Adhesive composition and manufacturing method thereof, adhesive sheet, dicing tape, dicing grain bonding integrated film, and manufacturing method of (meth)acrylic resin.

Abstract

An adhesive composition is provided. This adhesive composition contains (meth)acrylic resin (A), a photopolymerization initiator (B), and a crosslinking agent (C). The (meth)acrylic resin (A) has structural units containing hydroxyl groups (M-1), structural units containing vinyl unsaturated groups (M-2), and structural units containing carboxyl groups (M-3). The weight average molecular weight of the (meth)acrylic resin (A) is 200,000 to 650,000. The acid value of the (meth)acrylic resin (A) is 5 to 50 mg KOH / g.