Components for forming flexible device substrate

Abstract

A composition for forming a flexible device substrate is provided, which, even without containing fluorine atoms, still possesses transparency, high heat resistance, and, when forming electrodes on polyimide, can form a resin film with good adhesion to an inorganic insulating film. A composition for forming a flexible device substrate contains component (A) and component (C). Component (A): a polyimide precursor having one or both of the following: structure t0 derived from a tetracarboxylic dianhydride or a derivative thereof having the structure shown in formula (0-t) and structure d0 derived from a diamine having the structure shown in formula (0-d), and does not contain fluorine atoms; Component (C): a specific compound shown in formula [1].