Adhesives for semiconductors, multilayer films, semiconductor devices, and methods for manufacturing the same.

Abstract

An adhesive for semiconductors contains a curable resin component and an inorganic filler. The inorganic filler comprises boron nitride particles and at least one selected from the group consisting of silicon dioxide particles, aluminum oxide particles, aluminum nitride particles, and silicon carbide particles. Based on the total amount of the semiconductor adhesive, the content of boron nitride particles is 45% by mass or less, and the average particle diameter of the boron nitride particles is 2 μm or less.