Method for determining whether a ＜111＞ type ingot is at optimal orientation angle range and method and system to process a ＜111＞ type ingot

Abstract

type ingot; determining if the crystal orientation of the ingot is at a best turning angle area, processing the ingot if determination of being at a best turning angle area is made, and adjusting X-axial crystal orientation and Y-axial crystal orientation of the ingot if determination of being not at a best turning angle area is made, thereby processing the ingot after ensuring the ingot is at the best turning angle area. The present invention may reduce warp value of the sliced wafers and keep warp value stable through ensuring that the crystal orientation of the ingot is at the best turning angle area from a random turning angle.

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