Easy-open sealing gasket

Abstract

This application provides an easy-open sealing gasket, which comprises, from top to bottom, an upper layer, a connecting layer, and an adhesive composite layer. The upper layer includes a surface film. The connecting layer includes a bonding adhesive. The adhesive composite layer comprises, from top to bottom, a lower connecting film, an electromagnetic induction heating layer, and an adhesive layer. The connecting layer bonds the upper layer and the adhesive composite layer together through the bonding adhesive, forming an unbonded area between the upper layer and the adhesive composite layer. The aforementioned easy-open sealing gasket improves the convenience of opening for the user.

Description

[Technical Field]

[0001] This case relates to a sealing gasket, and more particularly to an easy-open sealing gasket. [Previous Technology]

[0002] Note that, in order to prevent leakage of the contents and spoilage due to external environmental influences, sealing gaskets are used to seal the openings of packaging containers such as beverage cans and medicine cans. Furthermore, sealing gaskets are generally made of materials such as aluminum foil or cardboard.

[0003] By using a sealing gasket that is tightly sealed to the container opening, it is possible to prevent leakage of the contents and to seal and preserve the contents. [Summary of the Invention]

[0004] However, since the conventional sealing gasket design mainly considers the sealing performance and not the ease of opening, in this case, the aluminum foil or cardboard at the container opening is not easy to open by pressing with your fingers, and cutting with a knife or poking with an awl is both troublesome and dangerous, causing inconvenience to the user.

[0005] Therefore, how to solve the above-mentioned problems encountered by conventional sealing gaskets and effectively improve the ease of opening has become an urgent problem that this technical field hopes to solve.

[0006] To solve the above problems, this invention provides an easy-open sealing gasket, which comprises, from top to bottom, an upper layer, a connecting layer, and an adhesive composite layer. The upper layer comprises a surface film. The connecting layer comprises a connecting adhesive. The adhesive composite layer comprises, from top to bottom, a lower connecting film, an electromagnetic induction heating layer, and an adhesive layer. The connecting layer bonds the upper layer and the adhesive composite layer together through the connecting adhesive, and an unbonded area is formed between the upper layer and the adhesive composite layer.

[0007] In some embodiments, the cross-sectional width of the coating area of ​​the adhesive is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the coating area of ​​the adhesive is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

[0008] In some embodiments, the bonding layer further comprises an interlayer and a coating layer. The interlayer is disposed in the unbonded area and is bonded to the upper layer by a composite adhesive. The coating layer is applied to the lower surface of the interlayer. The material of the interlayer is selected from at least one of the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyamide (PA), polyethylene naphthalate (PEN), and polyimide (PI). The material of the coating layer is a varnish or silicone oil.

[0009] In some embodiments, the bonding layer further includes an interlayer and a coating layer. The interlayer is disposed in the unbonded area and is bonded to the adhesive composite layer via a composite adhesive. The coating layer is applied to the upper surface of the interlayer. The material of the interlayer is selected from at least one of the group consisting of PET, PP, PA, PEN, and PI. The material of the coating layer is a varnish or silicone oil.

[0010] In some embodiments, the bonding layer further includes a coating layer. The coating layer is applied to the lower surface of the upper layer or the upper surface of the adhesive composite layer. The coating layer is made of varnish or silicone oil.

[0011] In some embodiments, the coating layer is coated in a full-area coating or a dot-area coating.

[0012] In some embodiments, the cross-sectional width of the coating area of ​​the coating layer is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the coating area of ​​the coating layer is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

[0013] In some embodiments, the material of the lower connecting membrane is selected from at least one of the group consisting of polyethylene (PE), PP, PET, PA expandable polypropylene (EPP) and expandable polyethylene (EPE).

[0014] In some embodiments, the adhesive composite layer further comprises a composite film. The composite film is disposed above the electromagnetic induction heating layer. The composite film is made of at least one material selected from the group consisting of PET, PP, PA, PEN, and PE.

[0015] In some embodiments, the adhesive is a dry composite adhesive or a hot melt laminate, and the material of the hot melt laminate is selected from at least one of the group consisting of PE, PP, ethylene-methyl acrylate copolymer (EMAC), ethylene-methacrylic acid copolymer (EMAA), ethylene-acrylic acid copolymer (EAA), ethylene-ethyl acrylate copolymer (EEA), and ethylene-methyl methacrylate copolymer (EMMA).

[0016] In some embodiments, the material of the surface film is selected from at least one of the group consisting of PP, PET, PE, PA, PEN, PI and EMAC.

[0017] In some embodiments, the sealing layer is a combination of hot melt adhesive or sealing film and adhesive. The hot melt adhesive is made of at least one of the group consisting of ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene butyl acrylate copolymer (EBA), EAA, EMAC, polyacrylate, polyacrylamide copolymer (PA), and EMAA. The sealing film is made of at least one of the group consisting of PE, PP, PA, polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), and PET. The adhesive is disposed between the sealing film and the electromagnetic induction heating layer.

[0018] In some embodiments, the adhesive system makes the peel strength between the upper layer and the adhesive-sealed composite layer greater than or equal to 17.8 N / 15 mm.

[0019] In some embodiments, the electromagnetic induction heating layer is an aluminum foil or a wireless information integration sheet.

[0020] In some embodiments, the wireless information integration sheet includes a base film, an information and heating layer, and a first adhesive layer. The information and heating layer includes an information area and an electromagnetic induction heating ring. The first adhesive layer is located between the base film and the information and heating layer. The information area has an antenna and a chip that are mutually conductive, and the electromagnetic induction heating ring surrounds the information area in a planar view.

[0021] In some embodiments, the wireless information integration sheet further includes a protective layer and a second adhesive layer, wherein the protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

[0022] In some embodiments, there is a gap between the electromagnetic induction heating ring and the information area. In other embodiments, the gap is the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring, which is 0.1 mm to 3 mm. In still other preferred embodiments, the gap between the electromagnetic induction heating ring and the information area is completely filled.

[0023] In some embodiments, the information and heating layer further includes at least one physical connection bridge, which is used to connect the information area and the electromagnetic induction heating ring.

[0024] Those skilled in the art to which this application pertains can use the easy-open sealing gasket provided in this application to not only prevent leakage of contents and deterioration due to external environmental influences, but also allow users to easily open the container opening by directly pinching the crescent-shaped flap (i.e., the upper layer structure above the unsealed area) without the aid of external objects, thereby further achieving the effect of easy opening.

[0025] One aspect of this invention is based on the aforementioned problems with the prior art, and its purpose is to provide an easy-open sealing gasket that further enhances the ease of opening for the user. In other words, the easy-open sealing gasket provided in this invention can simultaneously ensure the airtightness of the contents and the ease of opening for the user.

Implementation Method

[0026] The following describes the implementation of this application through specific embodiments. Those skilled in the art can understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of this application.

[0027] Unless otherwise stated herein, the term "A to B" as used in the specification and the appended claims includes the meaning of "more than A and less than B". For example, the term "10 to 40% by weight" includes the meaning of "more than 10% by weight and less than 40% by weight".

[0028] Furthermore, in the description of this case, it should be noted that terms such as "first," "second," and "third" are used to distinguish between elements, rather than to limit the elements themselves or indicate a specific order of elements. It should be noted that in the description described below, the same elements or steps may be represented by the same number.

[0029] Please refer to FIG1, which is a cross-sectional schematic diagram illustrating the easy-open sealing gasket 50 of the first embodiment of this invention. As shown in FIG1, the easy-open sealing gasket 50 comprises, from top to bottom, an upper layer 100, a connecting layer 200, and an adhesive composite layer 300. The upper layer 100 includes a surface film 110, the connecting layer 200 includes a connecting adhesive 210, and the adhesive composite layer 300 comprises, from top to bottom, a lower connecting film 330, an electromagnetic induction heating layer 310, and an adhesive layer 320. The various structures will be described in more detail below.

[0030] <<Upper Layer 100>> The upper layer 100 is disposed on the topmost layer of the easy-open sealing gasket 50. Taking FIG. 1 as an example, the upper layer 100 includes a surface film 110, which serves as the topmost layer (i.e., the surface layer) of the easy-open sealing gasket 50. In some embodiments, the upper and / or lower surfaces of the surface film 110 may be printable surfaces, which may be used to print different patterns. In some embodiments, the material of the surface film 110 may be at least one selected from the group consisting of PP, PET, PE, PA, PEN, PI, and EMAC. Furthermore, the thickness of the surface film 110 is preferably 12 to 150 µm, within which tensile strength is greater, and the surface is smooth and glossy; additionally, when heat conduction is felt below the easy-open sealing gasket 50, the surface film 110 can be prevented from sticking to other external components (e.g., bottle caps).

[0031] <<Connecting Layer 200>> The connecting layer 200 is disposed between the upper layer 100 and the adhesive composite layer 300. Taking FIG1 as an example, the connecting layer 200 includes a connecting adhesive 210, and the connecting layer 200 can bond the upper layer 100 and the adhesive composite layer 300 through the connecting adhesive 210, forming an unbonded area UA between the upper layer and the adhesive composite layer 300, thereby ensuring that a portion of the area between the upper layer 100 and the adhesive composite layer 300 is separated from each other (i.e., not completely bonded), so that the user can easily peel off the easy-open sealing gasket 50 by hand without the aid of external objects. In some embodiments, the easy-open sealing gasket 50 can achieve a peel strength between the upper layer 100 and the adhesive composite layer 300 greater than or equal to 17.8N / 15mm through the connecting adhesive 210, thereby firmly bonding the upper layer 100 and the adhesive composite layer 300. In some embodiments, the bonding adhesive 210 may be a bonding adhesive capable of providing a peel strength between the upper layer 100 and the adhesive composite layer 300 greater than or equal to 17.8 N / 15 mm, but is not limited thereto. In some embodiments, the bonding adhesive 210 may be a dry composite adhesive, but is not limited thereto. In other embodiments, the bonding adhesive 210 may be a hot melt laminate, and the material of the hot melt laminate may be at least one selected from the group consisting of PE, PP, EMAC, EMAA, EAA, EEA, and EMMA. Furthermore, the thickness of the hot melt laminate is preferably 4 to 60 µm.

[0032] <<Adhesive-Sealing Composite Layer 300>> The adhesive-sealing composite layer 300 is disposed at the bottom of the easy-open sealing gasket 50. Taking Figure 1 as an example, the adhesive-sealing composite layer 300 includes, from top to bottom, a lower connecting film 330, an electromagnetic induction heating layer 310, and an adhesive layer 320. The electromagnetic induction heating layer 310 can be aluminum foil or a wireless information integrated sheet described later. Aluminum foil is a common structure in conventional sealing gaskets, and the thickness of the aluminum foil is preferably 10 to 40 µm, thereby enhancing the barrier function against moisture and oxygen, producing the effect of preventing leakage of contents and sealing and preserving the contents. Furthermore, the wireless information integrated sheet described later can be used to replace aluminum foil in this invention, which can effectively reduce the amount of aluminum foil used and reduce energy consumption. Specifically, the wireless information integration chip in this case can enhance wireless information transmission capabilities, reduce aluminum foil waste, lower energy consumption, avoid manpower waste, prevent interference from metals and liquids, improve production efficiency, provide excellent communication performance, and significantly extend communication distance, thereby greatly enhancing the automation, digitalization, and intelligence of factories, warehouses, logistics, stores, and unmanned checkout management. In some embodiments, the thickness of the wireless information integration chip is preferably 27µm to 2.5mm.

[0033] The sealing layer 320 is primarily used to seal the container opening. In some embodiments, the sealing layer 320 may be, for example, a hot melt adhesive. The hot melt adhesive may be made of at least one of the group consisting of EVA, PIB, EBA, EAA, EMAC, polyacrylate, acrylic copolymer, and EMAA, but is not limited thereto. Furthermore, the thickness of the hot melt adhesive is preferably 4 to 100 µm. With certain types of hot melt adhesives, adhesives can be eliminated, and a continuous sealing effect can be achieved even when the contents of the glass container contain water, and also when the contents of the glass container contain chili peppers, garlic, fermented bean curd, honey, or other pungent additives.

[0034] Furthermore, in another embodiment (e.g., FIG. 3, FIG. 4A, or FIG. 4B), taking FIG. 3 as an example, the adhesive layer 320 may be a combination of an adhesive film 321 and an adhesive 322, and the adhesive 322 is disposed between the adhesive film 321 and the electromagnetic induction heating layer 310. In some embodiments, the material of the adhesive film 321 may be at least one selected from the group consisting of PE, PP, PA, PVDC, EVOH, and PET, and the thickness of the adhesive film 321 is preferably 12 to 100 µm; while the adhesive 322 may be, for example, a composite adhesive, but is not limited thereto.

[0035] As described above, when the sealing layer 320 is a combination of hot melt adhesive or sealing film and adhesive, it makes it easier for the user to peel off the easy-open sealing gasket 50 from the bottle opening, or makes it easier for the user to peel off the clean easy-open sealing gasket 50 from the bottle opening.

[0036] The lower connecting film 330 is disposed above the electromagnetic induction heating layer 310. In other words, the lower connecting film 330 can be directly laminated above the electromagnetic induction heating layer 310, or it can be indirectly laminated above the electromagnetic induction heating layer 310 (i.e., other structures are disposed between the lower connecting film 330 and the electromagnetic induction heating layer 310). Taking FIG1 as an example, the lower connecting film 330 is disposed on the uppermost layer of the adhesive composite layer 300, which is used to laminate with the upper layer 100. More specifically, the lower connecting film 330 is laminated with the surface film 110 of the upper layer 100 through the adhesive 210. In some embodiments, the material of the lower connecting membrane 330 may be selected from at least one of the group consisting of PE, PP, PET, PA, EPP and EPE, and the thickness of the lower connecting membrane 330 is preferably 12 to 200 µm; thereby, the peel strength between the lower connecting membrane 330 and the upper layer 100 after lamination can be improved.

[0037] Thus, the easy-open sealing gasket 50 shown in Figure 1 not only prevents leakage of the contents and spoilage due to external environmental influences, but also allows the user to easily open the container opening by directly pinching the crescent-shaped flap (i.e., the structure of the upper layer 100 above the unsealed area UA) without the aid of external objects, thereby further achieving the function of easy opening. In other words, the easy-open sealing gasket 50 shown in Figure 1 can simultaneously ensure the airtightness of the contents and the convenience of opening for the user.

[0038] In some embodiments, the cross-sectional width W1 of the coating area of ​​the adhesive 210 can be greater than or equal to one-sixth of the cross-sectional width W2 of the easy-open sealing gasket 50, and the cross-sectional width W1 of the coating area of ​​the adhesive 210 can be less than or equal to five-sixths of the cross-sectional width W2 of the easy-open sealing gasket 50. This allows manufacturers to adjust the coating area of ​​the adhesive 210 according to actual needs, thereby further increasing the manufacturer's design flexibility. Furthermore, when the cross-sectional width W2 of the easy-open sealing gasket 50 is relatively large, the cross-sectional width W1 of the coating area of ​​the adhesive 210 can be smaller; and when the cross-sectional width W2 of the easy-open sealing gasket 50 is relatively small, the cross-sectional width W1 of the coating area of ​​the adhesive 210 can be larger.

[0039] Please refer to FIG2A, which is a cross-sectional schematic diagram illustrating the easy-open sealing gasket 50 of the second embodiment of this invention. More specifically, the easy-open sealing gasket 50 shown in FIG2A may further include an interlayer 230A and a coating layer 230B, and the interlayer 230A may be bonded to the upper layer 100 through a composite adhesive 220. Hereinafter, each structure will be described in more detail. Since the other components are substantially the same as those in the easy-open sealing gasket 50 shown in FIG1, they will not be described again here.

[0040] <<Interlayer 230A>> Taking FIG. 2A as an example, interlayer 230A can be disposed in the unbonded area UA as shown in FIG. 1, and interlayer 230A can be bonded to the upper layer 100 through composite adhesive 220. In some embodiments, the material of interlayer 230A can be at least one selected from the group consisting of PET, PP, PA, PEN and PI, and the thickness of interlayer 230A is preferably 12 to 24 µm. In some embodiments, the easy-open sealing gasket 50 can achieve a peel strength between interlayer 230A and the upper layer 100 greater than or equal to 17.8 N / 15 mm through composite adhesive 220, thereby securing the composite interlayer 230A and the upper layer 100. In some embodiments, composite adhesive 220 can be a bonding adhesive capable of achieving a peel strength between interlayer 230A and the upper layer 100 greater than or equal to 17.8 N / 15 mm, but is not limited thereto. In some embodiments, the composite adhesive 220 may be a dry composite adhesive, but is not limited thereto. In other embodiments, the composite adhesive 220 may be a hot melt laminate, and the material of the hot melt laminate may be at least one selected from the group consisting of PE, PP, EMAC, EMAA, EAA, EEA, and EMMA. Furthermore, the thickness of the hot melt laminate is preferably 4 to 60 µm. In some embodiments, to improve manufacturing convenience, the composite adhesive 220 may be the same as the bonding adhesive 210, and the easy-open sealing gasket 50 may achieve a peel strength greater than or equal to 17.8 N / 15 mm between the surface film 110 and the adhesive-sealed composite layer 300 through the bonding adhesive 210. That is, the same adhesive (e.g., the bonding adhesive, dry composite adhesive, or hot melt laminate as described above) may be used for both the bonding adhesive 210 and the composite adhesive 220. In other words, the bonding adhesive 210 and the composite adhesive 220 may be applied simultaneously as the same adhesive.

[0041] <<Coating Layer 230B>> Taking FIG. 2A as an example, coating layer 230B can be applied to the lower surface of interlayer 230A. In some embodiments, the material of coating layer 230B can be varnish or silicone oil, and the thickness of coating layer 230B is preferably 0.5 to 20 µm. Since only coating layer 230B is applied to the lower surface of interlayer 230A, and no other adhesive is used to bond interlayer 230A to adhesive composite layer 300, a gap area SA can exist between coating layer 230B and adhesive composite layer 300. This ensures that a portion of the area between coating layer 230B and adhesive composite layer 300 is separated from each other (i.e., not completely bonded), allowing the user to easily peel off the easy-open sealing gasket 50 by hand without the aid of external objects.

[0042] Furthermore, with conventional sealing gaskets, as the gap between the electromagnetic induction heating layer 310 and the interlayer 230A becomes thinner, after electromagnetic induction sealing, the pull flap of the conventional sealing gasket often adheres to the film below it, making it difficult for the user to open the pull flap. With the easy-open sealing gasket 50 shown in FIG2A, since the lower surface of the interlayer 230A is coated with varnish or silicone oil (i.e., coating layer 230B), the user can easily pry open the interlayer 230A with their fingers, thereby ensuring that the user can easily open the easy-open sealing gasket 50 by directly pinching the interlayer 230A without the aid of external objects.

[0043] In some embodiments, the coating layer 230B can be coated in a full-area or dot-area manner, so that the user can easily pry open the interlayer 230A with their fingers, thereby ensuring that the user can easily open the easy-open sealing gasket 50 by directly pinching the interlayer 230A without the aid of external objects. Taking the dot-area coating method as an example, after electromagnetic induction sealing, the small amount of air between the dot matrix of dot-area coating varnish or silicone oil provided in this invention will be heated and expanded by electromagnetic induction sealing. This will cause the interlayer 230A to be pushed upward, thereby ensuring that the interlayer 230A and the adhesive composite layer 300 are separated from each other, so that the user can more easily pry open the interlayer 230A with their fingers, thereby ensuring that the user can easily open the easy-open sealing gasket 50 by directly pinching the interlayer 230A without the aid of external objects.

[0044] In some embodiments, the cross-sectional width W3 of the coating area of ​​the coating layer 230B can be greater than or equal to one-sixth of the cross-sectional width W2 of the easy-open sealing gasket 50, and the cross-sectional width W3 of the coating area of ​​the coating layer 230B can be less than or equal to five-sixths of the cross-sectional width W2 of the easy-open sealing gasket 50, thereby allowing the manufacturer to adjust the coating area of ​​the coating layer 230B according to actual needs, thereby further increasing the manufacturer's design flexibility.

[0045] Please refer to FIG2B, which is a cross-sectional schematic diagram illustrating the easy-open sealing gasket 50 of the third embodiment of this invention. More specifically, the easy-open sealing gasket 50 shown in FIG2B may further include a coating layer 230B. Since the other components are substantially the same as those of the easy-open sealing gasket 50 shown in FIG1, they will not be described again here.

[0046] <<Coating Layer 230B>> Coating layer 230B can be applied to the lower surface of the upper layer 100 (as shown in FIG. 2B) or the upper surface of the adhesive composite layer 300 (as shown in FIG. 2D described later). Taking FIG. 2B as an example, coating layer 230B can be applied to the lower surface of the upper layer 100. More specifically, coating layer 230B can be applied to the lower surface of the surface film 110 of the upper layer 100; alternatively, coating layer 230B can also be applied to the upper surface of the lower connecting film 330 of the adhesive composite layer 300 as shown in FIG. 2D. In some embodiments, the material of coating layer 230B can be varnish or silicone oil, and the thickness of coating layer 230B is preferably 0.5 to 20 µm. Because a portion of the lower surface of the upper layer 100 is coated with a coating layer 230B, and the upper layer 100 is not bonded to the adhesive composite layer 300 through other adhesives, a gap region SA can exist between the coating layer 230B and the adhesive composite layer 300. This ensures that the portion of the coating layer 230B and the adhesive composite layer 300 are separated from each other (i.e., not completely bonded), allowing the user to easily peel off the easy-open sealing gasket 50 by hand without the aid of external objects. In other words, compared to FIG. 2A, as shown in FIG. 2B, the coating layer 230B is coated on the lower surface of the upper layer 100, rather than on the lower surface of the interlayer 230A as shown in FIG. 2A. This helps to reduce the component configuration of the easy-open sealing gasket 50, thereby reducing the overall thickness of the easy-open sealing gasket 50 and reducing the use of the composite adhesive 220 as shown in FIG. 2A.

[0047] Furthermore, the coating method of the coating layer 230B shown in FIG2B can be full-area coating or dot coating. Also, the cross-sectional width W3 of the coating area of ​​the coating layer 230B shown in FIG2B can be greater than or equal to one-sixth of the cross-sectional width W2 of the easy-open sealing gasket 50, and the cross-sectional width W3 of the coating area of ​​the coating layer 230B can be less than or equal to five-sixths of the cross-sectional width W2 of the easy-open sealing gasket 50.

[0048] Please refer to Figure 2C, which is a cross-sectional schematic diagram illustrating a partial change in the easy-open sealing gasket 50 shown in Figure 2A. Compared with Figure 2A, the configuration relationship between the composite adhesive 220, the interlayer 230A, and the coating layer 230B of the easy-open sealing gasket 50 shown in Figure 2C can be appropriately adjusted. More specifically, the interlayer 230A of the easy-open sealing gasket 50 shown in Figure 2C can be disposed in the unbonded area UA as shown in Figure 1 and can be bonded to the adhesive composite layer 300 through the composite adhesive 220, so that the peel strength between the interlayer 230A and the adhesive composite layer 300 is greater than or equal to 17.8N / 15mm (thereby firmly bonding the interlayer 230A and the adhesive composite layer 300). The coating layer 230B can be coated on the upper surface of the interlayer 230A to form a gap area SA between the coating layer 230B and the upper layer 100, thereby ensuring that a portion of the area between the coating layer 230B and the upper layer 100 is separated from each other (i.e., not completely bonded to each other), so that the user can easily peel off the easy-open sealing gasket 50 by hand without the aid of external objects.

[0049] Please refer to Figure 2D, which is a cross-sectional schematic diagram illustrating a partial variation of the easy-open sealing gasket 50 shown in Figure 2B. More specifically, compared to Figure 2B, the coating layer 230B of the easy-open sealing gasket 50 shown in Figure 2D is coated on the upper surface of the adhesive-sealing composite layer 300. Since the other components are substantially the same as those of the easy-open sealing gasket 50 shown in Figure 2B, they will not be described again here.

[0050] Taking Figures 2A to 2D as examples, coating layer 230B can be coated on the lower surface of interlayer 230A as shown in Figure 2A, coating layer 230B can be coated on the lower surface of upper layer 100 as shown in Figure 2B, coating layer 230B can be coated on the upper surface of interlayer 230A as shown in Figure 2C, or coating layer 230B can be coated on the upper surface of adhesive composite layer 300 as shown in Figure 2D.

[0051] Please refer to FIG3, which is a cross-sectional schematic diagram illustrating the easy-open sealing gasket 50 of the fourth embodiment of this invention. More specifically, the adhesive composite layer 300 of the easy-open sealing gasket 50 shown in FIG3 further includes a composite film 340. Since the other components are substantially the same as those of the easy-open sealing gasket 50 shown in FIG1, they will not be described again here.

[0052] <<Composite Film 340>> Taking Figure 3 as an example, the composite film 340 is disposed above the electromagnetic induction heating layer 310. More specifically, the composite film 340 is disposed between the lower connecting film 330 and the electromagnetic induction heating layer 310, and it is used to improve the tensile strength of the easy-open sealing gasket 50. In some embodiments, the material of the composite film 340 may be at least one selected from the group consisting of PET, PP, PA, PEN and PE, and the thickness of the composite film 340 is preferably 12 to 100 µm.

[0053] Taking Figure 3 as an example, an adhesive 390 can be used to bond the lower connecting film 330 and the composite film 340, as well as the electromagnetic induction heating layer 310 and the composite film 340. In some embodiments, the adhesive 390 may be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the lower connecting film 330 and the electromagnetic induction heating layer 310 or the electromagnetic induction heating layer 310 and the composite film 340) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0054] Please refer to FIG4A, which is a cross-sectional schematic diagram illustrating the easy-open sealing gasket 50 of the fifth embodiment of this invention. More specifically, the upper layer 100 of the easy-open sealing gasket 50 shown in FIG4A further includes an upper bonding film 130, and the adhesive composite layer 300 further includes a thickening layer 360. Since the other components are substantially the same as those of the easy-open sealing gasket 50 shown in FIG2A, they will not be described again here.

[0055] <<Upper Connecting Film 130>> The upper connecting film 130 is disposed below the surface film 110. In other words, the upper connecting film 130 can be directly laminated below the surface film 110, or it can be indirectly laminated below the surface film 110 (i.e., other structures are disposed between the surface film 110 and the upper connecting film 130). Taking FIG4A as an example, the upper connecting film 130 is disposed at the bottom layer of the upper layer 100 and is used to laminate with the adhesive composite layer 300. More specifically, the upper connecting film 130 is laminated with the lower connecting film 330 of the adhesive composite layer 300 through the adhesive 210. In some embodiments, the material of the upper bonding membrane 130 may be selected from at least one of the group consisting of PE, PP, PA, EMMA and EMAC, and the thickness of the upper bonding membrane 130 is preferably 12 to 100 µm; thereby, the peel strength between the upper bonding membrane 130 and the lower bonding membrane 330 of the adhesive composite layer 300 after lamination can be improved.

[0056] <<Lower Connecting Film 330>> Taking Figure 4A as an example, the lower connecting film 330 is disposed on the uppermost layer of the adhesive composite layer 300 and is used to laminate with the upper layer 100. More specifically, the lower connecting film 330 is laminated with the upper connecting film 130 of the upper layer 100 through the adhesive 210. In some embodiments, the material of the lower connecting film 330 may be at least one selected from the group consisting of PE, PP, PET, PA, EPP and EPE, and the thickness of the lower connecting film 330 is preferably 12 to 200 µm; thereby, the peel strength after lamination between the lower connecting film 330 and the upper connecting film 130 of the upper layer 100 can be improved.

[0057] <<Thickening Layer 360>> Taking FIG4A as an example, the thickening layer 360 is disposed above the electromagnetic induction heating layer 310 (specifically, it may be located between the lower connecting film 330 and the electromagnetic induction heating layer 310), and is used to increase the thickness of the easy-open sealing gasket 50. In some embodiments, the material of the thickening layer 360 may be at least one selected from the group consisting of EPE, EPP, PE, PP and paper, and the thickness of the thickening layer 360 is preferably 60 to 2000µm; thereby, the thickness of the easy-open sealing gasket 50 can be increased.

[0058] Taking FIG4A as an example, an adhesive 390 can be used to bond the lower connecting film 330 and the thickening layer 360, and the thickening layer 360 and the electromagnetic induction heating layer 310. In some embodiments, the adhesive 390 may be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the lower connecting film 330 and the thickening layer 360 or the thickening layer 360 and the electromagnetic induction heating layer 310) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0059] Furthermore, an adhesive 190 may be used to bond the surface film 110 and the upper connecting film 130 together. In some embodiments, the adhesive 190 may be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the surface film 110 and the upper connecting film 130) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0060] Please refer to Figure 4B, which is a cross-sectional schematic diagram illustrating a partial change in the easy-open sealing gasket 50 shown in Figure 4A. More specifically, compared to Figure 4A, the configuration relationship between the composite adhesive 220, the interlayer 230A, and the coating layer 230B of the easy-open sealing gasket 50 shown in Figure 4B can be substantially the same as that of the easy-open sealing gasket 50 shown in Figure 2C, so as to form a gap region SA between the coating layer 230B and the upper layer 100, thereby ensuring that a portion of the area between the coating layer 230B and the upper layer 100 is separated from each other (i.e., not completely composite with each other), so that the user can easily peel off the easy-open sealing gasket 50 by hand without the aid of external objects.

[0061] Please refer to Figures 5A and 5B, which are side views illustrating the easy-open sealing gasket 50 of the first specific example of this case. More specifically, Figure 5A illustrates an embodiment in which the cross-sectional width of the coating area of ​​the adhesive used to bond the upper layer 100 to the adhesive-sealing composite layer 300 is equal to five-sixths of the cross-sectional width of the easy-open sealing gasket 50; and Figure 5B illustrates an embodiment in which the cross-sectional width of the coating area of ​​the adhesive used to bond the upper layer 100 to the adhesive-sealing composite layer 300 is equal to one-sixth of the cross-sectional width of the easy-open sealing gasket 50.

[0062] Please refer to Figures 6A and 6B, which are side views illustrating the easy-open sealing gasket 50 of the second specific embodiment of this case. More specifically, Figure 6A illustrates an embodiment in which the cross-sectional width of the coating area of ​​the coating layer 230B coated below the interlayer 230A is equal to one-sixth of the cross-sectional width of the easy-open sealing gasket 50; and Figure 6B illustrates an embodiment in which the cross-sectional width of the coating area of ​​the coating layer 230B coated below the interlayer 230A is equal to five-sixths of the cross-sectional width of the easy-open sealing gasket 50.

[0063] [Wireless Information Integration Chip] Next, the wireless information integration chip that can be used in this case will be described.

[0064] First, please refer to FIG7, which is a cross-sectional schematic diagram illustrating the wireless information integration sheet 100w of the first embodiment of this invention. As shown in FIG7, the wireless information integration sheet 100w may include a base film 1w, a first adhesive layer 2w, and an information and heating layer 3w. The first adhesive layer 2w is located between the base film 1w and the information and heating layer 3w to bond the base film 1w and the information and heating layer 3w. The various structures will be described in more detail below.

[0065] The base film 1w is the initial layer used to fabricate the wireless information integration sheet. In one specific example, the material of the base film 1w can be at least one selected from the group consisting of PI, PEN, PET, polycarbonate (PC), PP, and PE. Furthermore, the thickness of the base film 1w is preferably 20 to 150 µm, within which longitudinal tensile strength is greater. In addition, as shown in FIG. 7, the lower surface of the base film 1w is bonded to the first adhesive layer 2w, while the upper surface of the base film 1w can serve as a printing surface for printing different patterns.

[0066] The first adhesive layer 2w is a layer used to bond the base film and information to the heating layer. In one specific example, the first adhesive layer 2w only needs to be able to bond the base film 1w and information to the heating layer 3w, and its material can be, for example, a composite adhesive. Furthermore, the thickness of the first adhesive layer 2w can be 0.5 to 7 µm, which allows the peel strength between the two bonded materials to be greater than 4 N / 15 mm.

[0067] Taking Figure 7 as an example, the information and heating layer 3w includes an information area 31w and an electromagnetic induction heating ring 32w. The information area 31w has the function of wireless information read and write transmission for subsequent product traceability. Among them, the information area 31w has an antenna 312w and a chip 311w that are interconnected. Furthermore, the electromagnetic induction heating ring 32w can be heated by electromagnetic induction through the electromagnetic field generated by the electromagnetic induction sealing machine, so that the adhesive layer of the sealing gasket is heated and melted and adhered to the container opening, thereby acting as an electromagnetic induction sealing gasket to seal the container opening. With the wireless information integrated chip included in this case, most of the heat can be generated in the electromagnetic induction heating ring 32w, and very little heat is conducted only in at least one physical connection bridge 33w between the antenna 312w and the electromagnetic induction heating ring 32w. The physical connecting bridge 33w can have a length of 0.1 to 3 mm and a width of 0.01 to 5 mm. The material of the physical connecting bridge 33w can be the same as that of the antenna 312w. This prevents excessive heat transfer to the central area of ​​the sealing gasket during electromagnetic induction sealing, thus saving energy. Furthermore, when applied to sealing gaskets containing batteries, the thickness of the information and heating layer 3w can be 6 µm to 2.5 mm; while when applied to sealing gaskets without batteries, the thickness of the information and heating layer 3w can be 6 to 300 µm.

[0068] Next, Figure 8A is a plan view illustrating a specific example of the information and heating layer 3w in this case, and Figure 8B is a plan view illustrating another specific example of the information and heating layer 3w in this case. As shown in Figure 8A or Figure 8B, the electromagnetic induction heating ring 32w surrounds the information area 31w in a planar view. Also, as shown in Figure 8A, the electromagnetic induction heating ring 32w and the information area 31w are filled with a spacer ITV, that is, there are no physical connecting elements (such as physical connecting bridges described later) between the electromagnetic induction heating ring 32w and the information area 31w. In this way, by filling the spacer ITV between the electromagnetic induction heating ring 32w and the information area 31w, this filled spacer ITV can block heat conduction to the information area 31w when electromagnetic induction heating occurs, which is a preferred state. Furthermore, the spacer ITV (the distance between the outermost edge of the information area 31w and the innermost edge of the electromagnetic induction heating ring 32w) can be 0.1 to 3 mm. Next, as shown in Figure 8B, a gap ITV is provided at most of the location between the electromagnetic induction heating ring 32w and the information area 31w. This gap ITV can block most of the heat conduction to the information area 31w when electromagnetic induction heating occurs, and the gap ITV (the distance between the outermost edge of the information area 31w and the innermost edge of the electromagnetic induction heating ring 32w) can be 0.1 to 3 mm. In addition, there can be at least one physical connection bridge 33w (two are indicated in Figure 8B and Figure 9B described later) between the antenna 312w and the electromagnetic induction heating ring 32w. The length of the physical connection bridge 33w can be 0.1 to 3 mm, and the width of the physical connection bridge 33w can be 0.01 to 5 mm. At this time, although the closed-loop electromagnetic induction heating ring 32w and the information area 31w are electrically connected, the wireless communication distance is not reduced much. In other words, the space between the electromagnetic induction heating ring 32w and the information area 31w can be filled with a spacer ITV, and can have both a spacer ITV and a physical connection bridge 33w at the same time, or it can be without a spacer (for example, the space between the electromagnetic induction heating ring 32w and the information area 31w can be filled with a physical connection bridge 33w).

[0069] In one specific example, the material of the electromagnetic induction heating ring 32w may be a metal, such as aluminum, copper, gold, silver, or tin, but is not limited thereto. Furthermore, from the viewpoint of the effect of generating heat when subjected to a changing electromagnetic field and cost, the electromagnetic induction heating ring 32w is preferably made of aluminum foil, and its thickness is preferably 6 to 40 µm.

[0070] Next, Figure 9A is a plan view illustrating a specific example of the information area of ​​this invention, and Figure 9B is a plan view illustrating another specific example of the information area of ​​this invention. Figure 9A shows an embodiment where the space between the electromagnetic induction heating ring 32w and the information area 31w in Figure 8A is filled with spaced ITVs, and Figure 9B shows an embodiment where most of the space between the electromagnetic induction heating ring 32w and the information area 31w in Figure 8B is filled with spaced ITVs. Furthermore, as shown in Figure 9A or Figure 9B, the information area 31w includes a chip 311w and an antenna 312w. Moreover, when wireless information transmission functionality is achieved, the chip 311w and the antenna 312w can be arranged in the manner shown in Figure 9A or Figure 9B, or in other ways, based on the RFID frequency band desired by the user, without particular limitation.

[0071] On the other hand, regarding the chip 311w, it may have a unique identification code and can be selected according to the purpose. For example, it may be a radio frequency identification near field communication (RFID_NFC) chip, a radio frequency identification high frequency (RFID_HF) chip, a radio frequency identification ultra-high frequency (RFID_UHF) chip, or a radio frequency identification microwave (RFID_MW) chip, etc., without particular limitation. All of these chips can be matched with the antenna 312w described later to realize wireless information communication functions.

[0072] Next, regarding the antenna 312w, its main function is to generate wirelessly transmitted signals. Its material can be metal, such as copper, silver, gold, tin or aluminum, etc., without any particular limitation.

[0073] In addition, although Figure 7 shows the case where the base film 1w is on top and the information and heating layer 3w is on the bottom, the order of the base film 1w and the information and heating layer 3w can be reversed as needed, that is, adjusted to the case where the base film 1w is on the bottom and the information and heating layer 3w is on top.

[0074] Alternatively, the wireless information integration sheet can also be a wireless information integration sheet 100w', which, as shown in FIG10, includes, in addition to the aforementioned base film 1w, first adhesive layer 2w, and information and heating layer 3w, a protective layer 5w and a second adhesive layer 4w. The protective layer 5w is located on the side of the information and heating layer 3w furthest from the base film 1w. Furthermore, the second adhesive layer 4w is located between the information and heating layer 3w and the protective layer 5w, and is used to bond the information and heating layer 3w and the protective layer 5w.

[0075] In one specific example, the second adhesive layer 4w only needs to be able to bond the information layer to the heating layer 3w and the protective layer 5w, and its material can be, for example, a dry composite adhesive, without particular limitation. Furthermore, the thickness of the second adhesive layer 4w can be 0.5 to 7 µm, preferably such that the peel strength between the two bonded layers is greater than 4 N / 15 mm. In addition, as shown in FIG10, the second adhesive layer 4w can extend to fill the gap between the electromagnetic induction heating ring 32w and the information area 31w to improve the overall structural strength of the wireless information integrated chip 100w'.

[0076] Next, the protective layer 5w will be described. The protective layer 5w is used to protect the information area 31w (i.e., the chip 311w, the antenna 312w, and the optional battery) from external damage to the chip 311w and the battery, thereby affecting their ability to transmit wireless information. The material of the protective layer 5w can be at least one selected from the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), polyethylene naphthalate (PEN), and polyimide (PI). Furthermore, in a preferred embodiment, the thickness of the protective layer 5w can be 12 to 100 µm.

[0077] Furthermore, either the upper or lower surface of the protective layer 5w can be used as the printing surface. Therefore, although Figure 10 shows the case where the base film 1w is on the bottom and the protective layer 5w is on the top (the upper surface of the protective layer 5w is used as the printing surface), the order of the base film 1w and the protective layer 5w can be reversed as needed, that is, the case where the base film 1w is on the top and the protective layer 5w is on the bottom (the lower surface of the protective layer 5w is used as the printing surface).

[0078] [Method for making an easy-open sealing gasket (I)] The method for making the easy-open sealing gasket 50 shown in Figure 3 will be further revealed here.

[0079] First, an adhesive is applied to the lower surface of the composite film roll, and the lower surface of the composite film roll is dry-laminated with the upper surface of the electromagnetic induction heating layer roll. The roll is then placed in a curing chamber for more than 24 hours to produce the first composite roll.

[0080] Next, an adhesive is applied to the composite film surface of the first composite roll, and the composite film surface of the first composite roll is dry-laminated with the lower surface of the lower connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the second composite roll.

[0081] Next, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the upper surface of the sealing film roll. The roll is then placed in a curing chamber for at least 24 hours to produce the lower composite roll. Alternatively, hot melt adhesive is applied to the electromagnetic induction heating layer of the second composite roll to produce the lower composite roll.

[0082] Next, a bonding adhesive is applied to a designated area on the lower surface of the surface film roll, and the lower surface of the surface film roll is dry-laminated with the lower bonding film surface of the lower composite roll. The roll is then placed in a curing chamber for more than 24 hours to produce an easy-open sealing gasket roll. Afterward, easy-open sealing gaskets of appropriate sizes are cut according to the user's needs.

[0083] Here, the specified range is between one-sixth and five-sixths of the cross-sectional width of the easy-open sealing gasket. Furthermore, the peel strength between the two layers of material bonded by the adhesive is greater than 4 N / 15 mm; while the peel strength between the two layers of material bonded by the bonding adhesive is greater than or equal to 17.8 N / 15 mm. The temperatures of the five sections of the upper drying tunnel of the dry laminator are 60 to 65°C, 65 to 70°C, 70 to 75°C, 75 to 80°C, and 80 to 85°C, respectively. The temperature of the laminating roller of the dry laminator is 50 to 60°C. The temperature of the curing chamber is 50 to 55°C.

[0084] [Method for making an easy-open sealing gasket (II)] The method for making the easy-open sealing gasket 50 shown in Figure 4A will be further revealed here.

[0085] First, an adhesive is applied to the lower surface of the surface film roll, so that the lower surface of the surface film roll is dry-laminated with the upper surface of the upper connecting film roll, and then the roll is placed in a curing chamber for more than 24 hours to produce the upper composite roll.

[0086] Next, varnish or silicone oil is applied to the lower surface of the sandwich roll in a full-area coating or dot-coating manner to create a coated flap roll.

[0087] Next, an adhesive is applied to the upper surface of the electromagnetic induction heating layer roll, and the upper surface of the electromagnetic induction heating layer roll is dry-laminated with the lower surface of the thickened layer roll. The roll is then placed in a curing chamber for more than 24 hours to produce the first composite roll.

[0088] Next, an adhesive is applied to the thickened layer of the first composite roll, and the thickened layer of the first composite roll is dry-laminated with the lower surface of the lower connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the second composite roll.

[0089] Next, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the upper surface of the sealing film roll. The roll is then placed in a curing chamber for at least 24 hours to produce the lower composite roll. Alternatively, hot melt adhesive is applied to the electromagnetic induction heating layer of the second composite roll to produce the lower composite roll.

[0090] Next, a super-strong adhesive is applied to the upper connecting film surface of the upper composite roll, and a coated flap film roll is sandwiched in the middle. The upper connecting film surface of the upper composite roll, the upper surface of the coated flap film roll, and the lower connecting film surface of the lower composite roll are dry-laminated using a sandwich lamination method. The roll is then placed in a curing chamber for more than 24 hours to produce an easy-open sealing gasket roll. Afterward, easy-open sealing gaskets of appropriate sizes are cut according to the user's needs.

[0091] Here, the cross-sectional width of the coated flap film roll is between one-sixth and five-sixths of the cross-sectional width of the easy-open sealing gasket. Furthermore, the peel strength between the two layers of material bonded by the adhesive is greater than 4 N / 15 mm; while the peel strength between the two layers of material bonded by the super-strong adhesive (i.e., using the same adhesive as both the bonding adhesive and the composite adhesive in this case) is greater than or equal to 17.8 N / 15 mm. The temperatures of the five sections of the upper drying tunnel of the dry laminator are 60 to 65°C, 65 to 70°C, 70 to 75°C, 75 to 80°C, and 80 to 85°C, respectively. The temperature of the laminating roller of the dry laminator is 50 to 60°C. The temperature of the curing chamber is 50 to 55°C.

[0092] [Preparation of Wireless Information Integration Sheet Roll Material] Based on the following steps, a preferred embodiment of the present invention, the wireless information integration sheet roll material, is prepared. The wireless information integration sheet roll material described herein can be used as an embodiment of the aforementioned electromagnetic induction heating layer roll material in the process of preparing the aforementioned easy-open sealing gasket roll material.

[0093] First, a composite adhesive (first adhesive layer) is applied to the composite surface of the base film roll, and then it is laminated with the composite surface of the metal foil roll to produce a wireless information integrated circuit preform roll. Second, the metal foil of the wireless information integrated circuit preform roll is etched to connect the antenna and the chip to form an electrical connection. Then, the chip is encapsulated using a chip encapsulation protective adhesive through a dispensing machine, and the connecting wires connecting the chip and the antenna are also applied. At this point, the metal foil of the wireless information integrated circuit preform roll forms an information and heating layer, and the wireless information integrated circuit preform roll becomes a wireless information integrated circuit roll.

[0094] The peel strength between the two layers of materials bonded by the composite adhesive is greater than 4N / 15mm.

[0095] In addition, if it is desired to add a battery to the information and heating layer, a welding machine or conductive adhesive can be used to process the battery cell and the chip into an electrical connection.

[0096] On the other hand, based on the aforementioned wireless information integrated sheet roll, a dry composite adhesive (second adhesive layer) is applied to the composite surface of the protective layer roll, and the information and heating layer surface (the surface away from the base film) of the wireless information integrated sheet roll roll is dry-laminated, and then cured in a curing chamber for more than 24 hours to produce another embodiment of the wireless information integrated sheet roll roll.

[0097] It should be noted that the above description is only an illustrative example of manufacturing an easy-open sealing gasket. That is to say, those skilled in the art to which this application pertains can also adjust the order to manufacture an easy-open sealing gasket.

[0098] This application is not limited to the various embodiments described above. Those skilled in the art to which this application pertains can make various additions, subtractions, substitutions, and / or modifications within the scope disclosed in the claims. Furthermore, embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of this application. 190: Adhesive [Simplified Explanation of the Diagram]

[0099] Figure 1 is a cross-sectional schematic diagram illustrating the easy-open sealing gasket of the first embodiment of this invention. Figure 2A is a cross-sectional schematic diagram illustrating the easy-open sealing gasket of the second embodiment of this invention. Figure 2B is a cross-sectional schematic diagram illustrating the easy-open sealing gasket of the third embodiment of this invention. Figure 2C is a cross-sectional schematic diagram illustrating a partial variation of the easy-open sealing gasket shown in Figure 2A. Figure 2D is a cross-sectional schematic diagram illustrating a partial variation of the easy-open sealing gasket shown in Figure 2B. Figure 3 is a cross-sectional schematic diagram illustrating the easy-open sealing gasket of the fourth embodiment of this invention. Figure 4A is a cross-sectional schematic diagram illustrating the easy-open sealing gasket of the fifth embodiment of this invention. Figure 4B is a cross-sectional schematic diagram illustrating a partial variation of the easy-open sealing gasket shown in Figure 4A. Figures 5A to 5B are side views illustrating the easy-open sealing gasket of the first specific embodiment of this invention. Figures 6A to 6B are side views illustrating the easy-open sealing gasket of the second specific embodiment of this invention. Figure 7 is a cross-sectional schematic diagram illustrating the wireless information integration chip of the first embodiment of this invention. Figure 8A is a plan view illustrating a specific example of the information and heating layer of this invention. Figure 8B is a plan view illustrating another specific example of the information and heating layer of this invention. Figure 9A is a plan view illustrating a specific example of the information area of ​​this invention. Figure 9B is a plan view illustrating another specific example of the information area of ​​this invention. Figure 10 is a cross-sectional schematic diagram illustrating the wireless information integration chip of the second embodiment of this invention.

Claims

1. An easy-open sealing gasket, comprising, from top to bottom: an upper layer comprising a surface film; a bonding layer comprising a bonding adhesive; and an adhesive-sealing composite layer comprising, from top to bottom: a lower bonding film, an electromagnetic induction heating layer, and an adhesive-sealing layer; wherein, The bonding layer is used to bond the upper layer and the adhesive composite layer through the bonding adhesive, and an unbonded area is formed between the upper layer and the adhesive composite layer; wherein, the electromagnetic induction heating layer is a wireless information integrated chip, the wireless information integrated chip includes: a base film; an information and heating layer, which includes an information area and an electromagnetic induction heating ring; and a first adhesive layer, which is located between the base film and the information and heating layer; wherein, the information area has an antenna and a chip that are mutually conductive, and the electromagnetic induction heating ring surrounds the information area in a planar view; wherein, there is a gap between the electromagnetic induction heating ring and the information area.

2. The easy-open sealing gasket as described in claim 1, wherein, The cross-sectional width of the coating area of ​​the adhesive is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the coating area of ​​the adhesive is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

3. The easy-open sealing gasket as described in claim 1, wherein, The bonding layer further comprises: an interlayer disposed in the unbonded area, and the interlayer being bonded to the upper layer by means of a composite adhesive; and a coating layer coated on the lower surface of the interlayer; wherein the material of the interlayer is selected from at least one of the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyamide (PA), polyethylene naphthalate (PEN), and polyimide (PI); and wherein the material of the coating layer is a varnish or silicone oil.

4. The easy-open sealing gasket as described in claim 3, wherein, The coating layer is applied using either full-area coating or dot-area coating.

5. The easy-open sealing gasket as described in claim 3, wherein, The cross-sectional width of the coating area of ​​the coating layer is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the coating area of ​​the coating layer is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

6. The easy-open sealing gasket as described in claim 1, wherein, The bonding layer further comprises: an interlayer disposed in the unbonded area, and the interlayer being bonded to the adhesive composite layer by means of a composite adhesive; and a coating layer coated on the upper surface of the interlayer; wherein the material of the interlayer is selected from at least one of the group consisting of PET, PP, PA, PEN and PI; and wherein the material of the coating layer is a varnish or silicone oil.

7. The easy-open sealing gasket as described in claim 1, wherein, The bonding layer further includes: a coating layer applied to the lower surface of the upper layer or the upper surface of the adhesive composite layer; wherein the coating layer is made of varnish or silicone oil.

8. The easy-open sealing gasket as described in claim 7, wherein, The coating layer is applied using either full-area coating or dot-area coating.

9. The easy-open sealing gasket as described in claim 7, wherein, The cross-sectional width of the coating area of ​​the coating layer is greater than or equal to one-sixth of the cross-sectional width of the easy-open sealing gasket, and the cross-sectional width of the coating area of ​​the coating layer is less than or equal to five-sixths of the cross-sectional width of the easy-open sealing gasket.

10. The easy-open sealing gasket as described in claim 1, wherein, The material of the lower connecting membrane is selected from at least one of the group consisting of polyethylene (PE), PP, PET, PA, expandable polypropylene (EPP) and expandable polyethylene (EPE).

11. The easy-open sealing gasket as described in claim 1, wherein, The adhesive composite layer further includes: a composite film disposed above the electromagnetic induction heating layer; wherein the composite film is made of at least one material selected from the group consisting of PET, PP, PA, PEN and PE.

12. The easy-open sealing gasket as described in claim 1, wherein, The adhesive is a dry composite adhesive or a hot melt laminate, and the material of the hot melt laminate is selected from at least one of the group consisting of PE, PP, ethylene-methyl acrylate copolymer (EMAC), ethylene-methacrylic acid copolymer (EMAA), ethylene-acrylic acid copolymer (EAA), ethylene-ethyl acrylate copolymer (EEA), and ethylene-methyl methacrylate copolymer (EMMA).

13. The easy-open sealing gasket as described in any one of claims 1 to 12, wherein, The material of the surface film is selected from at least one of the group consisting of PP, PET, PE, PA, PEN, PI and EMAC.

14. The easy-open sealing gasket as described in any one of claims 1 to 12, wherein, The sealing layer is a combination of hot melt adhesive or sealing film and adhesive. The hot melt adhesive is made of at least one material selected from the group consisting of ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene butyl acrylate copolymer (EBA), EAA, EMAC, polyacrylate, acrylic copolymer and EMAA. The sealing film is made of at least one material selected from the group consisting of PE, PP, PA, polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH) and PET. The adhesive is disposed between the sealing film and the electromagnetic induction heating layer.

15. The easy-open sealing gasket as described in any one of claims 1 to 12, wherein, The adhesive provides a peel strength between the upper layer and the adhesive composite layer that is greater than or equal to 17.8 N / 15 mm.

16. The easy-open sealing gasket as described in claim 1, wherein, The wireless information integrated chip also includes a protective layer and a second adhesive layer. The protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

17. The easy-open sealing gasket as described in claim 1, wherein, The interval is the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring, which is 0.1 mm to 3 mm.

18. The easy-open sealing gasket as described in claim 1, wherein, The electromagnetic induction heating ring is completely separated from the information area.

19. The easy-open sealing gasket as described in claim 1, wherein, The information and heating layer also includes at least one physical connection bridge, which is used to connect the information area and the electromagnetic induction heating ring.

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