Method for wafer insection and system thereof

Abstract

The present application discloses a system for wafer inspection. The system for wafer inspection includes a multi-wavelength light source, a camera lens assembly, and an image sensor. The multi-wavelength light source emits a first light having a first wavelength and a second light having a second wavelength to illuminate a wafer to be inspected. The first wavelength is different from the second wavelength. The camera lens assembly receives and guides a first reflected light of the first light reflected by the wafer, and receives and guides a second reflected light of the second light reflected by the wafer. The camera lens assembly has a first focal length corresponding to the first wavelength and a second focal length corresponding to the second wavelength, and the first focal length is different from the second focal length. The image sensor receives the first reflected light from the camera length assembly so as to generate a first inspection image, and receives the second reflected light from the camera length assembly so as to generate a second inspection image.

Images