Film adhesives, die-cutting bonding monolithic films, and semiconductor devices and methods for manufacturing the same.

TW202629723APending Publication Date: 2026-07-16RESONAC CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-09-11
Publication Date
2026-07-16

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Abstract

This invention discloses a film-like adhesive containing a thermosetting resin component and an elastomer, and may further contain inorganic fillers. The content of inorganic fillers is 0-5% by mass, based on the total amount of the film-like adhesive. The shear viscosity at 120°C is below 10000 Pa·s.
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