Enclosed components and electroplating equipment
TW202629842APending Publication Date: 2026-07-16ACM RES (SHANGHAI) INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ACM RES (SHANGHAI) INC
- Filing Date
- 2025-11-18
- Publication Date
- 2026-07-16
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Figure TWG2TA001069054_001 
Figure TWG2TA001069054_002 
Figure TWG2TA001069054_003
Abstract
A sealing component and an electroplating apparatus are disclosed. The sealing component is used to seal the electroplating apparatus, which includes a cavity and a substrate clamping assembly. The cavity has an opening. The sealing component includes a cover and a connecting device. The cover is fitted onto the substrate clamping assembly to close the opening after a clamping plate enters the cavity, thus sealing the cavity. The cover and the substrate clamping assembly are configured to be relatively movable so that the clamping plate can move relative to the cover within the cavity after the cover closes the opening. The connecting device is connected to the substrate clamping assembly and is used to move the cover and close the opening when the clamping plate enters the cavity through the opening; and / or, to move the cover and disengage it from the opening when the clamping plate moves out of the cavity through the opening.
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