Perforated glass substrate for semiconductor packaging, glass substrate for semiconductor packaging, method for manufacturing perforated glass substrate for semiconductor packaging, and method for manufacturing glass substrate for semiconductor packaging.

Abstract

The objective of this invention is to provide a glass substrate suitable for forming holes with a near-straight hole shape, and a method for manufacturing the glass substrate. The glass substrate G1 and glass substrate G2 of this invention include: a first main surface G1a, a first main surface G2a, a second main surface G1b, a second main surface G2b serving as the opposite side of the first main surface G1a and the first main surface G2a, and holes 1 and 2. The glass substrate G1 and glass substrate G2 are characterized in that: holes 1 and holes 2 include non-through holes 2 formed on one of the first main surfaces G1a, the first main surface G2a, the second main surfaces G1b, and the second main surface G2b, and / or through holes 1 penetrating between the first main surfaces G1a, the first main surface G2a, the second main surfaces G1b, and the second main surfaces G2b; when the HF etching rate of the glass substrate G1 and glass substrate G2 is set to ER, and the HF etching rate after heat treatment of the glass substrate G1 and glass substrate G2 is set to ERa, ER / ERa is 0.2 or more and less than 1.

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