Optical interconnections for semiconductor devices

Abstract

A structure is disclosed. The structure can include a first plurality of integrated device dies, an interconnect device, and an optical unit. The interconnect device can be electrically connected to the first plurality of integrated device dies. The optical unit can be disposed vertically above the interconnect device. The optical unit can be optically connected to an optical interconnect. The first plurality of integrated device dies can communicate with a second plurality of integrated device dies at least through the interconnect device, the optical unit, and the optical interconnect.

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