Copper microparticles

Abstract

In one embodiment, the present invention relates to copper microparticles having a tap density of 2.8 g / cm³ or more, a specific surface area of ​​1 m² / g or more and 5 m² / g or less, and in a particle size histogram based on number, the particle size D10 at a cumulative frequency of 10% and the particle size D90 at a cumulative frequency of 90% satisfy the relationship D90 / D10 ≤ 3.7. In another embodiment, the present invention relates to a copper microparticle dispersion containing the above-mentioned copper microparticles. In yet another embodiment, the present invention relates to a method for manufacturing copper microparticles, comprising: maintaining a mixture containing a copper raw material compound, a reducing agent, a dispersant, and a solvent with an SP value of 8 to 18 at a predetermined temperature below the boiling point of the solvent for at least 1 minute to reduce the copper raw material compound.