Resin composition, prepreg, resin sheet, printed wiring board, semiconductor package, and semiconductor device
TW202629678APending Publication Date: 2026-07-16MITSUBISHI GAS CHEM CO INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- MITSUBISHI GAS CHEM CO INC
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-16
Abstract
The problem to be solved by the present invention is to provide a resin composition that can impart excellent flame retardancy while suppressing the reactivity of borate esters with thermosetting compounds. The solution is a resin composition comprising a thermosetting compound (A), a phosphorus compound (B), and a borate ester compound (C) represented by the following Formula
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