Methods for manufacturing pseudo-adhesives, wafer stacks, and thin wafers for wafer fabrication

Abstract

The present invention addresses the problem of providing a dummy adhesive for wafer processing, a wafer stack, and a method for manufacturing thin wafers. This dummy adhesive provides sufficient substrate retention after wafer bonding, even when using high-gradient substrates, exhibits excellent subsequent wafer processing toughness, and demonstrates excellent wafer peelability and post-peeling cleaning and removal properties. The solution of the present invention is a dummy adhesive for wafer processing, which is composed of a thermosetting polysiloxane-based composition containing a nonfunctional organopolysiloxane, used for dummy bonding of a wafer to a support.

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