Pad for chemical-mechanical polishing
TW202629349APending Publication Date: 2026-07-16ENTEGRIS INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ENTEGRIS INC
- Filing Date
- 2025-12-01
- Publication Date
- 2026-07-16
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Figure TWG2TA001069102_001 
Figure TWG2TA001069102_002 
Figure TWG2TA001069102_003
Abstract
Described are pads for chemical-mechanical polishing having a central area that is adapted to control pad temperature at the central area by controlling the amount of friction between the pad and a wafer substrate at the central area during chemical-mechanical processing, or by removing heat energy from the central area of the pad during chemical-mechanical polishing.
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