Pre-assembled structure of electrical connector and manufacturing method of electrical connector including optoelectronic transceiver module

Abstract

A pre-assembled structure of an electrical connector and a method of manufacturing an electrical connector including an optoelectronic transceiver module. The pre-assembled structure of the electrical connector includes: a substrate including at least one mounting portion; a frame housing member provided to surround the mounting portion, wherein the frame housing member forming a holding space with the mounting portion; the optoelectronic transceiver module provided within the holding space and configured to conduct to the mounting portion after being down-pressurized; and a protective plate configured to be fixed on the photoelectric transceiver module through the frame housing member. An upper surface of the protective plate is made of high-temperature-resistant material. The protective plate is configured to withstand the high temperature environment during the surface mount technology process and prevent the optoelectronic transceiver module from being damaged during the surface mount technology process.

Description

[Technical Field]

[0001] This application relates to the field of connectors, and in particular to a pre-assembled structure of an electrical connector and a method for manufacturing an electrical connector including an optoelectronic transceiver module. [Previous Technology]

[0002] Photons transmit at extremely high speeds and can also perform multiplexing by utilizing different wavelengths of the spectrum. Compared to existing electronic technologies, using photons instead of electrons for data transmission in integrated circuits to meet the demand for high-throughput signal transmission is the future trend. Currently, although the developed optoelectronic integrated circuits can form optoelectronic transceivers through co-packaging technology, the manufacturing of photon transmission structures involves the combination of waveguides and photonic crystals. Excessive surface roughness and interface loss within the transmission path can significantly reduce transmission efficiency. Furthermore, impurities and minor dimensional errors can cause the entire optical path to fail completely. Therefore, before the final optical integrated circuit is manufactured, there is often a semi-finished stage in which the circuit and optical path are manufactured separately to ensure process stability.

[0003] However, the process of combining circuits and optical paths to produce the final optical integrated circuit may involve thermal and surface bonding processes. How to maintain effective signal conversion efficiency and improve process yield, as well as material compatibility and proper thermal management, are urgent issues that need to be addressed. [Summary of the Invention]

[0004] The purpose of this application is to provide a pre-assembled structure for an electrical connector and a method for manufacturing an electrical connector including an optoelectronic transceiver module, so as to properly solve the problems of the prior art.

[0005] To achieve the above objectives, this application provides a pre-assembled structure for an electrical connector, comprising:

[0006] A substrate having at least one mounting portion;

[0007] A frame housing component is configured to surround the mounting portion, the frame housing component and the mounting portion forming an accommodating space;

[0008] An optoelectronic transceiver module is disposed within the accommodating space and configured to communicate with the mounting portion after being pressed down; and

[0009] A protective plate is configured to be fixed above the optoelectronic transceiver module through the frame housing. An upper surface of the protective plate is made of a high-temperature resistant material. The protective plate is configured to withstand a high-temperature environment during a surface bonding process to prevent the optoelectronic transceiver module from being damaged during the surface bonding process.

[0010] Preferably, in the pre-assembled structure of the electrical connector of this application, the frame housing also has a plurality of spring contacts, and the optoelectronic transceiver module is supported by the plurality of spring contacts.

[0011] Preferably, in the pre-assembly structure of the electrical connector of this application, the plurality of springs are further configured to suspend the optoelectronic transceiver module relative to the mounting portion before the optoelectronic transceiver module is pressed down.

[0012] Preferably, in the pre-assembled structure of the electrical connector of this application, the frame housing further includes a plurality of positioning members, and the optoelectronic transceiver module is configured to be positioned above a plurality of conductive terminals of the mounting portion through the plurality of positioning members.

[0013] Preferably, in the pre-assembled structure of the electrical connector of this application, the frame housing further includes a plurality of screw holes for locking and securing an upper cover for clamping the optoelectronic transceiver module and the mounting portion.

[0014] Based on the above objectives, this application further provides a method for manufacturing an electrical connector including an optoelectronic transceiver module, comprising:

[0015] Provides a pre-assembled structure for an electrical connector;

[0016] A surface bonding process is performed on the pre-assembled structure of the electrical connector;

[0017] Remove the protective plate from the pre-assembled structure of the electrical connector;

[0018] A fiber optic module is connected to the pre-assembled structure of the electrical connector; and

[0019] Press down the photoelectric transceiver module to make the photoelectric transceiver module connected to the mounting part.

[0020] Preferably, the step of connecting the pre-assembled structure of the electrical connector to the optical fiber module causes the optoelectronic transceiver module to be pressed down, so that the optoelectronic transceiver module is connected to the mounting part.

[0021] Preferably, after the step of pressing down the photoelectric transceiver module to make the photoelectric transceiver module and the mounting part connected, the method further includes providing an upper cover on the frame housing to press the photoelectric transceiver module and the mounting part together.

[0022] Preferably, the upper cover is locked into the frame housing via a screw structure.

[0023] Preferably, the screw structure includes a plurality of screws.

[0024] This application has at least the following beneficial effects: The embodiments of the pre-assembled structure of the electrical connector and the manufacturing method of the electrical connector including the optoelectronic transceiver module provided in this application can form a pre-assembled structure of the electrical connector capable of directly performing surface mount technology (SMT) processes through a pre-set frame housing. Combined with a structure that allows direct connection between the mounting part and the optoelectronic transceiver module by simply pressing down, the production process of electrical connectors for customized circuits can be simplified. Furthermore, since the alignment of the optoelectronic transceiver module and the substrate mounting part is completed during the production of the pre-assembled structure, the subsequent manufacturer does not need to bear the production risk of aligning the optoelectronic transceiver module and the electrical connector substrate, and can more reasonably control production costs.

Implementation Method

[0025] The following description of this application, accompanied by drawings incorporated in and forming part of the specification, illustrates embodiments of this application; however, this application is not limited to these embodiments. Furthermore, the following embodiments may be appropriately integrated to complete another embodiment.

[0026] To ensure a complete understanding of this application, the following description provides detailed steps and structures. Obviously, implementation of this application does not limit the specific details known to those skilled in the art. Furthermore, known structures and steps are not detailed further to avoid unnecessarily limiting this application. It should be noted that in the description of this application, the functions or steps mentioned herein may appear in an order different from that shown in the accompanying drawings. For example, depending on the functions or steps involved, two consecutively shown figures may actually be performed substantially simultaneously or sometimes in reverse order.

[0027] This application provides a pre-assembly structure for an electrical connector and a method for manufacturing an electrical connector including an optoelectronic transceiver module. The pre-assembly structure for the electrical connector is used to manufacture an electrical connector including an optoelectronic transceiver module. Further explanation: The pre-assembly structure for the electrical connector and the corresponding method for manufacturing an electrical connector including an optoelectronic transceiver module of this application have manufacturing advantages such as high precision, rapid manufacturing, low cost, and miniaturization, which can effectively improve the manufacturing efficiency and yield of electrical connectors using co-packaged optics (CPO) technology that includes an optoelectronic transceiver module.

[0028] Please refer to Figure 1, which is a perspective view of a pre-assembled structure of an electrical connector according to an embodiment of this application. The pre-assembled structure 1 of the electrical connector includes: a substrate 10 having at least one mounting portion 11; a frame housing 20 configured to surround the mounting portion 11, forming an accommodating space 21 with the mounting portion 11; an optoelectronic transceiver module 30 disposed within the accommodating space 21 and configured to communicate with the mounting portion 11 after being pressed down; and a protective plate 40 configured to be fixed above the optoelectronic transceiver module 30 through the frame housing 20. One upper surface of the protective plate 40 is made of a high-temperature resistant material, and the protective plate 40 is configured to withstand high-temperature environments during a surface mount technology (SMT) process to prevent damage to the optoelectronic transceiver module 30 during the SMT process. In one embodiment provided in this application, the frame housing 20 is made of metal.

[0029] In the pre-assembly structure 1 of the electrical connector provided in one embodiment of this application, the frame housing 20 also has a plurality of spring pieces 22, and the optoelectronic transceiver module 30 is supported by the plurality of spring pieces 22.

[0030] In a pre-assembly structure 1 of an electrical connector according to an embodiment of this application, the plurality of spring tabs 22 are further configured to suspend the optoelectronic transceiver module 30 relative to the mounting portion 11 before the optoelectronic transceiver module 30 is pressed down. Therefore, when the pre-assembly structure 1 of the electrical connector subsequently undergoes a surface bonding process, the optoelectronic transceiver module 30 can remain away from the substrate 10, preventing the terminals inside the optoelectronic transceiver module 30 from being deformed by heat.

[0031] In a pre-assembly structure 1 of an electrical connector according to an embodiment of this application, the frame housing 20 further includes a plurality of positioning members 23, and the optoelectronic transceiver module 30 is configured to be positioned above a plurality of conductive terminals of the mounting portion 11 through the plurality of positioning members 23. Therefore, in the subsequent manufacturing process of the electrical connector including the optoelectronic transceiver module 30, the manufacturer does not need to recalibrate the alignment of the optoelectronic transceiver module 30 with the conductive terminals of the mounting portion 11, thus further improving the production yield of the electrical connector including the optoelectronic transceiver module.

[0032] In the pre-assembly structure 1 of the electrical connector provided in one embodiment of this application, the frame housing 20 further includes a plurality of screw holes for locking and securing the optoelectronic transceiver module 30 and an upper cover of the mounting portion 11. Therefore, the electrical connector including the optoelectronic transceiver module provided in this application can further prevent the optoelectronic transceiver module 30 from springing back and causing poor signal reception.

[0033] Referring to Figure 3, this application also provides a method for manufacturing an electrical connector including an optoelectronic transceiver module, comprising:

[0034] S1: Provide a pre-assembled structure for an electrical connector.

[0035] By providing the pre-assembled structure of the electrical connector described in the preceding paragraph, the manufacturer no longer needs to bear the risk of failure of the mounting part of the calibration substrate and the optoelectronic transceiver module, thus improving the production yield.

[0036] S2: Perform a surface bonding process on the pre-assembled structure of the electrical connector.

[0037] S3: Remove the protective plate of the pre-assembled structure of the electrical connector.

[0038] This creates space for the subsequent installation of the cover for securing the optoelectronic transceiver module and the mounting unit.

[0039] S4: Connect a fiber optic module to the pre-assembled structure of the electrical connector.

[0040] Through this step, the electrical connector and the fiber optic module complete the signal connection.

[0041] S5: Press down the photoelectric transceiver module to make the photoelectric transceiver module connected to the mounting part.

[0042] In one embodiment of this application, a method for manufacturing an electrical connector including an optoelectronic transceiver module is provided, wherein the step of connecting the pre-assembled structure of the electrical connector to the optical fiber module causes the optoelectronic transceiver module to be pressed down so that the optoelectronic transceiver module is connected to the mounting part.

[0043] It should be noted that in this application, the pre-assembled structure may include a linkage structure that drives the optoelectronic transceiver module to be pressed down through the access fiber optic module. This can be achieved through a push rod motion linkage set inside the access fiber optic module, or by using an internal spring to drive the optoelectronic transceiver module to be pressed down.

[0044] Please refer to Figures 2 and 4. Figure 4 is a flowchart illustrating a method for manufacturing an electrical connector including an optoelectronic transceiver module according to another embodiment of this application. In one embodiment provided in this application, the method for manufacturing an electrical connector including an optoelectronic transceiver module further includes, after the step of pressing down the optoelectronic transceiver module to make it conductive with the mounting portion:

[0045] S6: A top cover is provided on the outer casing of the frame to press the optoelectronic transceiver module against the mounting part. This improves the connection stability between the optoelectronic transceiver module and the mounting part.

[0046] In one embodiment provided in this application, a method for manufacturing an electrical connector including an optoelectronic transceiver module, wherein after a top cover is provided on the frame housing to press the optoelectronic transceiver module against the mounting portion, the method further includes:

[0047] S7: A screw structure for locking the upper cover into the outer casing of the frame.

[0048] The upper cover can be used to precisely position the optoelectronic transceiver module and the mounting part via the screw structure.

[0049] In one embodiment provided in this application, a method for manufacturing an electrical connector including an optoelectronic transceiver module, wherein a screw structure for locking the upper cover 50 into a frame housing 20 includes:

[0050] S8: Lock in a plurality of screws that pass through the top cover and the frame housing.

[0051] This further stabilizes the top cover 50 to prevent the optoelectronic transceiver module 30 from floating up and causing the optoelectronic signal exchange of the electrical connector containing the optoelectronic transceiver module 30 to fail.

[0052] Compared to the prior art, the embodiments of the pre-assembled structure of the electrical connector and the manufacturing method of the electrical connector including the optoelectronic transceiver module provided in this application can form a pre-assembled structure of the electrical connector capable of directly performing surface mount technology (SMT) processes through a pre-set frame housing. Combined with a structure that allows direct connection between the mounting section and the optoelectronic transceiver module upon direct pressing, the production process of electrical connectors for customized circuits can be simplified. Furthermore, since the alignment of the optoelectronic transceiver module and the substrate mounting section is completed during the production of the pre-assembled structure, the subsequent manufacturer does not need to bear the production risk of aligning the optoelectronic transceiver module and the electrical connector substrate, enabling more reasonable control of production costs.

[0053] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made to this work without departing from its spirit and scope shall be included in the appended patent application scope. [Simplified Explanation of the Diagram]

[0054] Figure 1 is a perspective view of the pre-assembled structure of an electrical connector according to an embodiment of this application.

[0055] Figure 2 is a perspective view of an electrical connector including an optoelectronic transceiver module according to an embodiment of this application.

[0056] Figure 3 is a schematic flowchart of a method for manufacturing an electrical connector including an optoelectronic transceiver module according to an embodiment of this application.

[0057] Figure 4 is a schematic flowchart of a method for manufacturing an electrical connector including an optoelectronic transceiver module according to another embodiment of this application.

Claims

1. A pre-assembled structure for an electrical connector, comprising: A substrate having at least one mounting portion; A frame housing is configured to surround the mounting portion, and the frame housing and the mounting portion form an accommodating space; An optoelectronic transceiver module is disposed within the accommodating space and configured to be in communication with the mounting portion after being pressed down; and a protective plate is configured to be fixed above the optoelectronic transceiver module through the frame housing, the upper surface of the protective plate being made of a high-temperature resistant material, and the protective plate being configured to withstand a high-temperature environment during a surface bonding process to prevent damage to the optoelectronic transceiver module during the surface bonding process; wherein, the frame housing further includes a plurality of positioning members, and the optoelectronic transceiver module is configured to be positioned above a plurality of conductive terminals of the mounting portion through the plurality of positioning members.

2. The pre-assembled structure of the electrical connector as claimed in claim 1, wherein the frame housing further has a plurality of spring contacts, and the optoelectronic transceiver module is supported by the plurality of spring contacts.

3. The pre-assembled structure of the electrical connector as claimed in claim 2, wherein the plurality of springs are further configured to suspend the optoelectronic transceiver module relative to the mounting portion before the optoelectronic transceiver module is pressed down.

4. The pre-assembled structure of the electrical connector as claimed in claim 1, wherein the frame housing further includes a plurality of screw holes for securing a top cover for clamping the optoelectronic transceiver module and the mounting portion.

5. A method for manufacturing an electrical connector including an optoelectronic transceiver module, comprising: providing a pre-assembly structure of the electrical connector as disclosed in claim 1; performing a surface bonding process on the pre-assembly structure of the electrical connector; removing the protective plate of the pre-assembly structure of the electrical connector; connecting an optical fiber module to the pre-assembly structure of the electrical connector; and pressing down the optoelectronic transceiver module to make the optoelectronic transceiver module connected to the mounting portion.

6. The method for manufacturing an electrical connector including an optoelectronic transceiver module as described in claim 5, wherein the step of connecting the pre-assembled structure of the electrical connector to the optical fiber module causes the optoelectronic transceiver module to be pressed down, thereby making the optoelectronic transceiver module connected to the mounting part.

7. The method of manufacturing an electrical connector including an optoelectronic transceiver module as described in claim 5, wherein after the step of pressing down the optoelectronic transceiver module to make the optoelectronic transceiver module conductive with the mounting part, the method further includes providing a top cover on the frame housing to press the optoelectronic transceiver module and the mounting part together.

8. The method of manufacturing an electrical connector including an optoelectronic transceiver module as described in claim 7, wherein after a top cover is provided on the frame housing to press the optoelectronic transceiver module against the mounting portion, the method further includes: locking the top cover into a screw structure of the frame housing.

9. A method of manufacturing an electrical connector comprising an optoelectronic transceiver module as claimed in claim 8, wherein a screw structure for locking the upper cover into the frame housing comprises: locking in a plurality of screws passing through the upper cover and the frame housing.

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