Enclosed components and electroplating equipment

TW202629842APending Publication Date: 2026-07-16ACM RES (SHANGHAI) INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ACM RES (SHANGHAI) INC
Filing Date
2025-11-18
Publication Date
2026-07-16

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Abstract

A sealing component and an electroplating apparatus are disclosed. The sealing component is used to seal the electroplating apparatus, which includes a cavity and a substrate clamping assembly. The cavity has an opening. The sealing component includes a cover and a connecting device. The cover is fitted onto the substrate clamping assembly to close the opening after a clamping plate enters the cavity, thus sealing the cavity. The cover and the substrate clamping assembly are configured to be relatively movable so that the clamping plate can move relative to the cover within the cavity after the cover closes the opening. The connecting device is connected to the substrate clamping assembly and is used to move the cover and close the opening when the clamping plate enters the cavity through the opening; and / or, to move the cover and disengage it from the opening when the clamping plate moves out of the cavity through the opening.
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