Photosensitive resin composition and its cured product
TW202629618APending Publication Date: 2026-07-16TAIYO HOLDINGS CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TAIYO HOLDINGS CO LTD
- Filing Date
- 2025-10-23
- Publication Date
- 2026-07-16
Abstract
The present invention provides a photosensitive resin composition and a cured form of the composition, the composition comprising paraffin wax, inorganic filler, photopolymerization initiator, photosensitive resin and reactive diluent.
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