Test socket and method of manufacturing the same
TW202630014APending Publication Date: 2026-07-16ISC CO LTD
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Patent Information
- Application Number
- TW115100085
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-02
- Filing Date
- 2026-01-02
- Publication Date
- 2026-07-16
Abstract
A test socket is disclosed that can effectively prevent damage to conductive portions by preventing a load from being concentrated on a specific conductive portion when testing a device under test (e.g., a semiconductor device). The test socket according to an embodiment of the present disclosure includes a first conductive portion array disposed in a first region, in which a plurality of first conductive portions have gaps with respect to an insulating support portion, and a second conductive portion array disposed in a second region different from the first region, in which a plurality of second conductive portions are supported by the insulating support portion without gaps.
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