Circuit substrate with liquid-cooling loop and optical communication module thereof

Abstract

A circuit substrate with liquid-cooling loop and an optical communication module thereof are provided. The circuit substrate includes a circuit layer made of glass material and a closed layer made of glass material. A conductive layer is arranged on a surface of the circuit layer and at least electrically connected to an optical communication unit. The closed layer is stacked below another surface of the circuit layer to seal the circuit layer. A channel structure is arranged between the circuit layer and the closed layer and correspondingly passes under the optical communication unit. Two channel holes of the channel structure are arranged on the circuit layer or the closed layer. A coolant is therefore injecting through the channel holes to help the optical communication unit heat dissipation.

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