Evaporative cooling of portable electronic devices

Abstract

A device includes a cover configured to provide an outer surface of a portable electronic device. The device also includes a heat dissipation mechanism integrated in the cover and configured to evaporatively cool the portable electronic device. The heat dissipation mechanism includes a set of liquid retention structures located at the outer surface. The heat dissipation mechanism also includes a set of electrodes coupled to the set of liquid retention structures and configured to enable transport of liquid at the liquid retention structures from a first location of the outer surface to a second location of the outer surface.