Direct connectorization for high-frequency signals
TW202630020APending Publication Date: 2026-07-16FORMFACTOR INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- FORMFACTOR INC
- Filing Date
- 2025-09-24
- Publication Date
- 2026-07-16
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Figure TWG2TA001068619_001 
Figure TWG2TA001068619_002 
Figure TWG2TA001068619_003
Abstract
Improved electrical connections to a probe head are provided by making electrical connections to a flexible circuit connected to the probes. Preferably these connections are solderless and made with a single ganged unit. Many advantages result compared to conventional approaches of making soldered connections to a flexible circuit, or coupling the flexible circuit to a printed circuit board (PCB) and making the connections from the PCB using semi-rigid coaxial cables.
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