip-plate to cool down and provide auxiliary cooling for the wafers. The sealing mounting base drives the support turntable to rotate through the mounting through hole. Three pin support plates are used to place wafers, causing the wafers to rotate with the support turntable.

[0021] The heating upper cavity and cooling cavity are detachably connected to the corresponding storage slots. Each heating upper cavity has an upper cavity inlet / outlet cover. Formic acid gas delivery pipes connect the four upper cavity inlet / outlet covers. These formic acid gas delivery pipes are connected to the outlet of the formic acid storage tank via a valve island box. A vacuum pneumatic valve is located at the upper end of the third heating upper cavity in counter-clockwise order, and a diaphragm sealing valve is located on the formic acid gas delivery pipe connected to the third heating upper cavity in counter-clockwise order. The lower ends of the four heating upper cavities... Each component is equipped with an upper heating plate. The vacuum assembly includes a pressure chamber, which is fixedly connected to the upper middle part of the upper fixed plate and is connected to the upper fixed plate. The upper end of the pressure chamber is connected to a conversion head, which is connected to the exhaust pipe of another process chamber. Several filter canisters are connected to the conversion head. The filter canisters are connected to the top of the four upper chamber inlet / outlet covers through filter tubes. The filter tubes are equipped with spiral heating tubes inside. An aluminum baffle valve is connected to the filter tube connected to the third upper chamber inlet / outlet cover in counterclockwise order.

[0022] With the above structure, nitrogen gas is injected into the formic acid storage tank from the external liquid nitrogen tank. The nitrogen gas and formic acid form a mixed gas. The mixed gas is injected into the four upper chamber inlet and outlet gas cover plates through the valve island box and the formic acid gas transmission pipeline. It is heated by the upper heating plate to form mixed hot gas. The vacuum pneumatic valve is used to open and close the gas circuit and control the airflow, and plays a role in depressurization. The diaphragm sealing valve is used to cut off and regulate the injected mixed gas. When venting, the pressure chamber draws out the waste gas inside the upper fixed plate and enters the conversion head. The waste gas of the four heated upper chambers enters the filter tube through the four upper chamber inlet and outlet gas cover plates. The spiral heating tube inside the filter tube heats the inside of the filter tube to prevent cold gas from entering the upper chamber inlet and outlet gas cover plates and ensure that the internal temperature of the four heated upper chambers is stable. After the waste gas is drawn into the filter tank for filtration, the waste gas enters the conversion head and then enters another process chamber exhaust pipe for discharge. The aluminum baffle valve is used to control the air flow rate of the third upper chamber inlet and outlet gas cover plate in counterclockwise sequence.

[0023] The lifting chamber assembly includes a fixed frame and a corrugated lifting sleeve. Pneumatic push rods are fixed to both sides of the fixed frame. A lifting frame is fixed between the telescopic ends of the two pneumatic push rods. A lifting sleeve shaft is fixed to the upper end of the lifting frame, extending into and passing through the corrugated lifting sleeve. The heating and cooling plate assembly includes a lower cavity and several multi-way solenoid valves. The lower cavity is fixed to the lower end of the lower fixed plate. The fixed frame and the corrugated lifting sleeve are both fixed to the lower end of the lower cavity at corresponding positions. The lower end of the corrugated lifting sleeve is fixed to the lifting sleeve shaft. The lower cavity has a lower cavity inside, through which the lifting sleeve shaft passes. The lower cavity and the upper end of the lifting sleeve shaft are fixedly connected to the lower end of the lower cavity. The upper end of the lower cavity is provided with a cavity sealing ring. The bottom of the inner side of the lower cavity is provided with a lower pad plate. The lower cavity is provided with a lower heat insulation cover. The lower heat insulation cover is placed above the lower pad plate. The heating and cooling plate unit and the loading cooling plate are respectively set on the upper end of the lifting sleeve shaft at the corresponding position. The heating and cooling plate unit and the loading cooling plate are respectively located inside the lower heat insulation cover at the corresponding position. Several multi-way solenoid valves are placed inside the valve island box. Several multi-way solenoid valves are respectively connected to the formic acid storage tank and the heating and cooling plate unit through pipes.

[0024] With the above structure, the telescopic ends of the two pneumatic push rods drive the lifting frame to rise and fall, and the lifting frame drives the lifting sleeve shaft to rise and fall. When the lifting sleeve shaft rises, it compresses the corrugated lifting sleeve for sealing. The lifting sleeve shaft drives the lower cavity to rise and fall. At this time, the lower pad and the lower heat insulation cover rise and fall synchronously. When the lower cavity rises, the cavity sealing ring abuts against the lower end of the sealing ring for sealing. At the same time, the lifting sleeve shaft drives the heating and cooling plate unit and the loading cooling plate component to rise and fall. When the heating and cooling plate unit and the loading cooling plate component rise, they lift the wafer off the three pin support plates. The lower heat insulation cover is used for heat insulation. The external liquid nitrogen tank injects nitrogen into the formic acid storage tank. The nitrogen and formic acid form a mixed gas. The mixed gas is injected into the heating and cooling plate unit through several multi-port solenoid valves inside the valve island box and blows onto the wafer above the heating and cooling plate unit, so that the wafer is suspended and rotated to ensure that the wafer is heated evenly.

[0025] The heating and cooling plate unit includes a lower plate body and a lower heating plate bottom cover. A suspended ventilator is fixed to the upper end of the lower plate body. Several spiral ventilator grooves are formed on the inner wall of the suspended ventilator. Several sets of inclined vent holes are formed at the upper end of the lower plate body. The vent holes are connected to the multi-way solenoid valves at corresponding positions through pipes. Several temperature measurement holes are formed at the upper end of the lower plate body. Three circumferentially distributed clearance holes are formed on the lower plate body and the suspended ventilator. The clearance holes are located below the pin support plates at corresponding positions. A heat insulation plate is fixed to the upper end of the lower heating plate bottom cover. Several circumferentially distributed heat insulation air guide boxes are fixed to the upper end of the heat insulation plate. The heat insulation air guide boxes are located at corresponding positions. Directly below the ventilation holes, a guide tube is fixed to the lower end of the bottom cover of the lower heating plate. The guide tube is inserted into the lifting sleeve shaft at the corresponding position and is connected to the lifting sleeve shaft at the corresponding position. Several circumferentially distributed wiring holes are opened inside the heat insulation plate. One end of the wiring hole is connected to the guide tube, and the other end of the wiring hole is connected to the heat insulation air guide box at the corresponding position. The lower end of the lower plate of four heating and cooling plate units is equipped with an electric heating wire. The wiring end of the electric heating wire extends into and passes through the guide tube at the corresponding position. The lower end of the lower plate of another heating and cooling plate unit is equipped with a cooling coil. The connecting end of the cooling coil extends into and passes through the guide tube at the corresponding position. The connecting end of the cooling coil is connected to an external cold source.

[0026] With the above structure, the wiring hole is connected to the guide tube and the heat insulation air guide box, and the guide tube is connected to the corresponding lifting sleeve shaft. This is used to place the pipe between the vent hole and the corresponding multi-way solenoid valve. At the same time, the guide tube is connected to the corresponding lifting sleeve shaft to carry the wiring terminals of electrical equipment such as electric heating wires and temperature sensors. The mixed gas is injected into the vent hole through several multi-way solenoid valves inside the valve island box to form mixed hot gas, which is blown onto the wafer above the heating and cooling plate unit. The airflow passes through the inner wall of the suspended vent tube. Several spiral vents blow out, allowing the wafer to float stably and rotate, ensuring uniform heating of the wafer; temperature measurement holes are used to install temperature sensors, clearance holes are used to avoid pin support plates, heat insulation plates are used to insulate and protect the transmission lines and the pipes between the heat insulation vents and the corresponding multi-way solenoid valves, and heat insulation air guide boxes are used to connect the heat insulation vents and the corresponding multi-way solenoid valves; external cold sources are injected into the cooling coils to cool the lower plate, forming mixed cold air, which also allows the wafer to float stably and rotate, ensuring uniform cooling of the wafer.

[0027] The loading cooling plate includes a locking insulation plate, which is inserted into the lifting sleeve shaft at the corresponding position. The locking insulation plate is located inside the lower heat insulation cover at the corresponding position. The upper end of the locking insulation plate is provided with a locking cooling upper plate. The upper end of the locking cooling upper plate is provided with a clearance groove and three circumferentially distributed clearance holes. A locking cooling pipe is provided between the locking cooling upper plate and the locking insulation plate. The terminal of the locking cooling pipe extends out of the locking insulation plate, and the connecting end of the locking cooling pipe extends into and passes through the guide tube at the corresponding position. The connecting end of the locking cooling pipe is connected to an external cold source.

[0028] With the above structure, the lifting sleeve shaft drives the locking insulation plate to rise and fall, thereby driving the locking cooling plate and locking cooling pipe to rise and fall. An external cold source is injected into the locking cooling pipe to cool the locking cooling plate. The locking cooling plate provides auxiliary cooling treatment for the wafer above it. The locking insulation plate is used for heat preservation.

[0029] Compared with the prior art, this wafer-level reflow soldering equipment has the following advantages:

[0030] By cooperating with the EFEM system, the handling robot, safety light curtain, and equipment fan filter, stable wafer handling and air cleanliness inside the chamber are achieved. Simultaneously, the handling robot, in conjunction with two wafer loading / unloading machines, stably handles and places wafers before and after processing. Through the formic acid storage tank, valve island box, and rotating welding system, the wafers undergo sequential heating followed by cooling, rapid cooling, and auxiliary cooling. The initial heating melts the metal powder in the solder paste, effectively reducing the height difference between bumps, lowering the surface roughness of the solder bumps, and removing oxides from the solder. The wafers are then cooled and solidified. The system utilizes a flip-plate assembly, loading cooling plate, heating and cooling plate, and lifting chamber assembly, along with a lower fixed plate and an upper fixed plate. The trays work together to form a loading chamber, enabling positioning loading and auxiliary cooling. Four heating chambers are formed by the cooperation of four upper heating chambers with corresponding heating and cooling tray units equipped with electric heating wires, heating and cooling tray components, and lifting chamber assemblies with the lower and upper fixed trays. The heating and cooling tray units, in conjunction with the formic acid storage tank and valve island box, blow hot air onto the wafer, allowing it to float stably and rotate, ensuring uniform heating. Similarly, cooling chambers are formed by the cooperation of corresponding heating and cooling tray units equipped with cooling coils, heating and cooling tray components, and lifting chamber assemblies with the lower and upper fixed trays. The heating and cooling tray units, in conjunction with the formic acid storage tank and valve island box, blow cold air onto the wafer, allowing it to float stably and rotate, ensuring uniform cooling.

Implementation Method

[0031] The following are specific embodiments of the present invention and, together with the accompanying drawings, further describe the technical solution of the present invention. However, the present invention is not limited to these embodiments.

[0032] As shown in Figures 1-15, this wafer-level reflow soldering equipment includes an EFEM system 1 and a process area box 5 located behind the EFEM system 1. Two wafer loading and unloading machines 3 are located on the front side of the EFEM system 1. A control system 2 is located on the side of the EFEM system 1. A handling robot 15 and an equipment fan filter are located inside the EFEM system 1. The process area box 5 contains a rotary welding system 22, a valve island box 23, a power supply box 24, a power distribution cabinet 25, an exhaust system 4, and a formic acid storage tank 30. The formic acid storage tank 30 is connected to the rotary welding system 22 through a pipeline. The air inlet of the formic acid storage tank 30 is connected to an external liquid nitrogen tank through a pipeline.

[0033] Several wafers to be processed are placed on one of the wafer loading / unloading machines 3. The handling robot 15 places the wafers to be processed into the rotary welding system 22 in sequence. The external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30. The nitrogen and formic acid form a mixture. The mixture is injected into the upper and lower sides of the rotary welding system 22 through the valve island box 23. The wafers are subjected to a heating treatment followed by a cooling treatment. The heating treatment melts the metal powder in the solder paste, which can effectively reduce the height difference of each bump, reduce the surface roughness of the solder bumps, and remove the oxides contained in the solder. The cooling process rapidly cools and solidifies the wafer, ensuring a firm connection between the assembly and the circuit board. During this process, the lower gas injection lifts the wafer, suspending and rotating it to ensure uniform heating. In this system, the equipment fan filter operates continuously to maintain air cleanliness inside the chamber. After cooling and solidification, the wafer is then placed onto another wafer loading / unloading machine 3 by the handling robot 15. The exhaust system 4 discharges formic acid volatiles from the process area box 5 and exhausts waste gas from the rotating welding system 22. The power supply box 24 primarily provides operating power to various electrical appliances. The power distribution cabinet 25 is used to distribute power to various electrical appliances.

[0034] The EFEM system 1 includes an EFEM lower main housing 6 and an EFEM upper main housing 7 located on the upper part of the EFEM lower main housing 6. The EFEM lower main housing 6 has a robot control box 14 inside, and a handling robot 15 is located inside the EFEM lower main housing 6. Two wafer loading and unloading machines 3 are located on the front side of the EFEM lower main housing 6. The front side of the EFEM lower main housing 6 is equipped with a safety light curtain 16, an emergency stop switch 8, and a warning light 10. The safety light curtain 16 is located on the front side of the two wafer loading and unloading machines 3. The four corners of the lower end of the EFEM lower main housing 6 are equipped with feet 12 and casters 13. The side of the EFEM lower main housing 6 is equipped with a control touch screen 11 and several control buttons. The equipment fan filter is located inside the EFEM upper main housing 7. The front side of the EFEM upper main housing 7 is equipped with a high-definition camera lens 9. The EFEM upper main housing 7 is equipped with a camera and an edge finder.

[0035] The robot control box 14 is used to control the handling robot 15 to perform various actions. The safety light curtain 16 can monitor the working area at all times to ensure the safety of mechanical equipment and improve the production efficiency of the equipment. The high-definition camera lens 9 is used to detect the external working environment. The emergency stop switch 8 is used to stop the equipment in an emergency. The warning light 10 flashes to warn in abnormal conditions. The control touch screen 11 and several control buttons are used to set the operation information of each electrical device. The camera and the edge finder work together to stably monitor the internal activities of the transmission space. The edge finder can detect the edge of the wafer surface through the optical sensor to determine the position and orientation of the wafer, which greatly improves the transmission efficiency.

[0036] The control system mainly includes the FA factory end, CTC host computer and IAP slave computer. The CTC host computer mainly includes GUI and scheduling module. The IAP slave computer includes PLC module, wafer robot module and load port module, which is responsible for controlling the transmission module.

[0037] The FA factory end is the factory application layer of the factory automation system. The FA factory end ensures that the automated equipment can work continuously and stably. The main functions of the CTC host computer are data acquisition and processing, monitoring and display, control and command issuance, system interaction and information management, alarm and fault handling, and ensuring the safe operation of the system. The main functions of the IAP slave computer are to receive and parse upgrade commands, perform firmware upgrade operations, provide feedback on upgrade status, and ensure system security and stability.

[0038] The process area box 5 includes a lower process chamber 26 and an upper process chamber 17 located at the upper end of the lower process chamber 26. Several differential pressure gauges 31 are provided on the side of the upper process chamber 17. The formic acid storage tank 30, valve island box 23, power supply box 24, and distribution cabinet 25 are all located inside the lower process chamber 26. The rotating welding system 22 is located inside the rear side of the lower process chamber 26. The exhaust system 4 includes a gas holder exhaust component 18, an electrical cabinet exhaust component 19, a process chamber exhaust component 20, and a process chamber exhaust pipe 21. The gas holder exhaust component 18 consists of a gas holder, a gas holder exhaust pipe connected to the upper end of the gas holder, and a gas holder flange pipe connected to the upper end of the gas holder exhaust pipe. The gas holder is located inside the front side of the upper process chamber 17. The electrical cabinet exhaust component 19 includes an electrical cabinet, an electrical cabinet exhaust pipe connected to the upper end of the electrical cabinet, and an electrical cabinet exhaust pipe connected to the upper end of the electrical cabinet exhaust pipe. The gas holder and electrical cabinet are arranged inside the front of the process chamber 17. The gas holder exhaust pipe, gas holder flange pipe, electrical cabinet exhaust pipe, and electrical cabinet flange pipe extend from the upper end of the process chamber 17. The process chamber exhaust pipe 21 is connected to the upper end of the process chamber 17 and is located directly above the rotating welding system 22. The process chamber exhaust component 20 includes a connecting box, which is arranged inside the front of the process chamber 17. The lower end of the connecting box is provided with two process chamber exhaust pipes 29. One process chamber exhaust pipe 29 is located above the formic acid storage tank 30, and the other process chamber exhaust pipe 29 is provided with a butterfly valve 27 and a differential pressure gauge 28. The other process chamber exhaust pipe 29 is connected to the rotating welding system 22. The upper end of the connecting box is provided with a process chamber flange pipe, which extends from the upper end of the process chamber 17.

[0039] Several differential pressure gauges 31 are used to monitor the internal air pressure of the process chamber 17. The gas cabinet of the gas cabinet exhaust component 18 is mainly used to store gas circuit components and gas pipes. The exhaust operation refers to exhausting the gas when a gas leak occurs in the gas cabinet, so as to protect personnel safety and extend the service life of the equipment. Several electrical devices are installed inside the electrical cabinet. During the operation of the electrical devices, heat and possible harmful gases will be generated. The exhaust of the electrical cabinet is to ensure the normal operation of the equipment and extend its service life.

[0040] One of the process chamber exhaust pipes 29 is located above the formic acid storage tank 30 and is used to discharge the formic acid volatilized from the formic acid storage tank 30 to the connecting box, and then discharge it from the process chamber flange pipe. When the rotating welding system 22 is venting, it discharges the gas through the other process chamber exhaust pipe 29 to the connecting box, and then discharges it from the process chamber flange pipe. The differential pressure gauge is used to monitor the gas pressure, and the butterfly valve is used to control the exhaust volume.

[0041] The rotary welding system 22 includes a lower fixed plate 35, which is fixed to the bottom of the process chamber 17. The upper end of the lower fixed plate 35 is hinged to an upper fixed plate 32 via two hinges 64. Two symmetrically arranged flipping power components 36 are provided between the lower fixed plate 35 and the upper fixed plate 32. A power motor 70 is fixed to the middle of the lower end of the lower fixed plate 35. A sealing mounting seat 69 is fixed to the output shaft of the power motor 70. A support turntable is fixed to the upper end of the sealing mounting seat 69. 95. The support turntable 95 is rotatably disposed between the upper fixed plate 32 and the lower fixed plate 35. The lower fixed plate 35 has six circumferentially distributed heating and cooling plate components 72 at its lower end. Each heating and cooling plate component 72 has a lifting chamber assembly 33 at its lower end. Five of the heating and cooling plate components 72 have heating and cooling plate units 80 inside, and the other heating and cooling plate component 72 has a loading cooling plate component 71 inside. The heating and cooling plate units 80 and the loading cooling plate component 71 are both disposed above the lifting chamber assembly 33.

[0042] The upper end of the lower fixed plate 35 is provided with a high-pressure straight-aerial L-shaped valve 41, a flap assembly 40, a cooling chamber 34, and four heating upper chambers 38. The flap assembly 40 is located at the upper end of the cooling plate assembly 71. The cooling chamber 34 and the four heating upper chambers 38 are arranged clockwise and located at the upper end of the five heating and cooling plate units 80. The upper end of the upper fixed plate 32 and the four heating upper chambers 38 is provided with a vacuum assembly 39. The vacuum assembly 39 is connected to the exhaust pipe 29 of another process chamber. The four heating upper chambers 38 are... The cavity 38 and the formic acid storage tank 30, as well as the heating and cooling plate units 80 below the four heating upper cavities 38 and the formic acid storage tank 30, are all connected through valve island boxes 23. The heating and cooling plate units 80 below the cooling cavity 34 and the loading cooling plate components 71 are connected to an external cold source. The upper fixed plate 32 is provided with an upper water pipe 63, and the lower fixed plate 35 is provided with a lower water pipe 68. The lower water pipe 68 is connected to the upper water pipe 63, and both the lower water pipe 68 and the upper water pipe 63 are connected to an external cold source.

[0043] Two flipping power components 36 drive the upper fixed plate 32 to open and close at the upper end of the lower fixed plate 35 via two flip hinges 64; the flip plate assembly 40 opens, and the handling robot 15 places the wafers to be processed on the wafer loading and unloading machine onto the support turntable 95 above the loading cooling plate 71 in sequence. After the wafers to be processed are placed, the flip plate assembly 40 closes; the external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30, and the nitrogen and formic acid form a mixture. The mixture is injected into the heating upper cavity 38 through the valve island box 23; the output shaft of the power motor 70 drives the sealing mounting seat 69 to rotate intermittently, thereby driving the support turntable 95 to open and close between the upper fixed plate 32 and the lower fixed plate. The wafer rotates intermittently between five heating and cooling discs 72 and the corresponding four heating upper chambers 38 and cooling chambers 34. The heating and cooling disc units 80 below the four heating upper chambers 38 are connected to the valve island box 23 between themselves and the formic acid storage tank 30. This process involves heating followed by cooling to melt the metal powder in the solder paste, effectively reducing the height difference between the bumps, lowering the surface roughness of the solder bumps, and removing oxides from the solder. The cooling chamber 34 is connected to an external cold source for rapid cooling and solidification of the wafer. The wafer then rotates back between the flip-plate assembly 40 and the loading cooling disc 71 for auxiliary cooling of the wafer. After processing, the wafers are placed onto another wafer loading / unloading machine 3 by the transport robot 15. Each time a wafer passes a heating / cooling plate 72, the lifting chamber assembly 33 lifts the heating / cooling plate unit 80 and the loading cooling plate 71. Then, an external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30, forming a mixture with the formic acid. This mixture is injected into the heating / cooling plate unit 80 through the valve island box 23, blowing onto the wafers above the heating / cooling plate unit 80, causing the wafers to suspend and rotate, ensuring uniform heating. The loading cooling plate 71 is connected to an external cold source to ensure uniform cooling of the wafers. Then, the injection of the mixed gas stops, and the wafers fall onto the heating / cooling plate unit 80 and the loading cooling plate 71. 71. Then, the lifting chamber assembly 33 lowers the heating and cooling plate unit 80 and the loading cooling plate component 71, detaching the heating and cooling plate unit 80 and the loading cooling plate component 71 from the wafer and placing the wafer on the support turntable 95. The vacuum assembly 39 is used to extract the waste gas generated after the working process between the four heating upper chambers 38 and the corresponding heating and cooling plate components 72, and then discharges the waste gas to the connecting box through another process chamber exhaust pipe 29, and then discharges it from the process chamber flange pipe. The differential pressure gauge is used to monitor the gas pressure, and the butterfly valve is used to control the exhaust volume. During the operation, the external cold source is drawn into the lower water pipe 68, then enters the upper water pipe 63, and flows back to the external cold source for reuse.

[0044] The lower fixed plate 35 has several through holes 66, and the upper outer edge of the lower fixed plate 35 has a sealing ring 65; the flipping power component 36 includes a vertical plate 57 and a hydraulic push rod 67. The vertical plate 57 is fixed to the upper end of the upper fixed plate 32. The two ends of the hydraulic push rod 67 are respectively hinged to the lower fixed plate 35 and the flipping bracket 51. The upper end of the upper fixed plate 32 has a loading port 55 and five storage slots 56. The loading port 55 and the five storage slots 56 are evenly distributed in a circle. The loading port 55 is located at the upper end of the loading cooling plate component 71. The upper end of the upper fixed plate 32 has an upper water pipe groove 54. The upper water pipe 63 is engaged inside the upper water pipe groove 54. The upper end of the upper fixed plate 32 is fixed with several quick-clamping buckles 37. The quick-clamping buckles 37 are detachably engaged with the lower fixed plate 35; the flipping assembly 40 includes nitrogen. The pipeline flap 53 and two flap brackets 51 are fixed to the upper end of the upper fixed plate 32 and are located on both sides of the loading port 55. One end of the nitrogen pipeline flap 53 is hinged to the upper end of the upper fixed plate 32. On both sides of the other end of the nitrogen pipeline flap 53, there are flap cylinders 52 between the flap brackets 51 on the same side. The nitrogen pipeline flap 53 is connected to an external cold source. The support turntable 95 has six circumferentially distributed sealing holes 60 and one mounting through hole 59. The mounting through hole 59 is located in the middle of the support turntable 95 and is connected to the upper end of the sealing mounting seat 69. The sealing holes 60 are all provided with sealing rings 61. Each sealing ring 61 has three circumferentially distributed pin engagement grooves 58. The pin engagement grooves 58 are detachably engaged with pin support plates 62.

[0045] The hydraulic push rod 67 extends, driving the upright plate 57 to pull the upper fixed plate 32 open via two hinges 64. Conversely, the hydraulic push rod 67 retracts, and the upper fixed plate 32 closes, facilitating installation. The loading port 55 is used to place and remove wafers. The upper water pipe 63 is engaged inside the upper water pipe groove 54 for cooling. Several quick-release clips 37 are used to lock the upper fixed plate 32 and the lower fixed plate 35, ensuring stable locking of the upper fixed plate 32 and the lower fixed plate 35. When the wafer is in a circular motion, the flip-plate cylinder 52 retracts, causing the nitrogen pipeline flip-plate 53 to rotate and open. Conversely, when the flip-plate cylinder 52 extends, the nitrogen pipeline flip-plate 53 rotates and closes, contacting the loading port 55. The nitrogen pipeline flip-plate 53 is connected to an external cold source, allowing the nitrogen pipeline flip-plate 53 to cool down, thus providing auxiliary cooling for the wafer. The sealing mounting base 69 drives the support turntable 95 to rotate through the mounting through hole 59. The three pin support plates 62 are used to place the wafer, causing the wafer to rotate with the support turntable 95.

[0046] The heating upper cavity 38 and the cooling cavity 34 are detachably connected to the corresponding storage slots 56. Each heating upper cavity 38 has an upper cavity inlet / outlet cover 47 at its upper end. Formic acid gas delivery pipes 49 are connected between the four upper cavity inlet / outlet cover 47. The formic acid gas delivery pipes 49 are connected to the outlet of the formic acid storage tank 30 via a valve island box 23. A vacuum pneumatic valve 48 is provided at the upper end of the third heating upper cavity 38 in counter-clockwise order, and a diaphragm sealing valve 50 is provided on the formic acid gas delivery pipe 49 connected to the third heating upper cavity 38 in counter-clockwise order. The lower ends of all four heating upper cavities 38 are... The system includes an upper heating plate; the vacuum assembly 39 includes a pressure chamber 42, which is fixedly connected to the upper middle part of the upper fixed plate 32 and is connected to the upper fixed plate 32. The upper end of the pressure chamber 42 is connected to a converter head 43, which is connected to the exhaust pipe 29 of another process chamber. Several filter canisters 44 are connected to the converter head 43. The filter canisters 44 are connected to the top of four upper chamber inlet / outlet cover plates 47 through filter tubes. The filter tubes are equipped with spiral heating tubes 46 inside each filter tube. An aluminum baffle valve 45 is connected to the filter tube connected to the third upper chamber inlet / outlet cover plate 47 in counterclockwise order.

[0047] An external liquid nitrogen tank injects nitrogen gas into the formic acid storage tank 30. The nitrogen gas and formic acid form a mixture. The mixture is injected into the four upper chamber inlet and outlet gas cover plates 47 through the valve island box 23 and the formic acid gas pipeline 49. It is then heated by the upper heating plate to form a hot mixture. The vacuum pneumatic valve 48 is used to open and close the gas path and control the airflow, and plays a role in depressurization. The diaphragm sealing valve 50 is used to cut off and regulate the injected mixture. During exhaust, the pressure chamber 42 extracts the waste gas inside the upper fixed plate 32 and enters the converter head 4. 3. The exhaust gas from the four upper heating chambers 38 enters the filter tube through the four upper chamber inlet and outlet covers 47. The spiral heating tube 46 inside the filter tube heats the inside of the filter tube, preventing cold air from entering the upper chamber inlet and outlet covers 47 and ensuring the internal temperature of the four upper heating chambers 38 is stable. After the exhaust gas is drawn into the filter tank 44 for filtration, the exhaust gas enters the converter head 43 and then enters another process chamber exhaust pipe 29 for discharge. The aluminum baffle valve 45 is used to control the air extraction flow rate of the third upper chamber inlet and outlet cover 47 in counterclockwise sequence.

[0048] The lifting chamber assembly 33 includes a fixed frame 101 and a corrugated lifting sleeve 75. Pneumatic push rods 74 are fixed on both sides of the fixed frame 101. A lifting frame 73 is fixed between the telescopic ends of the two pneumatic push rods 74. A lifting sleeve shaft 102 is fixed to the upper end of the lifting frame 73. The lifting sleeve shaft 102 extends into and passes through the corrugated lifting sleeve 75. The heating and cooling plate assembly 72 includes a lower cavity 76 and several multi-way solenoid valves 89. The lower cavity 76 is fixed to the lower end of the lower fixed plate 35. The fixed frame 101 and the corrugated lifting sleeve 75 are both fixed to the lower ends of the lower cavity 76 at corresponding positions. The lower end of the corrugated lifting sleeve 75 is fixed to the lifting sleeve shaft 102. The interior of the lower cavity 76 is provided with a lower cavity 77. The lifting sleeve shaft 102... 02 passes through the lower cavity 76 and the upper end of the lifting sleeve shaft 102 is fixedly connected to the lower end of the lower cavity 77. The upper end of the lower cavity 77 is provided with a cavity sealing ring. The bottom of the inner side of the lower cavity 77 is provided with a lower pad 78. The lower cavity 77 is provided with a lower heat insulation cover 79. The lower heat insulation cover 79 is placed above the lower pad 78. The heating and cooling plate unit 80 and the loading cooling plate component 71 are respectively set on the upper end of the lifting sleeve shaft 102 at the corresponding positions. The heating and cooling plate unit 80 and the loading cooling plate component 71 are respectively located inside the lower heat insulation cover 79 at the corresponding positions. Several multi-way solenoid valves 89 are placed inside the valve island box 23. Several multi-way solenoid valves 89 are respectively connected to the formic acid storage tank 30 and the heating and cooling plate unit 80 through pipes.

[0049] The telescopic ends of the two pneumatic push rods 74 drive the lifting frame 73 to rise and fall. The lifting frame 73 drives the lifting sleeve shaft 102 to rise and fall. When the lifting sleeve shaft 102 rises, it compresses the corrugated lifting sleeve 75 for sealing. The lifting sleeve shaft 102 drives the lower cavity 77 to rise and fall. At this time, the lower pad 78 and the lower heat insulation cover 79 rise and fall synchronously. When the lower cavity 77 rises, the cavity sealing ring abuts against the lower end of the sealing ring 61 for sealing. At the same time, the lifting sleeve shaft 102 drives the heating and cooling plate unit 80 and the loading... When the cooling plate 71 is raised and lowered, the heating and cooling plate unit 80 and the loading cooling plate 71 are raised, lifting the wafer off the three pin support plates 62. The lower heat insulation cover 79 is used for heat insulation. The external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30. The nitrogen and formic acid form a mixture. The mixture is injected into the heating and cooling plate unit 80 through several multi-port solenoid valves 89 inside the valve island box 23. It blows onto the wafer above the heating and cooling plate unit 80, making the wafer suspend and rotate, ensuring that the wafer is heated evenly.

[0050] The heating and cooling plate unit 80 includes a lower plate body 90 and a lower heating plate bottom cover 92. A suspended ventilator 82 is fixed to the upper end of the lower plate body 90. Several spiral ventilation grooves 83 are opened on the inner wall of the suspended ventilator 82. Several sets of inclined ventilation holes 84 are opened at the upper end of the lower plate body 90. The ventilation holes 84 are connected to the multi-way solenoid valves 89 at corresponding positions through pipes. Several temperature measuring holes 85 are opened at the upper end of the lower plate body 90. Three circumferentially distributed clearance holes 81 are opened on the lower plate body 90 and the suspended ventilator 82. The clearance holes 81 are located below the pin support plate 62 at corresponding positions. A heat insulation plate 88 is fixed to the upper end of the lower heating plate bottom cover 92. Several circumferentially distributed heat insulation air guide boxes 86 are fixed to the upper end of the heat insulation plate 88. The heat insulation air guide boxes 86 are located at a set of ventilation holes at corresponding positions. Directly below the hole 84, a guide tube 93 is fixed to the lower end of the bottom cover 92 of the lower heating plate. The guide tube 93 is inserted into the lifting sleeve shaft 102 at the corresponding position, and the guide tube 93 is connected to the lifting sleeve shaft 102 at the corresponding position. Several circumferentially distributed wiring holes 87 are opened inside the heat insulation plate 88. One end of the wiring hole 87 is connected to the guide tube 93, and the other end of the wiring hole 87 is connected to the heat insulation air guide box 86 at the corresponding position. Among them, the lower end of the lower plate body 90 of the four heating and cooling plate units 80 is provided with an electric heating wire 91. The wiring end of the electric heating wire 91 extends into and passes through the guide tube 93 at the corresponding position. The lower end of the lower plate body 90 of the other heating and cooling plate unit 80 is provided with a cooling coil 94. The connecting end of the cooling coil 94 extends into and passes through the guide tube 93 at the corresponding position. The connecting end of the cooling coil 94 is connected to an external cold source.

[0051] The wiring hole 87 is connected to the guide tube 93 and the heat insulation air guide box 86, and the guide tube 93 is connected to the corresponding lifting sleeve shaft 102. It is used to place the pipe between the vent hole 84 and the corresponding multi-way solenoid valve 89. At the same time, the guide tube 93 is connected to the corresponding lifting sleeve shaft 102 for the wiring terminals of electrical equipment such as electric heating wire 91 and temperature sensor. The mixed gas is injected into the vent hole 84 through several multi-way solenoid valves 89 inside the valve island box 23 to form mixed hot gas, which is blown onto the wafer above the heating and cooling plate unit 80. The airflow passes through the inner wall of the suspended vent tube 82. Several spiral ventilation slots 83 blow out, allowing the wafer to float stably and rotate, ensuring uniform heating of the wafer; temperature measurement hole 85 is used to install temperature sensor, clearance hole 81 is used to avoid pin support plate 62, heat insulation plate 88 is used to insulate and protect the transmission line and the pipe between heat insulation and ventilation hole 84 and the corresponding multi-way solenoid valve 89, heat insulation air guide box 86 is used to protect the pipe between heat insulation and ventilation hole 84 and the corresponding multi-way solenoid valve 89; external cold source is injected into cooling coil 94 to cool lower plate 90, forming mixed cold air, which also allows the wafer to float stably and rotate, ensuring uniform cooling of the wafer.

[0052] The cooling plate assembly 71 includes a locking insulation plate 99, which is inserted into the lifting sleeve shaft 102 at the corresponding position. The locking insulation plate 99 is located inside the lower heat insulation cover 79 at the corresponding position. The upper end of the locking insulation plate 99 is provided with a locking cooling upper plate 98. The upper end of the locking cooling upper plate 98 is provided with a clearance groove 97 and three circumferentially distributed clearance holes 96. A locking cooling pipe 100 is provided between the locking cooling upper plate 98 and the locking insulation plate 99. The wiring end of the locking cooling pipe 100 extends out of the locking insulation plate 99, and the connecting end of the locking cooling pipe 100 extends into and passes through the guide tube 93 at the corresponding position. The connecting end of the locking cooling pipe 100 is connected to an external cold source.

[0053] The lifting sleeve shaft 102 drives the locking insulation plate 99 to rise and fall, thereby driving the locking cooling upper plate 98 and the locking cooling pipe 100 to rise and fall. An external cold source is injected into the locking cooling pipe 100 to cool the locking cooling upper plate 98. The locking cooling upper plate 98 performs auxiliary cooling treatment on the wafer above it. The locking insulation plate 99 is used for heat preservation.

[0054] Working principle of the present invention: The FA factory end is the factory application layer of the factory automation system. The FA factory end ensures that the automated equipment can work continuously and stably; the main functions of the CTC host computer are data acquisition and processing, monitoring and display, control and command issuance, system interaction and information management, alarm and fault handling, to ensure the safe operation of the system; the main functions of the IAP slave computer are to receive and parse upgrade commands, firmware upgrade operation, feedback upgrade status, and ensure system security and stability.

[0055] The safety light curtain 16 can monitor the working area at all times to ensure the safety of mechanical equipment and improve the production efficiency of equipment; the high-definition camera lens 9 is used to detect the external working environment; the emergency stop switch 8 is used for emergency stop of equipment; the warning light 10 flashes to warn in abnormal conditions; the control touch screen 11 and several control buttons are used to set the operation information of each electrical device; the camera and edge finder work together to stably monitor the internal activities of the transmission space and the edge finder can detect the edge of the wafer surface through the optical sensor to determine the position and orientation of the wafer, which greatly improves the transmission efficiency;

[0056] The flip plate assembly 40, the loading cooling plate 71, the heating cooling plate 72 and the lifting chamber assembly 33 at the corresponding positions form a loading chamber with the lower fixed plate 35 and the upper fixed plate 32;

[0057] The four heating upper cavities 38, the corresponding heating and cooling plate units 80, heating and cooling plate components 72, and the lifting chamber assembly 33 form four heating chambers with the lower fixed plate 35 and the upper fixed plate 32 respectively; the temperature of the heating upper cavities 38 of the four heating chambers is 180°C, and the internal temperatures of the four heating chambers are controlled in counterclockwise order as 165°C, 300°C, 235°C and 195°C respectively;

[0058] The cooling chamber 34 forms a cooling chamber with the corresponding heating and cooling plate unit 80, heating and cooling plate component 72, and lifting chamber assembly 33, as well as the lower fixed plate 35 and the upper fixed plate 32;

[0059] The electric heating wire 91 heats the four lower plates 90. The external liquid nitrogen tank injects nitrogen into the formic acid storage tank 30. The nitrogen and formic acid form a mixed gas. The mixed gas is injected into the vent hole 84 through several multi-port solenoid valves 89 inside the valve island box 23 to form mixed hot gas. At the same time, the mixed gas is injected into the four upper chamber inlet and outlet cover plates 47 through the formic acid gas pipeline 49 via the valve island box 23, and is heated by the upper heating plate to form mixed hot gas. The mixed hot gas enters the four heating chambers respectively, so that the temperature meets the above settings.

[0060] An external cold source is injected into the cooling coil 94 to cool the lower plate 90, forming mixed cold air, which is then injected into the cooling chamber.

[0061] Several wafers to be processed are placed on one of the wafer loading and unloading machines 3. The flip cylinder 52 is retracted, which drives the nitrogen pipeline flip plate 53 to rotate and open, exposing the loading port 55 below and the locking cooling plate 98 below the loading port 55. The robot control box 14 is used to control the handling robot 15 to place the wafers to be processed on the three pin support plates 62 in sequence. After the placement is completed, the flip cylinder 52 extends, and the nitrogen pipeline flip plate 53 rotates and closes, abutting against the loading port 55.

[0062] The telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the flip plate assembly 40 drive the lifting frame 73 to rise. The lifting frame 73 drives the lifting sleeve shaft 102 to rise. When the lifting sleeve shaft 102 rises, it compresses the corrugated lifting sleeve 75. The lifting sleeve shaft 102 drives the lower cavity 77 to rise. At this time, the lower pad 78 and the lower heat insulation cover 79 rise synchronously. When the lower cavity 77 rises, the cavity sealing ring abuts against the lower end of the sealing ring 61 to seal. At the same time, the lifting sleeve shaft 102 drives the locking cooling plate 98 to rise. The locking cooling plate 98 lifts the wafer away from the three pin support plates 62 and positions the wafer. After positioning, the telescopic ends of the two pneumatic push rods 74 at this position drive the lifting frame 73 to fall down, and the wafer falls back to the three pin support plates 62.

[0063] The output shaft of the power motor 70 drives the sealing mounting seat 69 to rotate intermittently, thereby driving the support turntable 95 to rotate intermittently between the upper fixed plate 32 and the lower fixed plate 35, passing through the five heating and cooling discs 72 and the four heating upper cavities 38 and cooling cavities 34 in the corresponding positions, that is, entering the four heating chambers and cooling chambers in sequence.

[0064] After entering the four heating chambers, the telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the four upper heating chambers 38 drive the lifting frame 73 to rise. The lifting frame 73 drives the lifting sleeve shaft 102 to rise. When the lifting sleeve shaft 102 rises, it compresses the corrugated lifting sleeve 75. The lifting sleeve shaft 102 drives the lower cavity 77 to rise. At this time, the lower pad 78 and the lower heat insulation cover 79 rise synchronously. When the lower cavity 77 rises, the cavity sealing ring abuts against the lower end of the sealing ring 61 to seal. At the same time, the lifting sleeve shaft 102 drives the heating and cooling plate unit 80 to rise. The heating and cooling plate unit 80 lifts the wafer away from the three pin support plates 62 and injects the mixed hot gas inside the vent hole 84, which blows onto the heating and cooling plate. Above the unit 80, airflow is blown out through several spiral ventilation grooves 83 on the inner wall of the suspension ventilation cylinder 82, allowing the wafer to float stably and rotate, ensuring uniform heating of the wafer. After heating is completed, the mixing gas injection is stopped, and the wafer falls back onto the heating and cooling plate unit 80. Then, the telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the four heating upper chambers 38 drive the lifting frame 73 to descend, and the wafer falls back onto the three pin support plates 62. Then, it enters the interior of the other three heating chambers in sequence for first heating and then cooling. Through heating, the metal powder in the solder paste is melted, which can effectively reduce the height difference of each bump, reduce the surface roughness of the solder bumps, and remove the oxides in the solder.

[0065] After entering the cooling chamber, the telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the cooling chamber 34 drive the lifting frame 73 to rise. The lifting frame 73 drives the lifting sleeve shaft 102 to rise. When the lifting sleeve shaft 102 rises, it compresses the corrugated lifting sleeve 75. The lifting sleeve shaft 102 drives the lower cavity 77 to rise. At this time, the lower pad 78 and the lower heat insulation cover 79 rise synchronously. When the lower cavity 77 rises, the cavity sealing ring abuts against the lower end of the sealing ring 61 to seal. At the same time, the lifting sleeve shaft 102 drives the heating and cooling plate unit 80 to rise. The heating and cooling plate unit 80 lifts the wafer and separates it from the three The mixed cold air injected into the vent 84 of the pin support plate 62 is blown onto the wafer above the heating and cooling plate unit 80. The airflow is blown out through several spiral vent grooves 83 on the inner wall of the suspension vent 82, so that the wafer is stably suspended and rotated to ensure uniform cooling of the wafer. After cooling is completed, the injection of mixed air is stopped, and the wafer falls back onto the heating and cooling plate unit 80. Then, the telescopic ends of the two pneumatic push rods 74 of the lifting chamber assembly 33 below the cooling chamber 34 drive the lifting frame 73 to descend, and the wafer falls back onto the three pin support plates 62 to complete the cooling process and solidify the rapid cooling process of the wafer.

[0066] The output shaft of the power motor 70 drives the sealing mounting seat 69 to continue to rotate intermittently, thereby driving the support turntable 95 to rotate intermittently between the upper fixed plate 32 and the lower fixed plate 35, and then enter the loading chamber. The nitrogen pipeline flap 53 is connected to an external cold source, which can cool the nitrogen pipeline flap 53, perform auxiliary cooling treatment on the wafer, and optimize the cooling of the wafer.

[0067] Then the flip cylinder 52 retracts, driving the nitrogen pipeline flip plate 53 to rotate and open, and then the transport robot 15 places it on another wafer loading and unloading machine 3;

[0068] In this process, several differential pressure gauges 31 are used to monitor the internal air pressure of the process chamber 17. The gas cabinet of the gas cabinet exhaust component 18 is mainly used to store gas circuit components and gas pipes. The exhaust operation refers to exhausting the gas when a gas leak occurs in the gas cabinet, so as to protect personnel safety and extend the service life of the equipment. Several electrical devices are installed inside the electrical cabinet. During the operation of the electrical devices, heat and possible harmful gases will be generated. The exhaust of the electrical cabinet is to ensure the normal operation of the equipment and extend its service life.

[0069] One of the process chamber exhaust pipes 29 is located above the formic acid storage tank 30 and is used to discharge the formic acid volatilized from the formic acid storage tank 30 to the connecting box and then discharged from the process chamber flange pipe. When the rotating welding system 22 is venting, it discharges the gas through the other process chamber exhaust pipe 29 to the connecting box and then discharges from the process chamber flange pipe. The differential pressure gauge is used to monitor the gas pressure and the butterfly valve is used to control the exhaust volume.

[0070] When venting, the pressure chamber 42 draws out the exhaust gas from the inside of the upper fixed plate 32 and enters the converter head 43. The exhaust gas from the four heated upper chambers 38 enters the filter tube through the four upper chamber inlet and outlet cover plates 47. The spiral heating tube 46 inside the filter tube heats the inside of the filter tube to prevent cold air from entering the upper chamber inlet and outlet cover plates 47 and ensure that the internal temperature of the four heated upper chambers 38 is stable. After the exhaust gas is drawn into the filter tank 44 for filtration, the exhaust gas enters the converter head 43 and then enters another process chamber exhaust pipe 29 for discharge. The aluminum baffle valve 45 is used to control the air flow rate of the third upper chamber inlet and outlet cover plate 47 in the counterclockwise sequence.

[0071] During the operation of this system, the equipment fan filter is always working to ensure the cleanliness of the air inside the chamber; the power supply box 24 is mainly used to provide operating power for each electrical appliance; the power distribution cabinet 25 is used to distribute power to each electrical appliance.

[0072] In summary, by cooperating with the EFEM system 1, the handling robot 15, the safety light curtain 16, and the equipment fan filter, stable handling of wafers is achieved and the cleanliness of the air inside the chamber is ensured. At the same time, by cooperating with the handling robot 15 and the two wafer loading and unloading machines 3, wafers before and after processing are stably handled and placed.

[0073] By cooperating with the formic acid storage tank 30, the valve island box 23, and the rotating welding system 22, the wafer is subjected to heating treatment, rapid cooling treatment, and auxiliary cooling treatment in sequence. The heating treatment melts the metal powder in the solder paste, which can effectively reduce the height difference of each bump, reduce the surface roughness of the welding bumps, and remove the oxides in the solder. Then the wafer is cooled and solidified.

[0074] The loading chamber is formed by the cooperation of the flip plate assembly 40, the loading cooling plate 71, the heating cooling plate 72 and the lifting chamber assembly 33 with the lower fixed plate 35 and the upper fixed plate 32, so as to realize positioning loading and auxiliary cooling treatment.

[0075] Four heating chambers are formed by the cooperation of four upper heating chambers 38 with heating and cooling plate units 80, heating and cooling plate components 72, and lifting chamber components 33 with corresponding positions of electric heating wires 91, lower fixed plate 35, and upper fixed plate 32. The heating and cooling plate unit 80 cooperates with the formic acid storage tank 30 and valve island box 23 to blow hot air onto the wafer, so that the wafer is stably suspended and rotated, ensuring uniform heating of the wafer.

[0076] The cooling chamber is formed by the cooling cavity 34 and the corresponding positions of the heating cooling plate unit 80, the heating cooling plate component 72, the lifting chamber assembly 33, the lower fixed plate 35, and the upper fixed plate 32. The heating cooling plate unit 80 cooperates with the formic acid storage tank 30 and the valve island box 23 to blow cold air onto the wafer, so that the wafer is stably suspended and rotated, ensuring uniform cooling of the wafer.

[0077] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims. [Simplified Explanation of the Diagram]

[0078] Figure 1 is a front perspective view of the present invention. Figure 2 is a rear perspective view of the present invention. Figure 3 is a front perspective view of the EFEM system, control system, and wafer loading / unloading machine in the present invention. Figure 4 is a rear perspective view of the EFEM system, control system, and wafer loading / unloading machine in the present invention. Figure 5 is a right perspective view of the exhaust system, process area box, and rotary welding system in the present invention. Figure 6 is a left perspective view of the exhaust system, process area box, and rotary welding system in the present invention. Figure 7 is a perspective view of the rotary welding system in the present invention. Figure 8 is an exploded view of the rotary welding system in the present invention. Figure 9 is an exploded view of the heating and cooling plate component in the present invention. Figure 10 is an upper exploded view of the heating and cooling plate unit in the present invention. Figure 11 is a lower exploded view of the heating and cooling plate unit in the present invention when it is acting as a heating plate. Figure 12 is a partial structural view of the heating and cooling plate unit in the present invention when it is acting as a cooling plate. Figure 13 is an exploded view of the cooling plate component in the present invention. Figure 14 is a partial cross-sectional view of the rotary welding system in the present invention. Figure 15 is a schematic diagram of the exhaust system in this invention.

Claims

1. A wafer-level reflow soldering equipment, comprising an EFEM system (1) and a process area box (5) located at the rear of the EFEM system (1), wherein two wafer loading and unloading machines (3) are provided at the front of the EFEM system (1), and a control system (2) is provided at the side of the EFEM system (1). The EFEM system (1) is equipped with a handling robot (15) and an equipment fan filter. The process area box (5) is equipped with a rotary soldering system (22), a valve island box (23), a power supply box (24), a power distribution cabinet (25), an exhaust system (4), and a formic acid storage tank (30). The formic acid storage tank (30) is connected to the rotary soldering system (22) by a pipeline, and the air inlet of the formic acid storage tank (30) is connected to an external liquid nitrogen tank by a pipeline. The process area box (5) comprises a lower process chamber (26) and an upper process chamber (17) located at the upper end of the lower process chamber (26). The rotating welding system (22) includes a lower fixed plate (35), which is fixed to the bottom of the process chamber (17). The upper end of the lower fixed plate (35) is hinged to an upper fixed plate (32) via two hinges (64). Two symmetrically arranged flipping power components (36) are provided between the lower fixed plate (35) and the upper fixed plate (32). A power motor (70) is fixed to the middle of the lower end of the lower fixed plate (35). A sealing mounting seat (69) is fixed to the output shaft of the power motor (70). A support turntable (95) is fixed to the upper end of the sealing mounting seat (69). The supporting turntable (95) is rotatably disposed between the upper fixed plate (32) and the lower fixed plate (35). The lower fixed plate (35) has six circumferentially distributed heating and cooling plates (72) at its lower end. Each heating and cooling plate (72) has a lifting chamber assembly (33) at its lower end. Five of the heating and cooling plates (72) have heating and cooling plate units (80) inside, and the other heating and cooling plate (72) has a loading cooling plate (71) inside. The heating and cooling plate units (80) and the loading cooling plate (71) are both disposed above the lifting chamber assembly (33).The upper end of the lower fixed plate (35) is provided with a high-pressure straight-air L-shaped valve (41), a flap assembly (40), a cooling chamber (34), and four heating upper chambers (38). The flap assembly (40) is located at the upper end of the loading cooling plate component (71). The cooling chamber (34) and the four heating upper chambers (38) are arranged clockwise and located at the upper end of the five heating cooling plate units (80). The upper fixed plate (32) and the four heating upper chambers (38) are provided with a vacuum assembly (39). The vacuum assembly (39) is connected to the exhaust pipe (29) of another process chamber. The four heating upper chambers (38) are connected to the upper plate. The acid storage tanks (30) and the heating and cooling plate units (80) below the four heating upper chambers (38) are all connected to the formic acid storage tanks (30) through the valve island box (23). The heating and cooling plate units (80) below the cooling chamber (34) and the cooling plate mounting components (71) are connected to an external cold source. The upper fixed plate (32) has an upper water pipe (63) at its upper end, and the lower fixed plate (35) has a lower water pipe (68) at its lower end. The lower water pipe (68) is connected to the upper water pipe (63), and both the lower water pipe (68) and the upper water pipe (63) are connected to the external cold source.

2. The wafer-level reflow soldering equipment as described in claim 1, wherein, The EFEM system (1) includes an EFEM lower main housing (6) and an EFEM upper main housing (7) located on the upper part of the EFEM lower main housing (6). The EFEM lower main housing (6) is equipped with a robot control box (14). The handling robot (15) is located inside the EFEM lower main housing (6). Two wafer loading and unloading machines (3) are located on the front side of the EFEM lower main housing (6). The front side of the EFEM lower main housing (6) is equipped with a safety light curtain (16), an emergency stop switch (8), and a warning light (10). The safety light curtain (16) is located on the front side of the two wafer loading and unloading machines (3). The lower four corners of the EFEM lower main housing (6) are provided with foot cups (12) and casters (13). The side of the EFEM lower main housing (6) is provided with a control touch screen (11) and several control buttons. The equipment fan filter is located inside the EFEM upper main housing (7). The front of the EFEM upper main housing (7) is provided with a high-definition camera lens (9). The inside of the EFEM upper main housing (7) is provided with a camera and an edge finder.

3. The wafer-level reflow soldering equipment as described in claim 2, wherein, The control system mainly includes a FA factory terminal, a CTC host computer, and an IAP slave computer. The CTC host computer mainly includes a GUI and a scheduling module. The IAP slave computer includes a PLC module, a wafer robot module, and a loading port module, and is responsible for controlling the transmission module.

4. The wafer-level reflow soldering equipment as described in claim 3, wherein, Several differential pressure gauges (31) are provided on the side of the upper process chamber (17). The formic acid storage tank (30), the valve island box (23), the power supply box (24), and the power distribution cabinet (25) are all located inside the lower process chamber (26). The rotating welding system (22) is located inside the rear side of the lower process chamber (26). The exhaust system (4) includes a gas holder exhaust component (18), an electrical cabinet exhaust component (19), a process chamber exhaust component (20), and a process chamber exhaust pipe (21). The gas holder exhaust component (18) consists of a gas holder, a gas holder exhaust pipe connected to the upper end of the gas holder, and a gas holder flange pipe connected to the upper end of the gas holder exhaust pipe. The gas holder is located inside the front side of the upper process chamber (17). The electrical cabinet exhaust component (19) consists of an electrical cabinet, an electrical cabinet exhaust pipe connected to the upper end of the electrical cabinet, and an electrical cabinet flange pipe connected to the upper end of the electrical cabinet exhaust pipe. The gas holder and the electrical cabinet are located inside the lower process chamber (26). Inside the upper chamber (17), the gas holder exhaust pipe, the gas holder flange pipe, the electrical cabinet exhaust pipe and the electrical cabinet flange pipe extend out of the upper end of the process upper chamber (17). The process chamber exhaust pipe (21) is connected to the upper end of the process upper chamber (17) and is located directly above the rotary welding system (22). The process chamber exhaust component (20) includes a connecting box. The connecting box is located inside the upper chamber (17). The lower end of the connecting box is provided with two process chamber exhaust pipes (29). One process chamber exhaust pipe (29) is located above the formic acid storage tank (30). The other process chamber exhaust pipe (29) is provided with a butterfly valve (27) and a differential pressure gauge (28). The other process chamber exhaust pipe (29) is connected to the rotary welding system (22). The upper end of the connecting box is provided with a process chamber flange pipe. The process chamber flange pipe extends out of the upper end of the process upper chamber (17).

5. The wafer-level reflow soldering equipment as described in claim 4, wherein, The lower fixed plate (35) is provided with several through holes (66), and a sealing ring (65) is provided on the upper outer edge of the lower fixed plate (35). The flipping power component (36) includes a vertical plate (57) and a hydraulic push rod (67). The vertical plate (57) is fixed to the upper end of the upper fixed plate (32). The two ends of the hydraulic push rod (67) are respectively hinged to the lower fixed plate (35) and the flip plate bracket (51). The upper end of the upper fixed plate (32) is provided with a loading port (55) and five storage slots (56). The loading port (55) and the five storage slots (56) are evenly distributed in a circle. The loading port (55) is located at the upper end of the loading cooling plate (71). The upper end of the upper fixed plate (32) is provided with an upper water pipe groove (54). The upper water pipe (63) is engaged in the upper water pipe groove (54). The upper end of the upper fixed plate (32) is fixed with several quick clamps (37). The quick clamps (37) are detachably engaged in the lower fixed plate (35). The flap assembly (40) includes a nitrogen pipeline flap (53) and two flap brackets (51). The two flap brackets (51) are fixed to the upper end of the upper fixed plate (32) and are located on both sides of the loading port (55). One end of the nitrogen pipeline flap (53) is hinged to the upper end of the upper fixed plate (32). Both sides of the other end of the nitrogen pipeline flap (53) are provided with flap cylinders (52) between them and the flap brackets (51) on the same side. The nitrogen pipeline flap (53) is connected to the external cold source. The support turntable (95) has six circumferentially distributed sealing holes (60) and one mounting through hole (59). The mounting through hole (59) is located in the middle of the support turntable (95) and is connected to the upper end of the sealing mounting seat (69). Each sealing hole (60) has a sealing ring (61) inside. Each sealing ring (61) has three circumferentially distributed pin engagement grooves (58). Each pin engagement groove (58) can be detachably engaged with a pin support plate (62).

6. The wafer-level reflow soldering apparatus as described in claim 5, wherein, The heating upper cavity (38) and the cooling cavity (34) are detachably connected to the corresponding storage slot (56). The upper end of each heating upper cavity (38) is provided with an upper cavity inlet / outlet cover (47). A formic acid gas pipeline (49) is connected between the four upper cavity inlet / outlet cover plates (47). The formic acid gas pipeline (49) is connected to the outlet of the formic acid storage tank (30) through the valve island box (23). The upper end of the third heating upper cavity (38) in counterclockwise order is provided with a vacuum valve (48), and the formic acid gas pipeline (49) connected to the third heating upper cavity (38) in counterclockwise order is provided with a diaphragm sealing valve (50). The lower end of each of the four heating upper cavities (38) is provided with an upper heating plate. The vacuum assembly (39) includes a pressure chamber (42), which is fixedly connected to the upper middle part of the upper fixed plate (32) and is connected to the upper fixed plate (32). The upper end of the pressure chamber (42) is connected to a converter head (43), which is connected to the exhaust pipe (29) of another process chamber. Several filter canisters (44) are connected to the converter head (43). The filter canisters (44) are connected to the top of the four upper chamber inlet and outlet cover plates (47) through filter tubes. The filter tubes are all equipped with spiral heating tubes (46). An aluminum baffle valve (45) is connected to the filter tube connected to the third upper chamber inlet and outlet cover plate (47) in counterclockwise order.

7. The wafer-level reflow soldering equipment as described in claim 6, wherein, The lifting chamber assembly (33) includes a fixed frame (101) and a corrugated lifting sleeve (75). Pneumatic push rods (74) are fixed on both sides of the fixed frame (101). The lifting frame (73) is fixed between the telescopic ends of the two pneumatic push rods (74). A lifting sleeve shaft (102) is fixed at the upper end of the lifting frame (73). The lifting sleeve shaft (102) extends into and passes through the corrugated lifting sleeve (75). The heating and cooling plate (72) includes a lower cavity (76) and several multi-way solenoid valves (89). The lower cavity (76) is fixed to the lower end of the lower fixed plate (35). The fixing bracket (101) and the corrugated lifting sleeve (75) are both fixed to the lower end of the lower cavity (76) at corresponding positions. The lower end of the corrugated lifting sleeve (75) is fixed to the lifting sleeve shaft (102). The lower cavity (76) has a lower cavity (77) inside. The lifting sleeve shaft (102) passes through the lower cavity (76) and the upper end of the lifting sleeve shaft (102) is fixedly connected to the lower end of the lower cavity (77). The upper end of the lower cavity (77) is provided with a cavity sealing ring. The bottom inner side of the cavity (77) is provided with a lower pad plate (78), and the lower cavity (77) is provided with a lower heat insulation cover (79). The lower heat insulation cover (79) is placed above the lower pad plate (78). The heating and cooling plate unit (80) and the loading cooling plate component (71) are respectively located on the upper end of the lifting sleeve shaft (102) at the corresponding position. The heating and cooling plate unit (80) and the loading cooling plate component (71) are respectively located inside the lower heat insulation cover (79) at the corresponding position. The plurality of multi-way solenoid valves (89) are placed inside the valve island box (23). The plurality of multi-way solenoid valves (89) are respectively connected to the formic acid storage tank (30) and the heating and cooling plate unit (80) through pipes.

8. The wafer-level reflow soldering apparatus as described in claim 7, wherein, The heating and cooling plate unit (80) includes a lower plate body (90) and a lower heating plate bottom cover (92). A suspended ventilator (82) is fixed to the upper end of the lower plate body (90). Several spiral venting grooves (83) are formed on the inner wall of the suspended ventilator (82). Several sets of inclined venting holes (84) are formed at the upper end of the lower plate body (90). The venting holes (84) are connected to corresponding multi-way solenoid valves (89) via pipes. Several temperature measuring holes (85) are provided at the upper end. Three evenly distributed circular clearance holes (81) are provided on the lower plate (90) and the suspended ventilation cylinder (82). The clearance holes (81) are located below the pin support plate (62) at the corresponding position. A heat insulation plate (88) is fixed at the upper end of the lower heating plate bottom cover (92). Several evenly distributed circular heat insulation air guide boxes (86) are fixed at the upper end of the heat insulation plate (88). The heat insulation air guide boxes (86) are located at the corresponding position of the... Directly below the ventilation hole (84), a guide tube (93) is fixed to the lower end of the bottom cover (92) of the lower heating plate. The guide tube (93) is inserted into the lifting sleeve shaft (102) at the corresponding position, and the guide tube (93) is connected to the lifting sleeve shaft (102) at the corresponding position. The heat insulation plate (88) has several circumferentially distributed wiring holes (87) inside. One end of the wiring hole (87) is connected to the guide tube (93), and the other end of the wiring hole (87) is connected to the heat insulation plate (88) at the corresponding position. The heat conduction box (86) is connected; the lower end of the lower plate body (90) of the four heating and cooling plate units (80) is provided with an electric heating wire (91), the wiring end of the electric heating wire (91) extends into and passes through the guide tube (93) at the corresponding position, the lower end of the lower plate body (90) of another heating and cooling plate unit (80) is provided with a cooling coil (94), the connecting end of the cooling coil (94) extends into and passes through the guide tube (93) at the corresponding position, and the connecting end of the cooling coil (94) is connected to an external cold source.

9. The wafer-level reflow soldering apparatus as described in claim 8, wherein, The loading cooling plate component (71) includes a locking insulation plate (99), which is inserted into the lifting sleeve shaft (102) at the corresponding position. The locking insulation plate (99) is located inside the lower heat insulation cover (79) at the corresponding position. The upper end of the locking insulation plate (99) is provided with a locking cooling upper plate (98). The upper end of the locking cooling upper plate (98) is provided with a clearance groove (97) and three circumferentially distributed clearance holes (96). A locking cooling pipe (100) is provided between the locking cooling upper plate (98) and the locking insulation plate (99). The wiring end of the locking cooling pipe (100) extends out of the locking insulation plate (99), and the connecting end of the locking cooling pipe (100) extends into and passes through the guide tube (93) at the corresponding position. The connecting end of the locking cooling pipe (100) is connected to the external cold source.