Coupling method and device for array light source and array optical fiber

Abstract

The coupling method of this invention primarily involves placing a perforated plate between the array light source and the array optical fiber. By calculating and determining the distance between the array light source and the perforated plate, the divergence angle of the array light source can be adjusted to cover the core diameter of the array optical fiber. This not only improves passive coupling efficiency but also enhances the convenience and efficiency of assembly. Additionally, by injecting high-refractive-index adhesive into the perforations of the perforated plate and inserting the cores of the array optical fibers into the perforations, some adhesive is extruded through the perforations to cover the array light source. This approach allows the adjustment of the light divergence angle of the array light source, ensuring it is more concentrated within the core diameter range of the array optical fiber. As a result, the loss of the array light source is reduced, and optical communication performance is improved.

Description

Technical Field

[0001] This invention relates to a coupling process between a high-speed signal and an array light source and an array optical fiber, and more particularly to a coupling method and apparatus that uses a beam of light carrying an optical signal and passive coupling to improve coupling efficiency, as well as to improve the convenience and efficiency of assembly. Prior Technology

[0002] Note that network data volume continues to grow exponentially with the development of the technology industry. Applications such as 5G, AI, self-driving cars, and AR / VR will continue to generate more digital data, and network traffic growth has no end. The demand for bandwidth expansion for transmission network systems, which play a fundamental backbone role, is becoming increasingly urgent. In the next few years, 400G fiber optic networks will gradually become the main backbone network, replacing the current 100G-based architecture. In particular, the accelerated growth of hyperscale data centers and supercomputing will continue to expand the demand for bandwidth.

[0003] As data centers evolve towards hyperscale operations, the continued growth in network application data volume and the significantly increased demand for data interconnection necessitate more efficient management of servers and data. Previously, a typical data center had only a few hundred servers; hyperscale data centers may have over 100,000 servers. The sheer number of interconnecting these servers results in a considerable number of lines. Statistics show that three-quarters of a data center's overall data transmission volume is internal interconnection, with only one-quarter used for external transmission. The number of connections increases more than linearly with the number of servers.

[0004] Because optical signals transmitted in optical fibers can travel longer distances with lower distortion compared to electrical signals transmitted in cables, and because optical communication offers low transmission loss, high data security, excellent anti-interference capabilities, and ultra-high bandwidth, it has become a major modern information communication method and has experienced rapid development in recent years. Furthermore, due to the significantly higher bandwidth of optical signals compared to electrical signals, optical signals are currently the primary means of communication between servers in data centers.

[0005] However, optical communication systems must handle the splitting, combining, switching, and modulation of optical signals. Therefore, in addition to optical fibers, other electronic chips capable of processing optical signals are still needed, which we call "optical waveguide elements" or integrated optical circuits (OICs). Among them, silicon photonic integrated circuits (SPICs) refer to the integration of numerous optical components into one using silicon manufacturing processes, enabling the conversion of electrical signals into optical signals and copper into optical fibers, thus overcoming the speed, bandwidth, and heat problems of traditional electrical signal transmission. Silicon photonics and its related high-speed optical transmission modules have advantages such as high bandwidth, high speed, and no electromagnetic interference, aiming to replace copper or other metal electrical signal conductors, and can simultaneously solve issues such as increased transmission distance, rapid growth in data bandwidth, and power consumption cooling. Silicon photonic integrated circuits are considered a very important emerging technology with no other alternatives at present, suitable for applications in data centers, high-performance computing, and other fields. Co-Package Optics (CPO) refers to the technology of "packaging optical chips / modules and electronic chip modules together". CPO products are mostly used in AI servers, cloud servers, and high-speed transmission servers.

[0006] All the aforementioned optical communication systems require converting electrical signals into optical signals via optical transmitting elements (such as lasers), and then coupling the optical signals into optical fibers that conduct the optical signals. Conventional optical coupling fixtures are applied to OSA products with a single chip and a single lens element, enabling only single-transmission or single-reception coupling. The fiber alignment direction is perpendicular to the coupling plane, and the fiber and lens element are bonded by internal springs within the fiber. In the recently developed COB process, there may be an architecture with one transmitter chip and one receiver chip, or even an array of twelve transmitter chips and twelve receiver chips with array lenses. In this architecture, the fiber alignment direction is parallel to the coupling plane. However, due to the small size and thinness (approximately 3-4 mm) of the lens element and the fiber optic connector (MT fiber), they are very difficult to clamp and fix. There is no suitable fixture design for the fiber optic connector used in coupling to bond the connector and lens element. Furthermore, considering the need for high coupling efficiency and consistency of coupling efficiency for each optical channel, it is impossible to manufacture using existing optical coupling fixture designs.

[0007] Another conventional passive fully automatic array lens alignment device operates on the principle of using a set of image capture devices (CCDs) and a set of prisms to align the lens elements with the optical windows on the circuit board. When aligning the lens elements, the prisms move downwards, allowing the image capture devices to capture the image of the lens elements through the upper reflective surface of the prisms for alignment. When aligning the optical windows, the prisms move upwards, allowing the image capture devices to capture the image of the optical windows through the lower reflective surface of the prisms for comparison and alignment with the lens element images. However, conventional passive fully automatic array lens alignment devices suffer from suboptimal optical coupling values ​​due to factors such as mechanical movement errors, CCD imaging errors, and errors in the lens element and wafer materials. Based on existing conventional passive fully automated array lens coupling technology, the lens element and the wafer window have a deviation of several μm or more. Although it has good production efficiency, the equipment is very expensive and the entry barrier is quite high.

[0008] In view of this, the present invention proposes an innovative communication module coupling process for parallel transmission of array light sources, which is not only relatively inexpensive, but also adopts passive optical coupling alignment, which can optimize the optical values ​​of each optical channel and improve the performance of the product. Summary of the Invention

[0009] This invention relates to a coupling method and apparatus for parallel transmission of an array light source, and more particularly to a coupling method and apparatus that uses a light beam carrying an optical signal and passive coupling to improve coupling efficiency, as well as to improve the convenience and efficiency of assembly.

[0010] To achieve the above-mentioned objective, the coupling method between the array light source and the array optical fiber in this invention includes at least the following steps: providing a perforated plate between the array optical fiber and the array light source, the perforated plate having a body and at least one through hole penetrating opposite sides of the body; calculating the distance between the array light source and the perforated plate, the distance being the diameter of one core of the array optical fiber divided by tan(θ / 2), where θ is the light divergence angle of the array light source; moving the array light source toward the perforated plate, so that the array light source and the perforated plate are adjacent at the distance; performing a first dispensing, applying a first adhesive between the array light source and the perforated plate; performing a second dispensing, injecting a second adhesive into the through hole; moving the array optical fiber toward the perforated plate, so that the core of the array optical fiber is inserted into the through hole, and partially covering the array light source with the second adhesive; performing a third dispensing, applying a third adhesive between the array optical fiber and the perforated plate; and heating to cure the first, second, and third adhesives.

[0011] In a preferred embodiment, the core diameter is 50 μm to 100 μm and the light divergence angle is 20 degrees to 130 degrees.

[0012] In a preferred embodiment, the second colloid forms an encapsulating colloid corresponding to the perforation configuration and covers the array light source.

[0013] The present invention also provides a coupling device, comprising at least: a working platform; an array light source stage, disposed on the working platform for supporting the array light source, which is connected to a first power component and can drive the array light source stage to linearly displace along a first direction; an array fiber stage, disposed on the working platform for supporting the array fiber, which is connected to a second power component and can drive the array fiber stage to linearly displace along the first direction; and a perforated plate stage for supporting perforated plates, disposed on the working platform and located between the array light source stage and the array fiber stage, wherein the perforated plate has a body and at least one through hole, the through hole penetrating along the first direction. The platform has two opposing sides; at least two image capturing devices are respectively disposed above and on one side of the working platform; at least two dispensing devices are disposed on one side of the working platform; a ranging device is disposed on one side of the working platform; and a control mechanism is respectively connected to the first and second power components, the image capturing devices, the dispensing devices, and the ranging devices. The control mechanism is also provided with a calculation unit, which is connected to the ranging device. The calculation unit calculates the distance between the array light source and the aperture, where the distance is the diameter of one core of the array optical fiber divided by tan(θ / 2), and θ is the light divergence angle of the array light source.

[0014] In a preferred embodiment, the array light source is a vertical cavity surface emitting laser (VCSEL), the light divergence angle is 20 to 40 degrees, and the core diameter is 50 μm to 100 μm.

[0015] In a preferred embodiment, the array light source is disposed on a main carrier plate and electrically connected to a silicon photonic integrated circuit via a plurality of first conductive components. The array light source has a sub-carrier plate and a micro-light-emitting diode array. The sub-carrier plate has adjacent first and second surfaces and a plurality of second conductive components. The second conductive components are formed on the second surface. The micro-light-emitting diode array is disposed in a local area of ​​the first surface and electrically coupled to the second conductive components. The micro-light-emitting diode array has a plurality of adjacent micro-light-emitting diodes, and the distance between the adjacent micro-light-emitting diodes is 10~50μm.

[0016] In a preferred embodiment, the array light source is a micro LED with a light divergence angle of 120 to 150 degrees and a core diameter of 50 to 100 μm.

[0017] In a preferred embodiment, the image capturing device is connected to a third power unit, or the dispensing device is connected to a fourth power unit. Simple Explanation of the Diagram

[0018] Figure 1 is a three-dimensional structural view of the coupling device in this invention. Figure 2 is an enlarged perspective view of the coupling device in this invention. Figure 3 is a schematic diagram of the coupling device in this invention. Figure 4 is a flowchart of the coupling method in this invention. Figures 5 through 8 are schematic flowcharts of the coupling method in this invention. Figure 9 is an enlarged schematic diagram of the structure of the array light source and array optical fiber in this invention. Figure 10 is a schematic diagram of the structure of the silicon photonics communication module in this invention. Implementation

[0019] Unless otherwise stated, the following terms used in this specification and claims have the definitions given below. Please note that the singular form of the term "a" as used in this specification and claims is intended to encompass one or more items contained herein, such as at least one, at least two, or at least three, and not to imply only a single item contained herein. Furthermore, the open-ended conjunctions such as "comprising," "including," and "having" as used in the claims indicate that the combination of elements or components described in the claim does not exclude other components or components not specified in the claim. It should also be noted that the term "or" generally includes "and / or" in its meaning, unless otherwise clearly stated. The terms "about" or "substantially" as used in this specification and claims are used to modify any slight variations that do not alter the essence of the claim.

[0020] As shown in Figure 1, which is a three-dimensional structural view of the coupling device in this invention; Figure 2, which is an enlarged three-dimensional structural view of the coupling device in this invention; and Figure 3, which is a schematic structural diagram of the coupling device in this invention, the coupling device of this invention includes at least: a working platform 10, an array light source stage 21, an array fiber stage 22, a aperture stage 23, at least two image capturing devices 41, at least two dispensing devices 42, a ranging device 43, and a control mechanism 40.

[0021] The array light source stage 21 is disposed on the working platform 10 to support the array light source 50. It is connected to a first power component 24, which can drive the array light source stage 21 to linearly displace along the first direction X.

[0022] The fiber optic stage 22 is configured on the working platform 10 to carry the fiber optic array 60. It is connected to a second power component 25, which can drive the fiber optic stage 22 to move linearly along the first direction X.

[0023] The aperture plate stage 23 is used to support the aperture plate 70. It is disposed on the working platform 10 and located between the array light source stage 21 and the array fiber stage 22. The aperture plate 70 has a body 71 and at least one through hole 72. Please refer to Figure 5. The through hole 72 passes through the opposite sides of the body 71 along the first direction X.

[0024] At least two image capturing devices 41 are respectively disposed above and to one side of the working platform 10; at least two dispensing devices 42 and a ranging device 43 are disposed to one side of the working platform 10; and the control mechanism 40 is connected to the first and second power members 24 and 25, the image capturing device 41, the dispensing device 42, and the ranging device 43 respectively. The control mechanism 40 is also provided with a calculation unit 44, which is connected to the ranging device 43. The calculation unit 44 calculates the distance between the array light source 50 and the aperture 70. In addition, the image capturing device 41 is connected to a third power member 45, or the dispensing device 42 is connected to a fourth power member 46. The third and fourth power members 45 and 46 are respectively connected to the control mechanism 40 to control the operation of the image capturing device 41 and the dispensing device 42.

[0025] Please also refer to Figure 4. The manufacturing method of this invention includes at least the following steps:

[0026] A perforated plate 70 is provided between the arrayed optical fiber 60 and the arrayed light source 50, as shown in Figure 5. The plurality of perforations 72 of the perforated plate 70 are through the opposite sides of the body 71.

[0027] Calculate the distance H between the array light source 50 and the aperture 70. The distance H is the diameter of one core 61 of the array fiber 60 divided by tan(θ / 2), where θ is the light divergence angle of the array light source 50. The array fiber of the present invention can be a multimode array fiber with a core diameter of 50um to 100um and a light divergence angle of 20 degrees to 130 degrees. In a preferred embodiment, a vertical cavity surface emitting laser (VCSEL) can be used as the array light source with a light divergence angle of 20 degrees to 40 degrees, or a micro light-emitting diode (Micro LED) can be used as the array light source with a light divergence angle of 120 degrees to 150 degrees.

[0028] The array light source 50 is moved toward the aperture 70 so that the array light source 50 and the aperture 70 are adjacent at the distance H. The present invention can calculate the distance H between the array light source 50 and the aperture 70 according to the above formula based on the use of different array light sources and array optical fibers, so that the light divergence angle of the array light source can cover the core diameter of the array optical fiber, thereby achieving passive optical coupling and automatic light alignment to reduce the cost of optical coupling.

[0029] The first dispensing is performed by applying a first adhesive 81 between the array light source 50 and the aperture plate 70. The first adhesive 81 is a UV adhesive used to fix the array light source 50 and the aperture plate 70.

[0030] A second dispensing is performed, as shown in Figure 6, by injecting a second adhesive 82 into the perforation 72. The second adhesive 82 can be a paste-like adhesive made of a high-refractive-index material.

[0031] The array optical fiber 60 is moved toward the aperture 70, as shown in Figure 7, so that the fiber core 61 of the array optical fiber 60 is inserted into the aperture 72, and part of the second colloid 82 is extruded from the aperture 72 and covers the array light source 50. The second colloid 82 can correspond to the configuration of the aperture 72 to form an encapsulating colloid 83 covering the array light source 50. The configuration of the encapsulating colloid 83 can be arc-convex in the embodiment shown in the figure. Of course, different configurations of the aperture can also be designed as needed, and the encapsulating colloid 83 will form a corresponding shape.

[0032] A third dispensing is performed, as shown in Figure 8, by applying a third adhesive 84 between the array optical fiber 60 and the aperture plate 70. The third adhesive 84 is a UV adhesive used to fix the array optical fiber 60 and the aperture plate 70.

[0033] Heating is used to solidify the first, second, and third colloids to complete the communication module of the present invention.

[0034] In use, the calculation unit 44 calculates the distance H between the array light source 50 and the aperture 70 according to the formula above, based on the array light source 50 and the array optical fiber 60 used. The calculation unit 44 transmits the distance data to the control mechanism 40 to control the first power member 24 to drive the displacement of the array light source stage 21. The image capturing device 41 monitors the displacement of the array light source stage 21. The ranging device 43 further determines whether the distance between the array light source 50 and the aperture 70 is within the range of distance H ± 20 μm. The results monitored by the image capturing device 41 and the ranging device 43 are transmitted to the control mechanism 40 to control whether the first power member 24 is activated.

[0035] Subsequently, the control mechanism 40 further controls the dispensing device 42 to perform the first, second, and third dispensing operations, and controls the second power component 25 to move the array optical fiber 60 toward the aperture 70, so as to extrude the second adhesive 82 through the perforation 72 and form an encapsulating adhesive 83 covering the array light source 50.

[0036] This invention utilizes a computational method to set the distance between the array light source and the aperture, enabling the light divergence angle of the array light source to cover the core diameter of the array optical fiber. This not only improves passive coupling efficiency and allows for automatic light alignment to reduce coupling costs, but also enhances assembly convenience and efficiency. Furthermore, by injecting adhesive through perforations in the aperture, the core of the array optical fiber is inserted into these perforations, and some of the adhesive is extruded to cover the array light source, forming an encapsulating colloid. The light from the array light source can be directly refracted by the encapsulating colloid before entering the fiber core. This not only reduces refraction loss caused by light transmission between different media, but also allows the material and shape of the encapsulating colloid to adjust the light divergence angle of the array light source, creating a focusing effect. This concentrates the light source within the core diameter range of the array optical fiber, reducing the loss of the array light source and improving optical communication performance.

[0037] Furthermore, in the coupling between the array light source and the array fiber in this invention, as shown in the embodiment of Figure 9, the array light source 50 may have a subcarrier board 51 and a micro LED array 52. ​​Similarly, the array light source can be coupled to the array fiber using the coupling method and apparatus of this invention, allowing the array light source to transmit in parallel through the array fiber. The coupling of the array light source to the array fiber can also be further applied to silicon photonics communication modules, as shown in the embodiment of Figure 10. This silicon photonics communication module includes at least: a main carrier board 91, a silicon photonics integrated circuit 92, and an array light source 50. The main carrier board 91 is provided with a plurality of first conductive components and can be used to insert the array fiber bundle connector 62. In the embodiment shown, these first conductive components may include solder pads 93 and metal traces 94, which can be used to set and electrically connect the silicon photonics integrated circuit 92 and the array light source 50. This invention utilizes co-packaged optics. Optics (CPO) integrates the silicon photonics integrated circuit 92 and the array light source 50 directly into a single advanced package, also known as "silicon photonics technology." This allows the silicon photonics integrated circuit 92 to simultaneously handle electrical signal processing and optical signal transmission. Previously, electrons would travel from the chip through metal traces to the optical transceiver at the server's end before being converted into light. With this silicon photonics technology, electrons are converted into photons as soon as they leave the chip, eliminating the need to wait until the server's end for conversion. This reduces the distance electrons travel through metal traces, and the entire subsequent transmission is done by photons. This allows for further upgrades in chip performance and power consumption, while also enabling smaller component sizes, reduced power consumption, lower costs, and faster speeds.

[0038] The array light source 50 is disposed on the main carrier board 91 and electrically connected to the silicon photonic integrated circuit 92 via the metal traces 94. The array light source 50 has a sub-carrier board 51 and a micro-light-emitting diode (Micro-LED). The subcarrier plate 51 has adjacent first and second surfaces 511 and 512 and a plurality of second conductive components. These second conductive components are formed on the second surface 512. The micro-light-emitting diode array 52 is disposed in a local area of ​​the first surface 511 and electrically coupled to the second conductive components. In the embodiment shown, the subcarrier plate 51 is a cuboid, and the first and second surfaces 511 and 512 are two approximately perpendicularly adjacent sides of the cuboid. The second conductive components can be metal-plated lines 53 and are formed together on the first surface 511 and the second surface 512, extending from the first surface 511 to the second surface 512. The micro-light-emitting diode array 52 is electrically coupled to the metal-plated lines 53 located in a local area of ​​the first surface 511 of the subcarrier plate 51. The micro-light-emitting diode array 52 has a plurality of adjacent micro-light-emitting diodes (Micro-LEDs). LEDs 521, the aforementioned micro-light-emitting diode array 52 is soldered to the metal-plated lines 53 in a local area of ​​the first surface 511 of the subcarrier board 51, so that the micro-light-emitting diodes 521 are directly electrically coupled to the metal-plated lines 53 in the local area of ​​the first surface 511 of the subcarrier board 51; and the distance between adjacent micro-light-emitting diodes 521 is 10~50μm. Of course, these second conductive components may also have internal wires and metal-plated lines formed on the second surface, and the micro-light-emitting diodes are electrically connected to the metal-plated lines through the internal wires.

[0039] Therefore, the aforementioned use of co-packaged optics (CPO) to directly package the silicon photonic integrated circuit 92 and the array light source 50 together into a silicon photonic communication module can greatly shorten the transmission distance between the optoelectronic components and the silicon photonic integrated circuit. This can reduce the chance of output / input signals being affected by voltage drops or noise interference, solve the difficulties in electrical signal transmission, and reduce the number of high-speed signal traces, thereby reducing the chance of cracked electrical signal quality. Furthermore, it can further upgrade the chip's performance in terms of both efficiency and power consumption, and can reduce component size, power consumption, cost, and speed.

[0040] The above embodiments are for illustrative purposes only and are not intended to limit the invention. Various modifications or variations made by those skilled in the art without departing from the technical scope of the invention should also fall within the protection scope of the invention.

[0041] H: Spacing X: First direction 10: Work Platform 21: Array light source stage 22: Array Fiber Optic Platform 23: Slide Stage 24: First power component 25: Second power component 40: Control mechanism 41: Image capturing device 42: Dispensing device 43: Distance measuring device 44: Computing Unit 45: Third power component 46: Fourth power component 50: Array light source 51: Subcarrier 511: First Page 512: Second page 52: Micro-light-emitting diode array 521: Microluminescent Diode 53: Metal-plated wire 60: Arrayed fiber 61: Fiber Core 70: Perforated plate 71:Ontology 72: Perforation 81: First colloid 82: Second colloid 83: Encapsulating colloid 84: Third colloid 91: Main carrier board 92: Silicon Photonic Integrated Circuits 93: Solder pad 94: Metal traces

Claims

1. A coupling method between an array light source and an array optical fiber, comprising at least the following steps: providing an aperture between the array optical fiber and the array light source, the aperture having a body and at least one through-hole penetrating opposite sides of the body; calculating the distance between the array light source and the aperture, the distance being the core diameter of one of the array optical fibers divided by tan(θ / 2), where θ is the light divergence angle of the array light source; moving the array light source toward the aperture, so that the array light source and the aperture are adjacent at the distance; performing a first dispensing, applying a first adhesive between the array light source and the aperture; performing a second dispensing, injecting a second adhesive into the through-hole; moving the array optical fiber toward the aperture, inserting the core of the array optical fiber into the through-hole, and extruding a portion of the second adhesive through the through-hole to cover the array light source; performing a third dispensing, applying a third adhesive between the array optical fiber and the aperture; and heating to cure the first, second, and third adhesives.

2. The coupling method between the array light source and the array optical fiber as described in claim 1, wherein, The core diameter ranges from 50µm to 100µm, and the light divergence angle ranges from 20 degrees to 130 degrees.

3. The coupling method between the array light source and the array optical fiber as described in claim 1 or 2, wherein, Part of the second colloid corresponds to the configuration of the perforation to form an encapsulating colloid covering the array light source.

4. The coupling method between the array light source and the array optical fiber as described in claim 1 or 2, wherein, The second adhesive system is made of a high-refractive-index material.

5. A coupling device for an array light source and an array optical fiber, comprising at least: a working platform; an array light source stage, disposed on the working platform for supporting the array light source, connected to a first power member, capable of driving the array light source stage to linearly displace along a first direction; an array optical fiber stage, disposed on the working platform for supporting the array optical fiber, connected to a second power member, capable of driving the array optical fiber stage to linearly displace along the first direction; a perforated plate stage for supporting perforated plates, disposed on the working platform and located between the array light source stage and the array optical fiber stage, the perforated plate having a body and at least one through hole, the through hole penetrating through opposite sides of the body along the first direction; at least two image capturing devices, respectively disposed above and on one side of the working platform; and at least two adhesive dispensing devices, disposed on one side of the working platform. A ranging device is disposed on one side of the working platform; and a control mechanism is connected to the first and second power components, the image capturing device, the dispensing device, and the ranging device, respectively. The control mechanism also includes a calculation unit connected to the ranging device. The calculation unit calculates the distance between the array light source and the aperture plate. The distance is the diameter of one of the fiber cores of the array fiber divided by tan(θ / 2), where θ is the light divergence angle of the array light source.

6. The coupling device between the array light source and the array optical fiber as described in claim 5, wherein, The array light source is a vertical cavity surface emitting laser (VCSEL), the light divergence angle is 20 degrees to 40 degrees, and the core diameter is 50 μm to 100 μm.

7. The coupling device between the array light source and the array optical fiber as described in claim 5, wherein, The array light source is disposed on a main carrier board and electrically connected to a silicon photonic integrated circuit via a plurality of first conductive components. The array light source has a sub-carrier board and a micro-light-emitting diode array. The sub-carrier board has adjacent first and second surfaces and a plurality of second conductive components. The second conductive components are formed on the second surface. The micro-light-emitting diode array is disposed in a local area of ​​the first surface and electrically coupled to the second conductive components. The micro-light-emitting diode array has a plurality of adjacent micro-light-emitting diodes, and the distance between the adjacent micro-light-emitting diodes is 10~50μm.

8. The coupling device between the array light source and the array optical fiber as described in claim 7, wherein, The array light source is a micro LED, the light divergence angle is 120 to 150 degrees, and the core diameter is 50 to 100 μm.

9. The coupling device between the array light source and the array optical fiber as described in any one of claims 5 to 8, wherein, The image capturing device is connected to a third power unit, or the dispensing device is connected to a fourth power unit.

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