Semiconductor processing components and processing methods

Abstract

The present invention aims to provide a semiconductor processing composition and a processing method thereon, wherein the semiconductor processing composition exhibits excellent storage stability and can effectively reduce corrosion or defects in wiring materials on the surface of the object being processed. The semiconductor processing composition of the present invention contains (A) a heterocyclic compound, (B) a cationic water-soluble polymer, and (C) a liquid medium, wherein when the content of component (A) is set as MA [parts by mass] and the content of component (B) is set as MB [parts by mass], MA / MB = 0.1 to 1000, and the pH is 2 to 9.

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